CN208093557U - A kind of direct-injection type light source - Google Patents

Abstract

The utility model is related to a kind of direct-injection type light sources, especially a kind of that no dark space efficiency is needed to require high place, belong to technical field of semiconductor illumination.The direct-injection type light source it include encapsulating light emitting chip PCB glass single sided boards, be provided with the positive terminal pad of integration packaging and the negative terminal pad of integration packaging on the PCB glass single sided boards of encapsulating light emitting chip；The positive terminal pad of the integration packaging is connected by the LED anodes of total input anode cabling circuit and integration packaging after parallel connection LED；The negative terminal pad of the integration packaging is connected by the LED cathode of total negative pole of output end cabling circuit and integration packaging after series LED；LED luminescence chips P extremely anodes are fixed on according to positive and negative direction gluing on the cabling circuit of PCB glass single sided boards of encapsulating light emitting chip respectively with the poles LED luminescence chip N cathode.The utility model light source is one kind at low cost, no dark space, without hot spot, free from glare, a kind of luminous uniform direct-injection type light source.

Description

A kind of direct-injection type light source

Technical field

The utility model is related to a kind of direct-injection type light sources, especially a kind of that no dark space efficiency is needed to require high place, belong to Technical field of semiconductor illumination.

Background technology

The LED of the early stage common straw hat head and round end for having 0.06 watt of a small-power in the market, such lamp bead heat dissipation rely solely on Temperature on PN junction is carried out heat transfer and distributed by its pin, and the optic angle maximum that straw hat head LED is issued also can only be up to 120 O, the optic angle that round end LED is issued only have 15o；Though though above-mentioned two classes lamp bead straw hat head LED light emitting angers are larger, for low coverage From being a kind of undesirable optic angle for the light source of no dark space；And round end LED is a kind of compared with light-focusing type lamp bead, for closely without dark Area's light source is less ideal light source.The LED lamp bead heat dissipation of such 0.06W is only conducted heat by two positive and negative electrode pins, is passed through The service life can be up to 50,000 hours or so when surveying such LED full power operations；And the utility model light source takes full power work when in use 80% when making, i.e. 0.06W*80%=0.048W can make junction temperature on the LED of the utility model light source further decrease 20% in this way； It is above-mentioned can be up to the LED lamp bead in 50,000 hour service life, junction temperature only has 75 DEG C on chip at this time；And the utility model is using reduction by 20% Power efficiency, i.e. operating current are reduced to 16mA by original 20mA, then junction temperature can be reduced to 60 DEG C by 75 DEG C on luminescence chip, and LED life is nominally 100,000 hours, and condition is that luminescence chip operating temperature is 65 DEG C, and thus the utility model light source life reaches 100000 hours are the behaves that can be realized easily.

Common lamp bead has the paster LED lamp bead of independent luminescence chip encapsulation currently on the market, this lamp bead can only only conduct A kind of independent low-power light source, while this lamp bead chip is packaged in aluminum substrate copper clad layers；If being used for illuminator It needs that the single led lamp bead progress series and parallel form of indefinite quantity is taken to be combined into high power light source, and according to corresponding combination Form light source power design driven power supply, also as individually adopting surface mounted LED lamp bead light emitting angle maximum is in 140o, when consideration cost When cannot largely use paster LED lamp bead, one is desirable to sent out light emits in one direction must take lens or reflective Irradiating angle is corrected in the measure of cup；Two are desirable to the uniform no dark space of light beam requirement and hot spot that lamps and lanterns are sent out.Such as it is remote It is small that the shot-light of irradiation is desirable to light emitting angle；Panel light requires closely illumination to require light emitting angle big and uniform no dark space With no hot spot；And any corrective action for taking light will all cause either large or small light loss.

Also a kind of common integrated COB light emitting angles can reach 170o packing forms currently on the market, and the lamp bead of this type is most It is encapsulated using high-power chip, small area, this type light source is especially high for cooling stand requirement, because of small area cooling stand When for high-power PN junction chip package, the temperature that it is generated after working can be especially high, so the cooling stand often uses Imported Aluminium The substrate and high material of thermal coefficient, cost are very high；It is known that LED life is long, can reach 100,000 hours, 100,000 hour longevity The requirement of life is that the junction temperature on LED illuminator PN junction is not more than 65 DEG C, however the junction temperature on PN junction often rises 10 DEG C of service life and will contract Short half, i.e., when the junction temperature of PN junction reaches 75 DEG C, the service life will shorten to 50,000 hours；In order to make on COB illuminator PN junctions Temperature can distribute well, cooling stand material requires high thermal conductivity coefficient, because（Cabling circuit aluminum substrate and heat dissipation branch There is the insulating layer " PI polyimides " of one layer of pressure resistance DC2000 volt between frame material）The insulating layer coefficient of heat transfer is not high, to dissipating Heat is totally unfavorable；So the COB technologies of high-power, small area encapsulation heat conduction, resistance to pressure request and packaging technology are required to it is high； Additional heat dissipation metal shell is contacted with the package cooling holder of big work(COB when also requiring to be fabricated to lamps and lanterns needs well, otherwise COB On heat when not distributing not go out, light source light decay is serious, and the service life of light source will greatly shorten；COB light source is that high density is high-power Luminescence chip encapsulation technology, if but this light source certain the be out of order electric current on the roads Ze Zhe of chip will impose on other several roads all the way LED chip goes to undertake, and can thus accelerate COB light source and shorten the service life.

