CN203023841U

CN203023841U - Four-pi light emission light-emitting diode (LED) luminous tube with chips inversely installed in transparent ceramic tube and illuminating lamp

Info

Publication number: CN203023841U
Application number: CN2012205427813U
Authority: CN
Inventors: 葛世潮
Original assignee: ZHEJIANG LEDISON OPTOELECTRONICS CO Ltd
Current assignee: ZHEJIANG LEDISON OPTOELECTRONICS CO Ltd
Priority date: 2012-10-22
Filing date: 2012-10-22
Publication date: 2013-06-26
Anticipated expiration: 2022-10-22

Abstract

Provided is a four-pi light emission light-emitting diode (LED) luminous tube with chips inversely installed in a transparent ceramic tube and an illuminating lamp. The four-pi light emission LED luminous tube with the chips inversely installed in the transparent ceramic tube comprises a vacuum sealed light pervious blister shell and an LED luminous tube core, wherein the vacuum sealed light pervious blister shell is formed by a light pervious shell body and a core column with an exhaust pipe in a heat sealed mode, and heat dissipation protective gas is filled in the vacuum sealed light pervious blister shell. The LED luminous tube core is fixed in the vacuum sealed light pervious blister shell, and comprises the transparent ceramic tube with a high-heat-conductivity coefficient, and at least one string of LED chips, wherein the LED chips are the same or different in luminous colors, and are inversely installed on the outer tube wall of the transparent ceramic tube. An LED chip electrode is led out of the vacuum sealed light pervious blister shell through an electrode outgoing line. An LED illuminating lamp is formed by at least one additional LED actuator, an electric coupler and the like. Compared with the prior art, the four-pi light emission LED luminous tube with the chips inversely installed in the transparent ceramic tube has the advantages of being good in heat dissipation, large in load power of the LED chips, high in output luminous flux, high in luminous efficiency, and the like. The four-pi light emission LED luminous tube with the chips inversely installed in the transparent ceramic tube is used for manufacturing high-luminous-flux LED illuminating lamps with an output luminous flux in a range from hundreds lumens to 20000lm, and also can be used as discrete luminous devices.

Description

Flip-chip is in 4 π light extracting LED luminous tube and illuminating lamps of crystalline ceramics pipe

Technical field

The utility model relates to 4 π light extracting LED luminous tubes in LED illuminating lamp and LED luminescent device, particularly 4 π light extracting LED luminous tubes and the LED illuminating lamp of a kind of LED chip upside-down mounting on the crystalline ceramics pipe; As discrete LED luminescent device and LED illuminating lamp.

Background technology

LED chip upside-down mounting (Flipchip) technology grew up in 1998, it directly sticks on the PN junction of sapphire GaN LED chip on the silicon carrier of thermal conductivity factor up to 125-150W/m-K, and then stick on silicon carrier heat sink with the high thermal conductivity coefficient material or radiator on.Heat exchange pattern and light that this flip chip technology has changed traditional positive packing technique take out mode.The heat that the LED PN junction of the positive packing technique of tradition produces when working will be the Sapphire Substrate of 25-46W/m-K through thermal conductivity factor, and then through heat-conducting glue to LED support, heat sink, metallic circuit (MPCB) or radiator, thermal resistance is large therebetween, thermally conductive pathways is long; This is not for low-power LED, for example direct insertion the and surface label LED of indication or the 20mA that uses of display is large problem, but be exactly large problem for illuminating hundreds of mA to the power-type LED of a few A electric currents, large thermal resistance easily causes the junction temperature of PN junction to raise, luminous efficiency descends, light decay strengthens, even burn inefficacy.Secondly, the PN junction issued light of the LED of this positive assembling structure simultaneously takes out from P-GaN, the electrical conductivity of P-GaN is low, need to precipitate again one deck current-diffusion layer on its surface, films such as Au, Ni, ITO, this current-diffusion layer and electric connection line thereof and electrical connection pad will absorb and block the light of part outgoing; Simultaneously, the refractive index of GaN is up to 2.3, and it is to only 25.8 ° of the critical angle θ c of the emergent light of air, and the light directly solid angle of outgoing is only 1/10 (solid angle=2 π (the 1-cos θ c)) of 2 π, most of light will pass through outgoing after Multi reflection, absorption, thereby has reduced luminous efficiency.

