Summary of the invention
The invention provides a kind of light-emitting diode (Light-Emitting Diode, LED) encapsulating structure, have better reliability and optical quality.
The invention provides a kind of lighting device, its package structure for LED has better reliability and optical quality.
The invention provides a kind of optical diode base plate for packaging, so that the package structure for LED that arranges on it has better reliability and optical quality.
The present invention proposes a kind of package structure for LED, comprises LED package substrate, a plurality of the first light-emitting diode chip for backlight unit, a plurality of the second light-emitting diode chip for backlight unit and many bonding wires.LED package comprises substrate, the first connection pad, a plurality of the second connection pad and the 3rd connection pad with substrate.The first connection pad is disposed in the substrate.The second connection pad is disposed in the substrate and is arranged in the array of n * (n-1), and wherein n is positive integer, and the first connection pad arranged in proximity is in the second connection pad of the 1st row of array.The 3rd connection pad be disposed in the substrate and arranged in proximity in the second capable connection pad of the n-1 of array, wherein the second connection pad is disposed between the first connection pad and the second connection pad.The first light-emitting diode chip for backlight unit die bond is in the first connection pad and respectively to being positioned at the second connection pad of the 1st row that is arranged in array.The second light-emitting diode chip for backlight unit difference die bond is in the second connection pad.Each first light-emitting diode chip for backlight unit is by second connection pad of a bonding wire routing to the correspondence of the 1st row that is arranged in array, each capable corresponding second light-emitting diode chip for backlight unit of the second connection pad of n-1 that is arranged in array passes through a bonding wire routing to the three connection pads, and the i that is arranged in array is capable and corresponding second light-emitting diode chip for backlight unit of the second connection pad of j row is capable to the i+1 that is arranged in array by a bonding wire routing and the second connection pad of j row, wherein 1≤i≤n-2 and 1≤j≤n.
The present invention proposes a kind of lighting device, comprises pedestal and package structure for LED.Package structure for LED comprises LED package substrate, a plurality of the first light-emitting diode chip for backlight unit, a plurality of the second light-emitting diode chip for backlight unit and many bonding wires.LED package comprises substrate, the first connection pad, a plurality of the second connection pad and the 3rd connection pad with substrate.Substrate is disposed on the pedestal.The first connection pad is disposed in the substrate.The second connection pad is disposed in the substrate and is arranged in the array of n * (n-1), and wherein n is positive integer, and the first connection pad arranged in proximity is in the second connection pad of the 1st row of array.The 3rd connection pad be disposed in the substrate and arranged in proximity in the second capable connection pad of the n-1 of array, wherein the second connection pad is disposed between the first connection pad and the second connection pad.The first light-emitting diode chip for backlight unit die bond is in the first connection pad and respectively to being positioned at the second connection pad of the 1st row that is arranged in array.The second light-emitting diode chip for backlight unit difference die bond is in the second connection pad.Each first light-emitting diode chip for backlight unit is by second connection pad of a bonding wire routing to the correspondence of the 1st row that is arranged in array, each capable corresponding second light-emitting diode chip for backlight unit of the second connection pad of n-1 that is arranged in array passes through a bonding wire routing to the three connection pads, and the i that is arranged in array is capable and corresponding second light-emitting diode chip for backlight unit of the second connection pad of j row is capable to the i+1 that is arranged in array by a bonding wire routing and the second connection pad of j row, wherein 1≤i≤n-2 and 1≤j≤n.
The present invention proposes a kind of LED package substrate, comprises substrate, the first connection pad, a plurality of the second connection pad and the 3rd connection pad.The first connection pad is disposed in the substrate.The second connection pad is disposed in the substrate and is arranged in the array of n * (n-1), and wherein n is positive integer, and the first connection pad arranged in proximity is in the second connection pad of the 1st row of array.The 3rd connection pad be disposed in the substrate and arranged in proximity in the second capable connection pad of the n-1 of array, wherein the second connection pad is disposed between the first connection pad and the second connection pad.
