CN212257398U

CN212257398U - Non-polar direction surface mount type light emitting diode

Info

Publication number: CN212257398U
Application number: CN202021259675.5U
Authority: CN
Inventors: 陈都
Original assignee: Dongguan Ebird Photoelectric Technology Co ltd
Current assignee: Dongguan Ebird Photoelectric Technology Co ltd
Priority date: 2020-06-30
Filing date: 2020-06-30
Publication date: 2020-12-29
Anticipated expiration: 2030-06-30

Abstract

The utility model provides a chip-type light-emitting diode without polar direction, which comprises a shell, wherein a bowl-shaped cavity is arranged on the shell, a reflecting layer covers the bowl-shaped cavity, an insulating seat is arranged at the bottom of the bowl-shaped cavity, a LED chip is fixed on the insulating seat, a transparent adhesive layer is filled in the bowl-shaped cavity, a first wire hiding groove and a second wire hiding groove are arranged on the insulating seat, the positive electrode and the negative electrode of the LED chip are respectively connected with a first conductive lead and a second conductive lead, the first conductive lead passes through the first wire hiding groove, and the second conductive lead passes through the second wire hiding groove; the shell is internally provided with a first conductive pin and a second conductive pin which are both positioned below the light reflecting layer, the first conductive pin is provided with a first diode chip and a second diode chip, and the second conductive pin is provided with a third diode chip and a fourth diode chip. The utility model discloses overall structure is electrodeless to, and the installation fault-tolerant rate is high, installation easy operation, and overall structure is compact stable, can avoid forming the shadow, and luminous effectual.

Description

Non-polar direction surface mount type light emitting diode

Technical Field

The utility model relates to a light emitting diode packaging structure specifically discloses an anodeless SMD light emitting diode.

Background

The LED is also called a light emitting diode, is a common light emitting device, adopts a solid semiconductor chip as a light emitting material, and has the characteristics of high electro-optic conversion efficiency, long service life, high brightness and less heat generation.

The patch type light emitting diode is a packaging structure in which an LED chip and pins are arranged in a shell, and the pins are used for being connected with an electric energy supply circuit. The LED chip has one-way conductivity, and under the condition that a power supply is reversely connected, the LED chip cannot emit light, when the surface mount type light emitting diode in the prior art is mounted on a circuit system, the anode and the cathode of the surface mount type light emitting diode need to be accurately judged, otherwise, the surface mount type light emitting diode needs to be mounted again, the mounting efficiency is low, and the mounting operation is complex.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a non-polar surface mount light emitting diode for solving the problems in the prior art, which has an overall structure without connection requirements corresponding to positive and negative electrodes, is convenient to install and operate, and has a compact and stable overall structure and a good light emitting effect.

In order to solve the prior art problem, the utility model discloses a chip type light emitting diode of poleless orientation, including the casing, be equipped with bowl form cavity on the casing, bowl form cavity coats and is stamped the reflector layer, the bottom of bowl form cavity is equipped with the insulating seat, be fixed with the LED chip on the insulating seat, bowl form cavity intussuseption is filled with the transparent adhesive layer, be equipped with first wire hiding groove and second wire hiding groove on the insulating seat, the positive negative pole of LED chip is connected with first conductive lead and second conductive lead respectively, first conductive lead passes first wire hiding groove, the second conductive lead passes second wire hiding groove;

the shell is internally provided with a first conductive pin and a second conductive pin which are both positioned below the light reflecting layer, the first conductive pin is provided with a first diode chip and a second diode chip, the second conductive pin is provided with a third diode chip and a fourth diode chip, the anode of the first diode chip is connected with the first conductive pin, the two ends of the first conductive pin are respectively connected with the cathode of the first diode chip and the cathode of the third diode chip, the anode of the third diode chip is connected with the second conductive pin, the cathode of the second diode chip is connected with the first conductive pin, the two ends of the second conductive pin are respectively connected with the anode of the second diode chip and the anode of the fourth diode chip, and the cathode of the fourth diode chip is connected with the second conductive pin.

Further, a fluorescent powder layer is arranged at the bottom of the transparent adhesive layer.

Furthermore, the insulating base is a heat dissipation ceramic base.

Furthermore, a heat conducting adhesive layer is connected between the LED chip and the insulating base.

Furthermore, the first conductive lead and the second conductive lead are both silver wires.

Furthermore, the top surface of the first diode chip, the top surface of the second diode chip, the top surface of the third diode chip, the top surface of the fourth diode chip and the top surface of the insulating base are coplanar.

Furthermore, one side of the first conductive pin and one side of the second conductive pin, which are close to the insulating base, are respectively provided with a first clamping groove and a second clamping groove.

