CN201621532U

CN201621532U - Directly-down type ultrathin LED back light module unit

Info

Publication number: CN201621532U
Application number: CN2010201174027U
Authority: CN
Inventors: 宋义; 苏遵惠; 张俊锋; 李英翠
Original assignee: Shenzhen Diguang Electronics Co Ltd
Current assignee: Wuhan emperor optoelectronics Co., Ltd.
Priority date: 2010-02-10
Filing date: 2010-02-10
Publication date: 2010-11-03
Anticipated expiration: 2020-02-10

Abstract

The utility model relates to a directly-down type ultrathin LED back light module unit, characterized in that, a non-encapsulation LED chip light source is directly arranged on a PCB board, then, transparent glue or fluorescent glue is coated on the single LED chip light source surface, or a plurality of LED chip light source surfaces, namely, the same effect as the LED chip light source encapsulated in advance can be implemented, thereby reducing the process of encapsulation in advance of the LED chip light source, avoiding the arranging of an optical apparatus on the LED in order to decrease the back light source thickness, greatly saving the cost and increasing the light outpour surface of the light ray after the light ray generated by the LED chip light source in the transparent glue or transparent glue layer is refracted, additionally, the utility model can enable the distance of the cross light rays between the LED chip light sources to be greatly decreased by increasing the arrangement density of the LED chip light sources, thereby greatly reducing the back light module unit thickness to enable the scheme of the directly-down LED ultrathin back light module unit to be implemented.

Description

Straight-down negative ultra-thin LED module backlight

Technical field

The utility model relates to a kind of module backlight, relates in particular to a kind of straight-down negative ultra-thin LED module backlight, is applied to liquid crystal indicator field (as LCD TV, LCD etc.).

Background technology

Existing direct-light type LED backlight module, generally comprise LCD display, diffusion barrier and pcb board, pcb board is provided with the led light source after some encapsulation, after led light source emits beam, light becomes even, consistent behind diffusion barrier, shine on the LCD display equably then, thus the effect that realization is thrown light on to liquid crystal indicator.Though existing this module backlight is more common, but, because used LED power major part is more than 0.3 watt, so LED quantity lacking of each backlight with regard to usefulness, therefore its distribution density is just very little, the distance of the crosslights between the led light source is big, for the light that utilizes LED to send, will cause the thickness of module backlight bigger, be difficult to realize ultra-thinization, just must on LED, increase a lot of light refractions and optical reflection unit and want to make ultra-thin backlight source, cause cost very high; In addition, led light source all is through after the encapsulation, just can be used on the module backlight, and led light source is encapsulated, certainly will also can increase production cost, more important is that the light extraction efficiency of led light source also can partly be limited because the structural limitations of package support adds the refraction reflection unit that is increased, and causes cost height, efficient low.

Therefore, led chip directly not being produced on PCB in the prior art goes up and formation higher, low-cost, the high efficiency straight-down negative ultra-thin LED of LED distribution density module backlight.

The utility model content

Technical problem to be solved in the utility model is to provide a kind of the needs that led chip is encapsulated, need refraction and reflective optical device be not set on the led chip, directly led chip is being produced on the PCB and form higher, low-cost, the high efficiency straight-down negative ultra-thin LED of LED distribution density module backlight.

The utility model is to realize like this, a kind of straight-down negative ultra-thin LED module backlight, comprise LCD display, diffusion layer and pcb board, described pcb board surface is provided with the reflecting layer, also be provided with some not encapsulated LED chip light sources on the described pcb board, described led chip light source surface is coated with the material that can reflect the light that this led chip light source sends.

Particularly, described single led chip light source surface scribbles transparent adhesive tape or fluorescent glue by gluing process.

Particularly, described single led chip light source surface scribbles transparent adhesive tape or fluorescent glue by spraying coating process.

Particularly, described a plurality of led chip light sources surface is coated with substratum transparent or fluorescence glue-line by process for filling colloid into.

Further, described diffusion layer is provided with the lustre adding layer that light can be concentrated.

