CN208422957U - A kind of integrated LED multi-chip three-dimension packaging light source - Google Patents
A kind of integrated LED multi-chip three-dimension packaging light source Download PDFInfo
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- CN208422957U CN208422957U CN201821036065.1U CN201821036065U CN208422957U CN 208422957 U CN208422957 U CN 208422957U CN 201821036065 U CN201821036065 U CN 201821036065U CN 208422957 U CN208422957 U CN 208422957U
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Abstract
A kind of integrated LED multi-chip three-dimension packaging light source, chip array and cooling base are encapsulated including LED, LED encapsulates chip and the heat sink connection of cooling base, LED is encapsulated and is connected between chip by gold thread, the left end column of LED encapsulation chip array and the LED encapsulation chip of right end column pass through gold thread respectively and connect with positive terminal area and negative terminal area, concatenated filter capacitor and zener diode are equipped between positive terminal area and negative terminal area, the bottom of cooling base is equipped with radiating fin；It includes LED base and LED chip that LED, which encapsulates chip, and LED chip is fixed in LED base.LED chip good heat dissipation effect, the anti-tampering ability of the light source are strong, while cooling base bending strength increases, the deflection deformation problem that can prevent temperature gradient from generating.
Description
Technical field
The utility model relates to technical field of LED illumination, and in particular to a kind of integrated LED multi-chip three-dimension packaging light
Source.
Background technique
The problem of global energy shortage is aggravated once again, and energy-saving and emission-reduction are the major issues that we face.Light emitting diode
(LED) it is gradually promoted as a kind of novel semi-conductor solid-state cold light source in lighting area, and is big with the advantage of its energy-saving and environmental protection
Family is known.However, the only input power of 15-30% is converted to luminous energy, remaining is converted into heat under existing research level
Amount, causes the junction temperature of LED chip to increase, so that luminescence spectrum drift, light decay are done sth. in advance, the lost of life.Therefore radiating efficiency is improved
And realize junction temperature stability contorting, it is the critical issue during high power LED device designs and manufactures.
Application No. is 200420040555.0 utility models to disclose a kind of high-power multi-die integrated LED module, should
Module is by carrying out film/thick film mixing collection to multiple high brightness LED tube cores on ceramic substrate or metal substrate
At the electrical connection such as by series, parallel or in series and parallel, realizes different operating voltage, electricity between multiple high-brightness diode tube cores
The power reguirements of stream, can be white by the way that a certain proportion of fluorescent powder realization is added in transparent epoxy resin or silica gel coating
Light emitting, using the ceramic substrate or metal substrate of high heat conductance, the heat for enabling tube core to generate when shining is transmitted in time
On tube socket or cooling fin, to improve luminous efficiency and reliability.
Though however above-mentioned LED module realizes that single led chip forms great power LED using LED chip series-parallel system
Component, however LED module achievees the purpose that heat dissipation using the bottom plane and cross-ventilation of metal substrate, when the group of LED die
When number is smaller, which can meet its cooling requirements, and when the quantity of tube core further increases, the metal substrate is due to heat dissipation
Area is difficult to expand, and radiating efficiency is difficult to match with the calorific value of a large amount of tube cores, and metal substrate both ends form certain heating power
Gradient and cause metal substrate one end occur deflection deformation and destroy.
Utility model content
The utility model to solve the above-mentioned problems, devises a kind of integrated LED multi-chip three-dimension packaging light source, the light
The LED encapsulation chip-packaging structure in source is more reasonable, meets the cooling requirements of LED chip, while LED encapsulation chip array is heat sink
In on the copper-based seat with radiating fin, the radiating efficiency of high-power LED encapsulation chip array is improved, to meet LED encapsulation
The dilatation demand of chip array, while radiating fin can increase the intensity of copper-based seat thus when preventing thermal gradient from extremum occur
The problem of deflection deformation, occurs for copper-based seat；Thin metal layer anode and negative terminal area are equipped with filtered diode, can prevent power supply electricity
The interference of the harmonic wave, pulse signal of pressure.
