CN107816665B - High-color-gamut blue-green LED backlight module and manufacturing method thereof - Google Patents
High-color-gamut blue-green LED backlight module and manufacturing method thereof Download PDFInfo
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- CN107816665B CN107816665B CN201711065839.3A CN201711065839A CN107816665B CN 107816665 B CN107816665 B CN 107816665B CN 201711065839 A CN201711065839 A CN 201711065839A CN 107816665 B CN107816665 B CN 107816665B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V2200/00—Use of light guides, e.g. fibre optic devices, in lighting devices or systems
- F21V2200/20—Use of light guides, e.g. fibre optic devices, in lighting devices or systems of light guides of a generally planar shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
- F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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Abstract
The invention discloses a high-color gamut blue-green LED backlight module and a manufacturing method thereof, wherein the backlight module comprises blue-red LED lamp beads, green LED lamp beads, a PCB (printed Circuit Board), a metal back plate, reflecting paper, a lower light guide plate, an upper light guide plate, a diaphragm and an OPEN CELL; the PCB is a rectangular strip-shaped circuit board, and two rows of LED lamp beads are welded on the PCB; the blue-red LED lamp beads and the green LED lamp beads are respectively positioned in an upper row and a lower row; one side of the PCB is provided with four strip-shaped PCB welding spots vertical to the short edge; the PCB back surface is pasted on the inner side of the short edge of the L-shaped metal back plate, the reflection paper is placed on the inner layer of the long edge of the metal back plate, and the lower light guide plate, the upper light guide plate, the diaphragm and the OPEN CELL are sequentially placed above the reflection paper. The invention improves the color gamut value, solves the technical problem of uneven light mixing of the blue light chip and the red light chip, and can add the upper condensing lens and the lower condensing lens which are provided with the upper and the lower reflecting layers, so that the red, blue and green light can not be mixed and interfered before entering the lower light guide plate and the upper light guide plate.
Description
Technical Field
The invention relates to the field of LED backlight, in particular to a high-color gamut blue-green LED backlight module and a manufacturing method thereof.
Background
As a new solid illumination light source, the LED has the characteristics of small volume, long service life, good reliability, energy conservation, environmental protection, and the like, and is widely applied in the illumination and display fields, and with the rapid development of LED backlight technology, the consumer's demand for high color gamut of LED televisions is gradually increasing, and the LED televisions are required to have richer colors, better layering, and higher color reduction. The current mainstream method is to use a blue light chip to excite red and green fluorescent powder, and the color gamut can only reach 90-93% at most. The green chip has narrower half-wave width and shorter wavelength than the existing green fluorescent powder. In addition, the excitation efficiency of the phosphor is low, and the concentration of the phosphor is increased to obtain white light with high color gamut, which undoubtedly increases the cost of the packaging industry and increases the reject ratio.
In the traditional method, red and green fluorescent powder or yellow fluorescent powder is mixed with packaging adhesive and then is point-coated on a blue light chip, a white light LED is formed by light color compounding, or the red, green and blue chips are mixed into white light, or a quantum dot film and a quantum dot tube have the following defects: firstly, most of the current commercial fluorescent powder is YAG powder or silicate, nitride fluorescent powder, KSF fluorescent powder and beta-SiAlON, and the color gamut can only reach 72 to 93 percent; the excitation efficiency of the fluorescent powder is low, the color gamut can be improved only by increasing the using amount, and the requirements of the current society on lower energy consumption, higher energy efficiency and higher color gamut can not be met; red, green and blue LED chips are difficult to mix light, heat dissipation is also problematic, and a drive control system is more complex; the current commercial quantum dot material is easily affected by temperature and humidity to cause failure, and meanwhile, the preparation process of the quantum dot is complex, the yield is low, the stability is poor, the price is higher, and the quantum dot material cannot be completely popularized.
Application publication No. CN 201710537225.4 discloses high colour gamut LED lamp pearl of blue-green double-chip collocation red phosphor powder and backlight thereof, wherein produces a blue-green double-color LED lamp pearl, and LED lamp pearl distributes blue light chip and green glow chip at the inside of LED support, and blue light chip and green glow chip pass through red phosphor powder and the encapsulation glue between mix each other and toast solidification back encapsulation LED support's inside forms LED lamp pearl, and a plurality of lamp pearl bodies evenly distributed are on the formula PCB board that inclines, and the formula backlight unit that inclines is reproduced adopts short-wave section and the wide green light chip of narrow half-wave, makes up the unable high colour gamut effect that reaches of green phosphor powder.
