CN215342582U

CN215342582U - White light LED packaging structure with high light color quality

Info

Publication number: CN215342582U
Application number: CN202121159230.4U
Authority: CN
Inventors: 刘三林; 程鸣; 陈小燕; 徐以明; 肖瑞斌
Original assignee: Dongguan Ledstar Optoelectronics Co ltd
Current assignee: Dongguan Ledstar Optoelectronics Co ltd
Priority date: 2021-05-27
Filing date: 2021-05-27
Publication date: 2021-12-28
Anticipated expiration: 2031-05-27

Abstract

The utility model discloses a high-photochromic quality white light LED packaging structure which comprises a substrate, wherein the substrate comprises an insulating resin plate, a composite through groove, a conductive pad, a heat-conducting silica gel sheet, a heat-conducting sheet and a heat-radiating fin, the middle part of the top end of the insulating resin plate is provided with the composite through groove, the top end of the conductive pad is provided with an arc-shaped groove, the top end of the arc-shaped groove is provided with a light-emitting component, the surface of the light-emitting component is coated with a fluorescent glue layer, two ends of the substrate are respectively connected with a positive pin and a negative pin, the light-emitting component comprises three red light LED wafers and a blue light LED wafer, and the three red light LED wafers and the red light LED wafers are both arranged in the inner cavity of the arc-shaped groove The LED crystal is beneficial to heat dissipation of the LED crystal and prolongs the service life of the LED lamp.

Description

White light LED packaging structure with high light color quality

Technical Field

The utility model relates to the technical field of LEDs, in particular to a white light LED packaging structure with high light color quality.

Background

LED (semiconductor light emitting diode) packages refer to packages of light emitting chips, which are significantly different compared to integrated circuit packages. The encapsulation of LEDs is required not only to protect the wick, but also to be transparent. Therefore, the package of the LED has special requirements on the packaging material, and generally, the package has the function of providing sufficient protection for the chip, so as to prevent the chip from being damaged due to long-term exposure or mechanical damage in the air, so as to improve the stability of the chip; for LED packaging, it is also necessary to have good light extraction efficiency and good heat dissipation, and good packaging can make the LED have better luminous efficiency and heat dissipation environment, thereby improving the life of the LED.

The existing LED package structure also generates some new requirements in the production process, one of which is: the traditional white light LED packaging structure has poor performance in comparison with light color quality, and people can not feel comfortable when watching for a long time; the second step is as follows: the work of the LED wafer can generate heat, and the heat dissipation performance of the existing LED packaging structure is poor, so that the wafer is easily damaged, and the service life of the LED lamp is shortened.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a white light LED packaging structure with high light color quality, which aims to solve the problems that the traditional white light LED packaging structure manufactured in the background technology has poor performance of comparing light color quality, and human eyes are very uncomfortable to watch for a long time; the work of LED wafer can produce heat, and current LED packaging structure heat dispersion is relatively poor, causes the damage of wafer easily, reduces the life's of LED lamp problem.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a high photochromic quality white light LED packaging structure, includes the base plate, the base plate includes insulating resin plate, compound logical groove, conducting pad, heat conduction silica gel piece, conducting strip and radiating fin, compound logical groove has been seted up at the middle part on insulating resin plate top, compound inner chamber from the top down that leads to the groove bonds in proper order has conducting pad, heat conduction silica gel piece, conducting strip and radiating fin, the arc wall has been seted up on the top of conducting pad, the top fixed mounting of arc wall has light-emitting component, light-emitting component's surperficial cladding has the fluorescent glue layer, the both ends of base plate respectively fixedly connected with anodal pin and negative pole pin.

As a preferable technical scheme of the utility model, the light-emitting component comprises three red light LED wafers and one blue light LED wafer, the three red light LED wafers are fixedly arranged on one side of the top of the arc-shaped groove at equal intervals, and the blue light LED wafer is fixedly arranged on the other side of the top of the arc-shaped groove.

As a preferred technical solution of the present invention, the positive electrode of the light emitting device is electrically connected to the positive electrode pin, and the negative electrode of the light emitting device is electrically connected to the negative electrode pin.

As a preferred technical solution of the present invention, the three red LED chips and the three blue LED chips are electrically connected to the conductive pad through gold wires.

