CN102569284B - The LED that New LED luminescence chip and assembling thereof are formed - Google Patents
The LED that New LED luminescence chip and assembling thereof are formed Download PDFInfo
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- CN102569284B CN102569284B CN201210072034.2A CN201210072034A CN102569284B CN 102569284 B CN102569284 B CN 102569284B CN 201210072034 A CN201210072034 A CN 201210072034A CN 102569284 B CN102569284 B CN 102569284B
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- 238000004020 luminiscence type Methods 0.000 title claims abstract description 50
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000003466 welding Methods 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 abstract description 6
- 239000004411 aluminium Substances 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 238000012536 packaging technology Methods 0.000 description 5
- 230000007812 deficiency Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
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Abstract
The invention provides a kind of New LED luminescence chip, be electrically connected by LED point light source more than two and form, the LED point light source back side more than two is all directly fixed on metallic support; The present invention also provides a kind of LED be composed in series by New LED luminescence chip more than two panels.LED luminescence chip of the present invention is when assembling, and only LED point light source need be adjacent to and be arranged on the metallic support of heat radiation, then carry out being electrically connected, it is simple for assembly process, greatly can improve the packaging efficiency of LED luminescence chip.Meanwhile, by changing the radiating mode of LED luminescence chip, improve the heat dispersion of LED luminescence chip, thus extend the useful life of LED luminescence chip.At identical radiating effect, the radiating mode adding aluminium base than existing use SMD lamp pearl saves 50% heat conduction aluminum section bar, reduces production cost.The LED that the present invention is assembled by New LED luminescence chip, it is easy to assembly, and production cost is low, is more conducive to the universal of LED and promotes the use of.
Description
Technical field
The present invention relates to a kind of photovoltaic, particularly a kind of LED.
Background technology
LED (light-emitting diode) has the advantages such as power consumption is little, long service life, low cost, has been widely used in the fields such as illumination, display, as LED daylight lamp, LED indoor illuminating lamp, LED display, LED decorations etc.Along with country is to the pay attention to day by day of green light source, market and the application prospect of LED product are boundless.
Heat dissipation problem is the technical barrier that all LED light source products all must solve.Existing LED indoor illuminating lamp, fluorescent lamp etc., be generally electrically connected by tens independent packaged LED point light source and form.Each LEDs point-source of light is all that its back is provided with the aluminium base that can conduct heat, and aluminium base is adjacent to common thermal conductivity glue, then encapsulates.The heat radiation of each packaged LEDs point-source of light is connected with the heat sink of the external world by thermal conductivity glue again, when the conduction of repeatedly multilayer uses LED point light source a large amount of heat energy of generation export to slowly heat sink on.As can be seen here, existing LED point light source causes its heat dispersion undesirable by above-mentioned radiating mode, thus affects the useful life of the LED of being assembled by LED point light source.And existing commercially LED daylight lamp, LED indoor illuminating lamp not only also exist the problem of heat dispersion difference, also there is packaging technology complicated situation: existing LED has to pass through such packaging technology: by packaged LED point light source by by be attached to heat sink upper-cross high temperature Reflow Soldering, LED point light source is welded and fixed-is connected with power supply by LEDs point-source of light, just can be assembled into finished product.This packaging technology process is complicated, and adds the production cost of LED daylight lamp and LED indoor illuminating lamp.Therefore, in order to improve LED daylight lamp, the popularity rate of LED indoor illuminating lamp and popularization rate, be necessary to improve above-mentioned deficiency.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of novel LED luminescence chip is provided, this LED luminescence chip perfect heat-dissipating, long service life, the LED of being assembled by this LED luminescence chip, easy to assembly, production cost is low, is more conducive to the universal of LED and promotes the use of.
In order to achieve the above object, the present invention adopts following technical scheme: a kind of New LED luminescence chip, overall package is carried out in outside, it is characterized in that: be electrically connected by LED point light source more than two and form, the LED point light source back side more than two is all directly fixed on metallic support.