Above-mentioned introduction short wave band and the green chip of narrow half-wave width of current scheme, effectively promote the colour gamut of backlight display, but because the long and thin of formula LED lamp pearl is gone into to the side, the blue light that the blue light chip sent, the red light that the blue light arouses red phosphor powder to send and the first mixed light of green glow that the green chip sent in LED lamp pearl, secondary mixed light in formula light guide plate is gone into to the side, still unable misce bene, obvious variegated stripe (promptly, red and green tricolor light does not mix the polychrome area that evenly produces) appears in near the light guide plate that leads to backlight unit's light source. In order to overcome the defects of the prior art, a scheme is provided.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides a high-color gamut blue-green LED backlight module and a manufacturing method thereof, and solves the technical problem of uneven light mixing of a blue light chip and a red light chip while improving the color gamut value.
The purpose of the invention can be realized by the following technical scheme:
a high-color gamut blue-green LED backlight module comprises blue-red LED lamp beads, green LED lamp beads, a PCB (printed Circuit Board), a metal back plate, reflecting paper, a lower light guide plate, an upper light guide plate, a diaphragm and an OPEN CELL;
the PCB is a rectangular strip-shaped circuit board, and two rows of LED lamp beads are welded on the PCB; the blue-red LED lamp beads and the green LED lamp beads are respectively positioned in an upper row and a lower row; one side of the PCB is provided with four strip-shaped PCB welding spots vertical to the short edge; the back surface of the PCB is attached to the inner side of the short edge of the L-shaped metal back plate, reflective paper is placed on the inner layer of the long edge of the metal back plate, and a lower light guide plate, an upper light guide plate, a diaphragm and an OPEN CELL are sequentially placed above the reflective paper;
the LED lamp bead comprises a support, an LED chip, a gold wire, packaging glue, a white strip, a small bonding pad and a large bonding pad; wherein the bracket is a rectangular groove with an inclined inner side wall; a section of white strip is embedded in the middle of the bottom of the bracket, and a small bonding pad and a large bonding pad which penetrate through the bottom of the bracket are respectively arranged on two sides of the white strip; the small bonding pad and the large bonding pad respectively extend out of two sides of the bottom of the bracket; an LED chip is fixed on the inner side of the bottom of the bracket, a P electrode and an N electrode are arranged on the left and right of the top of the LED chip, and the P electrode and the N electrode are respectively connected to a small bonding pad and a large bonding pad on the bottom through gold wires; the bracket groove is filled with packaging glue;
an upper row and a lower row of series circuits are arranged in the PCB, a blue-red LED lamp bead series circuit is arranged on the upper row, two ends of the blue-red LED lamp bead series circuit are connected to two PCB welding spots, a green LED lamp bead series circuit is arranged on the lower row, and two ends of the green LED lamp bead series circuit are connected to the other two PCB welding spots; the PCB welding spots of the two rows of series circuits are respectively connected with two control power supplies by leads;
an upper condensing lens and a lower condensing lens which correspond to the blue-red LED lamp beads and the green LED lamp beads are respectively added on the left sides of the lower light guide plate and the upper light guide plate; an upper condensing lens reflecting layer and a lower condensing lens reflecting layer are respectively arranged on the upper surface and the lower surface of the upper condensing lens and the lower condensing lens;
the lamp beads in the blue-red LED lamp beads and the green-light LED lamp beads are replaced by inverted LED lamp beads, namely, an LED inverted chip is matched with an inverted bracket;
in the blue-red LED lamp bead, the excitation wavelength of a blue chip is 440nm-470nm, the excitation wavelength of red fluorescent powder is 620nm-650nm, in the green LED lamp bead, the wavelength of a green chip is 500nm-545nm, and the red fluorescent powder is made of one or more of nitride fluorescent powder, fluoride fluorescent powder, KSF fluorescent powder or silicate fluorescent powder;
the material in the support is composed of one or more of ceramics, PCT, EMC and SMC, and the size specification of the support is one of 4010, 4014, 7020 and 7016;
one or more LED chips are arranged in the blue-red LED lamp beads and the green LED lamp beads;
a manufacturing method of a high-color-gamut blue-green LED backlight module comprises the following steps:
step one, preparing an LED lamp bead: the blue light chip is fixedly crystallized at the bottom of the support, the blue light chip is respectively connected with the P electrode, the N electrode, the small bonding pad and the large bonding pad through gold wires, packaging glue mixed with red fluorescent powder is added into a support groove, and the packaging glue is baked and cured to form a blue-red LED lamp bead; the green chip is fixedly crystallized at the bottom of the support, the green chip is respectively connected with the P electrode, the N electrode, the small bonding pad and the large bonding pad through gold wires, packaging glue is added into the support groove, and the packaging glue is baked and cured to form a green LED lamp bead;
step two, preparing a double-circuit board: the blue-red LED lamp beads and the green LED lamp beads are fixedly welded on the upper row and the lower row of the PCB respectively through solder paste on the PCB; four wires are arranged on the four PCB welding spots and are connected with two control power supplies;
step three, assembling the backlight module: the PCB back is pasted in the L type short inboard of metal backplate through the gum, places lower light guide plate, goes up light guide plate, diaphragm, OPEN CELL on the long board of metal backplate L type in proper order.