As a preferred technical scheme of the utility model, heat dissipation cavities are surrounded at the bottoms of the heat conducting fins and the bottom ends of the inner cavities of the composite through grooves, communicating grooves are respectively formed at two ends of the bottom of the insulating resin plate, dust screens are respectively bonded in the inner cavities of the two communicating grooves, and two ends of each heat dissipation cavity are respectively communicated with the inner cavities of the two communicating grooves.

Compared with the prior art, the utility model has the beneficial effects that:

through the conducting pad, the heat conduction silica gel piece, the conducting strip, radiating fin, light emitting component, the arc wall, ruddiness LED wafer, blue light LED wafer, the cooperation of fluorescence glue film and dust screen, at ruddiness LED wafer, the surface cladding of blue light LED wafer has the fluorescence glue film, it is better to compare photochromic quality performance with traditional preparation white light LED packaging structure, can realize comfortable to people's eye, let the people feel joyful light environment, and through set up heat-conducting plate and radiating fin on the base plate, be favorable to the heat dissipation of LED crystal, strengthen the life of LED lamp.

Drawings

FIG. 1 is a schematic view of a substrate according to the present invention;

FIG. 2 is a top view of the present invention;

FIG. 3 is a cross-sectional view of a substrate of the present invention;

FIG. 4 is an enlarged view of the portion A of the present invention.

In the figure: 1. a substrate; 2. an insulating resin plate; 3. a composite through groove; 4. a conductive pad; 5. a heat-conducting silica gel sheet; 6. a heat conductive sheet; 7. a heat dissipating fin; 8. a light emitting assembly; 9. an arc-shaped slot; 10. a red LED wafer; 11. a blue LED chip; 12. a fluorescent glue layer; 13. a communicating groove; 14. a dust screen; 15. a positive electrode pin; 16. and a negative electrode pin.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the utility model provides a high light color quality white light LED package structure, which includes a substrate 1, wherein the substrate 1 includes an insulating resin plate 2, a composite through groove 3, a conductive pad 4, a heat conductive silicone sheet 5, a heat conductive sheet 6 and a heat dissipation fin 7, the composite through groove 3 is formed in the middle of the top end of the insulating resin plate 2, the conductive pad 4, the heat conductive silicone sheet 5, the heat conductive sheet 6 and the heat dissipation fin 7 are sequentially bonded in an inner cavity of the composite through groove 3 from top to bottom, an arc-shaped groove 9 is formed in the top end of the conductive pad 4, a light emitting assembly 8 is fixedly mounted at the top end of the arc-shaped groove 9, a fluorescent glue layer 12 is coated on the surface of the light emitting assembly 8, a positive pin 15 and a negative pin 16 are respectively and fixedly connected to two ends of the substrate 1, and the insulating resin plate 2, the composite through groove 3, the conductive pad 4, the heat conductive silicone sheet 5, the heat conductive sheet 6, the heat dissipation fin 7, the light emitting assembly 8, The arc-shaped groove 9, the red light LED wafer 10, the blue light LED wafer 11, the fluorescent glue layer 12, the communicating groove 13, the dust screen 14, the anode pin 15 and the cathode pin 16 are matched, compared with a traditional white light LED packaging structure, the white light LED packaging structure has better performance in light color, can realize a light environment comfortable to human eyes and pleasant to human senses, and is beneficial to heat dissipation of LED crystals and prolongs the service life of an LED lamp by arranging the heat conducting sheet 6 and the heat radiating fins 7 on the substrate 1.

Preferably, the light emitting assembly 8 includes three red light LED chips 10 and one blue light LED chip 11, the three red light LED chips 10 and the red light LED chips 10 are fixedly mounted on one side of the top of the arc-shaped groove 9 at equal intervals, the blue light LED chip 11 is fixedly mounted on the other side of the top of the arc-shaped groove 9, the three red light LED chips 10 and the blue light LED chip 11 serve as a light source, and the arc-shaped groove 9 has a certain light condensing effect.

Preferably, the positive electrode of the light emitting component 8 is electrically connected to the positive electrode pin 15, the negative electrode of the light emitting component 8 is electrically connected to the negative electrode pin 16, and the positive electrode pin 15 and the negative electrode pin 16 are used for being connected to an external power supply.

