KR20090001169A - Light emitting diode package and array of the same - Google Patents

Abstract

An LED package and an array of the same are provided to minimize the interval among the plurality of LED packages by parallelly arranging the LED packages neighboring each other. An LED package array comprises a substrate(10), and an plurality of LED packages(20) arranged on the substrate. The plurality of LED packages comprises a LED chip(26), and a housing accommodating the LED chip. The housing is comprised of an upper plate(21a) of the hexagonal in which the emission of the light generated from the LED chip is discharged, and six lateral plates(21b) which are orthogonal with the upper plate. One LED package among a plurality of LED packages is arranged to be coincide with the substrate center. Six lateral plates of one LED package are parallelly faced with the adjacent lateral plate of the other LED package.

Description

LED package and array thereof {LIGHT EMITTING DIODE PACKAGE AND ARRAY OF THE SAME}

1 is a view for explaining a conventional LED package array.

2 is a plan view of an LED package according to an embodiment of the present invention.

3 is a sectional view taken along X-X of FIG. 2;

4 is a bottom view of the LED package shown in FIG. 2.

5 is a view for explaining an LED package array according to an embodiment of the present invention.

Figure 6 is a view showing an application example of the LED package to which the present invention is applied.

7 is a view for explaining an LED package array of another embodiment to which the present invention is applied.

<Explanation of symbols for the main parts of the drawings>

10: substrate 20: LED package

21 housing 21a upper surface of regular hexagon

21b: side 22: first leadframe

24: second lead frame 25: recessed portion

26: LED chip 27: sealing member

W: Bonding Wire

The present invention relates to an LED package, and more particularly, a plurality of LED packages having a regular hexagonal structure arranged on a substrate face at least one side in parallel with other neighboring packages in parallel to minimize the gap between the plurality of LED packages The present invention relates to an LED package and an array thereof that reduce light loss and improve uniformity of a light emitting surface.

LED package is used for high-brightness light source for flashlight, backlight for liquid crystal display device (LCD) used in portable electronic products (mobile phones, camcorders, digital cameras and PDAs), light source for billboards, light sources for lighting and switch lighting, indicator lights, traffic signals, etc. Used.

A plurality of LED packages may be arranged in a line or matrix form on the substrate 1 as shown in FIG. 1 to manufacture an array of LED packages. At this time, the shape of the LED package 2 is formed in the shape of a circle, a square, etc. in the plane of the light emitting, a plurality of LED packages 2 are also applied to the arrangement in order to give high brightness.

However, since the LED package 2 has a circular or square shape, unlike the case where it is used as a separate unit, in the LED package array, even if the LED package 2 is arranged as tightly as possible, the empty space is not provided. There will be a lot. That is, in the LED package array as shown in (b) of FIG. 1, when the rectangular LED package 2 is arranged on the circular substrate 1, an empty space is generated due to the rectangular LED package structure, and the rectangular LED package is provided. As shown in (b) of FIG. 1, the surface where the actual light is emitted from (2) is smaller than the housing area of the LED package, thereby creating more empty space. In addition, in the LED package array as shown in FIG. 1 (c), the lead extends from the LED package 1 to the outside so that a large amount of empty space is generated when the plurality of LED packages 1 are arranged. Due to such empty space, light loss is greatly generated, and the light efficiency is not good even in the whole light emitting surface. In particular, in the LED package array as shown in (a) of FIG. 1, when the plurality of LED packages 2 are arranged, the shape of the LED packages 2 arranged on the substrate 1 is asymmetric, so that the uniformity of the entire light emitting surface is achieved. Uniformity is not good. In addition, the left / right and up / down light emission patterns are different from each other.

An object of the present invention is to provide an LED package array that can reduce the light loss of the LED package and improve the uniformity of the entire light emitting surface.

In order to achieve the above technical problem, the LED package array according to an embodiment of the present invention comprises a substrate, a plurality of LED packages having a regular hexagonal structure arranged on the substrate, the plurality of LED packages are LED chip and the It includes a housing for accommodating the LED chip, the housing is characterized in that consisting of the upper surface of the regular hexagon that the light emitted from the LED chip is made, and six sides perpendicular to the upper surface.

According to this embodiment, at least one LED package of the plurality of LED packages faces in parallel with a side of another LED package in which at least one side of the six sides is adjacent. In addition, it is preferable that one LED package of the plurality of LED packages is arranged to coincide with the substrate. More preferably the one LED package may face the six sides in parallel with the side of another neighboring LED package. In addition, one LED package of the plurality of LED packages includes each of the lead frames on side surfaces adjacent to each other, and the lead frames may be connected together in one soldering pattern on the substrate. In this case, the substrate includes a circle.

