CN102644904A - Light-mixing-type polycrystalline packaging structure - Google Patents
Light-mixing-type polycrystalline packaging structure Download PDFInfo
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- CN102644904A CN102644904A CN2011100416850A CN201110041685A CN102644904A CN 102644904 A CN102644904 A CN 102644904A CN 2011100416850 A CN2011100416850 A CN 2011100416850A CN 201110041685 A CN201110041685 A CN 201110041685A CN 102644904 A CN102644904 A CN 102644904A
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Abstract
The invention relates to a light-mixing-type polycrystalline packaging structure, which comprises a substrate unit, a light-emitting unit, a frame unit and a packaging unit. The first light-emitting module of the light-emitting unit is provided with a plurality of red light-emitting diode crystal grains which are arranged on the substrate unit. The second light-emitting module of the light-emitting unit is provided with a plurality of blue light-emitting diode crystal grains which are arranged on the substrate unit. The first surrounding-type frame colloids of the frame unit surround the first light-emitting module. The second surrounding-type frame colloids of the frame unit surround the second light-emitting module and the first surrounding-type frame colloids. The transparent colloids and the fluorescent colloids of the packaging unit respectively cover the first light-emitting module and the second light-emitting module. Color rendering is improved through mutual light mixing of a red light source produced after the red light-emitting diode crystal grains are matched with the transparent colloids and a white light source produced after the blue light-emitting diode crystal grains are matched with the fluorescent colloids.
Description
Technical field
The present invention relates to a kind of light-mixed type polycrystalline encapsulating structure, refer to a kind of light-mixed type polycrystalline encapsulating structure that is used to increase color rendering especially.
Background technology
The invention of electric light can be described as the life style that has changed the whole mankind up hill and dale, if our life does not have electric light, when night or weather conditions are not good, the work of all will be stopped; If be subject to illumination, building construction mode or human life style are thoroughly changed, therefore the whole mankind will can't improve, the age that stays on and fall behind.Be with, today employed on the market lighting apparatus, for example: fluorescent lamp, tengsten lamp even the more popular till now Electricity-saving lamp bulb of being accepted are widely used in the middle of the daily life all.Yet this type of electric light has fast, the high power consumption of optical attenuation mostly, be easy to generate high heat, the life-span is short, frangible or shortcoming such as difficult recovery.Therefore, in order to solve the above problems, use the made ray structure of light emitting diode in response to and give birth to.Yet tradition uses the made ray structure of light emitting diode that the not enough situation of color rendering is all arranged.
Summary of the invention
Technical problem to be solved by this invention is, to the deficiency of prior art a kind of light-mixed type polycrystalline encapsulating structure is provided, and it can be used for increasing color rendering.
In order to solve the problems of the technologies described above, the invention provides a kind of light-mixed type polycrystalline encapsulating structure, it comprises: a base board unit, a luminescence unit, a frame unit and an encapsulation unit.Base board unit has a substrate body and at least two crystal areas that are arranged at the substrate body upper surface.Luminescence unit has at least one first light emitting module and at least one second light emitting module that is used to produce blue light that is used to produce ruddiness; Wherein first light emitting module has the red light emitting diodes crystal grain on a plurality of wherein crystal areas that electrically are arranged at base board unit, and second light emitting module has the blue LED crystal grain on a plurality of other crystal areas that electrically are arranged at base board unit.The frame unit has mode through coating and forms at least one first of substrate body upper surface with center on and center on formula frame colloid and at least one second and center on formula frame colloid; Wherein first around formula frame colloid around first light emitting module; To form at least one wherein spacing space of first colloid of top, a crystal area that is positioned at; And second around formula frame colloid around second light emitting module and first around formula frame colloid, with form at least one above the other crystal area and first around the spacing space of second colloid that formula frame colloid and second centers between the formula frame colloid.Encapsulation unit has and is arranged at a transparent colloid and the fluorescent colloid of substrate body upper surface to cover first light emitting module and second light emitting module respectively; Wherein transparent colloid is limited in the spacing space of first colloid, and fluorescent colloid is limited in the spacing space of second colloid.Therefore, a plurality of red light emitting diodes crystal grain cooperate with transparent colloid and are positioned at inner ring, and a plurality of blue LED crystal grain cooperates with fluorescent colloid and is positioned at the outer ring.
The present invention also provides a kind of light-mixed type polycrystalline encapsulating structure, and it comprises:
One base board unit, it has a substrate body and at least two crystal areas that are arranged at this substrate body upper surface;
One luminescence unit; It has at least one first light emitting module and at least one second light emitting module that is used to produce blue light that is used to produce ruddiness; Wherein above-mentioned at least one first light emitting module has the red light emitting diodes crystal grain on a plurality of wherein crystal areas that electrically are arranged at this base board unit, and above-mentioned at least one second light emitting module has the blue LED crystal grain on a plurality of other crystal areas that electrically are arranged at this base board unit;
One frame unit; It has mode through coating and forms at least one first of this substrate body upper surface with center on and center on formula frame colloid and at least one second and center on formula frame colloid; Wherein above-mentioned at least one first around formula frame colloid around above-mentioned at least one second light emitting module; To form at least one wherein spacing space of first colloid of top, a crystal area that is positioned at; And above-mentioned at least one second around formula frame colloid around above-mentioned at least one first light emitting module and above-mentioned at least one first around formula frame colloid, with form at least one above the other crystal area and above-mentioned at least one first around the spacing space of second colloid that formula frame colloid and above-mentioned at least one second centers between the formula frame colloid; And
One encapsulation unit; It has and is arranged at a transparent colloid and the fluorescent colloid of this substrate body upper surface to cover above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module respectively; Wherein this fluorescent colloid is limited in the spacing space of above-mentioned at least one first colloid, and this transparent colloid is limited in the spacing space of above-mentioned at least one second colloid.
