CN1450850A - Circuit board with LED - Google Patents
Circuit board with LED Download PDFInfo
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- CN1450850A CN1450850A CN 03114343 CN03114343A CN1450850A CN 1450850 A CN1450850 A CN 1450850A CN 03114343 CN03114343 CN 03114343 CN 03114343 A CN03114343 A CN 03114343A CN 1450850 A CN1450850 A CN 1450850A
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- circuit board
- emittingdiode
- light
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Abstract
A circuit board comprises base plate fabricated with heat conduction material, printec circuit layer set on the base plate and at least a light-emitting diode wafer. The insulation layer is laid in between the base plate and the printed circuit layer. The concave position passing through to surface of the base plate is set at the printec circuit layer and the said light-emitting diode wafer is placed in the concave position. The present invention can ensure that electric leakage caused by aging of the printec circuit layer is not occured and the service time of the light-emitting diode wafer can be ensured since its operation heat is radiated out from the exposed concave position.
Description
Technical field
The present invention relates to a kind of circuit board, particularly a kind of circuit board with light-emittingdiode.
Background technology
The existing light-emittingdiode that is arranged on the circuit board has long useful life and lower power consumption under normal conditions, just because of have this advantage, light-emittingdiode has all obtained using widely in every field, the plate of giving instructions by telegraph as large-scale demonstration, red, green light and directing light of automobile, decorative lighting etc., for further improving the range of application of this product, light-emittingdiode just develops towards high brightness, low light loss direction.Yet, to improve the brightness and the power of LED Chips for Communication at present, except from its immanent structure and material improvement, supply the reliability of the circuit board of light-emittingdiode connection, insulating properties and thermal diffusivity become one of its key factor that whether has better performance and useful life, China Patent No. ZL00205585.6 discloses a kind of light-emitting diodes body device, its main technical schemes is heat-radiating substrate and at least one Lighting Division of being made by a metal material matter, this Lighting Division comprises the groove of being located on the heat-radiating substrate, be located at the printed circuit board (PCB) of top, heat radiation basis etc., its objective is that utilizing groove to increase area of dissipation prolongs light-emittingdiode useful life to reach, though this version makes the problem of its heat radiation obtain solution to a certain degree but also has a weak point, printed circuit board (PCB) as the band printed circuit laid on the heat-radiating substrate is the flexible flake of a 0.2mm, when it is laid on the heat-radiating substrate of being made by metal material, because circuit board is thinner, and be laid on substrate surface, very easy electric induction even the electric leakage that causes printed circuit and heat-radiating substrate of this structure, the fail safe that influence is used is difficult to be implemented in industrial application.
Summary of the invention
The objective of the invention is to provides a kind of circuit board that insulate well and have the band light-emittingdiode of good heat radiating at above-mentioned existing problems, and the circuit board of band light-emittingdiode on this basis also has the characteristics that are specially adapted to use on the lighting.
Technical scheme of the present invention is:
A kind of circuit board with light-emittingdiode, comprise the substrate made of Heat Conduction Material, be arranged at layer printed circuit board and at least one LED Chips for Communication on the substrate, be characterized in being provided with insulating barrier between aforesaid substrate and the layer printed circuit board, described printed circuit laminar surface is provided with and is through to the substrate surface recess, and described LED Chips for Communication is located in the recess.
The technical scheme that the present invention further is applied on the light fixture is:
The above-mentioned bulb of circuit board making with the band light-emittingdiode comprises lamp socket and is arranged at the lampshade of lamp socket upper end, is provided with in the described lamp socket for the ccontaining cavity of circuit board that has light-emittingdiode, is provided with the lead that links to each other with circuit board electrode in the lamp socket bottom.
The present invention is owing to the insulating barrier that is provided with between substrate of making at metal and the layer printed circuit board, when when guaranteeing layer printed circuit board, having good conduction long-time the use, effectively that layer printed circuit board and metal substrate is isolated by insulating barrier, make the brightness that can not influence light-emittingdiode between layer printed circuit board and the metal substrate because of the conduction induction, can not cause electric leakage because of long-term use layer printed circuit board causes layer printed circuit board to wear out yet, and LED Chips for Communication is damaged, and the LED Chips for Communication of on the recess that substrate is exposed of metallic substrate surfaces setting, installing, loose the useful life of having guaranteed LED Chips for Communication outside the heat that LED Chips for Communication is produced when work.In addition, it is more soft and meet the standard of international colour temperature to adopt above-mentioned usefulness to have the light that bulb produced of circuit board making of light-emittingdiode.
Below in conjunction with accompanying drawing the present invention is elaborated:
Description of drawings
Fig. 1 is a cross-sectional view of the present invention;
Fig. 2 is a perspective view of the present invention;
Fig. 3 is the cutaway view of bulb in the embodiment of the invention.