The invention provides a high-color gamut blue-green LED backlight module and a manufacturing method thereof, which can solve the technical problem of uneven light mixing of a blue light chip and a red light chip while improving the color gamut value.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic view of a high-gamut blue-green LED backlight module according to the present invention;
FIG. 2 is a schematic diagram of an LED lamp bead structure of a high-gamut blue-green LED backlight module according to the present invention;
FIG. 3 is a schematic view of a light source structure of a high-gamut blue-green LED backlight module according to the present invention;
FIG. 4 is a schematic structural diagram of a backlight module with a condensing lens added to a high-gamut blue-green LED backlight module according to the present invention;
fig. 5 is a flowchart of a method for manufacturing a high-gamut blue-green LED backlight module according to the present invention.
Detailed Description
The purpose of the invention can be realized by the following technical scheme:
a high-color gamut blue-green LED backlight module is shown in figures 1-4 and comprises blue-red LED lamp beads 11, green-light LED lamp beads 12, a PCB (printed Circuit Board) 2, a metal back plate 3, reflecting paper 4, a lower light guide plate 5, an upper light guide plate 6, a diaphragm 7 and an OPEN CELL 8;
the PCB 2 is a rectangular strip-shaped circuit board, and two rows of LED lamp beads are welded on the circuit board; the blue-red LED lamp beads 11 and the green LED lamp beads 12 are respectively positioned in an upper row and a lower row; one side of the PCB 2 is provided with four strip-shaped PCB welding spots 21 vertical to the short edge; the back of the PCB 2 is attached to the inner side of the short side of an L-shaped metal back plate 3, reflective paper 4 is placed on the inner layer of the long side of the metal back plate 3, and a lower light guide plate 5, an upper light guide plate 6, a diaphragm 7 and an OPEN CELL 8 are sequentially placed above the reflective paper 4;
the LED lamp bead comprises a support 101, an LED chip 102, a gold wire 103, packaging glue 104, a white strip 105, a small bonding pad 106 and a large bonding pad 107; wherein the bracket 101 is a rectangular groove with an inclined inner side wall; a section of white strip 105 is embedded in the middle of the bottom of the support 101, and small bonding pads 106 and large bonding pads 107 penetrating through the bottom of the support are respectively arranged on two sides of the white strip 105; the small bonding pad 106 and the large bonding pad 107 respectively extend out of two sides of the bottom of the bracket 101; an LED chip 102 is fixed on the inner side of the bottom of the support 101, a P electrode and an N electrode are arranged on the left and right of the top of the LED chip 102, and the P electrode and the N electrode are respectively connected to a small bonding pad 106 and a large bonding pad 107 at the bottom through gold wires 103; the groove of the bracket 101 is filled with packaging glue 104;
an upper row and a lower row of series circuits are arranged in the PCB 2, a blue-red LED lamp bead 11 series circuit is arranged on the upper row, two ends of the blue-red LED lamp bead 11 series circuit are connected to two PCB welding spots 21, a green LED lamp bead 12 series circuit is arranged on the lower row, and two ends of the green LED lamp bead 12 series circuit are connected to the other two PCB welding spots 21; the PCB welding points 21 of the two PCB circuits are respectively connected with two control power supplies by leads;
the blue-red LED lamp bead 11 series circuit and the green LED lamp bead 12 series circuit can be exchanged to form an upper row green LED lamp bead 12 series circuit and a lower row blue-red LED lamp bead 11 series circuit;