The present invention provides a kind of light-mixed type polycrystalline encapsulating structure in addition, and it comprises: a base board unit, a luminescence unit, a frame unit and an encapsulation unit.What they were different with above-mentioned two kinds of light-mixed type polycrystalline encapsulating structures is: can use a plurality of red light-emitting components to get for a plurality of red light emitting diodes crystal grain, and the use that can omit transparent colloid.In other words, a plurality of red light-emitting components of first light emitting module are because of encapsulating completion, thus can be directly mode through SMT be electrically connected at base board unit.
In other words, the present invention provides a kind of light-mixed type polycrystalline encapsulating structure in addition, and it comprises:
One base board unit, it has a substrate body and at least two crystal areas that are arranged at this substrate body upper surface;
One luminescence unit; It has at least one first light emitting module and at least one second light emitting module that is used to produce blue light that is used to produce ruddiness; Wherein above-mentioned at least one first light emitting module has the red light-emitting component on a plurality of wherein crystal areas that electrically are arranged at this base board unit, and above-mentioned at least one second light emitting module has the blue LED crystal grain on a plurality of other crystal areas that electrically are arranged at this base board unit;
One frame unit; It has mode through coating and forms at least one first of this substrate body upper surface with center on and center on formula frame colloid and at least one second and center on formula frame colloid; Wherein above-mentioned at least one first around formula frame colloid around above-mentioned at least one first light emitting module; And above-mentioned at least one second around formula frame colloid around above-mentioned at least one second light emitting module and above-mentioned at least one first around formula frame colloid, with form at least one above the above-mentioned other crystal area and above-mentioned at least one first around the spacing space of colloid that formula frame colloid and above-mentioned at least one second centers between the formula frame colloid; And
One encapsulation unit, it has one and is arranged at this substrate body upper surface to cover the fluorescent colloid of above-mentioned at least one second light emitting module, and wherein this fluorescent colloid is limited in the spacing space of above-mentioned at least one colloid.
The present invention also provides a kind of light-mixed type polycrystalline encapsulating structure, and it comprises: a base board unit, a luminescence unit, a frame unit and an encapsulation unit.What they were different with above-mentioned any light-mixed type polycrystalline encapsulating structure is: a plurality of red light emitting diodes crystal grain cooperate with transparent colloid and are positioned at the outer ring, and a plurality of blue LED crystal grain cooperates with fluorescent colloid and is positioned at inner ring.
In other words, the present invention provides a kind of light-mixed type polycrystalline encapsulating structure in addition, and it comprises:
One base board unit, it has a substrate body and at least two crystal areas that are arranged at this substrate body upper surface;
One luminescence unit; It has at least one first light emitting module and at least one second light emitting module that is used to produce blue light that is used to produce ruddiness; Wherein above-mentioned at least one first light emitting module has the red light-emitting component on a plurality of wherein crystal areas that electrically are arranged at this base board unit, and above-mentioned at least one second light emitting module has the blue LED crystal grain on a plurality of other crystal areas that electrically are arranged at this base board unit;
One frame unit; It has mode through coating and forms at least one first of this substrate body upper surface with center on and center on formula frame colloid and at least one second and center on formula frame colloid; Wherein above-mentioned at least one first around formula frame colloid around above-mentioned at least one second light emitting module; Forming at least one spacing space of colloid that is positioned at top, a crystal area wherein, and above-mentioned at least one second around formula frame colloid around above-mentioned at least one first light emitting module and above-mentioned at least one first around formula frame colloid; And
One encapsulation unit, it has one and is arranged at this substrate body upper surface to cover the fluorescent colloid of above-mentioned at least one second light emitting module, and wherein this fluorescent colloid is limited in the spacing space of above-mentioned at least one colloid.
In sum; Polycrystalline encapsulating structure provided by the present invention; It can produce the mixed light effect each other through " a plurality of red light emitting diodes crystal grain cooperate the red light source (or a plurality of red light-emitting component that has encapsulated completion) that produced of back with transparent colloid " and " blue LED crystal grain cooperates the back white light source that is produced with fluorescent colloid ", so lifting light-mixed type polycrystalline encapsulating structure of the present invention the color rendering that can appear.
In order further to understand characteristic of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide reference and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Figure 1A is the schematic top plan view of the embodiment of the invention one;
Figure 1B is the side-looking generalized section of the embodiment of the invention one;
Fig. 1 C is the spectrogram after the embodiment of the invention one is carried out mixed light;
Fig. 1 D is the functional block diagram of the embodiment of the invention one;
Fig. 1 E is the circuit diagram that the embodiment of the invention one is selected two current limliting chips for use;
Fig. 2 is the schematic top plan view of the embodiment of the invention two;
Fig. 3 is the side-looking generalized section of the embodiment of the invention three;
Fig. 4 is the side-looking generalized section of the embodiment of the invention four;
Fig. 5 is the schematic top plan view of the embodiment of the invention five;
Fig. 6 is the schematic top plan view of the embodiment of the invention six;
Fig. 7 uses the local schematic top plan view of a plurality of subsequent use weld pads for the present invention;
Fig. 8 A uses the local schematic side view of other a kind of circuit substrate for the present invention; And
Fig. 8 B uses the local schematic side view of another circuit substrate in addition for the present invention.
