CN202302944U - COB (chip on board) encapsulating lamp strip module for LED (light-emitting diode) surface light source - Google Patents
COB (chip on board) encapsulating lamp strip module for LED (light-emitting diode) surface light source Download PDFInfo
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- CN202302944U CN202302944U CN2011203409375U CN201120340937U CN202302944U CN 202302944 U CN202302944 U CN 202302944U CN 2011203409375 U CN2011203409375 U CN 2011203409375U CN 201120340937 U CN201120340937 U CN 201120340937U CN 202302944 U CN202302944 U CN 202302944U
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Abstract
The utility model discloses a COB (chip on board) encapsulating lamp strip module for an LED (light-emitting diode) surface light source, and the COB encapsulating lamp strip module belongs to the field of illumination. A PCB (printed circuit board) baseplate of the COB encapsulating lamp strip module is a strip aluminum base PCB; one side surface of the PCB baseplate is provided with a plurality of LED light-emitting chips and positive power supply electrode strips and negative power supply electrode strips; the LED light-emitting chips are directly encapsulated on the PCB baseplate; the LED light-emitting chips of the PCB baseplate are arranged on the PCB baseplate in a single row; the positive power supply electrode strips and the negative power supply electrode strips are respectively arranged on two sides of each LED light-emitting chip; an inter-chip connecting electrode slice is arranged between each two LED light-emitting chips; each LED light-emitting chip is connected with the inter-chip connecting electrode slice through a metal wire or a routed wire; m LED light-emitting chips are connected in series and then form a light-emitting chip group; and n light-emitting chip groups are connected in parallel and then are connected with an external driving power supply. By using the technical scheme, the encapsulation way of an apparatus is combined with a lamp shell; the chips directly conduct heat to the baseplate and then conduct the heat to the lamp shell by adopting an integrated COB multi-chip encapsulating lamp strip module as a light source; a better heat-radiating effect is achieved; and the purpose of effectively improving the service life of a lamp can be achieved. The COB encapsulating lamp strip module can be widely used for the field of indoor and outdoor illumination.
Description
Technical field
The utility model belongs to lighting field, relates in particular to a kind of light emitting module of the LED of employing luminescent device.
Background technology
Semiconductor lighting is acknowledged as one of high-tech sector of tool development prospect of 21 century.
Because LED (LED; Light-emitting diode; Semiconductor light-emitting-diode) be that to be converted into luminous energy through semiconductor devices be not by thermoluminescence to electric energy; So led light source has the cold light source of being called as, its conversion efficiency is along with the development of scientific research level just progressively improves, and reached now and to surpass level and its potentiality that can dig of electricity-saving lamp also very big.Can reach 100,000 hours as its long-life of semiconductor devices, also be all other light sources can't expect.
The mostly development and differentiation on the Discrete device packaging technical foundation of LED encapsulation technology, but very big particularity is arranged.
Generally speaking, the tube core of discrete device is sealed in the packaging body, and the effect of encapsulation mainly is protection tube core and completion electric interconnection.
LED encapsulation then is to have the function of accomplishing input electrical signal, protection tube core operate as normal, output visible light, and existing electrical quantity has the design and the specification requirement of optical parameter again, so can't be simply the encapsulation of discrete device be used for LED.
The encapsulation of LED at present mainly is divided into two kinds: the one, and independent encapsulation just encapsulates every chips separately, produces arbitrary source one by one, and then assembles as required; The 2nd, integrated encapsulation according to certain arrangement mode, is carried out integrated encapsulation with a plurality of chips then, and what this method encapsulated out is the aggregate of a multicore sheet.
After getting into 21 century, the high efficiency of LED, super brightnessization, panchromaticization constantly develop innovation, and red, orange LED light efficiency has reached 100Im/W, and green LED is 501m/W, and the luminous flux of single LED also reaches tens of I
m
Led chip and encapsulation no longer along the design concept and manufacturing production model of Gong Chuantong, at the light output facet that increases chip, are researched and developed and are not limited only to change amount of impurities in the material; Lattice defect and dislocation improve internal efficiency, simultaneously, how to improve tube core and encapsulation internal structure; Strengthen the inner probability that produces the photon outgoing of LED, improve light efficiency, solve heat radiation; Get the heavy optimal design of light and heat, improve optical property, quicken the surface mount process main flow direction of industrial circle research and development especially.
