CN101650007A - Power alternating current LED light source - Google Patents
Power alternating current LED light source Download PDFInfo
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- CN101650007A CN101650007A CN200810021686A CN200810021686A CN101650007A CN 101650007 A CN101650007 A CN 101650007A CN 200810021686 A CN200810021686 A CN 200810021686A CN 200810021686 A CN200810021686 A CN 200810021686A CN 101650007 A CN101650007 A CN 101650007A
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Abstract
The invention provides a power alternating current LED light source, which directly adopts an alternating current power supply and avoids using a complex drive circuit. In the power alternating current LED light source, an LED chip is directly packaged on a printed circuit board, power and chip are integrated, and functions of a surface light source are realized. The structure of the power alternating current LED light source comprises an alternating current input end, LED chips, an inductor and a capacitor, wherein a plurality of LED chips are serially connected in rows, a plurality of rows are parallelly connected, and the conducting directions of two adjacent rows of LED chips are opposite; and meanwhile, chips in different rows can also be longitudinally connected to form a grid structure. The capacitor and the inductor, which have proper capacities, are parallelly connected at two parallelly connected end points opposite in conducting directions and are serially connected to forman energy oscillatory circuit to eliminate the flash frequency of a light source. The power alternating current LED light source has an excellent radiation function and uniform light emission effect and can be used as a common semiconductor light source for various lamps.
Description
Technical field
The present invention relates to a kind of led light source, especially relate to a kind of power alternating current LED lighting source, belong to technical field of semiconductor illumination.
Background technology
At present, power stage LED product has two kinds of implementations: the one, adopt single large tracts of land power stage led chip encapsulation, and the U.S., Japan have had the product of 5W chip to introduce to the market, need the constant-current driving power supply power supply of low-voltage, high-current, and its price is also than higher; Another kind is to adopt small-power chip integration mode to realize power stage LED, and the PANASONIC electrician has developed the integrated LED product of 20W.Yet, but exist many insoluble technical problems such as the circuit power consumption is big, system reliability is low under the low-voltage, high-current condition for remote constant-current driving power supply power supply because power stage LED works.Present lighting field adopts the most general common interchange illumination that surely belongs to, and the existing common AC power (for example city's electrical network of alternating current 220V, interchange 110V city electrical network etc.) that adopts can roughly be divided into two kinds of situations for the drive circuit scheme of LED power supply: a kind of is to obtain DC driven by links such as traditional AC transformation, rectification, series connection voltage stabilizings; Another kind is to adopt advanced Switching Power Supply directly to produce required D.C. regulated power supply.Both have shortcomings such as cost height, energy consumption are big, complex structure.Because such scheme in fact all is to resupply LED after alternating current is converted into direct current, therefore, in fact is not the LED illuminating lamp that directly adopts Alternating Current Power Supply.
On the other hand, the combination of single led chip package parts is difficulty quite, seems very loaded down with trivial details in structural design and assembling, and the heat conduction path of each LED after the combination is widely different, and the heat of the monomer LED that has can not get fully distributing, and influences overall work.At present, for the encapsulation of the led chip more than the 3W, run into bigger difficulty aspect heat radiation, great power LED list lamp packaging cost is higher, will directly increase the light fixture cost, directly has influence on the promotion and application of great power LED at lighting field.
Summary of the invention
The objective of the invention is effectively to solve the deficiency that prior art exists, a kind of direct employing Alternating Current Power Supply is provided and need not the led light source of complicated drive circuit, led chip directly encapsulates at printed circuit board (PCB), the integrated power chip is in one, function with area source becomes the general semiconductor lighting source module that is fit to all kinds of lightings.
Technical solution of the present invention is: power alternating current LED light source, comprise ac input end, LED wafer, inductance and electric capacity, it is characterized in that: two wafer cells of LED wafer formation in parallel that conducting direction is opposite, several wafer cell series connection are embarked on journey, in parallel between the multirow, at two wafer end points in parallel that conducting direction is opposite, be parallel with the electric capacity and the inductance of suitable capacity, both series connection constitute the energy oscillation circuit.
Further, above-mentioned power alternating current LED light source, wherein, every row is often referred to horizontal direction, vertically connects between the chips in different rows again, makes the LED wafer form latticed array structure.
Further, above-mentioned power alternating current LED light source, wherein, described LED wafer directly welds or is mounted on metal or the non-metal base printed circuit board (PCB), dispose reflection bowl and connecting structure for electrical equipment around the LED wafer, the light-emitting window envelope of LED wafer has silicon class transparent resin, and its surface is curve form, forms optical lens.
