CN213184336U - High performance flip-chip COB structure - Google Patents
High performance flip-chip COB structure Download PDFInfo
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- CN213184336U CN213184336U CN202022662804.1U CN202022662804U CN213184336U CN 213184336 U CN213184336 U CN 213184336U CN 202022662804 U CN202022662804 U CN 202022662804U CN 213184336 U CN213184336 U CN 213184336U
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Abstract
The utility model discloses a high performance flip-chip COB structure, it includes: the lower base plate is provided with a lower mounting groove, the side wall of the lower mounting groove is provided with a lower connecting groove, and the bottom of the lower mounting groove is provided with a through hole; the upper substrate is provided with a light transmission hole, the bottom of the upper substrate is provided with an upper mounting groove, the bottom of the upper substrate is provided with an upper connecting groove, and the upper substrate is fixedly mounted at the top of the lower substrate; the LED chip is fixedly arranged in the lower mounting groove; the heat dissipation copper sheet is provided with a matching lug matched with the lower connecting groove and is fixedly arranged in the lower mounting groove; the connecting copper columns are installed in the lower connecting groove and the upper connecting groove and are electrically connected with the LED chip; the whole heat dissipation efficiency is improved, the structure is simple, convenient to install, produce and use, and the lighting effect is stable and soft.
Description
Technical Field
The utility model relates to a LED light source technical field especially involves a high performance flip-chip COB structure.
Background
The existing LED light source adopts a COB packaging form to design a basic lamp bead, so that the production cost is saved and the production efficiency is improved.
Most of the existing COB packaged light sources require matched optical components to perform color development treatment on light of the light sources, the COB light sources generally simulate natural light in order to obtain a better color development effect, partial light needs to be filtered out and softer lighting effect needs to be obtained for lighting requirements in certain fields, and further the optical components of the COB light sources are complex and expensive; and COB light source in case power is great, just need be equipped with great or the more radiator of fin like more than 15w, and current COB light source piece lies in the heat conduction efficiency on the radiator comparatively general, and COB light source temperature in case too high can lead to its light efficiency to go wrong.
Accordingly, there is a need for a high performance flip chip COB structure that addresses one or more of the above issues.
SUMMERY OF THE UTILITY MODEL
For solving one or more problems that exist among the prior art, the utility model provides a high performance flip-chip COB structure. The utility model discloses a solve the technical scheme that above-mentioned problem adopted and be: a high performance flip-chip COB structure, comprising: the lower base plate is provided with a lower mounting groove, the side wall of the lower mounting groove is provided with a lower connecting groove, and the bottom of the lower mounting groove is provided with a through hole;
the upper substrate is provided with a light hole matched with the lower mounting groove, the bottom of the upper substrate is provided with an upper mounting groove matched with the lower mounting groove, the bottom of the upper substrate is provided with an upper connecting groove matched with the lower connecting groove, and the upper substrate is fixedly mounted at the top of the lower substrate;
the LED chips are fixedly arranged in the lower mounting groove and the upper mounting groove;
the bottom of the heat dissipation copper sheet is provided with a bulge matched with the through hole, the heat dissipation copper sheet is provided with a matching lug matched with the lower connecting groove, and the heat dissipation copper sheet is fixedly installed in the lower mounting groove;
and the connecting copper column is arranged in the lower connecting groove and the upper connecting groove and is electrically connected with the LED chip.
Further, the infrabasal plate top surface is provided with the joint arch, the top substrate bottom surface be provided with the protruding complex joint groove of joint.
Furthermore, a step is arranged at the joint of the upper mounting groove and the bottom surface of the upper substrate.
Further, fluorescent glue is filled in the light-transmitting holes.
Furthermore, a conductive groove connected with the upper connecting groove is formed in the side wall of the upper substrate, a connecting copper foil is installed in the conductive groove, and the connecting copper foil is electrically connected with the connecting copper column.
Furthermore, glue is coated on the joint of the outer side surfaces of the upper substrate and the lower substrate.
The utility model discloses the beneficial value who gains is: the utility model discloses a will the infrabasal plate the upper substrate LED chip the heat dissipation copper sheet connect copper post and other parts and link together through ingenious structure, realized the high-efficient heat dissipation to the LED chip, improved the stability of the light efficiency of LED chip under high temperature operating condition, make things convenient for subsequent production and installation when improving the radiating efficiency through the layered design, stable in structure, succinctly can effectively protect inside circuit and LED chip. The utility model discloses a practical value has greatly improved above.
Drawings
Fig. 1 is a perspective view of a high-performance flip Chip On Board (COB) structure of the present invention;
fig. 2 is an exploded view of a high performance flip chip COB structure of the present invention;
fig. 3 is a schematic diagram of an upper substrate of a high-performance flip Chip On Board (COB) structure according to the present invention;
fig. 4 is a top view of a high performance flip chip COB structure of the present invention;
fig. 5 is a cross-sectional view of the top view a-a direction of the high performance flip chip COB structure of the present invention.