an upper condensing lens 13 and a lower condensing lens 14 corresponding to the blue-red LED lamp beads 11 and the green LED lamp beads 12 can be respectively added on the left sides of the lower light guide plate 5 and the upper light guide plate 6; an upper condensing lens reflecting layer 131 and a lower condensing lens reflecting layer 141 are respectively arranged on the upper surface and the lower surface of the upper condensing lens 13 and the lower condensing lens 14; the upper condenser lens 13 and the lower condenser lens 14 better converge blue red light and green light emitted by the blue-red LED lamp beads 11 and the green-light LED lamp beads 12 into the lower light guide plate 5 and the upper light guide plate 6, and the arrangement of the upper condenser lens reflecting layer 131 and the lower condenser lens reflecting layer 141 avoids mutual mixed light interference of the red blue light and the green light before entering the lower light guide plate 5 and the upper light guide plate 6;
the blue-red LED lamp beads 11 and the green LED lamp beads 12 can be replaced by inverted LED lamp beads, namely, LED inverted chips are matched with inverted supports;
in the blue-red LED lamp bead, the excitation wavelength of a blue chip is 440nm-470nm, the excitation wavelength of red fluorescent powder is 620nm-650nm, in the green LED lamp bead, the wavelength of a green chip is 500nm-545nm, and the red fluorescent powder is made of one or more of nitride fluorescent powder, fluoride fluorescent powder, KSF fluorescent powder or silicate fluorescent powder;
the material in the bracket 101 is composed of one or more of ceramics, PCT, EMC and SMC, and the size specification of the bracket 101 can be one of 4010, 4014, 7020 and 7016;
one or more LED chips 102 are arranged in the blue-red LED lamp beads 11 and the green LED lamp beads 12;
as shown in fig. 5, a method for manufacturing a high-gamut blue-green LED backlight module includes:
step one, preparing an LED lamp bead: the blue light chip is fixedly crystallized at the bottom of the support 101, the blue light chip is respectively connected with the P electrode, the N electrode, the small bonding pad 106 and the large bonding pad 107 through gold wires 103, packaging glue 104 mixed with red fluorescent powder is added into a groove of the support 101, and the packaging glue 104 is baked and cured to form a blue-red LED lamp bead 11; the green chip is fixedly crystallized at the bottom of the support 101, the green chip is respectively connected with the P electrode, the N electrode, the small bonding pad 106 and the large bonding pad 107 through gold wires 103, packaging glue 104 is added into the groove of the support 101, and the packaging glue 104 is baked and cured to form a green LED lamp bead 12;
step two, preparing a double-circuit board: the PCB 2 is fixedly welded with blue-red LED lamp beads 11 and green LED lamp beads 12 on the upper row and the lower row of the PCB 2 respectively through solder paste; four wires are arranged on the four PCB welding spots 21 and are connected with two control power supplies;
step three, assembling the backlight module: the back of the PCB 2 is pasted on the inner side of the L-shaped short plate of the metal back plate 3 through back glue, and the lower light guide plate 5, the upper light guide plate 6, the diaphragm 7 and the OPEN CELL 8 are sequentially placed on the 3L-shaped long plate of the metal back plate.
The working principle is as follows:
the PCB 2 independently controls the luminous intensity of the blue-red LED lamp beads 11 and the green LED lamp beads 12 through two control power supplies; the blue-red LED lamp beads 11 emit red blue light, the red blue light enters the upper light guide plate 6, the green light LED lamp beads 12 emit green light, and the green light enters the lower light guide plate 5; green light in the lower light guide plate 5 is refracted on the upper end face of the reflection paper surface, penetrates out of the upper surface of the lower light guide plate 5 and enters the upper light guide plate 6; the red and blue light in the upper light guide plate 6 and the green light entering from the lower light guide plate 5 are mixed and then penetrate out of the upper light guide plate 6; the mixed light is mixed again through the membrane 7 and finally the mixed light is illuminated on the OPEN CELL 8.