Pass through such scheme, LED point light source more than two is directly fixed on metallic support carries out overall outer enclosure (packaging technology adopts existing packaging technology) again, the heating panel of each point-source of light is whole metallic support, the a large amount of heat energy produced when LED point light source uses can directly be derived by metallic support fast, area of dissipation is large, rapid heat dissipation.
More particularly, the bullion support of described metallic support to be cross section be " convex " shape, the LED point light source back side more than two is all directly fixed on the tip platform of bullion support.The design of metallic support " convex " shape: on the one hand on the basis obtaining the area of dissipation identical with " mouth " shape support, saves metal material, reduces cost; The region that can effectively utilize the both sides of metallic support projection to be electrically connected as LED point light source on the other hand, kills two birds with one stone.
In order to realize the present invention better, the both sides platform of described bullion cantilever tip platform is respectively arranged with the first wire welding area and the second wire welding area; Described LED point light source more than two by the first wire welding area and the second wire welding area to realize and outside electrical connection.First wire welding area and the second wire welding area can be the bonding wire platform of any conductor manufacture or other modes that can realize electrical connection, facilitate LED point light source to realize electrical connection.
Described first wire welding area and the second wire welding area refer to the conductor bar on the both sides platform being separately fixed at bullion cantilever tip platform; Described LED point light source more than two by conductor bar to realize and outside electrical connection.
The top plan of described conductor bar and the plane of bullion cantilever tip platform are same level.Conductor bar is placed to increase the area (conductor while also can transferring heat) of heat radiation in the space that such one side can make full use of both sides platform; On the other hand conductor bar can with " mouth " shape of bullion support formation rule, convenient overall encapsulation.
In described LED point light source more than two, often organize LED point light source all in LED point light source in parallel; Connect between group.The connected mode often organizing LED point light source all in LED point light source can by current uniform, be distributed to multiple parallel circuits, reduce the fault of single LEDs point-source of light to the impact of whole light source: namely adopt such connected mode, indivedual point-source of lights in same group break down, and can not affect the luminescence of whole chip.
In described LED point light source more than two, the LED point light source quantity often organized in LED point light source is equal.The light-emitting line of the LED luminescence chip that LED point light source can be made like this to form is average, consistent.
As preferably, described bullion support refers to aluminum metal support.The perfect heat-dissipating of aluminum metal, uses it can reduce the production cost of LED as metallic support simultaneously.
Assembled the LED formed by above-mentioned New LED luminescence chip, it is characterized in that: be composed in series by New LED luminescence chip more than two panels.
The present invention uses like this: as shown in Fig. 4 New LED luminescence chip internal circuit schematic diagram, LED point light source more than two is connected successively, often organize LED point light source parallel connection electrical connections all in LED point light source, circuit power is arranged on the left side of LED luminescence chip, is from left to right by the sense of current of LED luminescence chip.Assembled the LED formed by New LED luminescence chip, be then composed in series successively by New LED luminescence chip more than two panels.
The present invention possesses following outstanding advantages and effect relative to prior art:
1, New LED luminescence chip of the present invention is when assembling, only LED point light source more than two need be adjacent to is arranged on the bullion support of heat radiation, encapsulate after drawing wire again, it is simple for assembly process, greatly can improve the packaging efficiency of LED luminescence chip.
2, the present invention changes the radiating mode of LED point light source, improves the heat dispersion of LED luminescence chip, thus extends the useful life of LED luminescence chip.
3, on the basis reaching identical radiating effect, the radiating mode that radiating mode of the present invention adds aluminium base than existing use SMD lamp pearl saves 50% heat conduction aluminum section bar, reduces the production cost of LED luminescence chip.
4, the present invention by current uniform, can be distributed to multiple parallel circuits by the electric connection mode arranging LED point light source, reduces single LEDs point-source of light to the impact of whole light source, can solve LED light source easily dead lamp, the problem that optical attenuation is large simultaneously.
5, New LED luminescence chip assembling of the present invention forms LED, and easy to assembly, production cost is low, is more conducive to the universal of LED and promotes the use of.