Again further, above-mentioned power alternating current LED light source, wherein, described printed circuit board (PCB) is that thickness is the aluminum or aluminum alloy sheet material of 0.5～4mm, be provided with the bowl pockets reverberation bowl in the LED wafer zone that is welded, its diameter is 0.5～4mm, and the degree of depth is 03～1mm, is the polishing silvered face around the pit reverberation bowl.
Again further, above-mentioned power alternating current LED light source, wherein, described printed circuit board (PCB) is provided with two above LED wafer welding regions, and is provided with electrical connector socket at the upper and lower side of printed circuit board (PCB).
Again further, above-mentioned power alternating current LED light source, wherein, this power alternating current LED light source is the red, green, blue monochromatic source; Or with different LED wafer combination results white lights.
The outstanding substantive distinguishing features and the obvious improvement of technical solution of the present invention is mainly reflected in:
1. a kind of LED lighting source of direct incoming transport electricity is provided, drive circuits such as the alternating current-direct current rectification adopted in the available circuit scheme, voltage stabilizing, filtering have been saved, only the alternating current LED light source that operating voltage need be adapted directly is connected on the AC power, just can provide economical and LED illumination efficiently.
2. adopt the integrated chip architecture of series connection, can promptly produce satisfactory LED PN junction integral substrates such as operating voltage, color, can reduce the cost of producing design greatly, improve product reliability in the stage of LED wafer manufacturing; The great power LED bare chip directly can also be encapsulated on the metallic circuit, gold thread connects each chip, and manufacturing process simplifies greatly, and product cost obviously reduces, and realizes modularization, standardization, large-scale production.
3. adopt transverse circuit to connect two opposite row LED wafer row of conducting direction; make two groups of adjacent LED wafers protecting component each other; as wherein certain LED wafer open circuit or short circuit in a group; another group LED of reverse parallel connection can provide current channel with it; although should inefficacy LED no longer luminous, Chuan Lian other LED still can work on it.
4. design chips reverberation bowl and bright plated film on metallic circuit adopt the novel silica gel of high reliability and high light transmittance that chip is carried out sealing, by special-purpose process mould moulding, make the transparent resin surface produce special curved surface in the hot setting process.And utilize the optical lens of particular design to adjust, and can control rising angle and light distribution effectively, the integral heat sink performance of light source and go out light effect and significantly improve, powerful spot light becomes luminous uniform surface light source, has improved euphorosia.
5. at the opposite wafer of two conducting directions end points in parallel, the electric capacity of suitable capacity in parallel and series inductance, shunt capacitance and series inductance are formed an oscillating circuit, and when guaranteeing the ac power waveform zero passage, the bust of voltage and current the light source stroboscopic can not occur.
6. can produce white LED light source after the encapsulation of this light source, also can join the light source that corresponding fluorescent material obtains other color with different wafers.
Description of drawings
Below in conjunction with accompanying drawing technical solution of the present invention is described further.
Fig. 1 is that the present invention forms structural representation;
Fig. 2 is that 110V AC LED wafer is formed the array structure schematic diagram;
Fig. 3 is that 220V AC LED wafer is formed the array structure schematic diagram;
Fig. 4 is a LED chip package structure schematic diagram.
Among the figure: C-electric capacity, L-inductance, ε
1, ε
2-alternating current interface, 1-input, 2-printed circuit board (PCB), 3-resin, 4-LED wafer, 5-pit reverberation bowl, 6-gold thread, 7-inductance, 8-electric capacity.
The specific embodiment
The invention provides a kind of power alternating current LED light source, it forms structure as shown in Figure 1, comprises ac input end ε
1, ε
2, the LED wafer, inductance L and capacitor C, described AC LED wafer multirow is arranged in parallel, and every row forms by several LED wafer tandem, and two adjacent row conducting directions are opposite, and every row is often referred to horizontal direction.Simultaneously, can also vertically connect between the wafer cell in these different rows, form latticed array structure.At two wafer end points in parallel that conducting direction is opposite, the capacitor C of suitable capacity in parallel and inductance L, both series connection constitute the energy oscillation circuit, to eliminate the stroboscopic of light source.Described wafer cell can be the combination with several LED wafers of above-mentioned array structure, can adopt different version to different wafer cells as required in one group of wafer array.