[main element description of reference numerals]
Light-mixed type polycrystalline encapsulating structure M
First group of ray structure N1
Second group of ray structure N2
Electrode layer 100 '
Heat dissipating layer 101
Conductive welding pad 102
Insulating barrier 103
Crystal area 11
The first light emitting module 2a red light emitting diodes crystal grain 20a
Anodal 201a
Red light-emitting component 20a '
The second light emitting module 2b blue LED crystal grain 20b
Anodal 201b
Second around formula frame colloid 30b
The 3rd around formula frame colloid 30c
Engagement lugs 300
The spacing space 300a of first colloid
The spacing space 300a ' of colloid
The spacing space 300b of second colloid
The spacing space 300b ' of colloid
Circular arc tangential line T
Angle θ
Height H
Width W
Light tight colloid 40c
Current limliting unit C current limliting chip C1
The lead unit W first lead W1
The second lead W2
Decide voltage source supplies device S
Adhesion body A1
Electric conductor A2
The specific embodiment
Embodiment one
See also shown in Figure 1A and Figure 1B, the embodiment of the invention one provides a kind of light-mixed type polycrystalline encapsulating structure M, and it comprises: a base board unit 1, a luminescence unit, a frame unit 3 and an encapsulation unit 4.
Luminescence unit has at least one first light emitting module 2a and at least one second light emitting module 2b that is used to produce blue light that is used to produce ruddiness; Wherein the first light emitting module 2a has red light emitting diodes crystal grain (the not naked crystalline substance of the encapsulation) 20a on a plurality of wherein crystal areas 11 that electrically are arranged at base board unit 1, and the second light emitting module 2b has blue LED crystal grain (naked crystalline substance) 20b on a plurality of other crystal areas 11 that electrically are arranged at base board unit 1.In other words; The designer can cook up at least two predetermined crystal areas 11 in advance on base board unit 1, so that above-mentioned a plurality of red light emitting diodes crystal grain 20a and above-mentioned a plurality of blue LED crystal grain 20b can electrically be arranged on respectively on two crystal areas 11 of base board unit 1 through the mode of routing.
Moreover; First and second all has an engagement lugs 300 (or a coupling recess) around formula frame colloid 30a, 30b; That is when first and second centered on finishing soon around the shaping production process of formula frame colloid 30a, 30b, engagement lugs 300 (or a coupling recess) promptly can produce naturally.In addition; First and second upper surface around formula frame colloid 30a, 30b is all a circular arc; First and second all can be between 40 degree to 50 degree with respect to the angle θ of the circular arc tangential line T of substrate body 10 upper surfaces around formula frame colloid 30a, 30b; First and second end face around formula frame colloid 30a, 30b all can be between between the 0.3mm to 0.7mm with respect to the height H of substrate body 10 upper surfaces; First and second width W around formula frame colloid 30a, 30b bottom all can be between between the 1.5mm to 3mm; First and second all can be between 4 to 6 around the thixotropic index (thixotropic index) of formula frame colloid 30a, 30b, and first and second is all the white hot sclerosis frame colloid that an inside has inorganic interpolation particle around formula frame colloid 30a, 30b.
In addition, the first group of ray structure N1 that is arranged at inner ring comprises: substrate body 10, a plurality of red light emitting diodes crystal grain 20a, first are around formula frame colloid 30a and transparent colloid 40a.The second group of ray structure N2 that is arranged at the outer ring comprises: substrate body 10, a plurality of blue LED crystal grain 20b, second are around formula frame colloid 30b and fluorescent colloid 40b.Moreover; According to different design requirements; First group of ray structure N1 and second group of ray structure N2 can shared same base board units 1 (example of being takeed like embodiment one) or use different base board units respectively, and first group of ray structure N1 and second group of ray structure N2 are combined into light-mixed type polycrystalline encapsulating structure M of the present invention.
In addition; As the spectrogram shown in Fig. 1 C; Because " a plurality of red light emitting diodes crystal grain 20a cooperate the back to be produced with transparent colloid 40a red light source " can produce the mixed light effect each other with " blue LED crystal grain 20b cooperates the back to be produced with fluorescent colloid 40b white light source "; And then promote the color rendering (for example, the on average lifting of color rendering Ra, the lifting of particularly positive red color rendering R9) that light-mixed type polycrystalline encapsulating structure M of the present invention institute can appear.Is that 24 (V) are under the condition of 1.25 (A) with electric current about this case at voltage, and resulting related experiment data are as follows:
| Luminous flux | 2872.629(Lumen) |
| Luminous power | 8.266(W) |
| Luminous efficiency | 95.251(Lumen/W) |
| CIE x and CIE y | 0.4289 with 0.3814 |
| CIE u ' and CIE v ' | 0.2553 with 0.5109 |
| Relative colour temperature | 2946.9(K) |
| Color rendering R9 | 37.468 |
| Average color rendering Ra | 90.128 |
Moreover; Light-mixed type polycrystalline encapsulating structure M further comprises: a current limliting unit C, its have at least two electrical (for example routing modes) be arranged at substrate body 10 upper surfaces and with second around the current limliting chip C1 of a formula frame colloid 30b specific range separated from one another.In addition; Frame unit 3 has at least two modes through coating and forms in substrate body 10 upper surfaces with center on and center on formula frame colloid 30c around the 3rd of above-mentioned two current limliting chip C1 respectively that (its preparation method centers on formula frame colloid 30a with above-mentioned first and second, 30b is identical; And above-mentioned two the 3rd around formula frame colloid 30c one-tenth one also capable of being combined be used for simultaneously around above-mentioned two current limliting chip C1 the 3rd around formula frame colloid); And encapsulation unit 4 has at least two and covers above-mentioned two current limliting chip C1 respectively and centered on the light tight colloid 40c that formula frame colloid 30c is centered on by above-mentioned two the 3rd respectively, receives the irradiation of light and produces the situation of damage to avoid above-mentioned two current limliting chip C1.
In addition; Base board unit 1 has at least one heat insulation slit 12 that runs through substrate body 10, and heat insulation slit 12 is positioned between luminescence unit (that is the first light emitting module 2a and second light emitting module 2b) and the current limliting unit C or center between the formula frame colloid 30c with the 3rd around formula frame colloid 30b second.Therefore, through the use of heat insulation slit 12, the heat that can significantly reduce between current limliting unit C and the luminescence unit passes the path, and then makes the present invention can effectively slow down the speed that heat that one or more current limliting chip C1 by current limliting unit C produced conducts to luminescence unit.
