CN1450850A - A circuit board with light emitting diodes - Google Patents
A circuit board with light emitting diodes Download PDFInfo
- Publication number
- CN1450850A CN1450850A CN 03114343 CN03114343A CN1450850A CN 1450850 A CN1450850 A CN 1450850A CN 03114343 CN03114343 CN 03114343 CN 03114343 A CN03114343 A CN 03114343A CN 1450850 A CN1450850 A CN 1450850A
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- China
- Prior art keywords
- circuit board
- light
- substrate
- emitting diodes
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000004020 conductor Substances 0.000 claims abstract 2
- 230000000149 penetrating effect Effects 0.000 claims abstract 2
- 239000000084 colloidal system Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 230000006698 induction Effects 0.000 abstract description 3
- 230000007774 longterm Effects 0.000 abstract description 2
- 230000032683 aging Effects 0.000 abstract 1
- 230000005611 electricity Effects 0.000 abstract 1
- 238000004891 communication Methods 0.000 description 20
- 230000004888 barrier function Effects 0.000 description 7
- 230000005855 radiation Effects 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- FFRBMBIXVSCUFS-UHFFFAOYSA-N 2,4-dinitro-1-naphthol Chemical compound C1=CC=C2C(O)=C([N+]([O-])=O)C=C([N+]([O-])=O)C2=C1 FFRBMBIXVSCUFS-UHFFFAOYSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
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Abstract
A circuit board with LED comprises a substrate made of heat conducting material, a printed circuit layer arranged on the substrate and at least one LED wafer, wherein an insulating layer is arranged between the substrate and the printed circuit layer, the printed circuit layer is provided with a concave position penetrating through the surface of the substrate, and the LED wafer is arranged in the concave position. The invention ensures the printed circuit layer to have good conductivity and effectively isolates the printed circuit layer from the metal substrate through the insulating layer, so that the brightness of the LED is not influenced by conductive induction between the printed circuit layer and the metal substrate, and the leakage of electricity caused by aging of the printed circuit layer due to long-term use of the printed circuit layer is avoided.
Description
Technical field
The present invention relates to a kind of circuit board, particularly a kind of circuit board with light-emittingdiode.
Background technology
The existing light-emittingdiode that is arranged on the circuit board has long useful life and lower power consumption under normal conditions, just because of have this advantage, light-emittingdiode has all obtained using widely in every field, the plate of giving instructions by telegraph as large-scale demonstration, red, green light and directing light of automobile, decorative lighting etc., for further improving the range of application of this product, light-emittingdiode just develops towards high brightness, low light loss direction.Yet, to improve the brightness and the power of LED Chips for Communication at present, except from its immanent structure and material improvement, supply the reliability of the circuit board of light-emittingdiode connection, insulating properties and thermal diffusivity become one of its key factor that whether has better performance and useful life, China Patent No. ZL00205585.6 discloses a kind of light-emitting diodes body device, its main technical schemes is heat-radiating substrate and at least one Lighting Division of being made by a metal material matter, this Lighting Division comprises the groove of being located on the heat-radiating substrate, be located at the printed circuit board (PCB) of top, heat radiation basis etc., its objective is that utilizing groove to increase area of dissipation prolongs light-emittingdiode useful life to reach, though this version makes the problem of its heat radiation obtain solution to a certain degree but also has a weak point, printed circuit board (PCB) as the band printed circuit laid on the heat-radiating substrate is the flexible flake of a 0.2mm, when it is laid on the heat-radiating substrate of being made by metal material, because circuit board is thinner, and be laid on substrate surface, very easy electric induction even the electric leakage that causes printed circuit and heat-radiating substrate of this structure, the fail safe that influence is used is difficult to be implemented in industrial application.
Summary of the invention
The objective of the invention is to provides a kind of circuit board that insulate well and have the band light-emittingdiode of good heat radiating at above-mentioned existing problems, and the circuit board of band light-emittingdiode on this basis also has the characteristics that are specially adapted to use on the lighting.
Technical scheme of the present invention is:
A kind of circuit board with light-emittingdiode, comprise the substrate made of Heat Conduction Material, be arranged at layer printed circuit board and at least one LED Chips for Communication on the substrate, be characterized in being provided with insulating barrier between aforesaid substrate and the layer printed circuit board, described printed circuit laminar surface is provided with and is through to the substrate surface recess, and described LED Chips for Communication is located in the recess.