The utility model has the advantages that: the utility model discloses an anodal to SMD emitting diode, it is connected with conductive pin through four diode chips to set up the LED chip, overall structure is anodal to, the electric current gets into all can drive the LED chip from arbitrary conductive pin and gives out light when installation is used, it corresponds the connection to need not positive negative pole, the installation fault-tolerant rate is high, installation easy operation is convenient, conductive lead wire is accomodate in the wire-hiding groove, overall structure is compact stable, all diode chips and conductive pin all are hidden under the reflector layer, can avoid forming harmful effects such as shadow, overall structure's luminous effect is good.

Drawings

Fig. 1 is a perspective structural diagram of a depression of the present invention.

Fig. 2 is a schematic cross-sectional view along a-a' in fig. 1.

Fig. 3 is a schematic diagram of the circuit structure of the present invention.

The reference signs are: the LED chip comprises a shell 10, a bowl-shaped concave cavity 11, a reflecting layer 12, a transparent adhesive layer 13, a fluorescent powder layer 131, an insulating base 20, a first wire hiding groove 21, a second wire hiding groove 22, an LED chip 30, a first conductive lead 31, a second conductive lead 32, a heat conducting adhesive layer 33, a first conductive pin 40, a first diode chip 41, a second diode chip 42, a first clamping groove 43, a second conductive pin 50, a third diode chip 51, a fourth diode chip 52 and a second clamping groove 53.

Detailed Description

For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.

Refer to fig. 1 to 3.

The embodiment of the utility model discloses a non-polar to SMD emitting diode, including insulating casing 10, be equipped with bowl form cavity 11 on the casing 10, bowl form cavity 11 coats and is stamped reflector layer 12, bowl form cavity 11 covers reflector layer 12 promptly, bowl form cavity 11's surface is equipped with insulating seat 20, be fixed with LED chip 30 on the insulating seat 20, LED chip 30 is located the center department of bowl form cavity 11, reflector layer 12 can effectively collect the light energy, improve the utilization ratio of energy, bowl form cavity 11 intussuseption is filled with transparent adhesive layer 13, transparent adhesive layer 13 cooperates casing 10 to form sealed packaging structure, can effectively improve SMD diode's waterproof and anticorrosive ability, be equipped with first wire-hiding groove 21 and second wire-hiding groove 22 that each other does not contact on insulating seat 20, two electrodes of LED chip 30 are connected with first lead wire 31 and second lead wire 32 respectively through soldering tin or short lead wire, the anode and the cathode of the LED chip 30 are respectively connected with a first conductive lead 31 and a second conductive lead 32, the first conductive lead 31 passes through the first wire-hiding groove 21, and the second conductive lead 32 passes through the second wire-hiding groove 22, that is, the first wire-hiding groove 21 and the second wire-hiding groove 22 can respectively realize effective limit on the first conductive lead 31 and the second conductive lead 32, so as to avoid the unreliable electrical connection structure inside the surface mount light-emitting diode chip caused by the problems of the deviation of the conductive leads and the like;

a first conductive pin 40 and a second conductive pin 50 both located below the light reflecting layer 12 are disposed in the housing 10, preferably, the first conductive pin 40 and the second conductive pin 50 are respectively located at two sides of the insulating base 20, the first conductive pin 40 is provided with a first diode chip 41 and a second diode chip 42, the second conductive pin 50 is provided with a third diode chip 51 and a fourth diode chip 52, the first diode chip 41, the second diode chip 42, the third diode chip 51 and the fourth diode chip 52 are all located below the light reflecting layer 12, so as to effectively prevent the diode chips from affecting the appearance of the overall patch-type light emitting diode chip and from forming a black shadow to affect the light emitting effect, the anode of the first diode chip 41 is connected to the first conductive pin 40, and both ends of the first conductive lead 31 are respectively connected to the cathode of the first diode chip 41 and the cathode of the third diode chip 51, the anode of the third diode chip 51 is connected to the second conductive pin 50, the cathode of the second diode chip 42 is connected to the first conductive pin 40, two ends of the second conductive lead 32 are respectively connected to the anode of the second diode chip 42 and the anode of the fourth diode chip 52, and the cathode of the fourth diode chip 52 is connected to the second conductive pin 50.

The utility model discloses practical four diode chips of LED chip 30 cooperation can form the effect of anodeless to, promptly the utility model discloses when being applied to circuit system, no matter the electric current gets into from first conductive pin 40 or second conductive pin 50, LED chip 30 can both realize work, can avoid appearing traditional SMD emitting diode because of the problem that the reversal connection can't light, installation convenient operation is swift. In addition, the whole structure is stable and firm, the internal electrical connection structure is firm, the utilization rate of light energy formed by the LED chip 30 is high, the brightness is uniform, no shadow is formed, and the light-emitting effect is good.