Preferably, the three red LED chips 10 and the blue LED chips 11 are electrically connected to the conductive pads 4 by gold wires.

Preferably, the bottom of the heat conducting sheet 6 and the bottom of the inner cavity of the composite through groove 3 are surrounded by a heat dissipation cavity, so that heat dissipation is facilitated.

Preferably, the communicating groove 13 has all been seted up at the both ends of insulating resin board 2 bottom, and the inner chamber of two communicating grooves 13 has all bonded dust screen 14, and communicating groove 13 is used for the circulation of air, and convenient heat dissipation, dust screen 14 prevent the entering of dust.

Preferably, two ends of the heat dissipation cavity are respectively communicated with the inner cavities of the two dust screens 14.

When the high-color-quality white light LED packaging structure is used, the fluorescent glue layer 12 is a mixture of fluorescent powder and transparent silica gel, the chromaticity center point coordinate of an LED lamp is controlled to fall on a black body locus line, the delta u 'v' circle is controlled to be within 4 orders, the color quality of the LED lamp is controlled to be equal to or more than 90 in Color Rendering Index (CRI), equal to or more than 80 and equal to or less than 100 in color Gamut Area Index (GAI), equal to or more than 90 in television illumination index (TLCI-2012), equal to or more than 90 in special color rendering index R9, equal to or more than 80 in TM-30-15: rg >80, Rf >80, the peak wavelength of the LED is between 615 and 635nm, so that the light color quality performance is better, a comfortable and pleasant light environment can be realized for human eyes, when the red LED wafer 10 and the blue LED wafer 11 work and generate heat, the heat is conducted to the heat conducting sheet 6 by the heat conducting silica gel sheet 5, the heat conducting sheet 6 transfers the heat to the radiating fin 7, the radiating area of the radiating fin 7 is enlarged, the bottom end of the radiating fin 7 is arranged in the radiating groove and communicated with the radiating groove 13, so that the external air passes through the radiating groove, the heat on the radiating fin 7 is taken away, the purpose of radiating the LED wafer is achieved, and the service life of the LED lamp is prolonged.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the utility model can be made, and equivalents and modifications of some features of the utility model can be made without departing from the spirit and scope of the utility model.

Claims

1. A high-color-quality white light LED packaging structure comprises a substrate (1), and is characterized in that: the base plate (1) comprises an insulating resin plate (2), a composite through groove (3), a conductive pad (4), a heat-conducting silica gel sheet (5), a heat-conducting fin (6) and a radiating fin (7), the composite through groove (3) is formed in the middle of the top end of the insulating resin plate (2), the conductive pad (4), the heat-conducting silica gel sheet (5), the heat-conducting fin (6) and the radiating fin (7) are sequentially bonded to the inner cavity of the composite through groove (3) from top to bottom, an arc-shaped groove (9) is formed in the top end of the conductive pad (4), a light-emitting assembly (8) is fixedly mounted at the top end of the arc-shaped groove (9), a fluorescent glue layer (12) is wrapped on the surface of the light-emitting assembly (8), and a positive pin (15) and a negative pin (16) are fixedly connected to the two ends of the base plate (1) respectively.

2. The package structure of claim 1, wherein the package structure comprises: light emitting component (8) include three ruddiness LED wafer (10) and a blue light LED wafer (11), and is three ruddiness LED wafer (10) equidistance fixed mounting in one side at arc wall (9) top, blue light LED wafer (11) fixed mounting in the opposite side at arc wall (9) top.

3. The package structure of claim 1, wherein the package structure comprises: the positive electrode of the light-emitting component (8) is electrically connected with the positive electrode pin (15), and the negative electrode of the light-emitting component (8) is electrically connected with the negative electrode pin (16).

4. The package structure of claim 2, wherein the package structure comprises: the three red light LED chips (10) and the blue light LED chips (11) are electrically connected with the conducting pad (4) through gold wires.

5. The package structure of claim 1, wherein the package structure comprises: the bottom of conducting strip (6) with the bottom of compound logical groove (3) inner chamber encloses there is the heat dissipation chamber, intercommunication groove (13) have all been seted up at the both ends of insulating resin board (2) bottom, two the inner chamber of intercommunication groove (13) all bonds dust screen (14), just the both ends in heat dissipation chamber respectively with two the inner chamber intercommunication of intercommunication groove (13).