Particularly, described pcb board is a monolithic construction, and perhaps described pcb board is two or the spliced structure of polylith.

Further, be provided with a white light layer between described pcb board and the diffusion barrier, described white light layer is used for the versicolor light that described led chip light source sends is become white light.

Particularly, be provided with the LED of blue led, red LED, green LED, RGB any two or three kinds of colour mixtures in the described led chip light source.

Particularly, the circuit connecting mode of described led chip light source is series, parallel or string and series-parallel connection.

The direct not encapsulated LED chip light source of the utility model is arranged on the pcb board, then at single led chip light source surface-coated transparent adhesive tape or fluorescent glue, or at a plurality of led chip light source surface-coated substratum transparents or fluorescence glue-line, can realize and the prior same effect of encapsulated LED chip light source, reduced the technology that the led chip light source is encapsulated in advance, also avoided Optical devices being set on LED, provided cost savings greatly for reducing backlight thickness; Simultaneously, after the light that the led chip light source sends reflects in transparent adhesive tape or substratum transparent, increased the exiting surface of light, add the utility model by increasing the density of arranging of led chip light source, the distance of the crosslights between the led chip light source is reduced significantly, thereby can reduce module thickness backlight greatly, make the scheme of the ultra-thin module backlight of straight-down negative LED be achieved; Because the utility model has significantly reduced the optical loss that is brought by other light refraction and reflection unit, has improved light utilization greatly.

Description of drawings

Fig. 1 is the schematic diagram that led chip light source surface that the utility model embodiment provides scribbles the module backlight of transparent adhesive tape;

Fig. 2 is the schematic diagram that led chip light source surface that the utility model embodiment provides scribbles the module backlight of fluorescent glue;

Fig. 3 is the schematic diagram that led chip light source surface that the utility model embodiment provides is coated with the module backlight of fluorescence glue-line;

Fig. 4 is a schematic diagram of setting up a white light layer between the pcb board of the module backlight in Fig. 2 and the diffusion barrier;

Fig. 5 is the schematic diagram that led chip light source parallel connection that the utility model embodiment provides is arranged;

Fig. 6 is the schematic diagram of the led chip light source series arrangement that provides of the utility model embodiment;

Fig. 7 is the led chip light source parallel connection that provides of the utility model embodiment, the schematic diagram that series combination is arranged;

Fig. 8 be the utility model embodiment comprising of providing a plurality of and string in conjunction with the schematic diagram of the led chip light source module of arranging.

The specific embodiment

In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.

As Fig. 1～shown in Figure 3, the straight-down negative ultra-thin LED module backlight that the utility model embodiment provides, comprise LCD display 1, diffusion barrier 2 and pcb board 3, described pcb board 3 is provided with some not encapsulated LED chip light sources 4, the material that described led chip light source 4 surface-coated can reflect the light that this led chip light source 4 sends.

Particularly, described single led chip light source 4 surfaces are coated with transparent adhesive tape 41 (as shown in Figure 1) or fluorescent glue 42 (as shown in Figure 2) by a glue or spraying coating process, and described transparent adhesive tape 41 can be a silica gel.

Perhaps, be coated with substratum transparent (not shown) or fluorescence glue-line 5 (as shown in Figure 3) by process for filling colloid on described a plurality of led chip light source 4.

The direct not encapsulated LED chip light source 4 of the utility model is contained on the pcb board 3, then at single led chip light source 4 surface-coated transparent adhesive tapes 41 or fluorescent glue 42, or on a plurality of led chip light sources 4, apply substratum transparent or fluorescence glue-line 5, can realize and the prior same effect of encapsulated LED chip light source, reduced the technology that the led chip light source is encapsulated in advance, also avoided Optical devices being set on LED, provided cost savings greatly for reducing backlight thickness; Simultaneously, after the light that led chip light source 4 sends reflects in transparent adhesive tape or substratum transparent 5, increased the exiting surface of light, add the utility model by increasing the density of arranging of led chip light source 4, the distance of the crosslights between the led chip light source 4 is reduced significantly, thereby can reduce module thickness backlight greatly, make the scheme of the ultra-thin module backlight of straight-down negative LED be achieved; Because the utility model has significantly reduced the optical loss that is brought by other light refraction and reflection unit, has improved light utilization greatly.