In order to achieve the above technical purposes, reach above-mentioned technical effect, the utility model is real by the following technical programs
Existing:
A kind of integrated LED multi-chip three-dimension packaging light source, which is characterized in that encapsulate chip array and heat dissipation including LED
Pedestal, it is the matrix structure that LED encapsulates that chip forms eight rows ten column that LED, which encapsulates chip array, and LED encapsulates chip and cooling base
Heat sink connection, the LED of every row, which is encapsulated, passes through gold thread series connection between chip, what the left end column that LED encapsulates chip array were arranged with right end
LED encapsulation chip passes through gold thread respectively and connect with positive terminal area and negative terminal area, positive terminal area and negative terminal area it
Between be equipped with concatenated filter capacitor and zener diode, the midpoint in positive terminal area and negative terminal area is respectively equipped with anode and connects
The bottom of line cylinder and negative terminal cylinder, cooling base is equipped with radiating fin；
The LED encapsulation chip includes LED base and LED chip, and LED chip is fixed in LED base, LED chip
Outside hot melt has fluorescent powder glue-line, and fluorescent powder glue-line external hot melting has epoxy resin layer, and LED chip is extended at the both ends of LED base
Pin, LED chip pin and LED base are welded on copper foil by solder, and copper foil is sputtered on oxide insulating layer, oxidation
Object insulating layer is heat-fused on metal substrate, and the bottom of metal substrate is equipped with hot boundary layer, and metal substrate is heat sink on cooling base.
Preferably, LED encapsulation chip has 80, and LED chip uses the blue chip of 0.3mm × 0.3mm.
Preferably, the oxide insulating layer is silicon dioxide insulating layer, and hot boundary layer selects High thermal-conductive silicone grease material
It is made, cooling base is copper-based seat.
The beneficial effects of the utility model are: the LED encapsulation chip-packaging structure of the light source is more reasonable, meet LED core
The cooling requirements of piece, while LED encapsulation chip array is heat sink on the copper-based seat with radiating fin, raising great power LED seals
The radiating efficiency of cored chip arrays, thus meet LED encapsulation chip array dilatation demand, while radiating fin can increase it is copper-based
The problem of deflection deformation, occurs for copper-based seat when the bending strength of seat is to prevent thermal gradient from extremum occur；Thin metal layer anode
It is equipped with filtered diode with negative terminal area, the interference of the harmonic wave, pulse signal of supply voltage can be prevented.
Detailed description of the invention
In order to illustrate more clearly of the technical solution of the utility model embodiment, make required for being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are merely some embodiments of the present invention,
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings
Other attached drawings.
Fig. 1 is a kind of overlooking structure diagram of integrated LED multi-chip three-dimension packaging light source；
Fig. 2 is a kind of present invention looks up structural representation of integrated LED multi-chip three-dimension packaging light source；
Fig. 3 is a kind of A-A cross-sectional view of integrated LED multi-chip three-dimension packaging light source.
In attached drawing, parts list represented by the reference numerals are as follows:
1- cooling base, 2-LED encapsulate chip, 3- filtered diode, 4- positive terminal cylinder, 5- positive terminal area, 6-
Negative terminal cylinder, 7- negative terminal area, 11- radiating fin, 21- solder, 22- copper foil, 23- oxide insulating layer, 24- gold
Category substrate, the hot boundary layer of 25-, 31- filter capacitor, 201- epoxy resin layer, 202-LED chip, 203- fluorescent powder glue-line,
204-LED pedestal, 205-LED chip pin.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
All other embodiment obtained, fall within the protection scope of the utility model.