[ reference numerals ]
101. lower substrate
102. lower mounting groove
103. lower connecting groove
104. lower ring groove
105. through hole
106. clamping projection
110. heat radiation copper sheet
111. fitting ear
112. bump
120 waterproof ring
201. Upper base plate
202. light hole
203. upper mounting groove
204. step
205. upper connecting groove
206. conducting bath
207. go up the ring groove
208. clamping groove
210. first mounting groove
211. second mounting groove
220. fluorescent glue
221. optical filter
222 transparent protective layer
301. LED chip
401. connecting copper foil
402. insert projection
410. connecting copper column
411. connecting the notches.
Detailed Description
In order to make the above objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the invention.
As shown in fig. 1-5, the utility model discloses a high performance flip-chip COB structure, it includes: the structure comprises a lower substrate 101, wherein a lower mounting groove 102 is formed in the lower substrate 101, a lower connecting groove 103 is formed in the side wall of the lower mounting groove 102, a through hole 105 penetrating through the lower mounting groove 102 is formed in the bottom of the lower mounting groove, and a lower ring groove 104 is formed in the top surface of the lower substrate 101;
an upper substrate 201, wherein the upper substrate 201 is provided with a light transmission hole 202 matched with the lower mounting groove 102, the bottom of the upper substrate 201 is provided with an upper mounting groove 203 matched with the lower mounting groove 102, the bottom of the upper substrate 201 is provided with an upper connecting groove 205 matched with the lower connecting groove 103, the bottom of the upper substrate 201 is provided with an upper ring groove 207 matched with the lower ring groove 104, the side wall of the upper substrate 201 is provided with a conductive groove 206 connected with the upper connecting groove 205, and the upper substrate 201 is fixedly mounted on the top of the lower substrate 101;
the waterproof ring 120 is installed in the lower ring groove 104 and the upper ring groove 207 and is in interference fit with the lower ring groove and the upper ring groove;
the LED chip 301 is fixedly installed in the lower installation groove 102 and the upper installation groove 203;
the bottom of the heat dissipation copper sheet 110 is provided with a protrusion 112 matched with the through hole 105, the heat dissipation copper sheet 110 is provided with a matching lug 111 matched with the lower connecting groove 103, and the heat dissipation copper sheet 110 is fixedly installed in the lower installing groove 102 and below the LED chip;
a connecting copper pillar 410, wherein the connecting copper pillar 410 is installed in the lower connecting groove 103 and the upper connecting groove 205 and is electrically connected with the LED chip 301;
a connection copper foil 401, wherein the connection copper foil 401 is installed in the conductive groove 206 and electrically connected with the connection copper pillar 410;
and the filter 221, wherein the filter 221 is fixedly installed on the light hole 202.
It should be pointed out that lower spread groove 103 with go up spread groove 205 and all be provided with two or more, generally be the symmetry setting when being provided with two, connect fixed joint of tip under copper post 410 and install in spread groove 103 down, go up base plate 201 with infrabasal plate 101 can be fixed through modes such as buckle, screw or glue, the cooperation be fixed a position when connecting copper post 410 can facilitate the installation. The optical filter 221 may be replaced by a lens, which mainly realizes the dimming effect on the light of the LED chip 301, so that the light is softer. Under the condition that water proofing is not needed, the waterproof ring 120 can replace a glue strip to adhere and seal the upper substrate 201 and the lower substrate 101. When in use, the utility model is directly and fixedly arranged on a radiator, the lower substrate 101 and the heat dissipation copper sheet 110 are fully contacted with the radiator through silicone grease or liquid gold, the heat dissipation effect is improved, and an external circuit is electrically connected with the connection copper foil 401 to realize power supply; in particular, the connection copper pillar 410 may be connected to an external circuit only through the connection copper pillar 410, and the upper connection groove 205 is connected to the top surface of the upper substrate 201, so that the connection copper pillar 410 is electrically connected to the outside, but may prevent a lens or the like from being disposed above the light-transmitting hole 202.
It should be noted that the bottom surface of the heat dissipation copper sheet 110 is generally flush with the bottom surface of the lower substrate 101 after installation, the heat dissipation copper sheet 110 can achieve better heat dissipation of the LED chip 301, and generally, the periphery of the heat dissipation copper sheet 110 is coated with silicone grease. Through connect copper post 410, connect copper foil 401 to LED chip 301 carries out the electricity and connects more conveniently than traditional laying the gold thread on the colloid and then be connected with the electric connection of outside copper foil to and conveniently set up light filter 221 and installation upper substrate 201, the electric connection stability is also higher. Generally, the material of the upper substrate 201 and the lower substrate 101 is ceramic or other material with excellent thermal conductivity.
Specifically, as shown in fig. 2 and 5, the top surface of the lower substrate 101 is provided with a clamping protrusion 106, and the bottom surface of the upper substrate 201 is provided with a clamping groove 208 matched with the clamping protrusion 106, so that the upper substrate 201 and the lower substrate 101 are fixedly clamped. And the inserting end of the connecting copper foil 401 is provided with an inserting protrusion 402, the upper end of the connecting copper column 410 is provided with a connecting notch 411 matched with the inserting protrusion 402, so that the connecting copper column 410 is connected with the connecting copper foil 401.
