CN214795501U

CN214795501U - Backlight module structure and backlight module

Info

Publication number: CN214795501U
Application number: CN202120951033.XU
Authority: CN
Inventors: 万耿; 戴兆宇; 邹英华; 肖文锋
Original assignee: Tcl Huarui Lighting Technology Huizhou Co ltd; Very Optoelectronics Huizhou Co Ltd
Current assignee: Tcl Huarui Lighting Technology Huizhou Co ltd; Very Optoelectronics Huizhou Co Ltd
Priority date: 2021-05-06
Filing date: 2021-05-06
Publication date: 2021-11-19
Anticipated expiration: 2031-05-06

Abstract

The utility model relates to a backlight module structure and backlight module, wherein the backlight module structure includes circuit board, ruddiness LED wafer, green glow LED wafer and blue light LED wafer, be provided with at least a set of LED pad on the circuit board, wherein, each LED pad of group all includes a ruddiness LED pad, a green glow LED pad and a blue light LED pad; one red light LED wafer is correspondingly arranged on each red light LED bonding pad, one green light LED wafer is correspondingly arranged on each green light LED bonding pad, one blue light LED wafer is correspondingly arranged on each blue light LED bonding pad, and the red light LED wafer, the green light LED wafer and the blue light LED wafer are respectively and electrically connected with the circuit board. The backlight module structure and the backlight module save cost, greatly improve the color gamut of the white light, and directly weld the LED wafer on the circuit board, shorten the heat dissipation channel of the LED wafer and reduce the thermal resistance.

Description

Backlight module structure and backlight module

Technical Field

The utility model relates to a backlight technical field especially relates to a backlight unit structure and backlight unit.

Background

At present, through the development of over ten years, the liquid crystal display television is increasingly networked and intelligentized nowadays, emerging technologies are also increasingly emerging, and application services are increasingly abundant. However, in terms of the most important image quality, the pure color gamut in the market is substantially 70% to 80%, so that the color distortion occurs.

The backlight module is usually used as a backlight source of the liquid crystal display device, and light sources in the backlight module are arranged on two sides or at the bottom of a circuit board, and then light rays of the light sources are spread over a screen through a light guide plate. In order to improve the color gamut, one side surface of the light guide plate is used as a light incident surface in the conventional backlight module structure, a circuit board is arranged on the light incident surface, and meanwhile, the surface mounted LED lamp beads are used as a light source. Because LED lamp pearl usually comprises multiple materials such as support, wafer, phosphor powder, packaging glue, current backlight unit is with high costs, and the colour gamut is not high.

SUMMERY OF THE UTILITY MODEL

Accordingly, there is a need for a backlight module structure and a backlight module.

A backlight module structure comprises: the LED packaging structure comprises a circuit board, a red LED wafer, a green LED wafer and a blue LED wafer, wherein at least one group of LED bonding pads is arranged on the circuit board, and each group of LED bonding pads comprises a red LED bonding pad, a green LED bonding pad and a blue LED bonding pad; one red light LED wafer is correspondingly arranged on each red light LED bonding pad, one green light LED wafer is correspondingly arranged on each green light LED bonding pad, one blue light LED wafer is correspondingly arranged on each blue light LED bonding pad, and the red light LED wafer, the green light LED wafer and the blue light LED wafer are respectively and electrically connected with the circuit board.

In one embodiment, the red LED chips are connected in series, the green LED chips are connected in series, and the blue LED chips are connected in series.

In one embodiment, the circuit board is provided with a first control circuit, a second control circuit and a third control circuit, each red light LED chip is connected with the first control circuit, each green light LED chip is connected with the second control circuit, and each blue light LED chip is connected with the third control circuit.

In one embodiment, each of the red LED chips, the green LED chips, and the blue LED chips is a flip chip, each of the red LED chips is disposed on each of the red LED pads and electrically connected to the circuit board through a conductive adhesive, each of the green LED chips is disposed on each of the green LED pads and electrically connected to the circuit board through a conductive adhesive, and each of the blue LED chips is disposed on each of the blue LED pads and electrically connected to the circuit board through a conductive adhesive.