Further, also the lustre adding layer (not shown) can be set on the described diffusion layer 2, this lustre adding layer is used for light is concentrated, and improves brightness.

Particularly, described pcb board 3 is monoblock type or spliced structure, the pcb board 3 of the utility model preferred two or the spliced structure of polylith (as Fig. 1～shown in Figure 4), like this, the size of pcb board 3 just can standardization, and can produce in enormous quantities, during assembling, according to required size a plurality of standardized pcb boards 3 are stitched together, have improved efficiency of assembling greatly, significantly reduced production cost.

As shown in Figure 4, further, be provided with a white light layer 6 between described pcb board 3 and the diffusion barrier 2, described white light layer 6 is used for the versicolor light that led chip light source 4 sends is become white light, like this, the range of choice of led chip light source 4 is just very big, and when white light layer 6 is not set, can only select to send the led chip light source of white light.Particularly, can be provided with the LED of blue led, red LED, green LED, RGB any two or three kinds of colour mixtures in the described led chip light source 4, by white light layer 6 light of these colors is transformed into white light then, thereby reach the purpose that improves gamut range.

Particularly, described led chip light source 4 can adopt following arrangement mode: can be that parallel connection is arranged (as shown in Figure 5), it also can be series arrangement (as shown in Figure 6), perhaps string and series-parallel connection are arranged (as shown in Figure 7), the led chip light source module (as shown in Figure 8) that perhaps adopts a plurality of strings and series-parallel connection to arrange all belongs to the range of application of the led chip light source 4 that the utility model provides; Wherein, string and can connecting into of arranging of series-parallel connection guarantee to have only this led chip light source 4 not work and the operate as normal that do not influence other led chip light sources 4 when one of them led chip light source 4 open circuits.

Further, the one or both sides of described pcb board 3 are provided with some electronic devices and components that are used to control led chip light source 4, reach the purpose that control led chip light source 4 adapts to the different operating requirement with this.

The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection domain of the present utility model.

Claims

1. straight-down negative ultra-thin LED module backlight, comprise LCD display, diffusion layer and pcb board, described pcb board surface is provided with the reflecting layer, it is characterized in that: also be provided with some not encapsulated LED chip light sources on the described pcb board, described led chip light source surface is coated with the material that can reflect the light that this led chip light source sends.

2. straight-down negative ultra-thin LED as claimed in claim 1 module backlight is characterized in that: described single led chip light source surface scribbles transparent adhesive tape or fluorescent glue by gluing process.

3. straight-down negative ultra-thin LED as claimed in claim 2 module backlight is characterized in that: described single led chip light source surface scribbles transparent adhesive tape or fluorescent glue by spraying coating process.

4. straight-down negative ultra-thin LED as claimed in claim 1 module backlight is characterized in that: described a plurality of led chip light sources surface is coated with substratum transparent or fluorescence glue-line by process for filling colloid into.

5. straight-down negative ultra-thin LED as claimed in claim 1 module backlight is characterized in that: described diffusion layer is provided with the lustre adding layer that light can be concentrated.

6. straight-down negative ultra-thin LED as claimed in claim 1 module backlight is characterized in that: described pcb board is a monolithic construction, and perhaps described pcb board is two or the spliced structure of polylith.

7. straight-down negative ultra-thin LED as claimed in claim 1 module backlight is characterized in that: be provided with a white light layer between described pcb board and the diffusion barrier, described white light layer is used for the versicolor light that described led chip light source sends is become white light.

8. straight-down negative ultra-thin LED as claimed in claim 7 module backlight is characterized in that: the LED that is provided with blue led, red LED, green LED, RGB any two or three kinds of colour mixtures in the described led chip light source.

9. straight-down negative ultra-thin LED as claimed in claim 1 module backlight is characterized in that: the circuit connecting mode of described led chip light source is series, parallel or string and series-parallel connection.