In this embodiment, the fluorescent powder layer 131 is disposed at the bottom of the transparent adhesive layer 13, the fluorescent powder layer 131 has a certain light transmittance, and light emitted from the LED chip 30 passes through the fluorescent powder layer 131 to form a light emitting effect with higher brightness and more satisfactory color.

In this embodiment, the insulating base 20 is a heat dissipation ceramic base, and the heat dissipation ceramic base directly contacts with the bottom surface of the LED chip 30, so that the heat dissipation performance of the surface mount diode can be effectively improved through the heat dissipation ceramic base, and the heat is prevented from accumulating on the LED chip 30 to affect the operation thereof.

Based on the above embodiment, the heat conductive adhesive layer 33 is connected between the LED chip 30 and the insulating base 20, and preferably, the heat conductive adhesive layer 33 is a heat conductive silicone adhesive layer, which can further improve the heat dissipation performance of the LED chip 30 and ensure the firmness and stability of the overall structure.

In this embodiment, the first conductive lead 31 and the second conductive lead 32 are both silver wires, and silver has good conductive performance, so that the conductive performance of the internal structure of the patch diode can be effectively ensured.

In the present embodiment, the top surfaces of the first diode chip 41, the second diode chip 42, the third diode chip 51, the fourth diode chip 52 and the insulating base 20 are coplanar, and the top surfaces of the diode chips and the insulating base 20 are coplanar, so that the first conductive lead 31 and the second conductive lead 32 can be effectively prevented from being bent during the connection process to affect the stability of the internal structure of the overall chip diode.

In this embodiment, the first and second

conductive pins

40 and 50 are respectively provided with a first and

second locking grooves

43 and 53 on the sides close to the insulating base 20, so that the stability of the connection structure between the housing and the conductive pins can be effectively improved, and preferably, the side of the insulating base 20 is provided with a third locking groove.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The electrodeless surface-mounted light-emitting diode is characterized by comprising a shell (10), wherein a bowl-shaped cavity (11) is arranged on the shell (10), a reflective layer (12) covers the bowl-shaped cavity (11), an insulating seat (20) is arranged at the bottom of the bowl-shaped cavity (11), an LED chip (30) is fixed on the insulating seat (20), a transparent adhesive layer (13) is filled in the bowl-shaped cavity (11), a first wire hiding groove (21) and a second wire hiding groove (22) are formed in the insulating seat (20), the positive electrode and the negative electrode of the LED chip (30) are respectively connected with a first conductive lead (31) and a second conductive lead (32), the first conductive lead (31) penetrates through the first wire hiding groove (21), and the second conductive lead (32) penetrates through the second wire hiding groove (22);

a first conductive pin (40) and a second conductive pin (50) which are located below the light reflecting layer (12) are arranged in the shell (10), a first diode chip (41) and a second diode chip (42) are arranged on the first conductive pin (40), a third diode chip (51) and a fourth diode chip (52) are arranged on the second conductive pin (50), the anode of the first diode chip (41) is connected with the first conductive pin (40), two ends of the first conductive lead (31) are respectively connected with the cathode of the first diode chip (41) and the cathode of the third diode chip (51), the anode of the third diode chip (51) is connected with the second conductive pin (50), the cathode of the second diode chip (42) is connected with the first conductive pin (40), and two ends of the second conductive lead (32) are respectively connected with the anode of the second diode chip (42) and the fourth conductive pin (50) The anode of the diode chip (52) and the cathode of the fourth diode chip (52) are connected with the second conducting pin (50).

2. The electrodeless directional patch type light-emitting diode as claimed in claim 1, wherein a fluorescent powder layer (131) is disposed at the bottom of the transparent adhesive layer (13).

3. The electrodeless directional patch type led of claim 1, wherein the insulating base (20) is a heat-dissipating ceramic base.

4. The chip type light-emitting diode with no polar direction as claimed in claim 3, wherein a thermal conductive adhesive layer (33) is connected between the LED chip (30) and the insulating base (20).

5. An electrodeless directional patch type light emitting diode as claimed in claim 1, wherein the first conductive lead (31) and the second conductive lead (32) are both silver wires.

6. An electrodeless direction patch light emitting diode as claimed in claim 1, wherein the top surface of the first diode chip (41), the top surface of the second diode chip (42), the top surface of the third diode chip (51), the top surface of the fourth diode chip (52) and the top surface of the insulating base (20) are coplanar.

7. The electrodeless directional patch light-emitting diode as claimed in claim 1, wherein the first conductive lead (40) and the second conductive lead (50) are respectively provided with a first locking groove (43) and a second locking groove (53) at a side close to the insulating base (20).