See also shown in Fig. 1 D and Fig. 1 E; The first light emitting module 2a can be electrically connected at substrate body 10 via parallelly connected mode with the second light emitting module 2b; Among above-mentioned a plurality of red light emitting diodes chip 20a and two the current limliting chip C1 one of them electrically connected each other, and above-mentioned a plurality of blue led chips 20b electrically connects with the another one among two current limliting chip C1 each other.Because can be used as bridge and the conduct decided between the voltage source supplies device S and the first light emitting module 2a, current limliting chip C1 decides the bridge between the voltage source supplies device S and the second light emitting module 2b, so that luminescence unit can obtain stable electric current supply from deciding voltage source supplies device S.
Certainly; Above-mentioned a plurality of red light emitting diodes chip 20a can be parallel with one another and form the red light emitting diodes chip group of a parallel connection; Above-mentioned a plurality of blue led chips 20b also can be divided into the blue led chips group of a plurality of parallel connections, and the red light emitting diodes chip group of above-mentioned parallel connection can be cascaded with a plurality of parallelly connected blue led chips groups.In addition, above-mentioned a plurality of red light emitting diodes chip 20a can be lighted simultaneously, also can carry out subregion point not (that is having only the red light emitting diodes chip 20a of part to be lighted).Above-mentioned a plurality of blue led chips 20b can be lighted simultaneously, also can carry out subregion point not (that is having only the blue led chips 20b of part to be lighted).
Embodiment two
See also shown in Figure 2ly, the embodiment of the invention two provides a kind of light-mixed type polycrystalline encapsulating structure M.Comparison by Fig. 2 and Fig. 1 can be known; The embodiment of the invention two is with embodiment one maximum difference: in embodiment two; Put upside down each other the position of the first light emitting module 2a and the second light emitting module 2b, and make the light emitting module 2a that wins be placed in the outer ring, and the second light emitting module 2b is placed in inner ring.In other words; First around formula frame colloid 30a around the second light emitting module 2b; Second around formula frame colloid 30b around the first light emitting module 2a and first around formula frame colloid 30a, and the first light emitting module 2a is arranged at first and centers between the formula frame colloid 30b with second around formula frame colloid 30a.Fluorescent colloid 40b is limited in the spacing space 300a of first colloid, and transparent colloid 40a is limited in the spacing space 300b of second colloid.
Therefore; The present invention can be along with designer's demand; And first group of ray structure N1 that will have " a plurality of red light emitting diodes crystal grain 20a and transparent colloid 40a " is arranged at inner ring; And second group of ray structure N2 that will have " blue LED crystal grain 20b and fluorescent colloid 40b " be arranged at first group of ray structure N1 that outer ring (shown in embodiment one) maybe will have " a plurality of red light emitting diodes crystal grain 20a and transparent colloid 40a " and be arranged at the outer ring, and second group of ray structure N2 that will have " blue LED crystal grain 20b and fluorescent colloid 40b " is arranged at inner ring (shown in embodiment two).
Embodiment three
See also shown in Figure 3ly, the embodiment of the invention three provides a kind of light-mixed type polycrystalline encapsulating structure M, and it comprises: a base board unit 1, a luminescence unit, a frame unit 3 and an encapsulation unit 4.Different being that the embodiment of the invention three and embodiment one are maximum: in embodiment three, according to different design requirements, first can be wherein a kind of in transparent colloid or the fluorescent colloid around formula frame colloid 30a and second around formula frame colloid 30b.For instance; The present invention can optionally add fluorescent material along with different demands and center in the formula frame colloid 30b around formula frame colloid 30a and second in first; The bright dipping so that light source can be led between transparent colloid 40a and the fluorescent colloid 40b (as among the figure upwards or shown in the arrow tiltedly), and then reduce the blanking bar situation between transparent colloid 40a and the fluorescent colloid 40b.
Embodiment four
See also shown in Figure 4ly, the embodiment of the invention four provides a kind of light-mixed type polycrystalline encapsulating structure M, and it comprises: a base board unit 1, a luminescence unit, a frame unit 3 and an encapsulation unit 4.Different being that the embodiment of the invention four and embodiment one are maximum: in embodiment four, according to different design requirements, first can be transparent colloid or fluorescent colloid around formula frame colloid 30a, and second can be reflective colloid around formula frame colloid 30b.For instance; The present invention can optionally add fluorescent material along with different demands and center on formula frame colloid 30a in first; The bright dipping so that light source can be led between transparent colloid 40a and the fluorescent colloid 40b (shown in the arrow that makes progress among the figure), and then reduce the blanking bar situation between transparent colloid 40a and the fluorescent colloid 40b.In addition because second around formula frame colloid 30b be reflective colloid, so that the light source that light-mixed type polycrystalline encapsulating structure M is launched can obtain preferable spotlight effect.
