CN107123642A - A kind of bluish-green high colour gamut LED lamp bead of chip-in series of red fluorescence powder collocation and its backlight - Google Patents
A kind of bluish-green high colour gamut LED lamp bead of chip-in series of red fluorescence powder collocation and its backlight Download PDFInfo
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- CN107123642A CN107123642A CN201710536958.6A CN201710536958A CN107123642A CN 107123642 A CN107123642 A CN 107123642A CN 201710536958 A CN201710536958 A CN 201710536958A CN 107123642 A CN107123642 A CN 107123642A
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- 239000000843 powder Substances 0.000 title claims abstract description 60
- 239000011324 bead Substances 0.000 title claims abstract description 42
- 238000004806 packaging method and process Methods 0.000 claims abstract description 9
- 230000005284 excitation Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 5
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000002096 quantum dot Substances 0.000 abstract description 9
- 150000001875 compounds Chemical class 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 230000009977 dual effect Effects 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 241001062009 Indigofera Species 0.000 description 1
- 229910003564 SiAlON Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The invention discloses a kind of bluish-green high colour gamut LED lamp bead of chip-in series of red fluorescence powder collocation and its backlight, including lamp bead body and backlight body, the lamp bead body is specific by LED support, blue chip, green glow chip and red fluorescence powder are constituted, the blue chip and the green glow chip is distributed with the inside of the LED support, the blue chip and the green glow chip are connected in a series arrangement, the blue chip and the green glow chip are by being mutually mixed between red fluorescence powder and packaging plastic and baking-curing post package in the inside of the LED support, multiple lamp bead bodies are evenly distributed on side entering type pcb board；The present invention uses blue chip and the compound obtained LED backlight of green glow chip-in series collocation red fluorescence powder, color gamut value is up to 100% 120%, it is easier to realize in technique, compared to quantum dot film and quantum dot pipe, blue, green dual chip series connection, collocation red fluorescence powder is also equipped with that stability is good, cost low advantage while superelevation colour gamut is realized.
Description
Technical field
The present invention relates to LED backlight technical field, the specially a kind of bluish-green high colour gamut of chip-in series of red fluorescence powder collocation
LED lamp bead and its backlight.
Background technology
Since 21st century, LED backlight technology turns into market master at present by constantly development and innovation
Stream, compared with traditional CCFL backlight, LED backlight has colour gamut height, brightness height, long lifespan, energy-conserving and environment-protective, color tunable etc.
Plurality of advantages, the LED backlight of particularly high colour gamut is widely used in the electronics fields such as TV, mobile phone, tablet personal computer, makes
Its screen color is more bright-coloured, color rendition Du Genggao.At present, the technical method for realizing white light is mainly three classes：First, blue light
LED chip collocation yellow fluorescent powder and red, the green fluorescence powder of blue chip collocation；The collocation of 2nd, ultraviolet or purple LED chip is red, green,
Blue three-color phosphor；3rd, three kinds of direct mixed lights of LED chip of red, green, blue, and at present the method for main flow be by red, green fluorescence powder or
Person's yellow fluorescent powder is mixed with packaging plastic, and then point is coated on blue chip, and white light is compounded to form by photochromic.
Either red, green fluorescence powder or yellow fluorescent powder are mixed with packaging plastic in conventional method, then point is coated in indigo plant
On optical chip, white light LEDs are compounded to form by photochromic, or the chip hybrid of red, green, blue three is into white light, or quantum dot film,
There is following various defects in quantum dot Guan Jun：Fluorescent material commercial at present is mostly YAG powder or silicate, nitride fluorescent first
Powder, KSF fluorescent material, β-SiAlON, colour gamut are only capable of reaching 72%-93%；The launching efficiency of fluorescent material is low, and improving colour gamut can only lead to
Cross increase consumption to realize, requirement of the today's society to more low energy consumption, more high energy efficiency and higher color domain far can not be met；
Red, green, blue three-color LED chip mixed light is difficult, and radiates there is also problem, while driving control system is more complicated；Current commercial
Quanta point material be easy to be influenceed by temperature, humidity and cause failure, simultaneously because quantum dot preparation technology is complicated, yield
Low, stability is poor, and price is higher, fails popularization completely.
How to improve prior art defect, be urgent problem.