In one embodiment of this invention, above-mentioned the 2nd row that are arranged in array to each second connection pad of n-1 row have for the second corresponding light-emitting diode chip for backlight unit carry out die bond crystal bonding area, carry out the routing district of routing and the groove between crystal bonding area and routing district for corresponding bonding wire, the routing district that wherein is arranged in the second connection pad of the capable and j row of the i+1 of array be positioned at the capable and j row of the i+1 that is arranged in array the second connection pad crystal bonding area and be arranged between the crystal bonding area of capable and the second connection pad that j is listed as of the i of array.
In one embodiment of this invention, above-mentioned each second connection pad that is arranged in the 1st row of this array have for the second corresponding light-emitting diode chip for backlight unit carry out die bond crystal bonding area, carry out the routing district of routing and the groove between crystal bonding area and routing district for corresponding bonding wire, wherein crystal bonding area is in the routing district and be arranged between the 2nd the second connection pad that is listed as of array.
In one embodiment of this invention, above-mentioned each second connection pad that is arranged in the n row of array have for the second corresponding light-emitting diode chip for backlight unit carry out die bond crystal bonding area, carry out the routing district of routing and the groove between crystal bonding area and routing district for corresponding bonding wire, wherein crystal bonding area is in the routing district and be arranged between the second connection pad that the n-1 of array is listed as.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended graphic being described in detail below.
Embodiment
Fig. 2 is the vertical view of the package structure for LED of one embodiment of the invention.Fig. 3 is the partial perspective view of the package structure for LED of Fig. 2.Fig. 4 is the vertical view that the LED package of Fig. 2 is used substrate.Please refer to Fig. 2 to Fig. 4, the package structure for LED 100 of present embodiment comprises that LED package is with substrate 110, a plurality of the first light-emitting diode chip for backlight unit 120 (illustrate is three), a plurality of the second light-emitting diode chip for backlight unit 130 (illustrate is six) and many bonding wires 140 (illustrate is nine).LED package comprises substrate 112, the first connection pad 114, a plurality of the second connection pad 116 (illustrate is six) and the 3rd connection pad 118 with substrate 110.In one embodiment, substrate 112 has end face, and the first connection pad 114 is disposed at the left area of the end face of substrate 112.The 3rd connection pad 118 is disposed at the zone, the right of the end face of substrate 112.The second connection pad 116 is disposed at the zone line of the end face of substrate 112.The second connection pad 116 is disposed between the first connection pad 114 and the 3rd connection pad 118.In another embodiment, connection pad can be conductive electrode.In other embodiments, bonding wire can be electric wire.Substrate can be base plate (submount), carries seat (carrier) or circuit board.
The first connection pad 114 is disposed in the substrate 112.The second connection pad 116 is disposed in the substrate 112 and is arranged in 3 * 2 connection pad arrays (being illustrated in Fig. 4).The first connection pad 114 arranged in proximity are in the second connection pad 116 of the 1st row of array.The 3rd connection pad 118 be disposed in the substrate 112 and arranged in proximity in the second connection pad 116 of the 2nd row of array.The first light-emitting diode chip for backlight unit 120 die bonds in or electrically be disposed on the first connection pad 114 and respectively to being positioned at the second connection pad 116 of the 1st row that is arranged in array.The second light-emitting diode chip for backlight unit 130 respectively die bond in or electrically be disposed on the second connection pad 116.In one embodiment, light-emitting diode chip for backlight unit is disposed at respectively as shown in Figure 2 on the connection pad and is arranged in 3 * 3 chip arrays.
Die bond each first light-emitting diode chip for backlight unit 120 on the first connection pad 114 is by bonding wire 140 routings or be electrically connected to the second connection pad 116 of the correspondence of the 1st row that is arranged in the connection pad array.Each the second connection pad 116 corresponding second light-emitting diode chip for backlight unit 130 of the 2nd row that are arranged in the connection pad array are by bonding wire 140 routings or be electrically connected to the 3rd connection pad 118.The second connection pad 116 corresponding the second light-emitting diode chip for backlight unit 130 that are arranged in the 1st row of connection pad array and j row are by bonding wire 140 routings or be electrically connected to the 2nd row that is arranged in array and the second connection pad 116 of j row.The scope of described j is decided to be 1≤j≤3.