Embodiment five
See also shown in Figure 5ly, the embodiment of the invention five provides a kind of light-mixed type polycrystalline encapsulating structure M, and it comprises: a base board unit 1, a luminescence unit, a frame unit 3 and an encapsulation unit 4.Base board unit 1 has substrate body 10 and at least two crystal areas 11 that are arranged at substrate body 10 upper surfaces.Luminescence unit has at least one first light emitting module 2a and at least one second light emitting module 2b that is used to produce blue light that is used to produce ruddiness; Wherein the first light emitting module 2a has red light-emitting component 20a ' on a plurality of wherein crystal areas 11 that electrically are arranged at base board unit 1 (for example each red light-emitting component 20a ' can be the red LED potted element that encapsulates completion; It can be electrically connected at base board unit 1 through the mode of SMT), and the second light emitting module 2b has the blue LED crystal grain 20b on a plurality of other crystal areas 11 that electrically are arranged at base board unit 1.Frame unit 3 has mode through coating and forms at least one first of substrate body 10 upper surfaces with center on and center on formula frame colloid 30a and at least one second and center on formula frame colloid 30b; Wherein first around formula frame colloid 30a around the first light emitting module 2a; And second around formula frame colloid 30b around the second light emitting module 2b and first around formula frame colloid 30a, at least one above the other crystal area 11 and at the first spacing space 300b ' of colloid that center between the formula frame colloid 30b around formula frame colloid 30a and second to form.First and second all has an engagement lugs 300 (or a coupling recess) around formula frame colloid 30a, 30b.Encapsulation unit 4 has one and is arranged at substrate body 10 upper surfaces to cover the fluorescent colloid 40b of the second light emitting module 2b, and wherein fluorescent colloid 40b is limited in the spacing space 300b ' of colloid.
Embodiment six
See also shown in Figure 6ly, the embodiment of the invention six provides a kind of light-mixed type polycrystalline encapsulating structure M, and it comprises: a base board unit 1, a luminescence unit, a frame unit 3 and an encapsulation unit 4.Base board unit 1 has substrate body 10 and at least two crystal areas 11 that are arranged at substrate body 10 upper surfaces.Luminescence unit has at least one first light emitting module 2a and at least one second light emitting module 2b that is used to produce blue light that is used to produce ruddiness; Wherein the first light emitting module 2a has red light-emitting component 20a ' on a plurality of wherein crystal areas 11 that electrically are arranged at base board unit 1 (for example each red light-emitting component 20a ' can be the red LED potted element that encapsulates completion; It can be electrically connected at base board unit 1 through the mode of SMT), and the second light emitting module 2b has the blue LED crystal grain 20b on a plurality of other crystal areas 11 that electrically are arranged at base board unit 1.Frame unit 3 has mode through coating and forms at least one first of substrate body 10 upper surfaces with center on and center on formula frame colloid 30a and at least one second and center on formula frame colloid 30b; Wherein first around formula frame colloid 30a around the second light emitting module 2b; At least onely be positioned at the wherein spacing space 300a ' of colloid of 11 tops, a crystal area to form, and second around formula frame colloid 30b around the first light emitting module 2a and first around formula frame colloid 30a.Encapsulation unit 4 has one and is arranged at substrate body 10 upper surfaces to cover the fluorescent colloid 40b of the second light emitting module 2b, and wherein fluorescent colloid 40b is limited in the spacing space 300a ' of colloid.
Embodiment one to embodiment five
See also shown in Figure 7ly, in the embodiment of the invention one to embodiment five, base board unit 1 has a plurality of anodal weld pad P and a plurality of negative pole weld pad N that are arranged at substrate body 10 upper surfaces that are arranged at substrate body 10 upper surfaces; Wherein each red light emitting diodes chip 20a has an anodal 201a and a negative pole 202a; The anodal 201a of each red light emitting diodes chip 20a is corresponding at least two among above-mentioned a plurality of anodal weld pad P, and the negative pole 202a of each red light emitting diodes chip 20a is corresponding at least two among above-mentioned a plurality of negative pole weld pad N; Wherein each blue led chips 20b has an anodal 201b and a negative pole 202b; The anodal 201b of each blue led chips 20b is corresponding at least two among above-mentioned a plurality of anodal weld pad P, and the negative pole 202b of each blue led chips 20b is corresponding at least two among above-mentioned a plurality of negative pole weld pad N.
Moreover light-mixed type polycrystalline encapsulating structure M further comprises: a lead unit W, and it has many first lead W1 and many second lead W2; Wherein per two first lead W1 be electrically connected between the anodal 201a of each red light emitting diodes chip 20a and among above-mentioned at least two pairing anodal weld pad P one of them respectively and be electrically connected at the negative pole 202a of each red light emitting diodes chip 20a and among above-mentioned at least two pairing negative pole weld pad N one of them between; Wherein per two second lead W2 be electrically connected between the anodal 201b of each blue led chips 20b and among above-mentioned at least two pairing anodal weld pad P one of them respectively and be electrically connected at the negative pole 202b of each blue led chips 20b and among above-mentioned at least two pairing negative pole weld pad N one of them between.
With red light emitting diodes chip 20a is example; Because the anodal 201a of each red light emitting diodes chip 20a and negative pole 202a have at least one subsequent use anodal weld pad P and at least one subsequent use negative pole weld pad N respectively; So when terminal the beating at (being welded on) one of them anodal weld pad P or negative pole weld pad N of the first lead W1 gone up and (caused floating the weldering during failure; That is first produce between lead W1 and " anodal weld pad P or the negative pole weld pad N " electrically connect); The producer need not remove because of the routing failure and be formed at the lip-deep welding slag of anodal weld pad P (or the lip-deep welding slag of negative pole weld pad N); The end of the first lead W1 can be beaten on the anodal weld pad P of another one (or another one negative pole weld pad N), with the time (promoting the efficient of routing) of saving routing and the success rate that increases routing.
Embodiment one to embodiment five
See also shown in Fig. 8 A, in the embodiment of the invention one to embodiment five, circuit substrate 100 has two electrode layers 100 ', and it can be positive electrode and negative electrode respectively.Wherein, Each red light emitting diodes chip 20a can be through an adhesion body A1 to be fixed in wherein on the electrode layer 100 '; And the positive pole (figure does not show) that is positioned at the upper surface of each red light emitting diodes chip 20a can pass through two first lead W1 respectively with negative pole (figure does not show), to be electrically connected at above-mentioned two electrode layers 100 ' respectively.Each blue led chips 20b also can be through an adhesion body A1 to be fixed in wherein on the electrode layer 100 '; And the positive pole (figure does not show) that is positioned at the upper surface of each blue led chips 20b can pass through two second lead W2 respectively with negative pole (figure does not show), to be electrically connected at above-mentioned two electrode layers 100 ' respectively.