In 2002; Surface mount encapsulated LED (SMD LED) is accepted by market gradually; And obtain certain market share, and turn to SMD (Surface Mount Devices) encapsulation to meet whole electron trade development main trend from independent pinned encapsulation, a lot of production firms release this series products.
SMD LED becomes a development focus, has solved problems such as brightness, visual angle, flatness, reliability, uniformity well, adopts lighter pcb board and reflector material; Showing epoxy resin that the reflecting layer need be filled still less, and removing heavier carbon steel material pin, through minification; Reduce weight, can easily product weight be alleviated half, finally make application more become perfect; Especially suitable indoor, the semi-outdoor full color display is used.
But the SMD encapsulation of existing LED is applicable to the encapsulation of low-power LED more, and it also has certain limitation on the package application of great power LED device, trace it to its cause, and mainly is that heat dissipation problem is more outstanding.After adopting integrated encapsulation, multiple chips is gathered on the very little area, and thermal resistance between chip and the fin increases, and High Power Illuminator problem of manufacturing of assembling is more outstanding again than encapsulation separately with regard to making heat dissipation problem for this.
The LED area source is to adopt the planar shaped light fixture of LED light-emitting particles as light source, and the quality of radiating effect is the key of decision light fixture bulk life time.
Along with power-type LED in the general lighting extensive applications; The power-type device application has also become trend in indoor illumination light fitting; Because the structure particularity (flat structureization) of area source type light fixture; Its luminescent device is arranged on the side of tabular lamp housing, and is in the narrow space, harsh more to the requirement of light fixture heat dissipation technology relatively.
The utility model content
The utility model technical problem to be solved provides a kind of LED area source with COB encapsulation lamp bar module; It adopts incorporate COB multicore encapsulation technology; Adopt the direct heat conduction of chip to arrive the thermally conductive pathways that substrate arrives lamp housing again, thermal resistance obviously reduces, and can reach better radiating effect; The conventional package mode can more effectively reduce device junction temperature relatively; The service life of raising/prolongation light fixture, also can improve the colour rendering of light source effectively, higher illuminance or light amount of lumens can be provided on the unit light-emitting area.
The technical scheme of the utility model is: provide a kind of LED area source with COB encapsulation lamp bar module; Comprise PCB substrate and LED luminescence chip; It is characterized in that: described PCB substrate is a strip aluminum base PCB plate, and an one of which side is provided with a plurality of LED luminescence chips and "+", "-" power electrode bar; Described LED luminescence chip directly is encapsulated on the PCB substrate through the heat conduction adhesive linkage; Its described a plurality of LED luminescence chips are arranged on the PCB substrate along the longitudinal axis of PCB substrate is single-row; Described "+", "-" power electrode bar are arranged in the both sides of each LED luminescence chip respectively; Between each LED luminescence chip, be provided with chip chamber connection electrode sheet; Said each LED luminescence chip is connected with chip chamber connection electrode sheet through gold thread/routing; Described a plurality of LED luminescence chip series connection back constitutes one group of luminescence chip group, is connected with external driving power after several luminescence chip group parallel connections.
Wherein, above said each LED luminescence chip, the fluorescence conversion glue-line is set.
The first LED luminescence chip of said each luminescence chip group is connected with "+" power electrode bar through gold thread/routing; Constitute the head end link of this luminescence chip group; The LED luminescence chip of each position, luminescence chip group end is connected with "-" power electrode bar through gold thread/routing; Constitute the terminal link of this luminescence chip group, each middle LED luminescence chip process gold thread/routing is connected in series with the chip chamber connection electrode sheet between each LED luminescence chip order successively.
Perhaps; The first LED luminescence chip of said each luminescence chip group is connected with "-" power electrode bar through gold thread/routing; Constitute the head end link of this luminescence chip group; The LED luminescence chip of each position, luminescence chip group end is connected with "+" power electrode bar through gold thread/routing, constitutes the terminal link of this luminescence chip group, and each middle LED luminescence chip process gold thread/routing is connected in series with the chip chamber connection electrode sheet between each LED luminescence chip order successively.