Under the configuration mode such as package structure for LED 100, even the first light-emitting diode chip for backlight unit 120 and the second light-emitting diode chip for backlight unit 130 are rectilinear (illustrating as rectilinear), being arranged in second light-emitting diode chip for backlight unit 130 of same row of chip array and corresponding the first light-emitting diode chip for backlight unit 120 can be by bonding wire 140 and connection pad series connection, to reduce the required drive current of package structure for LED 100.The first light-emitting diode chip for backlight unit 120 is electrically connected in the mode of connecting with the second light-emitting diode chip for backlight unit 130.In addition, therefore the length of bonding wire 140 can shorten to avoid bonding wire 140 fractures, to stay and cross the first light-emitting diode chip for backlight unit 120 and the second light-emitting diode chip for backlight unit 130 tops, to promote reliability and the optical quality of package structure for LED 100.In one embodiment, LED package is used for load level formula (horizontal type) light-emitting diode chip for backlight unit with substrate 110.Described horizontal light emitting diode chip comprises two electrodes that are positioned at its same surface.
Specifically, each second connection pad 116 have for the second corresponding light-emitting diode chip for backlight unit 130 carry out die bond crystal bonding area 116a (being illustrated in Fig. 4), carry out the routing district 116b of routing and the groove 116c between crystal bonding area 116a and routing district 116b for corresponding bonding wire 140.By between crystal bonding area 116a and routing district 116b, forming groove 116c, can avoid overflowing glue to corresponding routing district 116b for the sealing of each the second light-emitting diode chip for backlight unit 130, so that each routing district 116b positively is electrically connected at corresponding bonding wire 140.
Be arranged in the routing district 116b of the second connection pad 116 of the 2nd row of connection pad array and the 2nd row between the crystal bonding area 116b of the second connection pad 116 that the crystal bonding area 116b of the second connection pad 116 of the 2nd row that is arranged in the connection pad array and the 2nd row and the 1st row that is arranged in the connection pad array and the 2nd are listed as.Be arranged in the crystal bonding area 116a of the second connection pad 116 of the 1st row of connection pad array between the routing district 116b of the second connection pad 116 of the 1st row that are arranged in the connection pad array and the 2nd the second connection pad 116 that is listed as that is arranged in the connection pad array.Be arranged in the crystal bonding area 116a of the second connection pad 116 of the 3rd row of connection pad array between the routing district 116b of the second connection pad 116 of the 3rd row that are arranged in the connection pad array and the 2nd the second connection pad 116 that is listed as that is arranged in the connection pad array.By this, can really make each bonding wire 140 can not cross the first light-emitting diode chip for backlight unit 120 and the second light-emitting diode chip for backlight unit 130 tops.
In addition, be different from the crystal bonding area 116a of the 2nd the second connection pad 116 that is listed as that is positioned at the connection pad array and the relative position of routing district 116b owing to be positioned at the 1st row of connection pad array and the crystal bonding area 116a of the 3rd the second connection pad 116 that is listed as and the relative position of routing district 116b, therefore the routing district 116b that is arranged in each second connection pad 116 of the 1st row of connection pad array and the 3rd row can be between two light-emitting diode chip for backlight unit, and be arranged in the routing district 116b of each second connection pad 116 of the 2nd row of connection pad array can be between two light-emitting diode chip for backlight unit.By this, the first light-emitting diode chip for backlight unit 120 and the second light-emitting diode chip for backlight unit 130 are concentrated on the middle section of substrate 112, and the scope that can dwindle the fluorescent powder coating that package structure for LED 100 is carried out, to save manufacturing cost.In the 1st row of connection pad array, routing district 116b is positioned at the upside of crystal bonding area 116a.In the 3rd row of connection pad array, routing district 116b is positioned at the downside of crystal bonding area 116a.In the 2nd row of connection pad array, routing district 116b is positioned at the left side of crystal bonding area 116a.In one embodiment, in the 2nd row of connection pad array, routing district 116b can be configured in the right side of crystal bonding area 116a.