See also shown in Fig. 8 B, in the embodiment of the invention one to embodiment five, circuit substrate 100 has two electrode layers 100 ', and it can be positive electrode and negative electrode respectively.Wherein, A wherein electrode (figure does not show) that is positioned at the lower surface of each red light emitting diodes chip 20a can be through an electric conductor A2 to fix and to be electrically connected at a wherein electrode layer 100 '; And an other electrode (figure does not show) that is positioned at the upper surface of each red light emitting diodes chip 20a can pass through one first lead W1, to be electrically connected at an other electrode layer 100 '.A wherein electrode (figure does not show) that is positioned at the lower surface of each blue led chips 20b can be through an electric conductor A2 to fix and to be electrically connected at a wherein electrode layer 100 '; And an other electrode (figure does not show) that is positioned at the upper surface of each blue led chips 20b can pass through one second lead W2, to be electrically connected at an other electrode layer 100 '.
In sum; Because " a plurality of red light emitting diodes crystal grain cooperate the red light source (or a plurality of red light-emitting component that has encapsulated completion) that produced of back with transparent colloid " and " blue LED crystal grain cooperates the white light source that is then produced with fluorescent colloid " can produce the mixed light effect each other, so lifting light-mixed type polycrystalline encapsulating structure of the present invention the color rendering that can appear.
In addition; The mode of the present invention through coating be shaped one can be arbitrary shape around formula frame colloid (around formula white colloid); And through around the surface configuration of formula frame colloid with the position of limiting to a printing opacity packing colloid (transparent colloid or printing opacity colloid) and adjustment printing opacity packing colloid, so the present invention can (improve the luminous efficiency of LED crystal particle) and (rising angle of control LED crystal particle).In other words, through use,, and then can control (use amount of printing opacity packing colloid and position) so that the printing opacity packing colloid is limited in the spacing space of colloid around formula frame colloid.Moreover use amount and position through control printing opacity packing colloid, with the surface configuration and the height of adjustment printing opacity packing colloid, and then (controlling the rising angle of the light beam that a plurality of LED crystal particle produces).In addition, the present invention also can be through around the use of formula frame colloid, produces reflection so that the light beam that a plurality of LED crystal particle produced projects around the inwall of formula frame colloid, and then can increase luminous efficiency of the present invention.
The above is merely preferable possible embodiments of the present invention, and is non-so limit to scope of patent protection of the present invention, so the equivalence techniques that all utilizations specification of the present invention and accompanying drawing content are done changes, all is contained in the scope of the present invention.
Claims (20)
1. a light-mixed type polycrystalline encapsulating structure is characterized in that, comprising:
One base board unit, it has a substrate body and at least two crystal areas that are arranged at this substrate body upper surface;
One luminescence unit; It has at least one first light emitting module and at least one second light emitting module that is used to produce blue light that is used to produce ruddiness; Wherein above-mentioned at least one first light emitting module has the red light emitting diodes crystal grain on a plurality of wherein crystal areas that electrically are arranged at this base board unit, and above-mentioned at least one second light emitting module has the blue LED crystal grain on a plurality of other crystal areas that electrically are arranged at this base board unit;
One frame unit; It has mode through coating and forms at least one first of this substrate body upper surface with center on and center on formula frame colloid and at least one second and center on formula frame colloid; Wherein above-mentioned at least one first around formula frame colloid around above-mentioned at least one first light emitting module; To form at least one wherein spacing space of first colloid of top, a crystal area that is positioned at; And above-mentioned at least one second around formula frame colloid around above-mentioned at least one second light emitting module and above-mentioned at least one first around formula frame colloid, with form at least one above the other crystal area and above-mentioned at least one first around the spacing space of second colloid that formula frame colloid and above-mentioned at least one second centers between the formula frame colloid; And
One encapsulation unit; It has and is arranged at a transparent colloid and the fluorescent colloid of this substrate body upper surface to cover above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module respectively; Wherein this transparent colloid is limited in the spacing space of above-mentioned at least one first colloid, and this fluorescent colloid is limited in the spacing space of above-mentioned at least one second colloid.
2. light-mixed type polycrystalline encapsulating structure as claimed in claim 1 is characterized in that, above-mentioned at least one first and second all has an engagement lugs or a coupling recess around formula frame colloid.
3. light-mixed type polycrystalline encapsulating structure as claimed in claim 1; It is characterized in that; Above-mentioned at least one first centers on formula frame colloid around formula frame colloid and above-mentioned at least one second is arranged in a concentric circles; Above-mentioned at least one second light emitting module is arranged at above-mentioned at least one first and centers on formula frame colloid and above-mentioned at least one second around between the formula frame colloid, and above-mentioned a plurality of blue LED crystal grain centers on formula frame colloid around above-mentioned at least one first.
4. light-mixed type polycrystalline encapsulating structure as claimed in claim 1; It is characterized in that; Above-mentioned at least one first around formula frame colloid be transparent colloid or fluorescent colloid, and above-mentioned at least one second around formula frame colloid be transparent colloid, fluorescent colloid or reflective colloid.
5. light-mixed type polycrystalline encapsulating structure as claimed in claim 1; It is characterized in that; Above-mentioned at least one first and second upper surface around formula frame colloid is all a circular arc; Above-mentioned at least one first and second all spent between 50 degree between 40 with respect to the angle of the circular arc tangential line of this substrate body upper surface around formula frame colloid; Above-mentioned at least one first and second around the end face of formula frame colloid with respect to the height of this substrate body upper surface all between between the 0.3mm to 0.7mm; Above-mentioned at least one first and second around the width of formula frame colloid bottom all between between the 1.5mm to 3mm, above-mentioned at least one first and second around the thixotropic index of formula frame colloid all between 4 to 6, and above-mentioned at least one first and second is all the white hot sclerosis frame colloid that an inside has inorganic interpolation particle around formula frame colloid.