Further, between described strip aluminum base PCB plate and "+", "-" power electrode bar, or between described strip aluminum base PCB plate and chip chamber connection electrode sheet, insulating barrier is set.
M * n LED luminescence chip is set on the upper surface of the described strip aluminum base PCB of each root plate; Every m series connection back of described LED luminescence chip constitutes one group of luminescence chip group; Be connected with external driving power after the parallel connection of n group luminescence chip group, constitute a complete COB packaged LED lamp bar module.
Described heat conduction adhesive linkage is heat-conduction epoxy resin layer or argentiferous heat-conduction epoxy resin layer.
Described strip aluminum base PCB plate directly is connected with the housing of area source light fixture or fixes through securing member.
Compare with prior art, the utility model has the advantages that:
1. adopt the COB packaged type; The LED luminescence chip directly is fixed on the strip aluminum base PCB plate, has shortened the transmission path of chip heat to greatest extent, can significantly reduce the thermal resistance of luminescence chip; Help improving the heat conduction environment of lamp bar module; Under same radiating condition, can adopt more high-power LED luminescence chip, help to improve the luminous illumination or the luminous efficiency of whole light fixture;
2. divide into groups again after many LED luminescence chips serial connection and connect, help the balanced characteristics of luminescence and the luminous harmony of respectively organizing luminescence chip;
3.PCB adopt the arrangement mode of single LED luminescence chip on the substrate, can effectively reduce the monnolithic case size of light emitting module, help reducing the gauge of light fixture.
Description of drawings
Fig. 1 is the structural representation of the utility model;
Fig. 2 is the sectional structure sketch map of PCB substrate;
Fig. 3 is the connection sketch map that divides into groups again after the LED luminescence chip serial connection.
1 is the PCB substrate among the figure, and 2 is the LED luminescence chip, and 3 is "+" power electrode bar; 3-1 is that "+" power electrode extends jag, and 4 is "-" power electrode bar, and 4-1 is that "-" power electrode extends jag; 5 is chip chamber connection electrode sheet, and 6 is the fluorescence conversion glue-line.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is further specified.
Among Fig. 1, this COB encapsulation lamp bar module comprises PCB substrate and LED luminescence chip, and its inventive point is that described PCB substrate is a strip aluminum base PCB plate 1, and an one of which side is provided with a plurality of LED luminescence chips 2 and "+", "-" power electrode bar 3 and 4; Its described a plurality of LED luminescence chips are arranged on the PCB substrate along the longitudinal axis of PCB substrate is single-row; Described "+", "-" power electrode bar are arranged in the both sides of each LED luminescence chip respectively; Between each LED luminescence chip, be provided with chip chamber connection electrode sheet 5; Said each LED luminescence chip is connected with chip chamber connection electrode sheet through gold thread/routing (not shown); Described a plurality of LED luminescence chip series connection back constitutes one group of luminescence chip group, is connected with external driving power after several luminescence chip group parallel connections.
Adopt the COB packaged type; The LED luminescence chip directly is fixed on the strip aluminum base PCB plate, has shortened the transmission path of chip heat to greatest extent, can significantly reduce the thermal resistance of luminescence chip; Help improving the heat conduction environment of lamp bar module; Under same radiating condition, can adopt more high-power LED luminescence chip, help to improve the luminous illumination or the luminous efficiency of whole light fixture.
Among Fig. 2, described LED luminescence chip 2 directly is encapsulated on the PCB substrate 1 through heat conduction adhesive linkage (not shown).
Above said each LED luminescence chip, fluorescence conversion glue-line 6 is set.
Further, between described strip aluminum base PCB plate and "+", "-" power electrode bar, or between described strip aluminum base PCB plate and chip chamber connection electrode sheet, the insulating barrier (not shown) is set.
Described heat conduction adhesive linkage is heat-conduction epoxy resin layer or argentiferous heat-conduction epoxy resin layer.