Please refer to Fig. 2 and Fig. 3, package structure for LED 100 more comprises lens 150, thoroughly border 150 covers the first light-emitting diode chip for backlight unit 120 and the second light-emitting diode chip for backlight unit 130, and the optical axis of the second connection pad 116 corresponding the second light-emitting diode chip for backlight unit 130 that is arranged in the 1st row of connection pad array and the 2nd row is to being positioned at the optical axis of lens 150.In other words, be arranged in the 2nd row of chip array and the 2nd row and the optical axis of light-emitting diode chip for backlight unit that is positioned at central authorities to being positioned at the optical axis of lens 150, so that package structure for LED 100 has better optical quality.In one embodiment, lens 150 can be the packing colloid that forms by pressing mold processing procedure (molding process).The material of lens 150 can be silicon (silicon).In one embodiment, package structure for LED 100 more comprises phosphor powder layer (phosphor layer) 135, phosphor powder layer 135 is disposed between light-emitting diode chip for backlight unit and the lens 150, to cover the first light-emitting diode chip for backlight unit 120 and the second light-emitting diode chip for backlight unit 130.Phosphor powder layer 135 can comprise yellow fluorescent powder, red fluorescence powder, green emitting phosphor or be selected from two the combination at least wherein of yellow fluorescent powder, red fluorescence powder and green emitting phosphor.
Fig. 5 is the end view of the package structure for LED of Fig. 2.Fig. 6 is the upward view of the package structure for LED of Fig. 2.Please refer to Fig. 3, Fig. 5 and Fig. 6, package structure for LED 100 more comprises heat conductive pad 160, at least one the first electrode 170 (illustrate is two) and at least one the second electrode 180 (illustrate is two).Substrate 112 has relative first surface 112a and second surface 112b.In one embodiment, first surface 112a and second surface 112b can be respectively end face and bottom surface.Heat conductive pad 160 is disposed at second surface 112b.The first electrode 170 is disposed at second surface 112b and the internal circuit by substrate 112, pin inserts (pin through hole) or connector (plug) is electrically connected at the first connection pad 114.The second electrode 180 is disposed at second surface 112b and the internal circuit by substrate 112, pin inserts (pin through hole) or connector (plug) is electrically connected at the 3rd connection pad 118.
In the present embodiment, the material of substrate 112 is ceramic or other has the material that is electrically insulated of high-termal conductivity, is electrically connected to the first connection pad 160 and the second connection pad 170 to avoid heat conductive pad 160, and promotes the radiating efficiency of light-emitting diode 100.By heat conductive pad 160, the first electrode 170 and the second electrode 180 being disposed in the lump the second surface 112b of substrate 112, can dwindle the volume of package structure for LED 100 and simplify its processing procedure.The formation method of heat conductive pad 160, the first electrode 170 and the second electrode 180 is for example for electroplating (electroplating), electroless-plating (electroless plating), printing (printing) or other proper method.
Please refer to Fig. 5, package structure for LED 100 is disposed at the lighting device 60 that comprises package structure for LED 100 and pedestal 200 on the pedestal 200 with formation.Heat conductive pad 160 contact pedestals 60 conduct to pedestal 200 with the heat that package structure for LED 100 is produced.For instance, substrate 112 and heat conductive pad 160 are to be disposed at pedestal 200 by surface stuck encapsulation (surface-mount technology, SMT).In one embodiment, pedestal 200 can be flexible circuit board (flexible circuit board, FCB) or printed circuit board (PCB) (printed circuit board, PCB).
In the present embodiment, the first light-emitting diode chip for backlight unit 120 and the second light-emitting diode chip for backlight unit 130 comprise two the combination at least wherein of white light-emitting diode chip, blue LED chip, red light-emitting diode chip, green light LED chip or white light-emitting diode chip, blue LED chip, red light-emitting diode chip and green light LED chip, so that lighting device 60 is suitable for sending white light or colourama.