Inverted structure has overcome these shortcomings, and the PN junction of its LED directly contacts with the silicon substrate of high thermal conductivity coefficient, then is connected good heat dissipation effect with heat sink, MPCB, radiator etc. with heat-conducting glue, silver slurry or the tin slurry etc. of high thermal conductivity coefficient; Secondly, its light does not simultaneously take out from P-GaN, and simultaneously takes out from sapphire, and the current-diffusion layer of P-GaN can be thickeied, or adds one deck reflection layer, has eliminated again being in the light of electrode and lead-in wire simultaneously, thereby has improved light extraction efficiency, has namely improved luminous efficiency.

The PN junction of LED the probability of luminous son all directions in 4 π solid angles be identical, belong to 4 π luminous; Yet the light angle of emergence all≤2 π of above-mentioned formal dress or flip LED, 4 π are luminous to be become≤2 π bright dippings, wherein most of light to pass through Multi reflection, repeatedly absorb after outgoing, light outgoing efficient is low, namely luminous efficiency is low.

At present, generally all lower than 1000lm, luminous efficiency is 50-90lm/W approximately, and volume is large, Heavy Weight with the output light flux of the LED bulb lamp of above-mentioned technology; Be difficult to make the LED illuminating lamp that output light flux is higher, luminous efficiency is higher.

The high efficiency LED light-emitting section of a kind of LED chip P-N knot 4 π bright dippings of application before the applicant and with the LED bulb that it is made is seen Chinese patent application numbers 201010278760.0 and 201010610092.The 4 π bright dippings of LED chip PN junction, luminous efficiency is high, and need not to use metal heat sink; Can be made into output light flux and be 100-800lm, whole lamp efficiency and be lightweight, the LED illuminating lamp that volume is little of 110-180lm/W.But make high light flux more, for example during the illuminating lamp of several thousand lm, described light-emitting section bearing power is limited, is difficult to make high light flux LED illuminating lamp.

Summary of the invention

The purpose of this utility model is further to improve the LED heat dissipation problem of the PN junction 4 π bright dippings of LED, and provide 4 π light extracting LED luminous tube and the illuminating lamps of a kind of LED chip upside-down mounting in the crystalline ceramics pipe, can improve output light flux and the luminous efficiency of LED, be that hundreds of is to high light flux LED luminous tube and the illuminating lamp of 20000lm thereby can be made into output light flux.

The technical solution of the utility model is as follows:

The LED flip-chip that the utility model provides is in 4 π light extracting LED luminous tubes of crystalline ceramics pipe, and it comprises:

A printing opacity cell-shell, described printing opacity cell-shell is for by printing opacity housing and the vacuum seal printing opacity cell-shell that consists of with the stem stem sealing by fusing of blast pipe together; Described blast pipe is used for the printing opacity cell-shell first being vacuumized and being filled with heat radiation protection gas sealing by fusing afterwards again;

A LED luminous die that is fixed within described printing opacity cell-shell;

Described LED luminous die comprises:

The crystalline ceramics pipe of a high thermal conductivity coefficient;

At least a string identical illuminant colour or the not LED chip of identical illuminant colour of upside-down mounting on described crystalline ceramics pipe outer tube wall; Described upside-down mounting refers to: described a string at least identical illuminant colour or not the PN junction face of the LED chip of identical illuminant colour directly stick on the outer tube wall of crystalline ceramics pipe with transparent adhesive tape; The electrode of described LED chip is outside electrode outlet line is drawn the printing opacity cell-shell.

Described a string at least LED chip directly sticks on transparent adhesive tape on the outer tube wall of crystalline ceramics pipe, described a string at least identical illuminant colour or not the LED chip of identical illuminant colour mutually connected or connection in series-parallel by the wiring of chip electricity; Described a string at least identical illuminant colour or not two termination electrode lead-out wires of the LED chip of identical illuminant colour be fixed on crystalline ceramics pipe outer tube wall by fixture.

Described a string at least identical illuminant colour or not the LED chip of identical illuminant colour be blue light-emitting or/and the LED chip of ultraviolet light, described a string at least identical illuminant colour or be not coated with the first luminous bisque on the LED chip of identical illuminant colour; Described a string at least identical illuminant colour or LED chip and the crystalline ceramics pipe outer tube wall of identical illuminant colour also are not coated with the second luminous bisque.