Furthermore, the LED package has a housing for accommodating the LED chip and the LED chip, the housing is a top surface of the regular hexagon is made to emit light generated from the LED chip; And six side surfaces perpendicular to the upper surface. Herein, the LED chip receives current from a plurality of lead frames supported by the housing, wherein each of the lead frames extends through one side of the six sides.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

FIG. 2 is a plan view of the LED package according to the embodiment of the present invention, FIG. 3 is a sectional view taken along X-X of FIG. 2, and FIG. 4 is a bottom view of the LED package shown in FIG.

2 to 4, the LED package 20 according to the present embodiment is a symmetrical form, the overall appearance has a regular hexagonal structure. The LED package 20 includes first and second lead frames 22 and 24 formed of a lead frame and connected to external electrodes, and a housing 21 integrally formed therewith. The housing 21 may be polyphthalamide (PPA), and various internal structures of the LED package may be designed. The first and second lead frames 22 and 24 are disposed to face each other in close proximity, and the other ends thereof extend in opposite directions to protrude to the outside of the housing 21.

The housing 21 includes an upper surface 21a of a regular hexagon in which light emitted from the LED chip 26 is emitted while accommodating the LED chip 26, and six side surfaces perpendicular to the upper surface 21a ( 21b). Herein, the LED chip 26 receives current from the first and second lead frames 22 and 24 supported by the housing 21. Each of the first and second leadframes 22 and 24 extends through one side 21b of one of the six side surfaces 21b, in which the first and second leadframes ( The sides of the 22 and 24 form a structure that is bent parallel to the side of the housing 21 and toward the lower surface of the housing 21. A part of the first and second lead frames 22 and 24 which are parallel to the side of the housing 21 by the bending is preferably close to the side of the housing 21.

In the figure, a pair of lead frames 22 and 24 are shown on a pair of side surfaces of the housing 21 facing each other, but lead frames may also be provided on other sides. In this case, the LED packages can be connected in various ways in series, parallel, or in parallel, etc., and a plurality of LED chips can be mounted in each package to individually drive the LED chips in each package.

Such a regular hexagonal housing 21 has a recess 25 that exposes the first and second lead frames 22 and 24. The LED chip 26 is mounted on the bottom surface of the recess 25. In this case, the LED chip 26 may be attached to the first lead frame 22 by a conductive adhesive. In addition, the LED chip 26 may be connected to the second lead frame 24 through a bonding wire (W). Accordingly, the LED chip 26 is electrically connected to the first and second lead frames 22 and 24.

On the other hand, the recess 25 is filled with a sealing member 27 of a translucent resin such as epoxy or silicone. The encapsulation member 27 forms an LED package by covering the upper portion of the LED chip 26 and the bonding wires W mounted on the bottom surface of the concave portion 25.

Here, the upper surface of the sealing member 27 may be a flat surface as shown in the figure, it may have a constant curvature. In addition, the sealing member 27 may contain at least one phosphor. Accordingly, light emitted from the LED chip 26 may be color-converted by the phosphor to produce various colors.

The LED package array according to the embodiment of the present invention will be described with reference to FIG. 5.

5 is a view for explaining an LED package array according to an embodiment of the present invention.

As shown in FIG. 5, the LED package array according to the present embodiment includes a substrate 10 having a conductive pattern for largely transmitting an electrical signal, and a plurality of LEDs emitting light while being arranged on the substrate 10. It consists of a package 20. At this time, since the plurality of LED packages 20 arranged on the substrate 10 has been described above, detailed description thereof will be omitted.

The LED package 20 may be arranged on the substrate 10 at a predetermined interval like a honeycomb. In addition, a plurality of LED packages 20 mounted with at least two LED chips 26 may be arranged on the substrate 10 for high light output.

According to the present embodiment, the substrate 10 may be circular or annular, but the present invention is not limited thereto. In addition, the substrate 10 may be a printed circuit board (PCB), and lead terminals (not shown) for supplying power to the plurality of LED packages 20 are spaced apart from each other. The lead terminals are electrically connected to the first and second lead frames 22 and 24 provided in the LED package 20 arranged on the substrate 10. This lead terminal is formed by, for example, forming a conductive thin film metal such as a copper thin film through plating, printing, or other methods.

Meanwhile, each of the plurality of LED packages 20 has a regular hexagonal structure including six side surfaces 21b, and at least one side 21b of the six side surfaces 21b is a side surface of another neighboring package. Face parallel to This is illustrated well in FIG. In this case, the plurality of LED packages 20 is preferably arranged on the substrate at intervals to maximize the output of the light emitted from each LED package 20.

In addition, one LED package (a) of the plurality of LED package 20 is disposed so that the center and the center of the substrate 10. The one LED package a faces all six sides 21b in parallel with the side of another neighboring LED package.