The present invention does not limit the quantity of the first light-emitting diode chip for backlight unit 120 and the second light-emitting diode chip for backlight unit 130.Fig. 7 is the vertical view of the package structure for LED of another embodiment of the present invention.Fig. 8 is the vertical view that the LED package of Fig. 7 is used substrate.Please refer to Fig. 7 and Fig. 8, the package structure for LED 300 of present embodiment comprises LED package substrate 310, a plurality of the first light-emitting diode chip for backlight unit 320, a plurality of the second light-emitting diode chip for backlight unit 330 and many bonding wires 340.LED package comprises substrate 312, the first connection pad 314, a plurality of the second connection pad 316 and one the 3rd connection pad 318 with substrate 310.In one embodiment, substrate 312 has end face, and the first connection pad 314 is disposed at the left area of the end face of substrate 312.The 3rd connection pad 118 is disposed at the zone, the right of the end face of substrate 312.The second connection pad 316 is disposed at the zone line of the end face of substrate 312.The second connection pad 316 is disposed between the first connection pad 314 and the 3rd connection pad 318.In another embodiment, connection pad can be conductive electrode.In other embodiments, bonding wire can be electric wire.Substrate can be base plate (submount), carries seat (carrier) or circuit board.
The first connection pad 314 is disposed at substrate 312.The second connection pad 316 is disposed at substrate 312 and is arranged in the connection pad array (being illustrated in Fig. 8) of n * (n-1), and wherein n is positive integer.The first connection pad 314 arranged in proximity are in the second connection pad 316 of the 1st row of connection pad array.The 3rd connection pad 318 be disposed in the substrate 312 and arranged in proximity in the second capable connection pad 316 of the n-1 of connection pad array.The first light-emitting diode chip for backlight unit 320 die bonds are in the first connection pad 314 and respectively to being positioned at the second connection pad 316 of the 1st row that is arranged in the connection pad array.The second light-emitting diode chip for backlight unit 330 difference die bonds are in the second connection pad 316.In one embodiment, light-emitting diode chip for backlight unit is disposed at respectively connection pad and is arranged in the n of Fig. 7 * n chip array.
Each first light-emitting diode chip for backlight unit 320 is by bonding wire 340 routings or be electrically connected to the second connection pad 316 of the correspondence of the 1st row that is arranged in the connection pad array.Be arranged in each capable the second connection pad 316 corresponding second light-emitting diode chip for backlight unit 330 of the n-1 of connection pad array by bonding wire 340 routings or be electrically connected to the 3rd connection pad 318.The second connection pad 316 corresponding the second light-emitting diode chip for backlight unit 330 that are arranged in the capable and j row of the i of connection pad array are by bonding wire 340 routings or be electrically connected to the second connection pad 316 of the capable and j row of the i+1 that is arranged in the connection pad array.The scope of described i and j is decided to be 1≤i≤n-2 and 1≤j≤n.
Under the configuration mode such as package structure for LED 300, even the first light-emitting diode chip for backlight unit 320 and the second light-emitting diode chip for backlight unit 330 are rectilinear (illustrating as rectilinear), being arranged in second light-emitting diode chip for backlight unit 330 of same row of chip array and corresponding the first light-emitting diode chip for backlight unit 320 can be by bonding wire 340 and connection pad series connection, to reduce the required drive current of package structure for LED 300.The first light-emitting diode chip for backlight unit 320 is electrically connected in the mode of connecting with the second light-emitting diode chip for backlight unit 330.In addition, therefore the length of bonding wire 340 can shorten to avoid bonding wire 340 fractures, to stay and cross the first light-emitting diode chip for backlight unit 320 and the second light-emitting diode chip for backlight unit 330 tops, to promote reliability and the optical quality of package structure for LED 300.In one embodiment, LED package is used for load level formula (horizontal type) light-emitting diode chip for backlight unit with substrate 310.Described horizontal light emitting diode chip comprises two electrodes that are positioned at its same surface.
Specifically, each second connection pad 316 have for the second corresponding light-emitting diode chip for backlight unit 330 carry out die bond crystal bonding area 316a (being illustrated in Fig. 8), carry out the routing district 316b of routing and the groove 316c between crystal bonding area 316a and routing district 316b for corresponding bonding wire 340.By between crystal bonding area 316a and routing district 316b, forming groove 316c, can avoid overflowing glue to corresponding routing district 316b for the sealing of each the second light-emitting diode chip for backlight unit 330, so that each routing district 316b positively is electrically connected at corresponding bonding wire 340.