Described a string at least identical illuminant colour or not the LED chip 5 of identical illuminant colour first be fixed on a transparency carrier with transparent adhesive tape, then apply substratum transparent and luminous bisque to consist of a LED light-emitting section in described LED chip and transparency carrier surrounding; Described LED light-emitting section uses the transparent adhesive tape upside-down mounting on the outer tube wall of crystalline ceramics pipe.

There is a groove 22 in the place that described crystalline ceramics pipe is installed the LED light-emitting section, and described LED light-emitting section is contained in described groove.

Described a string at least identical illuminant colour or not each LED chip of the LED chip of identical illuminant colour one or more PN junctions are arranged.

What the utility model provided has flip-chip in the illuminating lamp of 4 π light-emitting pipes of crystalline ceramics pipe, and it has one or more described LED luminous tubes, LED driver, drive enclosure and electric connector; The output of described driver is connected with described a string at least LED chip through described electrode outlet line, and the input of described driver is connected with electric connector through connecting line; Electric connector is used for connecting external power and lights the LED illuminating lamp; Described drive enclosure is interconnected to constitute a LED illuminating lamp with described LED chip upside-down mounting in 4 π light-emitting pipes, driver and the electric connector of crystalline ceramics pipe.

Described a string at least LED chip is connected or connection in series-parallel mutually, driven by outer direct current or alternating voltage, the voltage that external voltage is complementary through driver output and described a string at least LED chip, total driving voltage of described a string at least LED chip is the 20-200% of the peak value of outer driving DC voltage or alternating voltage.

Described LED luminous die is fixed in described printing opacity cell-shell with upper end fixture and fixing lower; Fixing lower and upper end fixture are wire or sheet metal.

Described printing opacity cell-shell is shaped as column type, A-type, G-type, R-type, BR-shape, PAR-type, T-type, candle type or existing a kind of in bulb-shaped.

LED chip issued light of the present utility model, for example for blue light or ultraviolet light, through a luminous bisque change the light of other look into, during for example for white light, with the transparent pipe surrounding, one deck luminescent powder layer at least can be arranged on LED chip, it can be transformed into required white light or the light of other look to the LED chip issued light; In order to obtain the white light of required colour temperature and development index, also can be added with simultaneously and glow or the chip of other coloured light.

LED chip of the present utility model can be with the first formal dress of transparent adhesive tape on a transparency carrier, and namely the Sapphire Substrate of LED chip simultaneously sticks on transparency carrier, and described transparency carrier is glass, plastics or ceramic wafer; Mutually be electrically connected to metal wire between each chip, chip surrounding or chip and transparency carrier surrounding have transparent adhesive tape and luminous bisque, consist of the LED light-emitting section of one 4 π bright dippings; Then, then use the transparent adhesive tape upside-down mounting on crystalline ceramics pipe 4 the LED light-emitting section, namely the PN junction of LED chip one side is installed towards the crystalline ceramics pipe; The heat that produces during the work of the PN junction of LED chip is conducted to the transparent pipe of high thermal conductivity coefficient and dissipates through transparent adhesive tape and luminous bisque.

For the thermocontact area that increases LED light-emitting section and crystalline ceramics pipe, to reduce LED chip to the thermal resistance of crystalline ceramics pipe, can there be a groove on the ground that described crystalline ceramics pipe is installed light-emitting section, the LED light-emitting section is arranged in groove with transparent adhesive tape, thereby reduces thermal resistance, raising heat transfer and heat-sinking capability.

Described LED luminous die is sealed and be fixed in a vacuum-packed printing opacity cell-shell, the electrode of LED chip is via drawing with the electrode outlet line of cell-shell sealing, be filled with heat radiation and protective gas in cell-shell, described heat radiation and protective gas are such as being the inert gases such as helium, hydrogen, helium hydrogen gaseous mixture, nitrogen or neon; Described LED luminous die and saturating envelope shell consist of a LED luminous tube that can work independently.

One or more LED luminous tube of the present utility model, add LED driver and drive enclosure and electric connector, consist of a LED lighting bulb.

Each chip can have one or more P-N knots.