In one embodiment, each of the red LED chips, the green LED chips, and the blue LED chips is a front-mounted chip, each of the red LED chips is disposed on each of the red LED pads through an insulating adhesive and electrically connected to the circuit board through a conductive wire, each of the green LED chips is disposed on each of the green LED pads through an insulating adhesive and electrically connected to the circuit board through a conductive wire, and each of the blue LED chips is disposed on each of the blue LED pads through an insulating adhesive and electrically connected to the circuit board through a conductive wire.

In one embodiment, a plurality of sets of the LED pads are disposed on the circuit board 100, and the distances between two adjacent sets of the LED pads are equal.

In one embodiment, the red LED pads, the green LED pads and the blue LED pads in each group of the LED pads are arranged in a triangle.

In one embodiment, the LED packaging structure further comprises a reflection dam, wherein the reflection dam is arranged on the circuit board, and each red LED bonding pad, each green LED bonding pad and each blue LED bonding pad are correspondingly located in one reflection dam one by one.

In one embodiment, the LED light source further comprises a transparent colloid which is filled in each reflection dam in a one-to-one correspondence manner and seals each red LED wafer, each green LED wafer and each blue LED wafer.

A backlight module comprises the backlight module structure as described in any of the above embodiments.

The utility model has the advantages that: through the ruddiness LED pad that sets up the multiunit on the circuit board, green glow LED pad and blue light LED pad, need not be again with the support, the wafer, phosphor powder, multiple materials such as encapsulation glue are packaged into LED lamp pearl through packaging technique, the cost of backlight unit structure has been saved, and use ruddiness LED wafer, green glow LED wafer and blue light LED wafer can realize white light, and because the wafer is narrower than the half-wave width of phosphor powder, the very big promotion colour gamut of white light that uses three kinds of wafers to realize, and with LED wafer lug connection on the circuit board, the heat dissipation channel of LED wafer has been shortened, the thermal resistance has been reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic view of a backlight module according to an embodiment;

fig. 2 is a schematic view of a backlight module structure according to an embodiment.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The utility model discloses a backlight module structure, include: the LED packaging structure comprises a circuit board, a red LED wafer, a green LED wafer and a blue LED wafer, wherein at least one group of LED bonding pads is arranged on the circuit board, and each group of LED bonding pads comprises a red LED bonding pad, a green LED bonding pad and a blue LED bonding pad; one red light LED wafer is correspondingly arranged on each red light LED bonding pad, one green light LED wafer is correspondingly arranged on each green light LED bonding pad, one blue light LED wafer is correspondingly arranged on each blue light LED bonding pad, and the red light LED wafer, the green light LED wafer and the blue light LED wafer are respectively and electrically connected with the circuit board.

Above-mentioned backlight unit structure, through the ruddiness LED pad that sets up the multiunit on the circuit board, green glow LED pad and blue light LED pad, need not be with the support again, the wafer, the phosphor powder, multiple materials such as encapsulation glue are packaged into LED lamp pearl through packaging technique, the cost of backlight unit structure has been saved, and use ruddiness LED wafer, white light can be realized to green glow LED wafer and blue light LED wafer, and because the half-wave width of wafer ratio phosphor powder is narrow, the very big promotion colour gamut of white light that uses three kinds of wafers to realize, and with LED wafer lug weld on the circuit board, the heat dissipation channel of LED wafer has been shortened, the thermal resistance has been reduced.

In order to facilitate understanding of the backlight module structure of the present application, the backlight module structure is further described below with reference to the accompanying drawings.

As shown in fig. 1 and 2, a backlight module structure 10 includes: a circuit board 100, a red LED wafer 200, a green LED wafer 300, and a blue LED wafer 400. The circuit board 100 is used for carrying a wafer and conducting the wafer, the dominant wavelength of the red LED wafer is 600 mm to 650 mm for emitting red light, the dominant wavelength of the green LED wafer is 490 mm to 540 mm for emitting green light, and the dominant wavelength of the blue LED wafer is 440 mm to 480 mm for emitting blue light. Red, green and blue light can be mixed to form a suitable white light.