The content of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of bluish-green chip string of red fluorescence powder collocation
Join high colour gamut LED lamp bead and its backlight, further lifting color gamut value while solve it is complicated in the prior art and into
This high technical problem.
The present invention is achieved by the following technical solutions：A kind of bluish-green high colour gamut of chip-in series of red fluorescence powder collocation
LED lamp bead, including lamp bead body, the lamp bead body are specific by LED support, blue chip, green glow chip and red fluorescence powder
Constitute, the blue chip and the green glow chip, the blue chip and the green glow is distributed with the inside of the LED support
Chip is connected in a series arrangement, and the blue chip and the green glow chip pass through mutual between red fluorescence powder and packaging plastic
Mix and baking-curing post package is in the inside of the LED support.
Further, the excitation wavelength of the blue chip is 440nm-470nm, and the excitation wavelength of the green glow chip is
500nm-545nm。
Further, the excitation wavelength of the red fluorescence powder is 620nm-650nm, and the red fluorescence powder is specific by nitrogenizing
Matter fluorescent powder, KSF fluorescent material and silicate fluorescent powder are constituted.
Further, the specific one kind in ceramics, PCT, EMC, SMC of the LED support is made, the shape of the LED support
Can be the shape of square, strip, circle or other Regularias, the specification of the LED support can for 4010,4014,
7020th, one kind in 7016.
Further, the intrinsic blue chip of the lamp bead is at least one, and the green glow chip is at least one.
Further, be connected into a chip string between a blue chip and a green glow chip, two and
With in parallel or two and the connection of more than two circuit control modes between more than two chip strings.
Further, it is a kind of to be made of a kind of described bluish-green high colour gamut LED lamp bead of chip-in series of red fluorescence powder collocation
Backlight, including backlight body, the backlight body uses side entrance back structure, the backlight body it is specific by
Lamp bar, metal backing, reflector plate, light guide plate, diaphragm and OPEN CELL are constituted, and the lamp bar is specific by multiple lamp bead sheets
Body and pcb board are constituted, and the lamp bar is arranged in the light incident sides of the light guide plate in the way of side entering type.
A kind of preparation process of the bluish-green high colour gamut LED lamp bead of chip-in series of red fluorescence powder collocation is as follows：
Step 1：The blue chip and the green glow chip are arranged in the LED support in a series arrangement, Ran Hougu
Brilliant bonding wire；
Step 2：The red fluorescence powder and packaging plastic mixing point are coated in the LED support, baking-curing；
Step 3：The lamp bead body of solidification is attached on the pcb board, crosses after Reflow Soldering and can obtain the lamp bar.
The present invention has advantages below compared with prior art：The present invention proposes a kind of bluish-green chip string of red fluorescence powder collocation
Join high colour gamut LED lamp bead and its backlight, i.e. blue chip, green glow chip-in series, then the lamp bead that red fluorescence powder of arranging in pairs or groups is made
Body, a part of blue light excitated red fluorescent powder, the blue and green light sent afterwards by chip and feux rouges are compound to obtain high color
Domain LED backlight, with higher colour gamut, advantage is as follows：
1. using blue chip and the compound obtained LED backlight of green glow chip-in series collocation red fluorescence powder, color gamut value
Up to 100%-120%；
2. using blue chip and the compound obtained LED backlight of green glow chip-in series collocation red fluorescence powder, relative to
Red, green, blue three-color LED is simple in construction, is easier to realize in technique.
3. quantum dot film and quantum dot pipe are compared, blue, green dual chip series connection, collocation red fluorescence powder is realizing superelevation colour gamut
While be also equipped with that stability is good, the low advantage of cost；
4. the voltage of blue, green chip is close, it is close to decay, and bluish-green chip can be connected in a series arrangement, single power supply is used
Control chip lights.
Brief description of the drawings
Fig. 1 is the lamp of a kind of bluish-green high colour gamut LED lamp bead of chip-in series of red fluorescence powder collocation of the invention and its backlight
The internal structure schematic diagram of pearl body；
Fig. 2 is the backlight that a kind of bluish-green high colour gamut LED lamp bead of chip-in series of use red fluorescence powder collocation of the invention is made
The structural representation of the backlight body in source.
