CN218274633U

CN218274633U - LED lamp bead with efficient heat dissipation function

Info

Publication number: CN218274633U
Application number: CN202222183302.XU
Authority: CN
Inventors: 戴朋
Original assignee: Shenzhen Lianshang Photoelectric Co ltd
Current assignee: Shenzhen Lianshang Photoelectric Co ltd
Priority date: 2022-08-18
Filing date: 2022-08-18
Publication date: 2023-01-10
Anticipated expiration: 2032-08-18

Abstract

The utility model relates to a high-efficient radiating LED lamp pearl, including the base plate, the base plate is including the first region of installing the LED chip and the second region of installing drive circuit, and the first region cladding has transparent heat conduction silica gel's first packaging body, and the regional cladding of second has opaque ceramic silica gel's second packaging body, and first packaging body is connected with the second packaging body and is integrative common cladding base plate, and the regional connection lamp base of second, lamp base extend to the outside of second packaging body. The first region of second packaging body cladding that utilizes opaque ceramic silica gel can make drive circuit part invisible, increases LED lamp pearl's aesthetic property to heat dissipation that can be better utilizes the first packaging body cladding second region of transparent heat conduction silica gel to guarantee passing through of light promptly, heat dissipation that again can be fine.

Description

LED lamp bead with efficient heat dissipation function

Technical Field

The application belongs to the technical field of light emitting diode lighting, and relates to a high-efficiency heat-dissipation LED lamp bead.

Background

Compared with the traditional light source, the visible light emitted by the light emitting diode has the advantages of electricity saving, high luminous flux, long service life and no pollution, and the emitted light has no ultraviolet light, so that the LED lamp is used for replacing the traditional incandescent lamp and the energy-saving fluorescent lamp, which has become a critical technology in the effort of various countries.

In the related art, most fields can adopt the LED lamp to replace the conventional light source, and since the light emission of the LED is greatly affected by the temperature, the light emission intensity of the LED is reduced after the temperature is increased, and the service life of the LED lamp is also greatly affected, it is necessary to ensure that the LED lamp can have a good heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

The application aims at providing a high-efficient radiating LED lamp pearl.

The application is realized through the following technical scheme.

This technical scheme provides a high-efficient radiating LED lamp pearl, a serial communication port, which comprises a substrate, the base plate is including the first region of installing the LED chip and the second region of installing drive circuit, the first region cladding has the first packaging body of transparent heat conduction silica gel, the regional cladding of second has the second packaging body of opaque ceramic silica gel, first packaging body with the second packaging body is connected and is integrative common cladding the base plate, the second regional connection has the lamp base, the lamp base extends to the outside of second packaging body.

The technical effect that the second packaging body cladding first region that this application technical scheme has is, the second packaging body cladding that utilizes opaque ceramic silica gel can make drive circuit part invisible, increases LED lamp pearl's aesthetic property to heat dissipation that can be better, the first packaging body cladding second region that utilizes transparent heat conduction silica gel guarantees passing through of light promptly, heat dissipation that again can be fine.

In one embodiment of the present disclosure, the substrate is an aluminum substrate, a beryllium oxide ceramic substrate, or an aluminum nitride ceramic substrate.

In one embodiment of the present disclosure, the ceramic silica gel is an insulating and heat conducting silica gel filled with beryllium oxide ceramic powder, aluminum oxide ceramic powder, or aluminum nitride ceramic powder.

In one embodiment of the present disclosure, LED chips are mounted on two or one side of the first region, the LED chips are electrically connected to the driving circuit, and the driving circuit is electrically connected to the lamp pins.

In one embodiment of the present disclosure, a fluorescent colloid is further coated above the LED chip, and the fluorescent colloid is located below the first package body; or the first area is further coated with fluorescent colloid, and the first packaging body is coated outside the fluorescent colloid.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application, as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.

Fig. 1 is a schematic structural diagram of an LED lamp bead shown in an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a substrate shown in an embodiment of the present application.

Fig. 3 is a schematic cross-sectional structure diagram of an LED lamp bead shown in an embodiment of the present application.

Fig. 4 is another schematic cross-sectional structure diagram of an LED lamp bead shown in an embodiment of the present application.