Be arranged between the crystal bonding area 316b of the crystal bonding area 316b of the second connection pad 316 of the routing district 316b of the second connection pad 316 of the capable and j row of the i+1 of connection pad array and j row capable at the i+1 that is arranged in the connection pad array and the second connection pad 316 that j is listed as capable with the i that is arranged in the connection pad array, wherein 1≤i≤n-2 and 1≤j≤n.Be arranged in the crystal bonding area 316a of the second connection pad 316 of the 1st row of connection pad array between the routing district 316b of the 1st row that are arranged in the connection pad array and the 2nd the second connection pad 316 that is listed as that is arranged in the connection pad array.Be arranged in the crystal bonding area 316a of the second connection pad 316 of n row of connection pad array between the second connection pad 316 that the routing district 316b of the n row that are arranged in the connection pad array and the n-1 that is arranged in the connection pad array are listed as.By this, can really make each bonding wire 340 can not cross the first light-emitting diode chip for backlight unit 320 and the second light-emitting diode chip for backlight unit 330 tops.
In addition, be different from the crystal bonding area 316a of the second connection pad 316 that the 2nd row that are positioned at the connection pad array are listed as to n-1 and the relative position of routing district 316b owing to be positioned at the relative position of crystal bonding area 316a and routing district 316b of the second connection pad 316 of the 1st row of connection pad array and n row, therefore the routing district 316b that is arranged in each second connection pad 316 of the 1st row of connection pad array and n row can be between two light-emitting diode chip for backlight unit, and the 2nd row that are arranged in the connection pad array to the routing district 316b of each second connection pad 316 of n-1 row can be between two light-emitting diode chip for backlight unit.By this, the first light-emitting diode chip for backlight unit 320 and the second light-emitting diode chip for backlight unit 330 are concentrated on the middle section of substrate 312, and the scope that can dwindle the fluorescent powder coating that package structure for LED 300 is carried out, to save manufacturing cost.In the 1st row of connection pad array, routing district 316b is positioned at the upside of crystal bonding area 316a.In the n of connection pad array row, routing district 316b is positioned at the downside of crystal bonding area 316a.In the 2nd row of connection pad array were listed as to n-1, routing district 316b was positioned at the left side of crystal bonding area 316a.In one embodiment, in the 2nd row of connection pad array were listed as to n-1, routing district 316b can be configured in the right side of crystal bonding area 316a.
Please refer to Fig. 7, package structure for LED 300 more comprises lens 350, thoroughly border 350 covers the first light-emitting diode chip for backlight unit 320 and the second light-emitting diode chip for backlight unit 330, and the optical axis of the second connection pad 316 corresponding the second light-emitting diode chip for backlight unit 330 that is arranged in (n-1)/2 row of connection pad array and (n+1)/2 row is to being positioned at the optical axis of lens 350.In other words, be arranged in (n-1)/2 row of chip array and (n+1)/2 row and the optical axis of light-emitting diode chip for backlight unit that is positioned at central authorities to being positioned at the optical axis of lens 350, so that package structure for LED 300 has better optical quality.In one embodiment, lens 350 can be the packing colloid that forms by pressing mold processing procedure (molding process).The material of lens 350 can be silicon (silicon).In one embodiment, package structure for LED 300 more comprises phosphor powder layer (phosphor layer), phosphor powder layer is disposed between light-emitting diode chip for backlight unit and the lens, to cover the first light-emitting diode chip for backlight unit 320 and the second light-emitting diode chip for backlight unit 330.Phosphor powder layer can comprise yellow fluorescent powder, red fluorescence powder, green emitting phosphor or be selected from two the combination at least wherein of yellow fluorescent powder, red fluorescence powder and green emitting phosphor.
Package structure for LED 300 more comprises heat conductive pad, at least one the first electrode and at least one the second electrode.Substrate 312 has relative first surface and second surface.In one embodiment, first surface and second surface can be respectively end face and bottom surface.Heat conductive pad is disposed at second surface.The first electrode is disposed at second surface and the internal circuit by substrate 312, pin inserts (pin through hole) or connector (plug) is electrically connected at the first connection pad 314.The second electrode is disposed at second surface and the internal circuit by substrate 312, pin inserts (pin through hole) or connector (plug) is electrically connected at the 3rd connection pad 318.