Utility model content

The utility model is not big enough in order to overcome the angular that straw hat head is sent out with round end low-power LED, their light Angle is 120o and 15o respectively, is a kind of not applicable light source for producing for short distance illuminator, while they are in chip The junction temperature generated when work is only transmitted by two pins, and light decay is also easy to produce.

The utility model in order to overcome adopting surface mounted LED lamp bead light emitting angle 140o use more middle power or great power LED Lamp bead carries out series and parallel combination, and spaced apart be uniformly distributed also is also easy to produce the dark of non-uniform light when lamps and lanterns are made Area, this results in being avoided hot spot or dark space that from must deepening light-emitting surface distance when design short distance illuminator, must be in light extraction table Face installs the accessory of diffuser plate etc additional to prevent human eye from seeing hot spot or dark space, will result in remote light extraction in this way and light loss Seriously.

The utility model is that the high temperature of the integrated optical source for the COB forms for overcoming high-power small area encapsulation is difficult to distribute, this COB is that high-power chip is packaged on small area aluminum substrate, need to also be in encapsulation circuit and radiation aluminium to reach electrical performance demands Add one layer i.e. thermal coefficient good between substrate holder and good pressure-resistant performance again one kind " PI polyimides " material, and the material is led Hot coefficient again well can not 100% by heat all export.

In order to overcome the defect of above-mentioned three classes light source, the purpose of this utility model is to provide ultra-thin by commonly PCB glasses single sided board substitutes import aluminium base currently on the market routinely as low-power LED package cooling holder and covers copper heat dissipation A kind of direct-injection type light source that holder and large area small-power COB packing forms are laid with；The utility model light source be it is a kind of it is at low cost, No dark space, without hot spot, free from glare, shine a kind of uniform direct-injection type light source.

The utility model is achieved by the following technical programs：

A kind of direct-injection type light source, the direct-injection type light source it include encapsulating light emitting chip PCB glass single sided boards, encapsulating It is provided with the positive terminal pad of integration packaging and the negative terminal pad of integration packaging on the PCB glass single sided boards of luminescence chip；

The positive terminal pad of the integration packaging passes through total input anode cabling circuit after parallel connection LED and integration packaging LED anodes connect；

The negative terminal pad of the integration packaging passes through total negative pole of output end cabling circuit after series LED and integration packaging LED cathode connect；

LED luminescence chips P extremely anodes are fixed on encapsulation according to positive and negative direction gluing respectively with the poles LED luminescence chip N cathode On the cabling circuit of the PCB glass single sided boards of luminescence chip.

Further, the edge surrounding range of the PN junction luminescence chip on the PCB glass single sided boards of encapsulating light emitting chip Box dam structure with light source.

Further, layer of transparent yellow fluorescent powder colloid is coated on the surface of PN junction luminescence chip.

Further, there are injection molded layers on the light-emitting surface of direct-injection type light source.

The beneficial effects of the utility model：

The direct-injection type lamps and lanterns that can be illuminated by a kind of short distance that this utility model light source is fabricated to, such as this light source use The multiple uniform amounts of LED chip of large area arrangement small-power 0.06W are distributed in the good common PCB glass of 1.0mm heavy insulations performance On fine plate, and light emitting angle can reach 170o, can achieve the effect that the long-life even without additional cooling measure, according to actual measurement Using 0.06W low-power LED design lamps light source when actual use power be no more than its power 80% effective power（I.e. When no more than 0.06W*80%=0.048W）, the heat that is sent out when flux efficiency that LED is sent out is best while the chip operation Amount hardly injures the transparent plastic of the fluorescent powder and injection molding that are covered on chip, this layer surface plastics plays protection to light source chip Effect, while in order to avoid dazzle so the outer surface of injection molding is in frosted shape.Calorific value on chip is also extremely low；The light source Suitable for designing no dark space and the short distance illuminator place without hot spot.