Accompanying drawing explanation
Fig. 1 by three groups, often organize the structural representation of the New LED luminescence chip of the present invention that interior three LED point light source form;
Fig. 2 is the cross sectional representation of one group of LED point light source in Fig. 1;
Fig. 3 is three groups, often organizes the internal circuit schematic diagram of the New LED luminescence chip of the present invention of interior three LED point light source composition;
Fig. 4 is the internal circuit schematic diagram of the New LED luminescence chip that the present invention is made up of N number of LED point light source in N group, often group;
Wherein, 1 be LED luminescence chip, 2 be metallic support, 3 for LED point light source, 4 be the first wire welding area, 5 be the second wire welding area.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail, but embodiments of the present invention are not limited thereto.
Embodiment
Below for by three groups, often organize the LED luminescence chip that interior three LED point light source form and be described.
By three groups, often organize the structural representation of the New LED luminescence chip 1 that interior three LED point light source form as shown in Figure 1 (do not comprise outside encapsulating structure), the cross sectional representation of one group of LED point light source as shown in Figure 2: three groups of LED point light source 3 back sides are directly fixed on bullion support 2.Wherein, the cross section of bullion support 2 in " convex " shape, three LED point light source 3 often in group are evenly distributed, be close to be fixed on bullion support 2 tip platform on.The arrangement mode of LED point light source 3 can need to arrange according to the bright dipping of light fixture product.
As shown in Figure 2, the both sides platform of bullion support 2 tip platform is respectively arranged with the first wire welding area 4 and the second wire welding area 5; Three groups of LED point light source 3 by the first wire welding area 4 and the second wire welding area 5 to realize and outside electrical connection.First wire welding area 4 and the second wire welding area 5 can be formed by conductor bar, facilitate LED point light source 3 to realize electrical connection.The first wire welding area 4 that conductor bar is formed and the top plan of the second wire welding area 5 and the plane of bullion support 2 tip platform are positioned in same level.
The present invention by three groups, often organize the internal circuit schematic diagram of the New LED luminescence chip that interior three LED point light source form as shown in Figure 3, three LED point light source in same group of LED point light source are parallel with one another, three groups of LED point light source are connected successively, composition New LED luminescence chip.
LED of the present invention is electrically connected with external power supply to assemble again after then being connected by LED luminescence chip more than two and is formed.The electric connection mode of the LED point light source in this LED luminescence chip can by current uniform, be distributed to multiple parallel circuits, reduce single LEDs point-source of light to the impact of whole light source, thus the useful life of LED luminescence chip can be extended, LED luminescence chip easily dead lamp can be solved, the problem that optical attenuation is large simultaneously.
Above-mentioned LED luminescence chip may extend to and is made up of N number of LED point light source in N group, often group, and its internal circuit schematic diagram as shown in Figure 4.
Above-described embodiment is the present invention's preferably execution mode; but embodiments of the present invention are not restricted to the described embodiments; change, the modification done under other any does not deviate from Spirit Essence of the present invention and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (6)
1. a New LED luminescence chip, overall package is carried out in outside, it is characterized in that: be electrically connected by LED point light source more than two and form, the LED point light source back side more than two is all directly fixed on metallic support; The bullion support of described metallic support to be cross section be " convex " shape, the LED point light source back side more than two is all directly fixed on the tip platform of bullion support; The both sides platform of described bullion cantilever tip platform is respectively arranged with the first wire welding area and the second wire welding area; Described LED point light source more than two by the first wire welding area and the second wire welding area to realize and outside electrical connection; Described first wire welding area and the second wire welding area refer to the conductor bar on the both sides platform being separately fixed at bullion cantilever tip platform; Described LED point light source more than two by conductor bar to realize and outside electrical connection; The top plan of described conductor bar and the plane of bullion cantilever tip platform are same level; Fit in the tip platform both sides of described conductor bar and metallic support; " mouth " shape of described conductor bar and bullion support formation rule.
2. New LED luminescence chip according to claim 1, is characterized in that: in described LED point light source more than two, often organizes LED point light source all in LED point light source in parallel; Connect between group.