The invention provides a high-color-gamut blue-green LED backlight module and a manufacturing method thereof, which can solve the technical problem of uneven light mixing of a blue light chip and a red light chip while improving the color gamut value, and can be additionally provided with an upper condensing lens and a lower condensing lens, and a reflecting layer is arranged on the upper lens surface and the lower lens surface, so that the red blue light and the green light are not subjected to light mixing interference before entering a lower light guide plate and an upper light guide plate, and obvious speckles of the light guide plate near the traditional blue-green high-color-gamut backlight module light source are avoided.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the invention as defined in the following claims.
Claims (1)
1. The utility model provides a blue and green LED backlight unit, includes blue red LED lamp pearl (11), green glow LED lamp pearl (12), PCB board (2), metal backboard (3), reflection paper (4), lower light guide plate (5), goes up light guide plate (6), diaphragm (7), OPEN CELL (8), its characterized in that:
the PCB (2) is a rectangular strip-shaped circuit board, and two rows of LED lamp beads are welded on the PCB; the blue-red LED lamp beads (11) and the green LED lamp beads (12) are respectively positioned in an upper row and a lower row; one side of the PCB (2) is provided with four strip-shaped PCB welding spots (21) vertical to the short edge; the back of the PCB (2) is attached to the inner side of the short side of an L-shaped metal back plate (3), reflective paper (4) is placed on the inner layer of the long side of the metal back plate (3), and a lower light guide plate (5), an upper light guide plate (6), a diaphragm (7) and an OPEN CELL (8) are sequentially placed above the reflective paper (4);
the LED lamp bead comprises a support (101), an LED chip (102), a gold wire (103), packaging glue (104), a white strip (105), a small bonding pad (106) and a large bonding pad (107); wherein the bracket (101) is a rectangular groove with an inclined inner side wall; a section of white strip (105) is embedded in the middle of the bottom of the support (101), and small bonding pads (106) and large bonding pads (107) penetrating through the bottom of the support are respectively arranged on two sides of the white strip (105); the small bonding pad (106) and the large bonding pad (107) respectively extend out of two sides of the bottom of the bracket (101); an LED chip (102) is fixed on the inner side of the bottom of the support (101), a P electrode and an N electrode are arranged on the left and right of the top of the LED chip (102), and the P electrode and the N electrode are respectively connected to a small bonding pad (106) and a large bonding pad (107) on the bottom through gold wires (103); packaging glue (104) is filled in the groove of the bracket (101);
an upper row and a lower row of series circuits are arranged in the PCB (2), a blue-red LED lamp bead (11) series circuit is arranged on the upper row, two ends of the blue-red LED lamp bead (11) series circuit are connected to two PCB welding spots (21), a green LED lamp bead (12) series circuit is arranged on the lower row, and two ends of the green LED lamp bead (12) series circuit are connected to the other two PCB welding spots (21); the PCB welding spots (21) of the two rows of series circuits are respectively connected with two control power supplies by leads;
an upper condensing lens (13) and a lower condensing lens (14) which correspond to the blue-red LED lamp beads (11) and the green-light LED lamp beads (12) are respectively arranged on the left sides of the lower light guide plate (5) and the upper light guide plate (6), and an upper condensing lens reflecting layer (131) and a lower condensing lens reflecting layer (141) are respectively arranged on the upper surface and the lower surface of the upper condensing lens (13) and the lower condensing lens (14);
in the blue-red LED lamp bead, the excitation wavelength of a blue chip is 440nm-470nm, the excitation wavelength of red fluorescent powder is 620nm-650nm, in the green LED lamp bead, the wavelength of a green chip is 500nm-545nm, and the red fluorescent powder is made of one or more of nitride fluorescent powder, fluoride fluorescent powder, KSF fluorescent powder or silicate fluorescent powder;
the material in the bracket (101) is composed of one or more of ceramics, PCT, EMC and SMC, and the size specification of the bracket (101) is one of 4010, 4014, 7020 and 7016;
one or more LED chips (102) are arranged in the blue-red LED lamp beads (11) and the green LED lamp beads (12);