Fig. 2 is the array structure that 110V AC LED wafer is formed: about 40 LED wafer tandem become delegation, and capable being connected in parallel of total n formed LED wafer array; Simultaneously, have horizontal connection between the LED wafer of different rows, make described LED wafer array have latticed structure.Similarly, in the middle of the 220V AC LED wafer array structure shown in Figure 3, about 80 LED wafer tandem become delegation, and capable being connected in parallel of total m formed LED wafer array.In when design, note making the size of current of the operating voltage of respectively organizing LED wafer array in parallel and forward and reverse conducting identical or approaching, according to the watt level of single led wafer, can integratedly be packaged into the light source module that power is 5W～50W.In addition, in order to improve the overall brightness of light source, can also increase the line number of series connection integrated wafer or the area of increase single file series connection integrated wafer.
In the above-described embodiment; the number that is packaged into the LED wafer of integrated optical source can be determined according to the size requirements of operating voltage; adopt transverse circuit to connect two opposite row LED wafer row of conducting direction; make two groups of adjacent LED wafers protecting component each other; as wherein certain LED wafer open circuit or short circuit in a group; another group LED of reverse parallel connection can provide current channel with it, although should inefficacy LED no longer luminous, Chuan Lian other LED still can work on it.LED-based high reliability and long-life characteristics, even integrated level is quite high, the probability that breaks down also is very little.
Further, above-mentioned power alternating current LED light source, process (the COB of employing direct packaged LED wafer on circuit board, Chip on Board), the integrated power chip is in one, and size reduces, compact conformation, the integrated level height has improved the radiating effect of light fixture, has realized the superthin structure design of light fixture.Its encapsulating structure as shown in Figure 4, printed circuit board (PCB) 2 is taked integrated design with LED wafer 4, the incoming end 1 of each LED wafer 4 is set on printed circuit board (PCB) 2, and suitable inductance 7 and the electric capacity 8 of installed capacity, incoming end 1 is electrically connected with LED wafer 4 by gold thread 6.Number is more, the gap is thinner because circuit board is reached the standard grade, consider the heat radiation factor, pit reverberation bowl 5 is set, become the light echo area through polishing after silver-plated around the pit reverberation bowl 5 at printed circuit onboard led wafer welding region, have good reflecting effect, reach the purpose that is lifted out optical efficiency.Impact style or slotting cutter method for milling are taked in the processing of pit reverberation bowl 5, and its diameter is 0.5～4mm, and the about 0.3～1mm of the degree of depth, LED wafer 4 directly weld or are mounted on above the printed circuit board (PCB) 2 of pit reverberation bowl 5 bottoms.
Because the light characteristic of LED is different with incandescent lamp bulb and fluorescent lamp, photochromic uniformity is extremely important.Power alternating current LED lighting source of the present invention, exiting surface sealing novel silicon class transparent resin at reverberation bowl 5 inner LED wafers 4, its solid refractive index is between air and LED wafer, in the hot setting process, pass through special-purpose process mould moulding, make the transparent resin surface produce special curved surface, shown in the mark among Fig. 43, shape has a certain degree, thereby light can efficiently be shone.This curved surface forms light scattering face through the optical design of specialty, makes the high-power LED spot light become luminous uniform surface light source, improves the uniformity and the soft property of light.
The LED wafer can form the area source of low cost, Highgrade integration through after the above-mentioned process encapsulation, has superior heat sinking function and uniform luminous effect.Wherein, it is the metal of high thermal conductivities such as copper, aluminium, aluminium nitride, boron nitride, carborundum, silica, pottery of 0.5～4mm or nonmetal that printed circuit board (PCB) adopts thickness more, preferred carbofrax material.When adopting carborundum sheet material, on carborundum plate, paste a layer insulating, and on insulating barrier, carry out the copper laminating and close, finish the processing of carborundum circuit board by related process.
Power alternating current LED light source of the present invention both can occur with the form of monomer product, also can form a kind of product of multiple-unit boundling form.During concrete enforcement, two above led chip welding regions are set on metal or non-metal base printed circuit board (PCB), the connectivity port that the same design in the position up and down of product has normal pitch, and setting is electrically connected solder joint on circuit board, guarantees electrical safety and insulation.Further, can be equipped with electrical connector socket, according to the needs of application scenario they be carried out serial or parallel connection and expanded, make the light source of this cluster type can adapt to various application lightings, have great flexibility.
According to technical solution of the present invention, constitute the capacitor C and the inductance L of energy oscillation circuit, its capacity is selected according to the configuration of LED wafer and concrete application scenario and is determined that during assurance ac power waveform zero passage, the bust of voltage and current the light source stroboscopic can not occur.Selected LED wafer can be the monochromatic LED wafer, mates corresponding fluorescent material, is packaged into the monochromatic source of different colours; Also can use the LED wafer combination results white light of different colours.