Refering to fig. 1 shown in -3, a kind of integrated LED multi-chip three-dimension packaging light source, including LED encapsulation chip array and
Cooling base 1, LED encapsulate chip array be LED encapsulate chip 2 form eight rows ten column matrix structure, LED encapsulate chip with
Connection that cooling base is heat sink, every row LED encapsulation chip between by gold thread connect, LED encapsulate chip array left end column with
The LED encapsulation chip of right end column passes through gold thread respectively and connect 7 with positive terminal area 5 and negative terminal area, 5 He of positive terminal area
Concatenated filter capacitor 31 and zener diode 3 are equipped between negative terminal area 7, in positive terminal area 5 and negative terminal area 7
Positive terminal cylinder 4 and negative terminal cylinder 6 are respectively equipped at point, the bottom of cooling base 1 is equipped with radiating fin 11；
The LED encapsulation chip includes LED base 204 and LED chip 202, and LED chip 202 is fixed on LED base
On 204, hot melt has fluorescent powder glue-line 203 on the outside of LED chip 202, and 203 external hot melting of fluorescent powder glue-line has epoxy resin layer 201,
Extend LED chip pin 205, LED chip pin 205 and LED base and be welded in by solder 21 in the both ends of LED base 204
On copper foil 22, copper foil 22 is sputtered on oxide insulating layer 23, and oxide insulating layer 23 is heat-fused on metal substrate 24, Metal Substrate
The bottom of plate 24 is equipped with hot boundary layer 25, and metal substrate 24 is heat sink on cooling base 1.
Therein, the LED encapsulation chip 2 has 80, and LED chip 202 uses the blue light core of 0.3mm × 0.3mm
Piece.
Therein, the oxide insulating layer 23 is silicon dioxide insulating layer, and hot boundary layer 25 selects High thermal-conductive silicone grease
Material is made, and cooling base 1 is copper-based seat.
Hot boundary layer 25 in the present embodiment selects High thermal-conductive silicone grease to be made, using organic silicone as raw material, add it is heat-resisting,
Heat-conductive silicone smectic compound is made in the material of excellent thermal conductivity, the heat transfer that metal substrate 24 can be absorbed to dissipate
On hot radical seat 1, and cooling base 1 conducts heat on radiating fin 11, and the spacing of radiating fin 11 is 100um, radiating fin
Piece 11 increase between air to flow area, radiating efficiency is greatly improved, and can meet LED high-power, that volume is bigger envelope
The radiating requirements of cored chip arrays, while radiating fin 11 increases the bending strength of cooling base 1, prevents 1 liang of cooling base
Caused by the temperature gradient at end is excessive the problem of the deflection deformation of side；The both ends sputtering of cooling base 1 has metal layer by rotten
Positive terminal area 5 and negative terminal area 7 are formed after erosion, and 31 He of filter capacitor is equipped between positive terminal area 5 and negative terminal area 7
Zener diode 3, zener diode 3 utilize pn-junction reverse breakdown state, and electric current can change and voltage base in very large range
This constant phenomenon, manufactured pressure stabilization function, filter capacitor 31 may filter that harmonic wave and impulse disturbances in power supply, make
The electric current of output is more smooth；It is covered with YAG fluorescent powder glue-line on LED chip, LED chip can be made to launch white light, LED encapsulation
Connection is bonded by the gold thread between LED chip pin 205 between chip 2, LED base 204 and LED chip pin 205 pass through
Solder 21 is welded on silicon dioxide insulating layer, and silicon dioxide insulating layer, which is heat-fused on metal substrate 25, forms LED encapsulation chip
2, while silicon dioxide insulating layer can will be electrically insulated between LED base 204 and metal substrate 24, and can send out LED chip 202
In heat transfer out to metal substrate 24, heat is caused cooling base 1 to radiate by metal substrate 24.
In the description of this specification, the description of reference term " one embodiment ", " example ", " specific example " etc. means
Particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one of the utility model
In embodiment or example.In the present specification, schematic expression of the above terms be not necessarily referring to identical embodiment or
Example.Moreover, particular features, structures, materials, or characteristics described can be in any one or more embodiment or examples
In can be combined in any suitable manner.