Embodiment
The present invention such as Fig. 1, Fig. 2, shown in Figure 3, a kind of circuit board with light-emittingdiode, comprise the substrate 1 made of Heat Conduction Material, be arranged at layer printed circuit board 2 and at least one LED Chips for Communication 3 on the substrate 1, be characterized in being provided with insulating barrier 8 between aforesaid substrate 1 and the layer printed circuit board 2, described layer printed circuit board 2 surfaces are provided with and are through to substrate 1 surperficial recess 9, and described LED Chips for Communication 3 is located in the recess 9.
For further achieving the above object, the substrate 1 that above-mentioned employing metal material is made is generally selected the good aluminium of thermal diffusivity or copper material or other metal material for use, preferably suppress the section bar that forms with aluminium or copper, its structure can be the annular that is provided with downward extension in substrate 1 bottom surface, it also can be flute profile, this structure helps distributing of heat, the insulating barrier 8 that aforesaid substrate 1 is provided with layer printed circuit board 2 and substrate 1 and layer printed circuit board 2 insulation are separated, offer the recess 9 that at least more than one is through to substrate 1 surface in layer printed circuit board 2 surperficial appropriate locations, above-mentioned recess 9 can be a groove along the downward extension of substrate, above-mentioned groove internal fixation has a LED Chips for Communication 3, the two poles of the earth pin of described LED Chips for Communication 3 is by leading line and printed circuit joins, then use transparent colloid 4 sealing, above-mentioned transparent colloid 4 is for being added with the epoxy resin of fluorescent agent, certainly also available silica gel, when LED Chips for Communication 3 is luminous, the heat that is produced can directly reach substrate 1 by LED Chips for Communication 4 bottoms, to play the order ground of heat radiation.In addition, outer rim at transparent colloid is covered with a colored lens, above-mentioned colored lens be contain ultra-violet absorber, golden yellow female, green female, golden red is female, the PC plastic sheet of blue masterbatch additive, the light that the colored lens of making by combinations thereof can make LED Chips for Communication send is more soft and meet the standard of international colour temperature.
For the present invention can be used in practice, do detailed explanation below in conjunction with an embodiment:
The present invention as shown in Figure 1 and Figure 2, be formed by stacking by calendering by substrate 1, layer printed circuit board 2 and the insulating barrier be located at therebetween, described substrate 1 is by aluminium sheet or copper coin compression moulding, at least be provided with recess cup-shaped more than 9 in layer printed circuit board 2 surperficial appropriate locations, this recess 9 can be made with substrate 1 one.Be provided with in the cup-shaped recess 9 that is provided with on the aforesaid substrate 1 with the fixing LED Chips for Communication 3 of transparent adhesive tape, described LED Chips for Communication 3 and be connected with negative pole 21 with the positive pole 22 of layer printed circuit board 2 by the lead on the pin of the two poles of the earth, again with transparent colloid 4 its involution fixed thereafter, when these LED Chips for Communication 3 conducting galvanoluminescences, the heat that it produced then can directly conduct to substrate 1 from LED Chips for Communication 3 bottoms, to play the effect of heat radiation.
In implementation process, layer printed circuit board 2 surfaces are provided with the circuit of being made up of positive pole 22 and negative pole 21, and this circuit and substrate 1 are isolated by the insulating barrier 8 that is provided with between layer printed circuit board and substrate fully, during use, circuit passes by lead and is located at substrate 1 and layer printed circuit board 2, respectively electric current is connected to the positive and negative electrode input of circuit.
According to the said structure principle, the embodiment that the present invention uses in practice is as shown in Figure 3: a kind of bulb of the circuit board making with the band light-emittingdiode, comprise lamp screw base 6, lampshade 10, be provided with the ccontaining cavity of circuit board in the described lamp screw base 6, be provided with the lead 7 that is connected with circuit board two electrodes in lamp screw base 6 bottoms for the band light-emittingdiode.Above-mentioned lamp screw base 6 set cavitys are rounded, and its accent diameter and circuit board size are suitable.For guaranteeing that used bulb has enough brightness, the size of the LED Chips for Communication of installing on circuit board should be more than or equal to 25mm, and the epoxy resin that is added with fluorescent agent on this LED Chips for Communication carries out involution, and then cover is gone up colored lens, the bulb that adopts said structure to make, both can reach needed brightness, and this bulb has the illumination light that meets international colour temperature standard that produces 2000～5000 ° of k.
In sum, the present invention makes the total quality of product obtain guarantee because of having good insulation performance, and good radiator structure, make heat energy loose as soon as possible from, and then prolonged useful life of light-emittingdiode.
Claims (10)
1, a kind of circuit board with light-emittingdiode, comprise the substrate (1) made of Heat Conduction Material, be arranged at layer printed circuit board (2) and at least one LED Chips for Communication (3) on the substrate (1), it is characterized in that being provided with insulating barrier (8) between aforesaid substrate (1) and the layer printed circuit board (2), described layer printed circuit board (2) is provided with and is through to the surperficial recess of substrate (1) (9), and described LED Chips for Communication (3) is located in the recess.