The LED luminous tube of 4 π bright dippings of LED chip upside-down mounting of the present utility model and illuminating lamp compared with prior art have good heat dissipation, the LED chip bearing power is large, output light flux is high, the luminous efficiency advantages of higher.For the manufacture of output light flux be hundreds of to the high light flux LED illuminating lamp of 20000lm, also can be used as discrete illuminator.

Description of drawings

Fig. 1 is the structural representation of an embodiment of LED luminous tube of the 4 π bright dippings of LED chip upside-down mounting of the present utility model on the crystalline ceramics pipe.

Fig. 2 is the A-A cutaway view in Fig. 1.

Fig. 3 is also the schematic diagram of the A-A section in Fig. 1.

Fig. 4 is the structural representation with an embodiment of the LED illuminating lamp of the LED luminous tube of 4 π bright dippings of LED chip upside-down mounting of the present utility model.

The specific embodiment

Below in conjunction with accompanying drawing, the utility model is described in detail.

Fig. 1 is that LED chip upside-down mounting of the present utility model is in the structural representation of an embodiment of 4 π light extracting LED luminous tubes of crystalline ceramics pipe.

As shown in Figure 1, described LED luminous tube 1 includes a luminous die 2, a printing opacity cell-shell 3, described luminous die 2 includes a crystalline ceramics pipe 4, at least a string identical or LED chip not identical illuminant colour 5 by with transparent adhesive tape 6 upside-down mountings on the outer surface of crystalline ceramics pipe 4, described upside-down mounting is that the PN junction one side of LED chip 5 is installed towards crystalline ceramics pipe 4; Each LED chip 5 has one or more LED PN junctions, electric connection line 7 mutually series connection or the connection in series-parallel of the electrode of each LED chip 5 on the crystalline ceramics tube outer surface, two termination electrode lead-out wire 9a of series connection or series-parallel chip are fixed on crystalline ceramics pipe 4 by fixture 8, and electrode outlet line 9 draws through printing opacity cell-shell 3, is used for connecting outer operating voltage; Described LED luminous die 2 is fixed in printing opacity cell-shell 3 with lower fixture 10 and upper fixture 11; Be filled with heat radiation protection gas 12 in printing opacity cell-shell 3, described heat radiation protection gas 12 is inert gas or their gaseous mixture or the dry airs such as helium, hydrogen, helium hydrogen gaseous mixture, nitrogen or neon.

The PN junction of described LED chip 5 directly sticks on the crystalline ceramics pipe 4 of high thermal conductivity coefficient through skim transparent adhesive tape 6, the heat that produces during LED work is transmitted on crystalline ceramics pipe 4 very soon, this crystalline ceramics pipe 4 has the area of dissipation more much bigger than LED chip 5, its heat easily through crystalline ceramics pipe 4 surface conductive to heat radiation protection gas 12, through convection current and the conduction of heat radiation protection gas 12, dissipate through printing opacity cell-shell 3 again; Thereby reduced the PN junction of LED chip 5 to the thermal resistance of printing opacity cell-shell 3, effectively reduce the temperature rise of LED chip 5, improve load capacity, luminous efficiency and the output light flux of LED chip 5, simultaneously, also can use the larger LED chip of rated current, to reduce LED chip quantity and connecting line number thereof, enhance productivity and yield rate, thereby make output light flux up to the high light flux LED luminous tube of 800-20000lm.

The described electrode fixing device 8 of fixing two termination electrode lead-out wire 9a can be high-temp glue, high temperature plastics, pottery, modified resin, low-melting glass or silver slurry etc. and makes.

Described printing opacity cell-shell 3 consists of by printing opacity housing 3a with the stem stem 3c sealing by fusing of blast pipe 3b, electrode outlet line 9, and blast pipe 3b is used for printing opacity cell-shell 3 is vacuumized and be filled with the rear sealing by fusing of heat radiation protection gas 12, the air seal that is filled with in printing opacity cell-shell 3.

Described LED luminous die 2 has respectively upper end fixture 11 and fixing lower 10 to be fixed in printing opacity cell-shell 3; Fixing lower 11 and upper end fixture 10 can be wire or sheet metal etc.; One end of its fixing lower 10 and crystalline ceramics pipe 4 are fixing, and the other end and electrode outlet line 9 are fixing, and be less at crystalline ceramics pipe 4, when weight is lighter, can directly be fixed with stem stem 3c by electrode outlet line 9, and namely fixing lower 10 can.