6. light-mixed type polycrystalline encapsulating structure as claimed in claim 1 is characterized in that, this base board unit has a plurality of anodal weld pad and a plurality of negative pole weld pads that are arranged at this substrate body upper surface that are arranged at this substrate body upper surface; Wherein each red light emitting diodes chip has an anodal and negative pole; The positive pole of each red light emitting diodes chip is corresponding at least two in above-mentioned a plurality of anodal weld pads, and the negative pole of each red light emitting diodes chip is corresponding at least two in above-mentioned a plurality of negative pole weld pads; Wherein each blue led chips has an anodal and negative pole; The positive pole of each blue led chips is corresponding at least two in above-mentioned a plurality of anodal weld pads, and the negative pole of each blue led chips is corresponding at least two in above-mentioned a plurality of negative pole weld pads.
7. light-mixed type polycrystalline encapsulating structure as claimed in claim 6 is characterized in that, further comprises: a lead unit, and it has many first leads and many second leads; Wherein per two first leads be electrically connected between the positive pole of each red light emitting diodes chip and in above-mentioned at least two pairing anodal weld pads one of them respectively and be electrically connected at the negative pole of each red light emitting diodes chip and in above-mentioned at least two pairing negative pole weld pads one of them between; Wherein per two second leads be electrically connected between the positive pole of each blue led chips and in above-mentioned at least two pairing anodal weld pads one of them respectively and be electrically connected at the negative pole of each blue led chips and in above-mentioned at least two pairing negative pole weld pads one of them between.
8. light-mixed type polycrystalline encapsulating structure as claimed in claim 1; It is characterized in that; Further comprise: a current limliting unit; It has at least two electrically be arranged at this substrate body upper surface and with above-mentioned at least one second around the current limliting chip of a formula frame colloid specific range separated from one another; Wherein this frame unit has at least two modes through coating and forms in this substrate body upper surface with center on and center on the 3rd of above-mentioned at least two current limliting chips respectively and center on formula frame colloid; This encapsulation unit has at least two and covers above-mentioned at least two current limliting chips respectively and centered on the light tight colloids that formula frame colloid is centered on by above-mentioned at least two the 3rd respectively; Above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module are electrically connected at this substrate body in parallel; In above-mentioned a plurality of red light emitting diodes chip and above-mentioned at least two the current limliting chips one of them electrically connected each other, and above-mentioned a plurality of blue led chips is electrically connected each other with the another one in above-mentioned two current limliting chips at least.
9. light-mixed type polycrystalline encapsulating structure as claimed in claim 8; It is characterized in that; This base board unit has at least one heat insulation slit that runs through this substrate body, and above-mentioned at least one heat insulation slit is centering between the formula frame colloid around formula frame colloid and the above-mentioned at least one the 3rd between this luminescence unit and this current limliting unit or above-mentioned at least one second.
10. a light-mixed type polycrystalline encapsulating structure is characterized in that, comprising:
One base board unit, it has a substrate body and at least two crystal areas that are arranged at this substrate body upper surface;
One luminescence unit; It has at least one first light emitting module and at least one second light emitting module that is used to produce blue light that is used to produce ruddiness; Wherein above-mentioned at least one first light emitting module has the red light emitting diodes crystal grain on a plurality of wherein crystal areas that electrically are arranged at this base board unit, and above-mentioned at least one second light emitting module has the blue LED crystal grain on a plurality of other crystal areas that electrically are arranged at this base board unit;
One frame unit; It has mode through coating and forms at least one first of this substrate body upper surface with center on and center on formula frame colloid and at least one second and center on formula frame colloid; Wherein above-mentioned at least one first around formula frame colloid around above-mentioned at least one second light emitting module; To form at least one wherein spacing space of first colloid of top, a crystal area that is positioned at; And above-mentioned at least one second around formula frame colloid around above-mentioned at least one first light emitting module and above-mentioned at least one first around formula frame colloid, with form at least one above the other crystal area and above-mentioned at least one first around the spacing space of second colloid that formula frame colloid and above-mentioned at least one second centers between the formula frame colloid; And
One encapsulation unit; It has and is arranged at a transparent colloid and the fluorescent colloid of this substrate body upper surface to cover above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module respectively; Wherein this fluorescent colloid is limited in the spacing space of above-mentioned at least one first colloid, and this transparent colloid is limited in the spacing space of above-mentioned at least one second colloid.
11. light-mixed type polycrystalline encapsulating structure as claimed in claim 10 is characterized in that, above-mentioned at least one first and second all has an engagement lugs or a coupling recess around formula frame colloid.
12. light-mixed type polycrystalline encapsulating structure as claimed in claim 10; It is characterized in that; Above-mentioned at least one first centers on formula frame colloid around formula frame colloid and above-mentioned at least one second is arranged in a concentric circles; Above-mentioned at least one first light emitting module is arranged at above-mentioned at least one first and centers on formula frame colloid and above-mentioned at least one second around between the formula frame colloid, and above-mentioned a plurality of red light emitting diodes crystal grain centers on formula frame colloid around above-mentioned at least one first.
13. light-mixed type polycrystalline encapsulating structure as claimed in claim 10; It is characterized in that; Above-mentioned at least one first around formula frame colloid be transparent colloid or fluorescent colloid, and above-mentioned at least one second around formula frame colloid be transparent colloid, fluorescent colloid or reflective colloid.