Claims (6)
1, power alternating current LED light source, comprise ac input end, LED wafer, inductance and electric capacity, it is characterized in that: two wafer cells of LED wafer formation in parallel that conducting direction is opposite, several wafer cell series connection are embarked on journey, in parallel between the multirow, at two wafer end points in parallel that conducting direction is opposite, be parallel with the electric capacity and the inductance of suitable capacity, both series connection constitute the energy oscillation circuit.
2, power alternating current LED light source according to claim 1 is characterized in that: vertically connect between the chips in different rows, make the LED wafer form latticed array structure.
3, power alternating current LED light source according to claim 1 and 2, it is characterized in that: described LED wafer directly welds or is mounted on metal or the non-metal base printed circuit board (PCB), dispose reflection bowl and connecting structure for electrical equipment around the LED wafer, the light-emitting window envelope of LED wafer has silicon class transparent resin, its surface is curve form, forms optical lens.
4, power alternating current LED light source according to claim 3, it is characterized in that: described printed circuit board (PCB) is that thickness is the aluminum or aluminum alloy sheet material of 0.5～4mm, be provided with the bowl pockets reverberation bowl in the LED wafer zone that is welded, its diameter is 0.5～4mm, the degree of depth is 0.3～1mm, is the polishing silvered face around the pit reverberation bowl.
5, power alternating current LED light source according to claim 3 is characterized in that: described printed circuit board (PCB) is provided with two above LED wafer welding regions, and is provided with electrical connector socket at the upper and lower side of printed circuit board (PCB).
6, power alternating current LED light source according to claim 1 is characterized in that: this power alternating current LED light source is the red, green, blue monochromatic source, or with different LED wafer combination results white lights.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810021686A CN101650007A (en) | 2008-08-14 | 2008-08-14 | Power alternating current LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810021686A CN101650007A (en) | 2008-08-14 | 2008-08-14 | Power alternating current LED light source |
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|---|---|
| CN101650007A true CN101650007A (en) | 2010-02-17 |
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ID=41672300
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| CN200810021686A Pending CN101650007A (en) | 2008-08-14 | 2008-08-14 | Power alternating current LED light source |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101902856A (en) * | 2010-07-05 | 2010-12-01 | 陆敬仁 | Another method for driving common LED by alternating current |
| CN102883505A (en) * | 2012-09-21 | 2013-01-16 | 深圳Tcl新技术有限公司 | LED (light-emitting diode) driving circuit, method and LED lamp bar |
| CN103118461A (en) * | 2013-02-04 | 2013-05-22 | 天目照明有限公司 | Alternating-current-driven light emitting diode circuit and lighting device |
| CN103810947A (en) * | 2013-09-22 | 2014-05-21 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | LED display screen and manufacturing technology thereof |
| CN105226169A (en) * | 2015-11-04 | 2016-01-06 | 安徽湛蓝光电科技有限公司 | A kind of alternating current LED light source |
| TWI589182B (en) * | 2016-03-28 | 2017-06-21 | 勝德國際研發股份有限公司 | Power outlet device and led control circuit thereof |
| WO2024087427A1 (en) * | 2022-10-26 | 2024-05-02 | 象朵创芯微电子(苏州)有限公司 | Small light-emitting diode (led) module and preparation method therefor |
-
2008
- 2008-08-14 CN CN200810021686A patent/CN101650007A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101902856A (en) * | 2010-07-05 | 2010-12-01 | 陆敬仁 | Another method for driving common LED by alternating current |
| CN102883505A (en) * | 2012-09-21 | 2013-01-16 | 深圳Tcl新技术有限公司 | LED (light-emitting diode) driving circuit, method and LED lamp bar |
| CN103118461A (en) * | 2013-02-04 | 2013-05-22 | 天目照明有限公司 | Alternating-current-driven light emitting diode circuit and lighting device |
| CN103810947A (en) * | 2013-09-22 | 2014-05-21 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | LED display screen and manufacturing technology thereof |
| CN105226169A (en) * | 2015-11-04 | 2016-01-06 | 安徽湛蓝光电科技有限公司 | A kind of alternating current LED light source |
| TWI589182B (en) * | 2016-03-28 | 2017-06-21 | 勝德國際研發股份有限公司 | Power outlet device and led control circuit thereof |
| WO2024087427A1 (en) * | 2022-10-26 | 2024-05-02 | 象朵创芯微电子(苏州)有限公司 | Small light-emitting diode (led) module and preparation method therefor |
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Open date: 20100217 |