2, the circuit board of band light-emittingdiode according to claim 1 is characterized in that above-mentioned insulating barrier (8) is a colloidal materials.
3, the circuit board of band light-emittingdiode according to claim 1 is characterized in that above-mentioned recess (9) is a groove along the downward extension of substrate (1).
4, the circuit board of band light-emittingdiode according to claim 1 is characterized in that aforesaid substrate (1) is the section bar with aluminium or copper or the compacting of other metal material.
5, the circuit board of band light-emittingdiode according to claim 1 is characterized in that above-mentioned LED Chips for Communication (3) is provided with the transparent colloid (4) that can make LED Chips for Communication (3) involution.
6, the circuit board of band light-emittingdiode according to claim 5 is characterized in that above-mentioned transparent colloid (4) is for being added with the epoxy resin or the silica gel of fluorescent agent.
7, the circuit board of band light-emittingdiode according to claim 5 is characterized in that above-mentioned transparent colloid outer rim ring is covered with a colored lens (5).
8, a kind of according to above-mentioned bulb with the circuit board making of being with light-emittingdiode, comprise lamp screw base (6) and be arranged at the lampshade (10) of lamp screw base (6) upper end, be provided with in the described lamp screw base (6) for the ccontaining cavity of circuit board that has light-emittingdiode, be provided with the lead (7) that links to each other with circuit board electrode in lamp screw base (6) bottom.
9, the bulb with the circuit board making of being with light-emittingdiode according to claim 8 is characterized in that the set cavity of above-mentioned lamp screw base (6) is rounded, and its accent diameter and circuit board size are suitable.
10, the bulb with the circuit board making of being with light-emittingdiode according to claim 8 is characterized in that the foregoing circuit plate is provided with a LED Chips for Communication more than or equal to 25mm (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03114343 CN1450850A (en) | 2003-04-29 | 2003-04-29 | Circuit board with LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03114343 CN1450850A (en) | 2003-04-29 | 2003-04-29 | Circuit board with LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1450850A true CN1450850A (en) | 2003-10-22 |
Family
ID=28684113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03114343 Pending CN1450850A (en) | 2003-04-29 | 2003-04-29 | Circuit board with LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1450850A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101872202A (en) * | 2010-05-28 | 2010-10-27 | 常州九鼎车业有限公司 | Light source controller of automobile lamp |
| CN102082220A (en) * | 2009-11-27 | 2011-06-01 | 李学富 | LED and manufacturing process thereof |
| CN102221137A (en) * | 2010-04-15 | 2011-10-19 | 太盟光电科技股份有限公司 | Method for manufacturing lamp wick of light emitting diode lamp bulb and structure of lamp wick |
| CN102339929A (en) * | 2010-07-29 | 2012-02-01 | 富士迈半导体精密工业（上海）有限公司 | Method for manufacturing LED (Light-Emitting Diode) light-emitting component |
| CN102494259A (en) * | 2011-12-01 | 2012-06-13 | 深圳市华星光电技术有限公司 | Light-emitting diode (LED) lamp strip and backlight module for liquid crystal display device |
| CN102694102A (en) * | 2011-03-22 | 2012-09-26 | 展晶科技(深圳)有限公司 | Light emitting diode packaging structure, manufacturing method thereof, and light source apparatus |
| WO2013023388A1 (en) * | 2011-08-16 | 2013-02-21 | 深南电路有限公司 | Embeded circuit board and method for manufacturing the same |
-
2003
- 2003-04-29 CN CN 03114343 patent/CN1450850A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102082220A (en) * | 2009-11-27 | 2011-06-01 | 李学富 | LED and manufacturing process thereof |
| CN102221137A (en) * | 2010-04-15 | 2011-10-19 | 太盟光电科技股份有限公司 | Method for manufacturing lamp wick of light emitting diode lamp bulb and structure of lamp wick |
| CN101872202A (en) * | 2010-05-28 | 2010-10-27 | 常州九鼎车业有限公司 | Light source controller of automobile lamp |
| CN102339929A (en) * | 2010-07-29 | 2012-02-01 | 富士迈半导体精密工业（上海）有限公司 | Method for manufacturing LED (Light-Emitting Diode) light-emitting component |
| CN102694102A (en) * | 2011-03-22 | 2012-09-26 | 展晶科技(深圳)有限公司 | Light emitting diode packaging structure, manufacturing method thereof, and light source apparatus |
| CN102694102B (en) * | 2011-03-22 | 2014-11-05 | 展晶科技(深圳)有限公司 | Light emitting diode packaging structure, manufacturing method thereof, and light source apparatus |
| WO2013023388A1 (en) * | 2011-08-16 | 2013-02-21 | 深南电路有限公司 | Embeded circuit board and method for manufacturing the same |
| CN102494259A (en) * | 2011-12-01 | 2012-06-13 | 深圳市华星光电技术有限公司 | Light-emitting diode (LED) lamp strip and backlight module for liquid crystal display device |
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