Described strip aluminum base PCB plate directly is connected with the housing of area source light fixture or fixes through securing member.
Adopt the arrangement mode of single LED luminescence chip on the PCB substrate, can effectively reduce the monnolithic case size of light emitting module, help reducing the gauge of light fixture.
All the other same Fig. 1.
Among Fig. 3, described "+", "-" power electrode bar 3,4 are arranged in the both sides of each LED luminescence chip 2 respectively; Between each LED luminescence chip, be provided with chip chamber connection electrode sheet 5.
On circuit connecting mode, a plurality of LED luminescence chip series connection back constitutes one group of luminescence chip group, is connected with external driving power after several luminescence chip group parallel connections.
In actual manufacture process; The individual LED luminescence chip of m * n (for example 12 * 7) is set on the upper surface of the described strip aluminum base PCB of each root plate; The every m of described LED luminescence chip (for example 12) series connection back constitutes one group of luminescence chip group; Be connected with external driving power after (for example 7 groups) the luminescence chip group parallel connection of n group, constitute a complete COB packaged LED lamp bar module.
The first LED luminescence chip of each luminescence chip group is connected with "+" power electrode bar through gold thread/routing (not shown); Constitute the head end link of this luminescence chip group; The LED luminescence chip of each position, luminescence chip group end is connected with "-" power electrode bar through gold thread/routing; Constitute the terminal link of this luminescence chip group, each middle LED luminescence chip process gold thread/routing is connected in series with the chip chamber connection electrode sheet between each LED luminescence chip order successively.
Can know by figure; Illustrate the first LED luminescence chip 2 and the 2-2 of each luminescence chip group; 4-1 is connected through the extension of "-" power electrode on gold thread/routing (not shown) and "-" power electrode bar 4 jag; Constitute the head end link of this luminescence chip group; The LED luminescence chip 2-1 of the last position of each luminescence chip group extends jag 3-1 through gold thread/routing with "+" power electrode of "+" power electrode bar 3 and is connected, and constitutes the terminal link of this luminescence chip group, and each middle LED luminescence chip process gold thread/routing is connected in series with the chip chamber connection electrode sheet 5 between each LED luminescence chip order successively.
The present technique scheme adopts m string n, and also (connected mode that is commonly called as m * n) is made the COB aluminium base; In fact be exactly on the basis of the single-row arrangement of LED luminescence chip; Adopt rational printed circuit layout-design structure; Realizing or embodying being connected in series of m LED luminescence chip is one group of luminescence chip group, simultaneously, between the n on same COB aluminium base group luminescence chip group, adopts and the mode and the external driving power that connect and connect.
Adopt above-mentioned connected mode, help the balanced characteristics of luminescence and the luminous harmony of respectively organizing luminescence chip; Also can improve the colour rendering of light source effectively, higher illuminance or light amount of lumens can be provided on the unit light-emitting area.
All the other are with Fig. 1 or Fig. 2.
Along with power-type LED in the general lighting extensive applications, the power-type device application has also become trend in indoor illumination light fitting, relatively in the narrow space, harsh more to the requirement of light fixture heat dissipation technology; The present technique scheme combines the packing forms and the lamp casing of device well; Design adopts incorporate COB multicore to be packaged into the lamp bar as light source; The direct heat conduction of realization chip is arrived lamp housing again to substrate; Reach better radiating effect, its relative SMD mode lamp bar can effectively reduce device junction temperature, realizes improving the purpose of lamp life.
The utility model can be widely used in the indoor and outdoor illumination field.
Claims (8)
1. a LED area source comprises PCB substrate and LED luminescence chip with COB encapsulation lamp bar module, it is characterized in that:
Described PCB substrate is a strip aluminum base PCB plate, and an one of which side is provided with a plurality of LED luminescence chips and "+", "-" power electrode bar;
Described LED luminescence chip directly is encapsulated on the PCB substrate through the heat conduction adhesive linkage;
Its described a plurality of LED luminescence chips are arranged on the PCB substrate along the longitudinal axis of PCB substrate is single-row;
Described "+", "-" power electrode bar are arranged in the both sides of each LED luminescence chip respectively;
Between each LED luminescence chip, be provided with chip chamber connection electrode sheet;
Said each LED luminescence chip is connected with chip chamber connection electrode sheet through gold thread/routing;
Described a plurality of LED luminescence chip series connection back constitutes one group of luminescence chip group, is connected with external driving power after several luminescence chip group parallel connections.
