CN201407528Y

CN201407528Y - High-power LED lamp

Info

Publication number: CN201407528Y
Application number: CN2009201316383U
Authority: CN
Inventors: 林保龙; 郭寂波
Original assignee: Shenzhen Dtt Science & Technology Development Co Ltd
Current assignee: Shenzhen Dtt Science & Technology Development Co Ltd
Priority date: 2009-05-07
Filing date: 2009-05-07
Publication date: 2010-02-17
Anticipated expiration: 2019-05-07

Abstract

The utility model relates to a high-power LED lamp comprising a baseplate (1) and a plurality of LED chips (2) arranged on the baseplate (1), wherein, the LED chips (2) are numbered four at least, theLED chips (2) are arranged in the matrix form, the LED chips (2) in the same line or the same row are connected in series to form at least two series connection strips (7), and the series connectionstrips (7) are in parallel connection with each other. The high-power LED lamp provided by the utility model, with the plurality of low-power LED chips connected and arranged in the matrix form, has the benefits of increasing power, solving the heat dissipation problem, reducing size, and curtailing the overall cost of the high-power LED lamp.

Description

A kind of high-powered LED lamp

Technical field

The utility model relates to the LED lighting field, more particularly, relates to a kind of high-powered LED lamp.

Background technology

LED is as a kind of novel green light source product, be called as the 4th generation lighting source or green light source, have characteristics such as energy-saving and environmental protection, the life-span is long, volume is little, can be widely used in fields such as various indications, demonstration, decoration, backlight, general lighting and urban landscape.General led chip is all below 2W, in order to make it can be used for general lighting, normally with several the bigger led chips of the power composition high-power LED illuminating lamp that is together in parallel, but it all is subjected to the restriction of following reason: one, the power of single led chip is big more, its price is just expensive more, so that has correspondingly increased the cost of LED illuminating lamp; Its two, the caloric value of single high-power LED chip is big and heating region is concentrated relatively, heat abstractor is required harsh, heat dissipation problem is difficult to solve.

The utility model content

The technical problems to be solved in the utility model is that defectives such as the difficulty that costs an arm and a leg, dispels the heat at high-powered LED lamp in the prior art provide the high-powered LED lamp that a kind of volume is little, power is big, cost is low.

The technical scheme that its technical problem that solves the utility model adopts is: a kind of high-powered LED lamp is provided, and this high-powered LED lamp comprises substrate, a plurality of led chip that is arranged on the described substrate, it is characterized in that, described led chip is at least 4; Described led chip is matrix form arranges, and each led chip in wherein same delegation or the same row is connected mutually and formed at least two series connection bars, and described each connected between bar to being connected in parallel.

In the high-power lamp of the present utility model, described substrate is provided with chip attach pad (figure does not show) and pad, and described led chip is fixed on described chip attach pad (figure does not show) and upward and by lead links to each other with described pad.

Wherein, described pad is the pad that gold, aluminium, silver, copper or alloy are made.

Wherein, described lead is gold thread, aluminum steel, silver-colored line or copper cash.

Wherein, be provided with the elargol that both are bondd between described led chip and the described chip attach pad.

Wherein, a shared pad between adjacent two led chips in the same series connection bar.

In the high-power lamp of the present utility model, be coated with the embedding layer that constitutes by fluorescent glue on the described chip.

In the high-power lamp of the present utility model, described substrate edge is provided with the closure member that highly is not less than described embedding layer.

In the high-power lamp of the present utility model, described led chip is the small-power chip that packaging pin is positioned at the top.

In the high-power lamp of the present utility model, described substrate is copper film graphite substrate, flexible PCB or printed circuit board (PCB).

Implement high-powered LED lamp of the present utility model, have following beneficial effect: a plurality of low power led chips are the matrix form connection of arranging, have increased power, solved heat dissipation problem, reduced volume, reduced the cost of whole high-powered LED lamp.

High-powered LED lamp of the present utility model adopts elargol that led chip is fixed on the substrate, and is firm, stable; Adopt fluorescent glue to cover on the led chip, have excellent adhesive strength, dielectric properties are good, and the set shrinkage factor is little, the hardness height, and improved the luminous efficiency and the characteristics of luminescence.

Description of drawings

The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:

Fig. 1 is the plan structure figure of high-powered LED lamp embodiment of the present utility model;

Fig. 2 is that Fig. 1 is along indicating the sectional structure chart that line A dissects.

The specific embodiment

As shown in Figure 1, be the plan structure figure of high-powered LED lamp embodiment of the present utility model, again in conjunction with shown in Figure 2, be that Fig. 1 is along indicating the sectional structure chart that line A dissects.The utility model provides a kind of high-powered LED lamp, and this high-powered LED lamp comprises substrate 1, a plurality of led chip 2 that is arranged on the substrate 1, and led chip 2 is at least 4; Led chip 2 is matrix form arranges, and each led chip in wherein same delegation or the same row is connected mutually and formed at least two series connection bars 7, and each is connected between bar 7 to being connected in parallel.

Substrate 1 is provided with chip attach pad (figure does not show) and pad 6, led chip 2 is fixed on chip attach pad (figure does not show) and upward and by lead 5 links to each other with pad 6, a shared pad between adjacent two led chips 2 in the same series connection bar 7, and be coated with the embedding layer that constitutes by fluorescent glue 4 on the chip 2.