Description of reference numerals:

11-a substrate; 111-a first region; 112-a second region; 12-an LED chip; 13-a first package; 14-a second package; 15-lamp feet; 16-fluorescent colloid.

Detailed Description

Technical solutions in some embodiments of the present application will be clearly and completely described below with reference to the drawings in some embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.

As shown in fig. 1 to 4, the present embodiment provides a high-efficiency heat-dissipating LED lamp bead, including a substrate 11, the substrate 11 includes a first region 111 where an LED chip 12 is installed and a second region 112 where a driving circuit is installed, the first region 111 is coated with a first package body 13 of transparent heat-conducting silica gel, the second region 112 is coated with a second package body 14 of opaque ceramic silica gel, the first package body 13 and the second package body 14 are connected to form an integral body, and jointly coat the substrate 11, the second region 112 is connected to a lamp base 15, and the lamp base 15 extends to the outside of the second package body 14.

Therefore, the second region 112 is coated by the second packaging body 14 made of opaque ceramic silica gel, so that the driving circuit part can be invisible, the attractiveness of the LED lamp bead is improved, better heat dissipation can be achieved, the first region 111 is coated by the first packaging body 13 made of transparent heat-conducting silica gel, light can be guaranteed to pass through, and good heat dissipation can be achieved.

In this embodiment, the substrate 11 is an aluminum substrate 11, a beryllium oxide ceramic substrate 11, or an aluminum nitride ceramic substrate 11. The substrates 11 have good heat conduction performance, and can conduct heat generated by the LED chip 12 in time, so as to ensure that the temperature of the LED chip 12 is raised due to heat accumulation.

In this embodiment, the ceramic silica gel is an insulating heat-conducting silica gel filled with beryllium oxide ceramic powder, aluminum oxide ceramic powder, or aluminum nitride ceramic powder. The traditional heat-conducting silica gel is low in heat conductivity, generally below 10w/m.k, beryllium oxide ceramic can reach about 270w/m.k, aluminum nitride ceramic can reach about 320w/m.k, and aluminum oxide ceramic also has about 30w/m.k, and the ceramic powder is filled into the heat-conducting silica gel, so that the heat conductivity can be increased, an opaque effect can be achieved, a driving circuit of the second area 112 can not be seen, and the attractiveness of the LED lamp bead is improved.

In this embodiment, the LED chip 12 is mounted on both sides or one side of the first region 111, the LED chip 12 is electrically connected to the driving circuit, and the driving circuit is electrically connected to the lamp pin 15. For example, when the LED chip 12 is mounted on only one surface of the first region 111, the substrate 11 may be an aluminum substrate 11 in order to increase the thermal conductivity of the substrate 11.

In this embodiment, a fluorescent colloid 16 is further coated above the LED chip 12, and the fluorescent colloid 16 is located below the first package 13; or the first region 111 is further covered with the phosphor paste 16, and the phosphor paste 16 is located under the first package body 13. In this way, the LED chip 12 is packaged by the fluorescent colloid 16, so that the LED chip 12 is invisible, and the light is more uniform and soft.

Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. The utility model provides a high-efficient radiating LED lamp pearl, a serial communication port, which comprises a substrate, the base plate is including the first region of installing the LED chip and the second region of installing drive circuit, the first region cladding has transparent heat conduction silica gel's first packaging body, the regional cladding of second has opaque ceramic silica gel's second packaging body, first packaging body with second packaging body connects and is integrative common cladding the base plate, the second regional connection has the lamp base, the lamp base extends to the outside of second packaging body.

2. The LED lamp bead with efficient heat dissipation according to claim 1, wherein the substrate is an aluminum substrate, a beryllium oxide ceramic substrate or an aluminum nitride ceramic substrate.

3. The LED lamp bead with high heat dissipation efficiency as claimed in claim 1, wherein LED chips are mounted on two or one side of the first region, the LED chips are electrically connected with the driving circuit, and the driving circuit is electrically connected with the lamp pins.

4. The LED lamp bead with high heat dissipation efficiency as recited in claim 1, wherein a fluorescent colloid is further coated above the LED chip, and the fluorescent colloid is located below the first package body; or the first area is further coated with fluorescent colloid, and the first packaging body is coated outside the fluorescent colloid.