Described a string at least LED chip 5 is monochromatic light chip or multiple illuminant colour chip, obtaining monochromatic light or heterogeneous light mixed-color light, such as getting white light with the chip hybrid such as red, blue, green.

Be the chip of blue light-emitting or ultraviolet light at described a string at least LED chip 5, and need to be transformed into the light time of other look to described blue light or ultraviolet light to it with luminescent powder, one deck luminescent powder layer 13 is at least arranged on described LED chip 5 and crystalline ceramics pipe 4, see in detail Fig. 2.

Described printing opacity cell-shell 3 be shaped as column type, A-type, G-type, R-type, BR-shape, PAR-type, T-type, candle type or existing a kind of in bulb-shaped.

Fig. 2 is the structural representation of an embodiment of the A-A section of Fig. 1.As shown in Figure 2, two layers of luminous bisque are arranged on LED chip 5, wherein the first luminous bisque 13a covers on LED chip, and the second luminous bisque 13b covers on LED chip 5 and crystalline ceramics pipe 4; The one side of the installation LED chip 5 of crystalline ceramics pipe 4 is provided with a plane 14 that facilitates chip to install; Described luminous bisque is mixed by luminescent powder and transparent medium.Identical in the meaning of the digital representative of other in Fig. 2 and Fig. 1.

Fig. 3 is the another structural representation of the A-A section of Fig. 1.As shown in Figure 3, described a string at least identical or LED chip 5 first formal dress of use transparent adhesive tape 15 not identical illuminant colour are on a transparency carrier 16, the Sapphire Substrate that is LED chip 5 simultaneously sticks on transparency carrier 16, and transparency carrier 16 is glass, plastics or ceramic wafer; Mutually be electrically connected to metal wire 17 between each LED chip, LED chip 5 and transparency carrier 16 surroundings have transparent adhesive tape 18 and luminous bisque 19, consist of the LED light-emitting section 20 of one 4 π bright dippings, then, described LED light-emitting section 20 use transparent adhesive tape 21 upside-down mountings are on crystalline ceramics pipe 4, and namely the PN junction of LED chip 5 is installed towards crystalline ceramics pipe 4; The heat that produces during the work of the PN junction of LED chip 5 through transparent adhesive tape 21 and 19 conduction of luminous bisque to the crystalline ceramics pipe 4 of high thermal conductivity coefficient and dissipate; In order to increase the heat transfer contact area of light-emitting section 20 and crystalline ceramics pipe 4, a groove 22 can be arranged on crystalline ceramics pipe 4, light-emitting section 20 is arranged in described groove, so that LED chip 5 better dispels the heat.The technique of this method is fairly simple, but the PN junction of LED chip 5 will pass through luminous bisque to the heat radiation approach of transparent pipe 4, and thermal resistance is larger.

Figure 4 shows that the structural representation of an embodiment of the LED illuminating lamp made from the LED luminous tube of LED chip upside-down mounting of the present utility model on the crystalline ceramics pipe.As shown in Figure 4,1 is the LED luminous tube of LED chip upside-down mounting of the present utility model on the crystalline ceramics pipe, 23 is the driver of LED, 24 is drive enclosure, 25 is electric connector, and drive enclosure 24 is interconnected to constitute a LED illuminating lamp 26 to LED luminous tube 1, driver 23 and electric connector 25; The output of driver 23 is connected with the electrode outlet line 9 of LED luminous tube, and its input is connected with electric connector 25 through connecting line 27, and electric connector 25 is used for connecting external power, connects external power, gets final product lightening LED lamp 26.

Series connection or the connection in series-parallel mutually of described a string at least LED chip 5, driven by outer direct current or alternating voltage, external voltage exports through driver 23 voltage that is complementary with described LED, and the total driving voltage of the LED after described series connection or connection in series-parallel is the 20-200% of the peak value of outer driving DC voltage or alternating voltage.

Described LED illuminating lamp 26 can have one or more LED luminous tubes 1 of the present utility model, is that hundreds of is to the high light flux LED illuminating lamp of 20000lm to make single tube or multitube LED illuminating lamp, to can be made into output light flux.

Each embodiment that the claimed scope of the utility model is not limited to introduce herein, all belongs to the scope that the utility model patent contains at all various forms of conversion of doing based on the utility model claim and description and replacement.