The preferred embodiment in the utility model disclosed above is only intended to help to illustrate the utility model.Preferred embodiment is simultaneously
There is no the details that detailed descriptionthe is all, also not limiting the utility model is only the specific embodiment.Obviously, according to this theory
The content of bright book can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to preferably
The principles of the present invention and practical application are explained, so that skilled artisan be enable to better understand and utilize this
Utility model.The utility model is limited only by the claims and their full scope and equivalents.
Claims (3)
1. a kind of integrated LED multi-chip three-dimension packaging light source, which is characterized in that including LED encapsulation chip array and heat dissipation base
Seat, it is the matrix structure that LED encapsulates that chip forms eight rows ten column that LED, which encapsulates chip array, and LED encapsulates chip and cooling base heat
Heavy connection, the LED of every row, which is encapsulated, passes through gold thread series connection between chip, the LED that LED encapsulates the left end column of chip array and right end arranges
Encapsulation chip passes through gold thread respectively and connect with positive terminal area and negative terminal area, sets between positive terminal area and negative terminal area
There are concatenated filter capacitor and a zener diode, the midpoint in positive terminal area and negative terminal area is respectively equipped with positive terminal circle
The bottom of column and negative terminal cylinder, cooling base is equipped with radiating fin；
The LED encapsulation chip includes LED base and LED chip, and LED chip is fixed in LED base, on the outside of LED chip
Hot melt has fluorescent powder glue-line, and fluorescent powder glue-line external hot melting has epoxy resin layer, and LED chip pin is extended at the both ends of LED base,
LED chip pin and LED base are welded on copper foil by solder, and copper foil is sputtered on oxide insulating layer, insulated by oxide
Layer is heat-fused on metal substrate, and the bottom of metal substrate is equipped with hot boundary layer, and metal substrate is heat sink on cooling base.
2. a kind of integrated LED multi-chip three-dimension packaging light source according to claim 1, which is characterized in that the LED
Encapsulation chip has 80, and LED chip uses the blue chip of 0.3mm × 0.3mm.
3. a kind of integrated LED multi-chip three-dimension packaging light source according to claim 1, which is characterized in that the oxygen
Compound insulating layer is silicon dioxide insulating layer, and hot boundary layer selects High thermal-conductive silicone grease material to be made, and cooling base is copper-based seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821036065.1U CN208422957U (en) | 2018-07-02 | 2018-07-02 | A kind of integrated LED multi-chip three-dimension packaging light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821036065.1U CN208422957U (en) | 2018-07-02 | 2018-07-02 | A kind of integrated LED multi-chip three-dimension packaging light source |
Publications (1)
| Publication Number | Publication Date |
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| CN208422957U true CN208422957U (en) | 2019-01-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821036065.1U Active CN208422957U (en) | 2018-07-02 | 2018-07-02 | A kind of integrated LED multi-chip three-dimension packaging light source |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112713230A (en) * | 2020-12-29 | 2021-04-27 | 安徽黑洞科技有限公司 | Manufacturing method of LED transparent screen |
-
2018
- 2018-07-02 CN CN201821036065.1U patent/CN208422957U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112713230A (en) * | 2020-12-29 | 2021-04-27 | 安徽黑洞科技有限公司 | Manufacturing method of LED transparent screen |
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Effective date of registration: 20190614 Address after: 650228 Office No. 606-32, Building A1, Yunshui Road, Dabanqiao Street, Central Yunnan New District, Kunming City, Yunnan Province Patentee after: Yunnan Xintengyuan Technology Co., Ltd. Address before: 650000 1-4 floors of 42 blocks, 39 Churchang West Road, Wuhua District, Kunming City, Yunnan Province Patentee before: Kunming Star Public Science and Technology Incubator Co., Ltd. |