In addition, a plurality of LED packages 20 may be arranged on the substrate 10 to face one LED package a at a predetermined interval while facing parallel to the one LED package a. Accordingly, it is possible to reduce the gap between the LED package 20, it is possible to maximize the light efficiency compared to the same quantity and size.

The LED package array in which the plurality of LED packages 20 are arranged on the substrate 10 is suitable for lighting, lighting fixtures, automobile head lamps, and the like.

6 is a view showing an application example of the LED package having a regular hexagonal structure to which the present invention is applied, Figure 6 (a) shows a plan view when the LED package of the present invention is arranged in a line, b) shows a bottom view when the LED packages are arranged in a line, and FIG. 6C shows a circuit diagram of the LED packages arranged in a line.

When arranging a plurality of LED packages 20 having a regular hexagonal structure on the substrate 10, as shown in FIG. 6B, one LED package of the plurality of LED packages 20 is adjacent to each other. At each of the lead frames 22 and 24, the lead frames 22 and 24 may be connected together in a soldering pattern b on the substrate 10. Surface mount technology (SMT), such as a reflow soldering process, for connecting leadframes 22, 24 facing in parallel with one another on the adjacent sides to a soldering pattern on substrate 10, for example. Can be used. As a result, the plurality of LED packages 20 may be connected to each other in close contact with the minimum space, and thus, the collection efficiency between the LED packages 20 may be excellent, and the overall light efficiency may be improved. In addition, it is also easy to install a collimator can maximize the light output.

7 is a view for explaining an LED package array of another embodiment to which the present invention is applied.

The array of LED packages as shown in FIG. 7 consists of a rectangular substrate 10 and a plurality of LED packages 20 arranged on the substrate 10. Such an LED package array is an orthogonal array, and can be applied to a product requiring small, medium and large LCD backlights and surface emission of a multi-output area.

According to a product application, the plurality of LED packages 20 may be arranged on the substrate 10 in at least one row. That is, as shown in FIG. 7A, the plurality of LED packages 20 may be arranged on the substrate 10 in five rows, and as shown in FIG. 7B, the plurality of LED packages 20 in three rows. ) May be arranged on the substrate 10, and as shown in FIG. 7C, the plurality of LED packages 20 may be arranged on the substrate 10 in a single row. In this case, the number of LED packages 20 arranged on the substrate 10 may be differently applied to the product depending on the light emitting surface.

According to an embodiment of the present invention, a plurality of LED packages having a regular hexagonal structure arranged on a substrate face at least one side surface in parallel with other neighboring packages in parallel, thereby minimizing gaps between the plurality of LED packages and increasing density of the LED packages. It can increase. Accordingly, it is possible to reduce the light loss due to the empty space when arranging the LED package, and to improve the light efficiency by increasing the uniformity of the light emitting surface by having a light emission pattern in almost all directions on the plane.

In addition, according to an embodiment of the present invention by placing one LED package of the plurality of LED packages to match the center of the substrate, all of the sides of one LED package facing in parallel with the side of the other LED package, When the LED package is arranged, light loss can be reduced by minimizing the blind spot between the LED packages.

According to an embodiment of the present invention, the number of soldering patterns can be reduced by connecting leadframes together on one side of the plurality of LED packages to one soldering pattern on the substrate, thereby reducing the number of soldering patterns. The amount of metal material can be reduced, and the soldering pattern on the substrate can be simplified.

Claims (8)

An LED package array comprising a substrate and a plurality of LED packages arranged on the substrate, The plurality of LED packages includes an LED chip and a housing for accommodating the LED chip, wherein the housing includes an upper surface of a regular hexagon where light emitted from the LED chip is emitted, and six sides perpendicular to the upper surface. LED package array, characterized in that made. The method according to claim 1, LED package array, characterized in that at least one LED package of the plurality of LED packages faces at least one side of the six sides in parallel with a side of another neighboring LED package. The method according to claim 1 or 2, The LED package array, characterized in that one LED package of the plurality of LED packages are arranged so as to be centered with the substrate. The method according to claim 3, Wherein said one LED package faces all of the six sides in parallel with a side of another neighboring LED package. The method according to claim 4, And the substrate comprises a circle. The method according to claim 2, One LED package of the plurality of LED packages includes each of the leadframes on the side adjacent to each other, the leadframes are connected together in a soldering pattern on the substrate. An LED package having an LED chip and a housing for accommodating the LED chip, The housing is the top surface of the regular hexagon that the light emitted from the LED chip is made; And LED package including six sides perpendicular to the top surface. The method according to claim 7, The LED chip is applied to a current from a plurality of lead frames supported on the housing, each of the lead frames, characterized in that extending through one of the six sides of the LED package.

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