In figure：1st, LED support；2nd, blue chip；3rd, green glow chip；4th, red fluorescence powder；5th, lamp bar；6th, metal backing；
7th, reflector plate；8th, light guide plate；9th, diaphragm；10、OPEN CELL.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Refer to Fig. 1 and Fig. 2, a kind of embodiment that the present invention is provided：A kind of bluish-green chip-in series of red fluorescence powder collocation
High colour gamut LED lamp bead, including lamp bead body, lamp bead body are specific glimmering by LED support 1, blue chip 2, green glow chip 3 and red
Light powder 4 is constituted, and blue chip 2 and green glow chip 3 is distributed with the inside of LED support 1, and blue chip 2 and green glow chip 3 are with series connection
Mode is connected, and blue chip 2 and green glow chip 3 pass through being mutually mixed between red fluorescence powder 4 and packaging plastic and baking-curing
Post package is in the inside of LED support 1；
The excitation wavelength of blue chip 2 is 440nm-470nm, and the excitation wavelength of green glow chip 3 is 500nm-545nm；
The excitation wavelength of red fluorescence powder 4 is 620nm-650nm, and red fluorescence powder 4 is specific by Nitride phosphor, KSF
Fluorescent material and silicate fluorescent powder are constituted；
The specific one kind in ceramics, PCT, EMC, SMC of LED support 1 is made, and the shape of LED support 1 can be square, long
The shape of bar shaped, circle or other Regularias, the specification of LED support 1 can be one kind in 4010,4014,7020,7016；
The intrinsic blue chip 2 of lamp bead is at least one, and green glow chip 3 is at least one；
A chip string, two and more than two chips are connected between one blue chip 2 and a green glow chip 3
With in parallel or two and the connection of more than two circuit control modes between string；
A kind of backlight being made of a kind of bluish-green high colour gamut LED lamp bead of chip-in series of red fluorescence powder collocation, including
Backlight body, backlight body uses side entrance back structure, and backlight body is specific by lamp bar 5, metal backing 6, reflection
Piece 7, light guide plate 8, diaphragm 9 and OPEN CELL10 are constituted, and lamp bar 5 is specifically made up of multiple lamp bead bodies and pcb board, lamp bar 5 with
The mode of side entering type is arranged in the light incident sides of light guide plate 8；
A kind of preparation process of the bluish-green high colour gamut LED lamp bead of chip-in series of red fluorescence powder collocation is as follows：
Step 1：Blue chip 2 and green glow chip 3 are arranged in LED support 1 in a series arrangement, then die bond bonding wire；
Step 2：Red fluorescence powder 4 and packaging plastic mixing point are coated in LED support 1, baking-curing；
Step 3：The lamp bead body of solidification is attached on pcb board, crosses after Reflow Soldering and can obtain lamp bar 5.
Operation principle, by setting blue chip 2 and green glow chip 3, and blue chip 2 and green glow core in LED support 1
Connected between piece 3 by the way of series connection so that the lamp bead body of acquisition, its color gamut value is up to 100%-120%, and using blue
Optical chip 2 and the compound obtained LED backlight of the series connection collocation red fluorescence powder 4 of green glow chip 3, relative to the color of red, green, blue three
LED structure is simple, is easier to realize in technique, compared to quantum dot film and quantum dot pipe, blue chip 2 and green glow chip 3 are connected,
Collocation red fluorescence powder 4 is also equipped with that stability is good, cost low advantage while superelevation colour gamut is realized, blue chip 2 and green
The voltage of optical chip 3 is close, it is close to decay, and blue chip 2 and green glow chip 3 are connected in a series arrangement, single power supply control is used
Chip light emitting processed, simplifies the structure of equipment, improves the stability of equipment.
Claims (8)
- The bluish-green high colour gamut LED lamp bead of chip-in series 1. a kind of red fluorescence powder is arranged in pairs or groups, including lamp bead body, it is characterised in that institute State lamp bead body to be specifically made up of LED support, blue chip, green glow chip and red fluorescence powder, the interior part of the LED support The blue chip and the green glow chip are furnished with, the blue chip and the green glow chip are connected in a series arrangement, described Blue chip and the green glow chip are existed by being mutually mixed between red fluorescence powder and packaging plastic and baking-curing post package The inside of the LED support.
- The bluish-green high colour gamut LED lamp bead of chip-in series 2. a kind of red fluorescence powder according to claim 1 is arranged in pairs or groups, its feature exists In the excitation wavelength of the blue chip is 440nm-470nm, and the excitation wavelength of the green glow chip is 500nm-545nm.