Description of the drawings

Fig. 1 is the PN junction luminescence chip internal structure schematic diagram of LED；

Fig. 2 is that the string of LED inside chips 36 and 9 is similar to COB packing forms plane Wiring structure schematic diagrames；

Fig. 3 is this light source dimensional structure diagram；

Fig. 4 is this light source separate structure schematic diagram；

Fig. 5 is this light source overall structure diagram.

In figure：1 is the positive terminal pad of integration packaging；1-1 is total input anode cabling circuit after parallel connection LED；2 be integrated The negative terminal pad of encapsulation, 2-2 are total negative pole of output end cabling circuit after series LED；3 is positive for the LED of integration packaging；4 be collection At the LED cathode of encapsulation；5 is extremely positive for LED luminescence chips P；6 be the poles LED luminescence chip N cathode；7 be encapsulating light emitting chip PCB glass single sided boards；8 be the box dam of light source；9 be cabling circuit；10 be PN junction luminescence chip；11 be injection molded layers；12 be light The light-emitting surface in source.

Specific implementation mode

With reference to the utility model is described in detail shown in such as Fig. 1,2,3,4,5：

A kind of direct-injection type light source, the direct-injection type light source it include encapsulating light emitting chip PCB glasses single sided board 7, sealing It fills and is provided with the positive terminal pad 1 of integration packaging and the negative terminal pad 2 of integration packaging on the PCB glasses single sided board 7 of luminescence chip；

The positive terminal pad 1 of the integration packaging passes through total input anode cabling circuit 1-1 and integration packaging after parallel connection LED LED anode 3 connect；

The negative terminal pad 2 of the integration packaging passes through total negative pole of output end cabling circuit 2-2 and integration packaging after series LED LED cathode 4 connect；

LED luminescence chips P extremely anodes 5 are fixed on envelope according to positive and negative direction gluing respectively with the poles LED luminescence chip N cathode 6 On the cabling circuit 9 for filling the PCB glasses single sided board 7 of luminescence chip.

The edge surrounding range of PN junction luminescence chip 10 on the PCB glasses single sided board 7 of encapsulating light emitting chip has light 8 structure of box dam in source.

Layer of transparent yellow fluorescent powder colloid is coated on the surface of PN junction luminescence chip 10.

There are injection molded layers 11 on the light-emitting surface 12 of direct-injection type light source.

LED luminescence chips P extremely anodes 5 with the poles LED luminescence chip N cathode 6 respectively according to positive and negative direction glue cementation In on the cabling circuit 9 of the PCB glasses single sided board 7 of encapsulating light emitting chip → this process be die bond；PN junction is shone core in next step 10 pin of piece welding → this process is bonding wire；It is exactly that will carry out box dam within the scope of the luminescence chip being distributed in next step again, in turn On PN junction luminescence chip 10 uniform gluing fix → this process be spin coating；Since the light that luminescence chip itself issues is blue Color, but need to emit beam as white light, 10 overlying of PN junction luminescence chip in this blue light is then needed to apply layer of transparent yellow fluorescence Arogel body → this process is point powder,（The yellow fluorescent powder the light, and colour temperature is higher, the white light color that sends out is the inclined pale blue of white light, instead Colour temperature is lower, the white light color that then issues is that white light is partially yellowish, luminous colour temperature can be into 2500K-7000K ranges The yellow fluorescent powder of row configuration various concentration is adjusted）, this powder thickness need to exceed luminescence chip surface, be otherwise not achieved pre- Phase quality white light is also easy to cause the damage of chip in injection molding；It needs to carry out a verification test before injection molding, be entered after qualified Last procedure is once molded in the light-emitting surface 12 of the light source, and it is the forthright good, heatproof of light transmission which, which requires material, Higher PMMA materials, the light transmittance 93% of PMMA materials 3mm thickness, the light transmittance of PC materials 3mm thickness only have 89%, for transmitting Luminous flux is best, light loss is reduced, so the injection molding thickness is designed as 1.8mm -2.0mm thickness, the corresponding plastic mould light extraction Surface need to carry out frosted processing, and the utility model light source could be made not have dazzle and can't see yellow on chip again in this way Fluorescent powder simultaneously no dark space again without hot spot and translucency it is good because using LED chip use COB packaging technologies, chip Light emitting angle can reach 170o.

Case effect illustrates to analyze：

The utility model light source need not increase pressure-resistant insulating layer " PI polyimides ", and LED chip is directly packaged in common list On the pcb board circuit of face, for pressure-resistant problem without consider, be thus greatly saved a difficult packaging technology technology and at This；Heat dissipation problem because using whole 0.06W small-power chip, the power chip when being designed to product using it 80% Effective power：That is when 80%*0.06W=0.048W, the junction temperature heat on LED is especially low, and a small amount of heat that when work generates only needs Heat transfer is carried out by the circuit on PCB to distribute.