the PCB (2) independently controls the luminous intensity of the blue-red LED lamp beads (11) and the green LED lamp beads (12) through two control power supplies; the blue-red LED lamp beads (11) emit red blue light, the red blue light enters the upper light guide plate (6), the green light LED lamp beads (12) emit green light, and the green light enters the lower light guide plate (5); green light in the lower light guide plate (5) is refracted on the upper end face of the reflection paper surface, penetrates out of the upper surface of the lower light guide plate (5) and enters the upper light guide plate (6); the red and blue light in the upper light guide plate (6) and the green light entering from the lower light guide plate (5) are mixed and then penetrate out of the upper light guide plate (6); the mixed light is mixed again through a membrane (7), and finally the mixed light is irradiated on OPENCELL (8);
the blue-green LED backlight module is manufactured by the following steps:
step one, preparing an LED lamp bead: the blue light chip is fixedly crystallized at the bottom of the support (101), the blue light chip is respectively connected with the P electrode, the N electrode, the small bonding pad (106) and the large bonding pad (107) through gold wires (103), packaging glue (104) mixed with red fluorescent powder is added into a groove of the support (101), and the packaging glue (104) is baked and cured to form a blue-red LED lamp bead (11); the green chip is fixedly crystallized at the bottom of the support (101), the green chip is respectively connected with the P electrode, the N electrode, the small bonding pad (106) and the large bonding pad (107) through gold wires (103), packaging glue (104) is added into the groove of the support (101), and the packaging glue (104) is baked and cured to form a green LED lamp bead (12);
step two, preparing a double-circuit board: the blue-red LED lamp beads (11) and the green LED lamp beads (12) are fixedly welded on the PCB (2) in an upper row and a lower row respectively through solder paste on the PCB (2); four wires are arranged on the four PCB welding spots (21) and are connected with two control power supplies;
step three, assembling the backlight module: the back of the PCB (2) is pasted on the inner side of the L-shaped short plate of the metal back plate (3) through back glue, and the lower light guide plate (5), the upper light guide plate (6), the diaphragm (7) and the OPEN CELL (8) are sequentially placed on the L-shaped long plate of the metal back plate (3).
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| CN201711065839.3A CN107816665B (en) | 2017-11-02 | 2017-11-02 | High-color-gamut blue-green LED backlight module and manufacturing method thereof |
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| CN201711065839.3A CN107816665B (en) | 2017-11-02 | 2017-11-02 | High-color-gamut blue-green LED backlight module and manufacturing method thereof |
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| CN107816665A CN107816665A (en) | 2018-03-20 |
| CN107816665B true CN107816665B (en) | 2020-01-07 |
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| CN111580212B (en) * | 2020-06-12 | 2022-03-04 | 京东方科技集团股份有限公司 | Side-in type backlight module |
| CN117704307B (en) * | 2024-02-02 | 2024-05-07 | 深圳市帝狼光电有限公司 | Mixed spectrum lamp and control method |
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| CN1912457A (en) * | 2005-07-29 | 2007-02-14 | 株式会社茉莉特斯 | Surface lighting device |
| CN201166314Y (en) * | 2008-02-18 | 2008-12-17 | 深圳市中电淼浩固体光源有限公司 | LCD backlight system using colour blending LED light source to combine with green LED light source |
| CN103234149A (en) * | 2013-03-29 | 2013-08-07 | 京东方科技集团股份有限公司 | Backlight module, liquid crystal display and backlight drive control method |
| CN107123642A (en) * | 2017-07-04 | 2017-09-01 | 安徽芯瑞达科技股份有限公司 | A kind of bluish-green high colour gamut LED lamp bead of chip-in series of red fluorescence powder collocation and its backlight |
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| JP4738470B2 (en) * | 2008-10-30 | 2011-08-03 | シャープ株式会社 | Illumination device and display device including the same |
| CN204187418U (en) * | 2014-11-12 | 2015-03-04 | 遵义师范学院 | A kind of mine auxiliary lighting apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1912457A (en) * | 2005-07-29 | 2007-02-14 | 株式会社茉莉特斯 | Surface lighting device |
| CN201166314Y (en) * | 2008-02-18 | 2008-12-17 | 深圳市中电淼浩固体光源有限公司 | LCD backlight system using colour blending LED light source to combine with green LED light source |
| CN103234149A (en) * | 2013-03-29 | 2013-08-07 | 京东方科技集团股份有限公司 | Backlight module, liquid crystal display and backlight drive control method |
| CN107123642A (en) * | 2017-07-04 | 2017-09-01 | 安徽芯瑞达科技股份有限公司 | A kind of bluish-green high colour gamut LED lamp bead of chip-in series of red fluorescence powder collocation and its backlight |
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