In the present embodiment, the material of substrate 312 is ceramic or other has the material that is electrically insulated of high-termal conductivity, is electrically connected to the first connection pad and the second connection pad to avoid heat conductive pad, and promotes the radiating efficiency of light-emitting diode 300.By heat conductive pad, the first electrode and the second electrode being disposed in the lump the second surface of substrate 312, can dwindle the volume of package structure for LED 300 and simplify its processing procedure.The formation method of heat conductive pad, the first electrode and the second electrode is for example for electroplating (electroplating), electroless-plating (electroless plating), printing (printing) or other proper method.
The package structure for LED 300 configurable lighting devices that on pedestal, comprise package structure for LED and pedestal with formation.Heat conductive pad contact pedestal conducts to pedestal with the heat that package structure for LED 300 is produced.For instance, substrate 312 and heat conductive pad are to be disposed at pedestal by surface stuck encapsulation (surface-mount technology, SMT).In one embodiment, pedestal can be flexible circuit board (flexible circuit board, FCB) or printed circuit board (PCB) (printed circuit board, PCB).
In the present embodiment, the first light-emitting diode chip for backlight unit 320 and the second light-emitting diode chip for backlight unit 330 comprise two the combination at least wherein of white light-emitting diode chip, blue LED chip, red light-emitting diode chip, green light LED chip or white light-emitting diode chip, blue LED chip, red light-emitting diode chip and green light LED chip, so that lighting device is suitable for sending white light or colourama.
In one embodiment, above-mentioned package structure for LED more can be applied on automobile lighting, TV and the products such as display backlight module, room lighting, outdoor lighting and billboards.
In one embodiment, except n is capable, be arranged in the light-emitting diode chip for backlight unit of the 2nd row to the n-1 row, the light-emitting diode chip for backlight unit routing on the left side is to the routing district, left side in small electrode zone, the small electrode zone has the right side crystal bonding area, and the light-emitting diode chip for backlight unit die bond on right side is in the right side crystal bonding area.Channel shaped is formed between the routing district, left side and right side crystal bonding area in small electrode zone.
In one embodiment, except n was capable, at the light-emitting diode chip for backlight unit that is arranged in the 1st row, the light-emitting diode chip for backlight unit routing on the left side was to the upside routing district in small electrode zone, the small electrode zone has the downside crystal bonding area, and the light-emitting diode chip for backlight unit die bond on right side is in the downside crystal bonding area.Channel shaped is formed between the upside routing district and downside crystal bonding area in small electrode zone.
In one embodiment, except n was capable, at the light-emitting diode chip for backlight unit that is arranged in the n row, the light-emitting diode chip for backlight unit routing on the left side was to the downside routing district in small electrode zone, the small electrode zone has the upside crystal bonding area, and the light-emitting diode chip for backlight unit die bond on right side is in the upside crystal bonding area.Channel shaped is formed between the downside routing district and upside crystal bonding area in small electrode zone.
In sum, package structure for LED of the present invention has a plurality of the second connection pads, and the second connection pad is arranged in array and between the first and the 3rd connection pad.Even first and second light-emitting diode chip for backlight unit is rectilinear, the second light-emitting diode chip for backlight unit and the first corresponding light-emitting diode chip for backlight unit that are arranged in the same row of array can be connected by bonding wire, to reduce the required drive current of package structure for LED.In addition, therefore the length of bonding wire can shorten to avoid the bonding wire fracture, stay and cross the light-emitting diode chip for backlight unit top, to promote reliability and the optical quality of package structure for LED.In addition, by forming groove between crystal bonding area and routing district, can avoid overflowing glue to corresponding routing district for the sealing of each the second light-emitting diode chip for backlight unit, so that each routing district positively is electrically connected at corresponding bonding wire.
Although the present invention discloses as above with embodiment; so it is not to limit the present invention; have in the technical field under any and usually know the knowledgeable; without departing from the spirit and scope of the invention; when doing a little change and retouching, so protection scope of the present invention is worked as with being as the criterion that claim was defined.