Specifically, as shown in fig. 3, a step 204 is provided at a connection position of the upper mounting groove 203 and the bottom surface of the upper substrate 201, so that a mounting margin is left to facilitate mounting of the LED chip 301. As shown in fig. 2 and 5, a first mounting groove 210 is disposed on a top surface of the light hole 202, a second mounting groove 211 is disposed on a top surface of the first mounting groove 210, a diameter of the second mounting groove is larger than that of the first mounting groove 210, a diameter of the first mounting groove 210 is larger than that of the light hole 202, fluorescent glue 220 is filled in the light hole 202, the optical filter 221 is mounted in the first mounting groove 210, and a transparent protection layer 222 is fixedly filled in the second mounting groove 211, so that light of the LED chip 301 is adjusted to provide better lighting effect and protect the LED chip 301 and the internal circuit. It should be noted that, the step 204 may also provide a thermal expansion gap for the fluorescent glue 220, so as to prevent the fluorescent glue 220 from propping against the upper substrate 201 or the lower substrate 101 when thermally expanding. In order to improve the sealing performance and the connection strength, a joint between the outer sides of the upper substrate 201 and the lower substrate 101 is generally coated with glue.
To sum up, the utility model discloses a will the infrabasal plate 101 the upper substrate 201 LED chip 301 heat dissipation copper sheet 110 connect copper post 410 and other parts and link together through ingenious structure, realized the high-efficient heat dissipation to the LED chip, improved the stability of the light efficiency of LED chip under high temperature operating condition, make things convenient for subsequent production and installation when improving the radiating efficiency through the layer-stepping design, stable in structure, succinctly can effectively protect inside circuit and LED chip. The utility model discloses a practical value has greatly improved above.
The above-described embodiments merely represent one or more embodiments of the present invention, which are described in detail and concrete, but are not to be construed as limiting the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. A high performance flip-chip COB structure, comprising: the lower base plate is provided with a lower mounting groove, the side wall of the lower mounting groove is provided with a lower connecting groove, and the bottom of the lower mounting groove is provided with a through hole;
the upper substrate is provided with a light hole matched with the lower mounting groove, the bottom of the upper substrate is provided with an upper mounting groove matched with the lower mounting groove, the bottom of the upper substrate is provided with an upper connecting groove matched with the lower connecting groove, and the upper substrate is fixedly mounted at the top of the lower substrate;
the LED chips are fixedly arranged in the lower mounting groove and the upper mounting groove;
the bottom of the heat dissipation copper sheet is provided with a bulge matched with the through hole, the heat dissipation copper sheet is provided with a matching lug matched with the lower connecting groove, and the heat dissipation copper sheet is fixedly installed in the lower mounting groove;
and the connecting copper column is arranged in the lower connecting groove and the upper connecting groove and is electrically connected with the LED chip.
2. The COB structure with the high performance and the upside-down mounting function is characterized in that clamping protrusions are arranged on the top surface of the lower substrate, and clamping grooves matched with the clamping protrusions are formed in the bottom surface of the upper substrate.
3. The COB structure with the inverted high performance according to claim 1, wherein a step is provided at a connection position of the upper mounting groove and the bottom surface of the upper substrate.
4. The high-performance flip-chip COB structure of claim 1, wherein the light-transmitting holes are filled with fluorescent glue.
5. The COB structure with the high performance flip chip as claimed in claim 1, wherein a conductive groove connected with the upper connecting groove is formed in the side wall of the upper substrate, a connecting copper foil is mounted in the conductive groove, and the connecting copper foil is electrically connected with the connecting copper pillar.
6. The COB structure with high performance and upside-down mounting of claim 1, wherein the joint of the outer side surfaces of the upper substrate and the lower substrate is coated with glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022662804.1U CN213184336U (en) | 2020-11-17 | 2020-11-17 | High performance flip-chip COB structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022662804.1U CN213184336U (en) | 2020-11-17 | 2020-11-17 | High performance flip-chip COB structure |
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| Publication Number | Publication Date |
|---|---|
| CN213184336U true CN213184336U (en) | 2021-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022662804.1U Active CN213184336U (en) | 2020-11-17 | 2020-11-17 | High performance flip-chip COB structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114576583A (en) * | 2022-03-21 | 2022-06-03 | 广东森普智能科技有限公司 | Lamp with high light emitting consistency |
-
2020
- 2020-11-17 CN CN202022662804.1U patent/CN213184336U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114576583A (en) * | 2022-03-21 | 2022-06-03 | 广东森普智能科技有限公司 | Lamp with high light emitting consistency |
| CN114576583B (en) * | 2022-03-21 | 2024-03-15 | 广东森普智能科技有限公司 | Lamp with high light emission consistency |
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