It is exemplified below：COB light source 18W is combined luminescence chip by the way of 3 and 3 strings, then per chips Power is 2W；Single chip operating voltage is 3V, operating current is I=P/U=2W/3V=666mA；When combining form is 3 and 3 string, Then this COB overall work voltage is 9V, operating current is I=P/U=18W/9V=2A；Then the 3 tunnel roads parallel connection Shi Zemei operating currents are 2000mA÷3=666mA；When any chip all the way leads to the problem of damage, then the operating current of 2000mA must be by other two-way Luminescence chip undertakes, and the roads Ze Mei operating current increases to 1000mA by original specified 666mA, and the roads Ji Mei luminescence chip respectively increases Added about [（1000mA-666mA）/ 666mA] * 100%=50.2% operating current burden, such result is it is obvious that on LED Junction temperature will rise rapidly, and then the rapid termination for generating light decay or service life.

The utility model light source case is for the direct projection light fitting frame light source that size is 300mm*300mm, though the light source is adopted With the encapsulation technology of COB, but using small-power 0.06W chips, the remaining area outside area occupied in addition to frame 268mm*268mm=71824（Square millimeter）It is laid with encapsulation, what present case used 36 and 9 goes here and there general powers as 19.44W, i.e. total work Rate is 36 and * 9 string * 0.06W=19.44W；Single chip operating voltage is 3V, operating current is I=P/U=0.06W/3V=20mA； Total working voltage is 9 string * 3V=27V, total working electric current be 20mA*36 simultaneously=720mA；When any chip all the way leads to the problem of damage When, then the operating current of 720mA must be undertaken by other 35 roads luminescence chip, and the roads Ze Mei operating current is by original specified 20mA increases to 20.57mA, and the roads Ji Mei luminescence chip respectively increases 2.85% operating current burden；Still more the utility model Design power is the 80% of rated power, i.e. 0.048W/3V=16mA, 36 and then total working electric current is 576mA in upper example, when all the way When wafer damage, 35 tunnels 576mA Ze You undertake, and the roads Ji Mei operating current increases to 16.46mA by 16mA, per the increased electric current in road Only 0.46mA, though the roads Ji Mei luminescence chip increases 2.88% operating current burden, the operating current of 16.46mA is also remote The specified operating current 20mA ranges of LED are not exceeded, such result is not it is obvious that the junction temperature on LED will rise rapidly, to hair Optical chip hardly generates the influence in light decay and service life.

Above-mentioned case circuit is a circuit step mode of 36 and 9 strings, can also carry out decomposition and be packaged into various lines Step mode, such as：Various ways, such flexible packing forms such as the string of 36 and 9 strings, 18 and 18 or 9 and 36 strings can also be intelligence Lamps and lanterns can be changed, scheme is provided, be designed to that the utility model chip can select various different colours 0.06W cores when intelligent light source Piece lamp bead is combined, such as：The form of the various mixing such as white, red, yellow, green and blue.

In addition to the implementation, the utility model can also have other embodiment, all to use equivalent replacement or equivalent change The technical solution for changing form, all falls in the protection domain of the requires of the utility model.

Claims (4)

1. a kind of direct-injection type light source, it is characterised in that：The direct-injection type light source it include encapsulating light emitting chip PCB glass single sides Plate（7）, in the PCB glass single sided boards of encapsulating light emitting chip（7）On be provided with the positive terminal pad of integration packaging（1）And integration packaging Negative terminal pad（2）；

The positive terminal pad of the integration packaging（1）Pass through total input anode cabling circuit after parallel connection LED（1-1）With integration packaging LED anode（3）Connection；

The negative terminal pad of the integration packaging（2）Pass through total negative pole of output end cabling circuit after series LED（2-2）With integration packaging LED cathode（4）Connection；

LED luminescence chips P is extremely positive（5）With the poles LED luminescence chip N cathode（6）Respectively envelope is fixed on according to positive and negative direction gluing Fill the PCB glass single sided boards of luminescence chip（7）Cabling circuit（9）On.

2. direct-injection type light source according to claim 1, it is characterised in that：In the PCB glass single sided boards of encapsulating light emitting chip （7）On PN junction luminescence chip（10）Edge surrounding range have light source box dam（8）Structure.

3. direct-injection type light source according to claim 2, it is characterised in that：In PN junction luminescence chip（10）Surface coating one Layer glassy yelloe fluorescent powder colloid.

4. direct-injection type light source according to claim 1, it is characterised in that：In the light-emitting surface of direct-injection type light source（12）On have note Mould layer（11）.