The circuit board 100 is provided with at least one group of LED pads, wherein each group of LED pads comprises a red LED pad 110, a green LED pad 120 and a blue LED pad 130. In one embodiment, a group of the LED pads is disposed on the circuit board 100, and in other embodiments, a plurality of groups of the LED pads are disposed on the circuit board 100, and the groups of the LED pads are disposed on the circuit board 100 at intervals. In one embodiment, a plurality of sets of the LED pads are disposed on the circuit board 100, and the distances between two adjacent sets of the LED pads are equal. The LED bonding pads are used to electrically connect the control circuit to the red LED chip 200, the green LED chip 300, and the blue LED chip 400, that is, the circuit board is provided with a control circuit connected to an external power source, and when the red LED chip 200, the green LED chip 300, and the blue LED chip 400 are disposed on the bonding pads, the control circuit can be electrically connected to the circuit board 100.

In one embodiment, each of the red LED chips 200, the green LED chips 300, and each of the blue LED chips 400 are flip chips, each of the red LED chips 200 is disposed on each of the red LED pads 110 and electrically connected to the circuit board 100 through a conductive adhesive, each of the green LED chips 300 is disposed on each of the green LED pads 120 and electrically connected to the circuit board 100 through a conductive adhesive, and each of the blue LED chips 400 is disposed on each of the blue LED pads 130 and electrically connected to the circuit board 100 through a conductive adhesive.

In one embodiment, each of the red LED chips 200, the green LED chips 300, and each of the blue LED chips 400 are forward mounted chips, each of the red LED chips 200 is disposed on each of the red LED pads 110 through an insulating adhesive and electrically connected to the circuit board 100 through a conductive wire, each of the green LED chips 300 is disposed on each of the green LED pads 120 through an insulating adhesive and electrically connected to the circuit board 100 through a conductive wire, and each of the blue LED chips 400 is disposed on each of the blue LED pads 130 through an insulating adhesive and electrically connected to the circuit board 100 through a conductive wire.

One red light LED wafer 200 is correspondingly arranged on each red light LED bonding pad 110, one green light LED wafer 300 is correspondingly arranged on each green light LED bonding pad 120, one blue light LED wafer 400 is correspondingly arranged on each blue light LED bonding pad 130, and each red light LED wafer 200, each green light LED wafer 300 and each blue light LED wafer 400 are respectively and electrically connected with the circuit board 100. In this way, the currents of the

LED chips

200, 300, 400 can be controlled by the control circuit on the control circuit board 100, so as to control the light emission thereof, thereby obtaining appropriate white light.

In order to individually control red light, green light and blue light, in one embodiment, the red LED chips 200, the green LED chips 300 and the blue LED chips 400 are connected in series. Thus, the red LED wafers 200, the green LED wafers 300 and the blue LED wafers 400 are connected in series, so that the current of red light, green light and blue light can be independently controlled, and white light with appropriate optical parameters can be obtained.

In order to separately control red light, green light and blue light, in one embodiment, the circuit board 100 is provided with a first control circuit, a second control circuit and a third control circuit, each red LED chip 200 is connected to the first control circuit, each green LED chip 300 is connected to the second control circuit, and each blue LED chip 400 is connected to the third control circuit. Therefore, the current of the red light, the green light and the blue light can be conveniently and independently controlled, and the white light with proper optical parameters can be obtained.

In order to facilitate the mixing of red light, green light and blue light to form purer white light, in one embodiment, the red LED pads 110, the green LED pads 120 and the blue LED pads 130 in each group of LED pads are arranged in a triangle. Thus, the light of three colors of red, green and blue can be well mixed to form purer white light.

In order to improve the light intensity of the backlight module structure, in one embodiment, the backlight module structure further includes a reflective dam 500, the reflective dam 500 is disposed on the circuit board 100, and each of the red LED pads 110, the green LED pads 120, and the blue LED pads 130 are uniformly and correspondingly located in one reflective dam 500. Like this, through setting up reflection box dam 500, the light that sends is gone through reflection box dam 500 to the effect of ruddiness LED wafer 200, green glow LED wafer 300, blue light LED wafer 400 side and launches openly effectively, improves the luminous intensity of backlight unit structure, has avoided the light leak, has promoted luminance simultaneously.