3. New LED luminescence chip according to claim 2, is characterized in that: in described LED point light source more than two, and the LED point light source quantity often organized in LED point light source is equal.
4. New LED luminescence chip according to claim 2, is characterized in that: described bullion support refers to aluminum metal support.
5. assembled the LED formed by New LED luminescence chip according to claim 1, it is characterized in that: be composed in series by New LED luminescence chip more than two panels.
6. assembled the LED formed by New LED luminescence chip according to claim 3, it is characterized in that: be composed in series by New LED luminescence chip more than two panels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210072034.2A CN102569284B (en) | 2012-03-16 | 2012-03-16 | The LED that New LED luminescence chip and assembling thereof are formed |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210072034.2A CN102569284B (en) | 2012-03-16 | 2012-03-16 | The LED that New LED luminescence chip and assembling thereof are formed |
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| CN102569284A CN102569284A (en) | 2012-07-11 |
| CN102569284B true CN102569284B (en) | 2016-03-30 |
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| CN103531109A (en) * | 2013-11-04 | 2014-01-22 | 广东威创视讯科技股份有限公司 | Method for solving failure of LED display screen and manufacturing method of LED display screen |
| CN105627122B (en) * | 2016-03-30 | 2018-11-27 | 湖南粤港模科实业有限公司 | It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1466782A (en) * | 2001-08-28 | 2004-01-07 | ���µ繤��ʽ���� | Lighting device using LED |
| CN1577909A (en) * | 2003-07-17 | 2005-02-09 | 丰田合成株式会社 | Illuminating device |
| CN101101908A (en) * | 2006-07-07 | 2008-01-09 | 启萌科技有限公司 | Light emitting diode module |
| CN202040616U (en) * | 2011-04-18 | 2011-11-16 | 广东科立盈光电技术有限公司 | Integrated large-power LED (light-emitting diode) light source |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101307880B (en) * | 2008-06-12 | 2011-09-28 | 茅建生 | Highly effective curved face reflecting type LED power optical module group |
| CN101387384A (en) * | 2008-10-24 | 2009-03-18 | 上海医疗器械股份有限公司 | Operation astral lamp using LED as light source |
| CN101545587B (en) * | 2009-06-08 | 2010-09-01 | 刘素霞 | A preparation method of high-performance heat-radiating semiconductor planar light source |
| CN101737662B (en) * | 2010-01-18 | 2011-05-04 | 赵翼 | Method for manufacturing integrated packaged high-power LED illuminating light source, and LED illuminating lamp |
| CN102384372B (en) * | 2010-09-02 | 2015-05-20 | 杭州番飞光电科技有限公司 | Light emitting device of LED (light-emitting diode) area light source covered by optical film and production method thereof |
| CN202549839U (en) * | 2012-03-16 | 2012-11-21 | 广东科立盈光电技术有限公司 | Novel LED (Light-Emitting Diode) light-emitting chip and LED lamp formed by assembling same |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1466782A (en) * | 2001-08-28 | 2004-01-07 | ���µ繤��ʽ���� | Lighting device using LED |
| CN1577909A (en) * | 2003-07-17 | 2005-02-09 | 丰田合成株式会社 | Illuminating device |
| CN101101908A (en) * | 2006-07-07 | 2008-01-09 | 启萌科技有限公司 | Light emitting diode module |
| CN202040616U (en) * | 2011-04-18 | 2011-11-16 | 广东科立盈光电技术有限公司 | Integrated large-power LED (light-emitting diode) light source |
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Effective date of registration: 20190730 Address after: 528000 Lisheng Photoelectric Co., Ltd. Lishui Town, Nanhai District, Foshan City, Guangdong Province Patentee after: Foshan City LUX Electrical & Lighting Co., Ltd. Address before: 528251 Hantian Science and Technology City, 17 Guicheng Deep Sea Road, Nanhai District, Foshan City, Guangdong Province Patentee before: Guangdong Keliying Photoelectric Technology Co., Ltd. |
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