- The bluish-green high colour gamut LED lamp bead of chip-in series 3. a kind of red fluorescence powder according to claim 1 is arranged in pairs or groups, its feature exists In the excitation wavelength of the red fluorescence powder is 620nm-650nm, and the red fluorescence powder is specific by Nitride phosphor, KSF Fluorescent material and silicate fluorescent powder are constituted.
- The bluish-green high colour gamut LED lamp bead of chip-in series 4. a kind of red fluorescence powder according to claim 1 is arranged in pairs or groups, its feature exists In the specific one kind in ceramics, PCT, EMC, SMC of the LED support is made, and the shape of the LED support can be square, long The shape of bar shaped, circle or other Regularias, the specification of the LED support can be one in 4010,4014,7020,7016 Kind.
- The bluish-green high colour gamut LED lamp bead of chip-in series 5. a kind of red fluorescence powder according to claim 1 is arranged in pairs or groups, its feature exists In the intrinsic blue chip of lamp bead is at least one, and the green glow chip is at least one.
- 6. a kind of red fluorescence powder is arranged in pairs or groups the bluish-green high colour gamut LED lamp bead of chip-in series according to claim 1 or 5, it is special Levy and be, a chip string, two and two or more are connected between a blue chip and a green glow chip The chip string between connected with parallel or two and more than two circuit control modes.
- 7. one kind is using a kind of bluish-green high colour gamut LED lamp bead system of chip-in series of red fluorescence powder collocation as claimed in claim 1 Into backlight, including backlight body, it is characterised in that the backlight body uses side entrance back structure, the back of the body Light source body is specifically made up of lamp bar, metal backing, reflector plate, light guide plate, diaphragm and OPEN CELL, the lamp bar it is specific by Multiple the lamp bead bodies and pcb board are constituted, and the lamp bar is arranged in the light incident sides of the light guide plate in the way of side entering type.
- 8. a kind of any one red fluorescence powder as described in claim 1-7 is arranged in pairs or groups the bluish-green high colour gamut LED lamp bead of chip-in series Preparation process is as follows：Step 1：The blue chip and the green glow chip are arranged in the LED support in a series arrangement, and then die bond is welded Line；Step 2：The red fluorescence powder and packaging plastic mixing point are coated in the LED support, baking-curing；Step 3：The lamp bead body of solidification is attached on the pcb board, crosses after Reflow Soldering and can obtain the lamp bar.
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| CN201710536958.6A CN107123642A (en) | 2017-07-04 | 2017-07-04 | A kind of bluish-green high colour gamut LED lamp bead of chip-in series of red fluorescence powder collocation and its backlight |
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| CN201710536958.6A CN107123642A (en) | 2017-07-04 | 2017-07-04 | A kind of bluish-green high colour gamut LED lamp bead of chip-in series of red fluorescence powder collocation and its backlight |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107816665A (en) * | 2017-11-02 | 2018-03-20 | 安徽唯诗杨信息科技有限公司 | A kind of bluish-green LED backlight module of high colour gamut and preparation method thereof |
| CN108063176A (en) * | 2017-10-30 | 2018-05-22 | 东莞市豪顺精密科技有限公司 | A kind of blue LED lamp and its manufacturing process and application |
| CN108332108A (en) * | 2017-11-03 | 2018-07-27 | 佛山市国星光电股份有限公司 | LED component, backlight lamp bar and backlight module |
| CN108365077A (en) * | 2018-02-09 | 2018-08-03 | 安徽唯诗杨信息科技有限公司 | A kind of high colour gamut backlight module |
| CN108615722A (en) * | 2018-04-28 | 2018-10-02 | 安徽芯瑞达科技股份有限公司 | A kind of backlight module blue chip, the high colour gamut LED lamp bead of green light chip |
| CN109164632A (en) * | 2018-08-31 | 2019-01-08 | 华南师范大学 | A kind of high colour gamut LCD backlight mould group and preparation method thereof |
| CN110534627A (en) * | 2018-05-23 | 2019-12-03 | 青岛海信电器股份有限公司 | A kind of LED lamp panel, preparation method and display device |
| CN113437055A (en) * | 2021-06-28 | 2021-09-24 | 惠州视维新技术有限公司 | LED light-emitting structure, backlight module and display device |
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Cited By (11)
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