In one embodiment, the height of the reflective dam 500 is at least 0.1 mm higher than each of the red LED chip 200, the green LED chip 300, and the blue LED chip 400. In one embodiment, the reflective box dam 500 may be made of epoxy glue, and may be added with high-reflectivity additives such as titanium dioxide, aluminum oxide powder, silver, etc., and may have a square, circular, horn, bell-jar shape, etc.

In order to prevent the oxidation of the LED chips, in one embodiment, a transparent adhesive body 600 is further included, and the transparent adhesive body 600 is filled in each of the reflective dams 500 in a one-to-one correspondence and seals each of the red LED chips 200, the green LED chips 300, and the blue LED chips 400. Thus, the LED chip is sealed in the cavity formed by the reflective dam 500 and the circuit board 100 by the transparent adhesive 600, and the LED chip can be effectively prevented from being oxidized.

The application also discloses a backlight module, which comprises the backlight module structure in any embodiment. It should be noted that the backlight module further includes a reflective sheet, a light guide sheet, and the like, and the improvement of the backlight module of the present application is limited to the above-mentioned backlight module structure, and is not repeated herein.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A backlight module structure, comprising:

the LED packaging structure comprises a circuit board, wherein at least one group of LED bonding pads are arranged on the circuit board, and each group of LED bonding pads comprises a red LED bonding pad, a green LED bonding pad and a blue LED bonding pad;

the LED packaging structure comprises red light LED wafers, green light LED wafers and blue light LED wafers, wherein one red light LED wafer is arranged on each red light LED bonding pad in a one-to-one corresponding mode, one green light LED wafer is arranged on each green light LED bonding pad in a one-to-one corresponding mode, one blue light LED wafer is arranged on each blue light LED bonding pad in a one-to-one corresponding mode, and the red light LED wafers, the green light LED wafers and the blue light LED wafers are respectively and electrically connected with a circuit board.

2. The backlight module structure of claim 1, wherein the red LED chips are connected in series, the green LED chips are connected in series, and the blue LED chips are connected in series.

3. The backlight module structure of claim 1, wherein the circuit board is provided with a first control circuit, a second control circuit and a third control circuit, each of the red LED chips is connected to the first control circuit, each of the green LED chips is connected to the second control circuit, and each of the blue LED chips is connected to the third control circuit.

4. The backlight module structure of claim 1, wherein each of the red LED chips, the green LED chips, and the blue LED chips is a flip chip, each of the red LED chips is disposed on each of the red LED pads and electrically connected to the circuit board through a conductive adhesive, each of the green LED chips is disposed on each of the green LED pads and electrically connected to the circuit board through a conductive adhesive, and each of the blue LED chips is disposed on each of the blue LED pads and electrically connected to the circuit board through a conductive adhesive.

5. The backlight module structure of claim 1, wherein each of the red LED chips, the green LED chips, and the blue LED chips is a front-mounted chip, each of the red LED chips is disposed on each of the red LED pads through an insulating paste and electrically connected to the circuit board through a conductive wire, each of the green LED chips is disposed on each of the green LED pads through an insulating paste and electrically connected to the circuit board through a conductive wire, and each of the blue LED chips is disposed on each of the blue LED pads through an insulating paste and electrically connected to the circuit board through a conductive wire.

6. The backlight module structure of claim 1, wherein a plurality of sets of the LED pads are disposed on the circuit board 100, and the distance between two adjacent sets of the LED pads is equal.

7. The backlight module structure of claim 1, wherein the red LED pads, the green LED pads, and the blue LED pads in each group of LED pads are arranged in a triangle.

8. The backlight module structure of claim 1, further comprising a reflective dam disposed on the circuit board, wherein each of the red LED pads, the green LED pads, and the blue LED pads are located in one reflective dam in a one-to-one correspondence.

9. The backlight module structure of claim 8, further comprising transparent glue filled in the reflective dams and sealing the red, green and blue LED dies.

10. A backlight module comprising the backlight module structure as claimed in any one of claims 1 to 9.