The technical scheme that the present invention further is applied on the light fixture is:
The above-mentioned bulb of circuit board making with the band light-emittingdiode comprises lamp socket and is arranged at the lampshade of lamp socket upper end, is provided with in the described lamp socket for the ccontaining cavity of circuit board that has light-emittingdiode, is provided with the lead that links to each other with circuit board electrode in the lamp socket bottom.
The present invention is owing to the insulating barrier that is provided with between substrate of making at metal and the layer printed circuit board, when when guaranteeing layer printed circuit board, having good conduction long-time the use, effectively that layer printed circuit board and metal substrate is isolated by insulating barrier, make the brightness that can not influence light-emittingdiode between layer printed circuit board and the metal substrate because of the conduction induction, can not cause electric leakage because of long-term use layer printed circuit board causes layer printed circuit board to wear out yet, and LED Chips for Communication is damaged, and the LED Chips for Communication of on the recess that substrate is exposed of metallic substrate surfaces setting, installing, loose the useful life of having guaranteed LED Chips for Communication outside the heat that LED Chips for Communication is produced when work.In addition, it is more soft and meet the standard of international colour temperature to adopt above-mentioned usefulness to have the light that bulb produced of circuit board making of light-emittingdiode.
Below in conjunction with accompanying drawing the present invention is elaborated:
Description of drawings
Fig. 1 is a cross-sectional view of the present invention;
Fig. 2 is a perspective view of the present invention;
Fig. 3 is the cutaway view of bulb in the embodiment of the invention.
Embodiment
The present invention such as Fig. 1, Fig. 2, shown in Figure 3, a kind of circuit board with light-emittingdiode, comprise the substrate 1 made of Heat Conduction Material, be arranged at layer printed circuit board 2 and at least one LED Chips for Communication 3 on the substrate 1, be characterized in being provided with insulating barrier 8 between aforesaid substrate 1 and the layer printed circuit board 2, described layer printed circuit board 2 surfaces are provided with and are through to substrate 1 surperficial recess 9, and described LED Chips for Communication 3 is located in the recess 9.
For further achieving the above object, the substrate 1 that above-mentioned employing metal material is made is generally selected the good aluminium of thermal diffusivity or copper material or other metal material for use, preferably suppress the section bar that forms with aluminium or copper, its structure can be the annular that is provided with downward extension in substrate 1 bottom surface, it also can be flute profile, this structure helps distributing of heat, the insulating barrier 8 that aforesaid substrate 1 is provided with layer printed circuit board 2 and substrate 1 and layer printed circuit board 2 insulation are separated, offer the recess 9 that at least more than one is through to substrate 1 surface in layer printed circuit board 2 surperficial appropriate locations, above-mentioned recess 9 can be a groove along the downward extension of substrate, above-mentioned groove internal fixation has a LED Chips for Communication 3, the two poles of the earth pin of described LED Chips for Communication 3 is by leading line and printed circuit joins, then use transparent colloid 4 sealing, above-mentioned transparent colloid 4 is for being added with the epoxy resin of fluorescent agent, certainly also available silica gel, when LED Chips for Communication 3 is luminous, the heat that is produced can directly reach substrate 1 by LED Chips for Communication 4 bottoms, to play the order ground of heat radiation.In addition, outer rim at transparent colloid is covered with a colored lens, above-mentioned colored lens be contain ultra-violet absorber, golden yellow female, green female, golden red is female, the PC plastic sheet of blue masterbatch additive, the light that the colored lens of making by combinations thereof can make LED Chips for Communication send is more soft and meet the standard of international colour temperature.
For the present invention can be used in practice, do detailed explanation below in conjunction with an embodiment:
The present invention as shown in Figure 1 and Figure 2, be formed by stacking by calendering by substrate 1, layer printed circuit board 2 and the insulating barrier be located at therebetween, described substrate 1 is by aluminium sheet or copper coin compression moulding, at least be provided with recess cup-shaped more than 9 in layer printed circuit board 2 surperficial appropriate locations, this recess 9 can be made with substrate 1 one.Be provided with in the cup-shaped recess 9 that is provided with on the aforesaid substrate 1 with the fixing LED Chips for Communication 3 of transparent adhesive tape, described LED Chips for Communication 3 and be connected with negative pole 21 with the positive pole 22 of layer printed circuit board 2 by the lead on the pin of the two poles of the earth, again with transparent colloid 4 its involution fixed thereafter, when these LED Chips for Communication 3 conducting galvanoluminescences, the heat that it produced then can directly conduct to substrate 1 from LED Chips for Communication 3 bottoms, to play the effect of heat radiation.