14. light-mixed type polycrystalline encapsulating structure as claimed in claim 10; It is characterized in that; Above-mentioned at least one first and second upper surface around formula frame colloid is all a circular arc; Above-mentioned at least one first and second all spent between 50 degree between 40 with respect to the angle of the circular arc tangential line of this substrate body upper surface around formula frame colloid; Above-mentioned at least one first and second around the end face of formula frame colloid with respect to the height of this substrate body upper surface all between between the 0.3mm to 0.7mm; Above-mentioned at least one first and second around the width of formula frame colloid bottom all between between the 1.5mm to 3mm, above-mentioned at least one first and second around the thixotropic index of formula frame colloid all between 4 to 6, and above-mentioned at least one first and second is all the white hot sclerosis frame colloid that an inside has inorganic interpolation particle around formula frame colloid.
15. light-mixed type polycrystalline encapsulating structure as claimed in claim 10 is characterized in that, this base board unit has a plurality of anodal weld pad and a plurality of negative pole weld pads that are arranged at this substrate body upper surface that are arranged at this substrate body upper surface; Wherein each red light emitting diodes chip has an anodal and negative pole; The positive pole of each red light emitting diodes chip is corresponding at least two in above-mentioned a plurality of anodal weld pads, and the negative pole of each red light emitting diodes chip is corresponding at least two in above-mentioned a plurality of negative pole weld pads; Wherein each blue led chips has an anodal and negative pole; The positive pole of each blue led chips is corresponding at least two in above-mentioned a plurality of anodal weld pads, and the negative pole of each blue led chips is corresponding at least two in above-mentioned a plurality of negative pole weld pads.
16. light-mixed type polycrystalline encapsulating structure as claimed in claim 10; It is characterized in that; Further comprise: a current limliting unit; It has at least two electrically be arranged at this substrate body upper surface and with above-mentioned at least one second around the current limliting chip of a formula frame colloid specific range separated from one another; Wherein this frame unit has at least two modes through coating and forms in this substrate body upper surface with center on and center on the 3rd of above-mentioned at least two current limliting chips respectively and center on formula frame colloid; This encapsulation unit has at least two and covers above-mentioned at least two current limliting chips respectively and centered on the light tight colloids that formula frame colloid is centered on by above-mentioned at least two the 3rd respectively; Above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module are electrically connected at this substrate body in parallel; In above-mentioned a plurality of red light emitting diodes chip and above-mentioned at least two the current limliting chips one of them electrically connected each other, and above-mentioned a plurality of blue led chips is electrically connected each other with the another one in above-mentioned two current limliting chips at least.
17. light-mixed type polycrystalline encapsulating structure as claimed in claim 16; It is characterized in that; This base board unit has at least one heat insulation slit that runs through this substrate body, and above-mentioned at least one heat insulation slit is centering between the formula frame colloid around formula frame colloid and the above-mentioned at least one the 3rd between this luminescence unit and this current limliting unit or above-mentioned at least one second.
18. a light-mixed type polycrystalline encapsulating structure is characterized in that, comprising:
One base board unit, it has a substrate body and at least two crystal areas that are arranged at this substrate body upper surface;
One luminescence unit; It has at least one first light emitting module and at least one second light emitting module that is used to produce blue light that is used to produce ruddiness; Wherein above-mentioned at least one first light emitting module has the red light-emitting component on a plurality of wherein crystal areas that electrically are arranged at this base board unit, and above-mentioned at least one second light emitting module has the blue LED crystal grain on a plurality of other crystal areas that electrically are arranged at this base board unit;
One frame unit; It has mode through coating and forms at least one first of this substrate body upper surface with center on and center on formula frame colloid and at least one second and center on formula frame colloid; Wherein above-mentioned at least one first around formula frame colloid around above-mentioned at least one first light emitting module; And above-mentioned at least one second around formula frame colloid around above-mentioned at least one second light emitting module and above-mentioned at least one first around formula frame colloid, with form at least one above the above-mentioned other crystal area and above-mentioned at least one first around the spacing space of colloid that formula frame colloid and above-mentioned at least one second centers between the formula frame colloid; And
One encapsulation unit, it has one and is arranged at this substrate body upper surface to cover the fluorescent colloid of above-mentioned at least one second light emitting module, and wherein this fluorescent colloid is limited in the spacing space of above-mentioned at least one colloid.
19. light-mixed type polycrystalline encapsulating structure as claimed in claim 18 is characterized in that, above-mentioned at least one first and second all has an engagement lugs or a coupling recess around formula frame colloid.
20. a light-mixed type polycrystalline encapsulating structure is characterized in that, comprising:
One base board unit, it has a substrate body and at least two crystal areas that are arranged at this substrate body upper surface;
One luminescence unit; It has at least one first light emitting module and at least one second light emitting module that is used to produce blue light that is used to produce ruddiness; Wherein above-mentioned at least one first light emitting module has the red light-emitting component on a plurality of wherein crystal areas that electrically are arranged at this base board unit, and above-mentioned at least one second light emitting module has the blue LED crystal grain on a plurality of other crystal areas that electrically are arranged at this base board unit;
One frame unit; It has mode through coating and forms at least one first of this substrate body upper surface with center on and center on formula frame colloid and at least one second and center on formula frame colloid; Wherein above-mentioned at least one first around formula frame colloid around above-mentioned at least one second light emitting module; Forming at least one spacing space of colloid that is positioned at top, a crystal area wherein, and above-mentioned at least one second around formula frame colloid around above-mentioned at least one first light emitting module and above-mentioned at least one first around formula frame colloid; And
One encapsulation unit, it has one and is arranged at this substrate body upper surface to cover the fluorescent colloid of above-mentioned at least one second light emitting module, and wherein this fluorescent colloid is limited in the spacing space of above-mentioned at least one colloid.
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Application publication date: 20120822 |