2. encapsulate lamp bar module according to the described LED area source of claim 1 with COB, it is characterized in that above said each LED luminescence chip, the fluorescence conversion glue-line being set.
3. encapsulate lamp bar module according to the described LED area source of claim 1 with COB; The first LED luminescence chip that it is characterized in that said each luminescence chip group is connected with "+" power electrode bar through gold thread/routing; Constitute the head end link of this luminescence chip group; The LED luminescence chip of each position, luminescence chip group end is connected with "-" power electrode bar through gold thread/routing; Constitute the terminal link of this luminescence chip group, each middle LED luminescence chip process gold thread/routing is connected in series with the chip chamber connection electrode sheet between each LED luminescence chip order successively.
4. encapsulate lamp bar module according to the described LED area source of claim 1 with COB; The first LED luminescence chip that it is characterized in that said each luminescence chip group is connected with "-" power electrode bar through gold thread/routing; Constitute the head end link of this luminescence chip group; The LED luminescence chip of each position, luminescence chip group end is connected with "+" power electrode bar through gold thread/routing; Constitute the terminal link of this luminescence chip group, each middle LED luminescence chip process gold thread/routing is connected in series with the chip chamber connection electrode sheet between each LED luminescence chip order successively.
5. encapsulate lamp bar module according to the described LED area source of claim 1 with COB; It is characterized in that between described strip aluminum base PCB plate and "+", "-" power electrode bar; Or between described strip aluminum base PCB plate and chip chamber connection electrode sheet, insulating barrier is set.
6. encapsulate lamp bar module according to the described LED area source of claim 1 with COB; It is characterized in that on the upper surface of the described strip aluminum base PCB of each root plate, being provided with m * n LED luminescence chip; Every m series connection back of described LED luminescence chip constitutes one group of luminescence chip group; Be connected with external driving power after the parallel connection of n group luminescence chip group, constitute a complete COB packaged LED lamp bar module.
7. encapsulate lamp bar module according to the described LED area source of claim 1 with COB, it is characterized in that described heat conduction adhesive linkage is heat-conduction epoxy resin layer or argentiferous heat-conduction epoxy resin layer.
According to the described LED area source of claim 1 with COB encapsulation lamp bar module, it is characterized in that described strip aluminum base PCB plate directly is connected with the housing of area source light fixture or fixes through securing member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203409375U CN202302944U (en) | 2011-09-13 | 2011-09-13 | COB (chip on board) encapsulating lamp strip module for LED (light-emitting diode) surface light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203409375U CN202302944U (en) | 2011-09-13 | 2011-09-13 | COB (chip on board) encapsulating lamp strip module for LED (light-emitting diode) surface light source |
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| Publication Number | Publication Date |
|---|---|
| CN202302944U true CN202302944U (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203409375U Expired - Fee Related CN202302944U (en) | 2011-09-13 | 2011-09-13 | COB (chip on board) encapsulating lamp strip module for LED (light-emitting diode) surface light source |
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| CN (1) | CN202302944U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102980155A (en) * | 2012-12-04 | 2013-03-20 | 东莞市中实创半导体照明有限公司 | LED (Light-Emitting Diode) integrated light source bottom plate |
| US9989206B2 (en) | 2013-03-11 | 2018-06-05 | Inception Innovations, Llc | Architectural lighting methods and apparatus |
-
2011
- 2011-09-13 CN CN2011203409375U patent/CN202302944U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102980155A (en) * | 2012-12-04 | 2013-03-20 | 东莞市中实创半导体照明有限公司 | LED (Light-Emitting Diode) integrated light source bottom plate |
| US9989206B2 (en) | 2013-03-11 | 2018-06-05 | Inception Innovations, Llc | Architectural lighting methods and apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20160913 |