Claims

1. a flip-chip is in 4 π light extracting LED luminous tubes of crystalline ceramics pipe, and it comprises:

A LED luminous die that is fixed within described printing opacity cell-shell;

Described LED luminous die comprises:

The crystalline ceramics pipe of a high thermal conductivity coefficient;

2. press flip-chip claimed in claim 1 in 4 π light extracting LED luminous tubes of crystalline ceramics pipe, it is characterized in that, described a string at least LED chip directly sticks on transparent adhesive tape on the outer tube wall of crystalline ceramics pipe, described a string at least identical illuminant colour or not the LED chip of identical illuminant colour mutually connected or connection in series-parallel by the wiring of chip electricity; Described a string at least identical illuminant colour or not two termination electrode lead-out wires of the LED chip of identical illuminant colour be fixed on crystalline ceramics pipe outer tube wall by fixture.

3. press the described flip-chip of claim 1 or 2 in 4 π light extracting LED luminous tubes of crystalline ceramics pipe, it is characterized in that, described a string at least identical illuminant colour or not the LED chip of identical illuminant colour be blue light-emitting or/and the LED chip of ultraviolet light, described a string at least identical illuminant colour or be not coated with the first luminous bisque on the LED chip of identical illuminant colour; Described a string at least identical illuminant colour or LED chip and the crystalline ceramics pipe outer tube wall of identical illuminant colour also are not coated with the second luminous bisque.

4. press flip-chip claimed in claim 1 in 4 π light extracting LED luminous tubes of crystalline ceramics pipe, it is characterized in that, described a string at least identical illuminant colour or not the LED chip of identical illuminant colour first be fixed on transparent adhesive tape on a transparency carrier, apply substratum transparent and luminous bisque at described LED chip and transparency carrier surrounding again, to consist of a LED light-emitting section; On the outer tube wall of crystalline ceramics pipe, namely chip PN junction one side is arranged on the outer tube wall of crystalline ceramics pipe towards the crystalline ceramics pipe described LED light-emitting section with the transparent adhesive tape upside-down mounting.

5. press flip-chip claimed in claim 4 in 4 π light extracting LED luminous tubes of crystalline ceramics pipe, it is characterized in that, there is a groove in the place that described crystalline ceramics pipe is installed the LED light-emitting section, and described LED light-emitting section is contained in described groove.

By flip-chip claimed in claim 1 in 4 π light extracting LED luminous tubes of crystalline ceramics pipe, it is characterized in that, described a string at least identical illuminant colour or not each LED chip of the LED chip of identical illuminant colour one or more LEDPN knot is arranged.

7. one kind has flip-chip in the illuminating lamp of 4 π light extracting LED luminous tubes of crystalline ceramics pipe, it is characterized in that, it has one or more described LED luminous tubes, LED driver, drive enclosure and electric connector; The output of described driver is connected with described a string at least LED chip through described electrode outlet line, and the input of described driver is connected with electric connector through connecting line; Electric connector is used for connecting external power and lights the LED illuminating lamp; Described drive enclosure is interconnected to constitute a LED illuminating lamp with described LED chip upside-down mounting in 4 π light-emitting pipes, driver and the electric connector of crystalline ceramics pipe.

8. has flip-chip in the illuminating lamp of 4 π light extracting LED luminous tubes of crystalline ceramics pipe by claimed in claim 7, it is characterized in that, described a string at least LED chip is connected or connection in series-parallel mutually, driven by outer direct current or alternating voltage, the voltage that external voltage is complementary through driver output and described a string at least LED chip, total driving voltage of described a string at least LED chip is the 20-200% of the peak value of outer driving DC voltage or alternating voltage.

9. have flip-chip in the illuminating lamp of 4 π light extracting LED luminous tubes of crystalline ceramics pipe by claimed in claim 7, it is characterized in that, described LED luminous die is fixed in described printing opacity cell-shell with upper end fixture and fixing lower; Fixing lower and upper end fixture are wire or sheet metal.

10. has flip-chip in the illuminating lamp of 4 π light extracting LED luminous tubes of crystalline ceramics pipe by claimed in claim 7, it is characterized in that, described printing opacity cell-shell is shaped as a kind of in column type, A-type, G-type, R-type, BR-shape, PAR-type, T-type or candle shape bulb shape.