The principle of the high-powered LED lamp that present embodiment provides is as follows: 100 low power led chips 2 are matrix form arrange, the line number of matrix is 10, columns also is 10,10 led chips 2 that are about to every row are together in series and form series connection bar 7, again these 10 serial bars 7 are together in parallel, arrange to connect and realize a kind of high-powered LED lamp thereby so 100 low power led chips 2 are matrix form.Wherein, the size of led chip 2 is identical, and its watt level can be selected according to the LED lamp of final needs, based on cost consideration, generally selects lower-powered led chip 2 for use.Simultaneously, on chip 2, be provided with the embedding layer (figure does not show) that constitutes by fluorescent glue 4, and also be provided with the closure member 3 that highly is not less than embedding layer (scheming not show) in substrate 1 edge, generally speaking, this closure member 3 is the glue ring, fluorescent glue 4 flows out when being used for preventing stop fluorescent glue 4, and the thickness of fluorescent glue 4 also can be adjusted as required.So arrange to connect and these 100 low power led chips 2 are carried out certain series and parallel connect, can obtain high-powered LED lamp, solved heat dissipation problem, reduced volume, reduced the cost of whole high-powered LED lamp by matrix form.

In the present embodiment, substrate 1 is the copper film graphite substrate, when design copper film graphite substrate, the series and parallel that connects of led chip 2 matrix forms having been arranged connects the networking and is arranged on the copper film graphite substrate and has suffered, in concrete high-powered LED lamp is made, after substrate designed, key was with COB (chip on board) technology led chip 2 to be fixed on chip attach pad (figure does not show) upward and with pad 6 to couple together.

Be provided with 100 chips 2 on the copper film graphite substrate, the zone that chip 2 is set on the copper film graphite substrate 1 is called viscous crystal region, and viscous crystal region is about 80% of substrate area.Led chip 2 adopts packing forms, and its packaging pin is positioned at the top of led chip 2, and is better bonding with lead 5 for the packaging pin that makes led chip 2, generally all can plate the very thin gold of one deck equably on the packaging pin of led chip 2.

The connection procedure of led chip 2 and chip attach pad (figure does not show) and pad 6: earlier led chip 2 usefulness elargol are fixed on the chip attach pad (figure does not show), put into the incubator baking, elargol is solidified; Be connected with pad 6 with lead 5 by the pin of COB technology again led chip 2, this lead 5 is a gold thread, can guarantee better that like this packaging pin of led chip 2 is connected with pad 6, avoid the long and relevant issues such as lead impedance brought of lead in other connection mode simultaneously; The last one deck fluorescent glue 4 that covers on chip 2 forms the embedding layer (figure does not show) that highly is lower than closure member 3, and lead 5 envelopes are wrapped.Wherein, adopt elargol that led chip 2 is fixed on the chip attach pad (figure does not show), firm, stable; Adopt fluorescent glue 4 to cover on the led chip 2, have excellent adhesive strength, dielectric properties are good, and the set shrinkage factor is little, the hardness height, and improved the luminous efficiency and the characteristics of luminescence.

High-powered LED lamp of the present utility model, each led chip 2 also can be provided with two pads 6 respectively, and not with the bar 7 of connecting in the led chip 2 that is adjacent shared.

High-powered LED lamp of the present utility model, the quantity of led chip 2 can be selected as required, need satisfy array arrangement quantity gets final product, substrate 1 also can be flexible PCB or printed circuit board (PCB) etc., lead 5 lines and also can be aluminum steel, silver-colored line or copper cash, pad 6 also can be made by aluminium, silver, copper or alloy, and these all can not influence the function of high-powered LED lamp of the present utility model, and the designer can carry out optimal selection according to actual needs.

The above only is a preferred embodiment of the present utility model, not in order to restriction the utility model, all any modifications of being done in spirit of the present utility model and principle, is equal to and replaces or improvement etc., all should be included in the protection domain of the present utility model.

Claims

1, a kind of high-powered LED lamp comprises substrate (1), a plurality of led chip (2) that is arranged on the described substrate (1), it is characterized in that described led chip (2) is at least 4; Described led chip (2) is matrix form arranges, and each led chip (2) in wherein same delegation or same row series connection mutually forms at least two series connection bars (7), and described each connected between bar (7) to being connected in parallel.

2, high-powered LED lamp according to claim 1 is characterized in that, described substrate (1) is provided with chip attach pad and pad (6), and described led chip (2) is fixed on the described chip attach pad and by lead (5) and links to each other with described pad (6).

3, high-powered LED lamp according to claim 2 is characterized in that, described pad (6) is the pad that gold, aluminium, silver, copper or alloy are made.

4, high-powered LED lamp according to claim 2 is characterized in that, described lead (5) is gold thread, aluminum steel, silver-colored line or copper cash.

5, high-powered LED lamp according to claim 2 is characterized in that, is provided with the elargol with both bondings between described led chip (2) and the described chip attach pad.

6, high-powered LED lamp according to claim 2 is characterized in that, a shared pad (6) between adjacent two led chips (2) in the same series connection bar (7).

7, high-powered LED lamp according to claim 1 is characterized in that, is coated with the embedding layer that is made of fluorescent glue (4) on the described chip (2).

8, high-powered LED lamp according to claim 7 is characterized in that, described substrate (1) edge is provided with the closure member (3) that highly is not less than described embedding layer.

9, high-powered LED lamp according to claim 1 is characterized in that, described led chip (2) is positioned at the small-power chip at top for packaging pin.

10, high-powered LED lamp according to claim 1 is characterized in that, described substrate (1) is copper film graphite substrate, flexible PCB or printed circuit board (PCB).