In implementation process, layer printed circuit board 2 surfaces are provided with the circuit of being made up of positive pole 22 and negative pole 21, and this circuit and substrate 1 are isolated by the insulating barrier 8 that is provided with between layer printed circuit board and substrate fully, during use, circuit passes by lead and is located at substrate 1 and layer printed circuit board 2, respectively electric current is connected to the positive and negative electrode input of circuit.
According to the said structure principle, the embodiment that the present invention uses in practice is as shown in Figure 3: a kind of bulb of the circuit board making with the band light-emittingdiode, comprise lamp screw base 6, lampshade 10, be provided with the ccontaining cavity of circuit board in the described lamp screw base 6, be provided with the lead 7 that is connected with circuit board two electrodes in lamp screw base 6 bottoms for the band light-emittingdiode.Above-mentioned lamp screw base 6 set cavitys are rounded, and its accent diameter and circuit board size are suitable.For guaranteeing that used bulb has enough brightness, the size of the LED Chips for Communication of installing on circuit board should be more than or equal to 25mm, and the epoxy resin that is added with fluorescent agent on this LED Chips for Communication carries out involution, and then cover is gone up colored lens, the bulb that adopts said structure to make, both can reach needed brightness, and this bulb has the illumination light that meets international colour temperature standard that produces 2000～5000 ° of k.
In sum, the present invention makes the total quality of product obtain guarantee because of having good insulation performance, and good radiator structure, make heat energy loose as soon as possible from, and then prolonged useful life of light-emittingdiode.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03114343 CN1450850A (en) | 2003-04-29 | 2003-04-29 | A circuit board with light emitting diodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03114343 CN1450850A (en) | 2003-04-29 | 2003-04-29 | A circuit board with light emitting diodes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1450850A true CN1450850A (en) | 2003-10-22 |
Family
ID=28684113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03114343 Pending CN1450850A (en) | 2003-04-29 | 2003-04-29 | A circuit board with light emitting diodes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1450850A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101872202A (en) * | 2010-05-28 | 2010-10-27 | 常州九鼎车业有限公司 | Light source controller of automobile lamp |
| CN102082220A (en) * | 2009-11-27 | 2011-06-01 | 李学富 | LED and manufacturing process thereof |
| CN102221137A (en) * | 2010-04-15 | 2011-10-19 | 太盟光电科技股份有限公司 | Manufacture method and structure of lamp core of light-emitting diode bulb |
| CN102339929A (en) * | 2010-07-29 | 2012-02-01 | 富士迈半导体精密工业（上海）有限公司 | Method for manufacturing LED (Light-Emitting Diode) light-emitting component |
| CN102494259A (en) * | 2011-12-01 | 2012-06-13 | 深圳市华星光电技术有限公司 | Light-emitting diode (LED) lamp strip and backlight module for liquid crystal display device |
| CN102694102A (en) * | 2011-03-22 | 2012-09-26 | 展晶科技(深圳)有限公司 | Light emitting diode packaging structure, manufacturing method thereof, and light source apparatus |
| WO2013023388A1 (en) * | 2011-08-16 | 2013-02-21 | 深南电路有限公司 | Embeded circuit board and method for manufacturing the same |
-
2003
- 2003-04-29 CN CN 03114343 patent/CN1450850A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102082220A (en) * | 2009-11-27 | 2011-06-01 | 李学富 | LED and manufacturing process thereof |
| CN102221137A (en) * | 2010-04-15 | 2011-10-19 | 太盟光电科技股份有限公司 | Manufacture method and structure of lamp core of light-emitting diode bulb |
| CN101872202A (en) * | 2010-05-28 | 2010-10-27 | 常州九鼎车业有限公司 | Light source controller of automobile lamp |
| CN102339929A (en) * | 2010-07-29 | 2012-02-01 | 富士迈半导体精密工业（上海）有限公司 | Method for manufacturing LED (Light-Emitting Diode) light-emitting component |
| CN102694102A (en) * | 2011-03-22 | 2012-09-26 | 展晶科技(深圳)有限公司 | Light emitting diode packaging structure, manufacturing method thereof, and light source apparatus |
| CN102694102B (en) * | 2011-03-22 | 2014-11-05 | 展晶科技(深圳)有限公司 | Light emitting diode packaging structure, manufacturing method thereof, and light source apparatus |
| WO2013023388A1 (en) * | 2011-08-16 | 2013-02-21 | 深南电路有限公司 | Embeded circuit board and method for manufacturing the same |
| CN102494259A (en) * | 2011-12-01 | 2012-06-13 | 深圳市华星光电技术有限公司 | Light-emitting diode (LED) lamp strip and backlight module for liquid crystal display device |
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