CN201820792U - Novel LED patch thermoelectric insulation support - Google Patents
Novel LED patch thermoelectric insulation support Download PDFInfo
- Publication number
- CN201820792U CN201820792U CN2010205683651U CN201020568365U CN201820792U CN 201820792 U CN201820792 U CN 201820792U CN 2010205683651 U CN2010205683651 U CN 2010205683651U CN 201020568365 U CN201020568365 U CN 201020568365U CN 201820792 U CN201820792 U CN 201820792U
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- support
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- led
- connection support
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Abstract
The utility model relates to a high-power LED support, in particular to a novel LED patch thermoelectric insulation support. The utility model provides the novel LED patch thermoelectric insulation support, which can transfer the heat generated during the operation of an LED chip to a heat dissipation substrate in time. The novel LED patch thermoelectric insulation support comprises a substrate, a connection support and a supporting strip, wherein the substrate is matched with the two side surfaces of the connection support, and the supporting strip is positioned on one side of the bottom of the connection support; and the LED chip is fixed on the conductive substrate through an insulating cement, and a first weld line region is arranged on the substrate; a second weld line region is also arranged on the connection support in the position corresponding to the first weld line region, an electrode is arranged on the connection support, the electrode is connected with the second weld line region, the first weld line region and the second weld line region are connected with the anode and the cathode of the LED chip respectively, the other end of the electrode is arranged at the bottom of the connection support and used for connecting with a printed circuit board (PCB), and the upper part of the LED chip is packaged with silicone rubber. The utility model improves the performance stability of the LED during work, thereby increasing the service life of the LED.
Description
Technical field
The utility model relates to a kind of high-power LED bracket, relates in particular to the thermoelectric separating support of a kind of New LED paster, belongs to the LED technical field.
Background technology
Now, increase along with the LED light efficiency, increasing high-powered LED lamp is applied to various places and throws light on, LED is a kind of solid-state semiconductor device, as a kind of novel lighting source, because its good stability, the life-span is long, brightness is high and many advantages such as energy-conservation, application prospect is extensive, particularly under equal brightness of illumination, the power consumption of following semiconductor lighting only is 1/8 of incandescent lamp, 1/2 of fluorescent lamp.The plasticity of LED is very strong, can design suitable light fixture as required, and white light LEDs is described as the light source of 21 century most worthy, will cause an illumination revolution.
At present, high-power LED bracket then is the indispensable assembly of LED lamp, the material of SMD (surface mounting devices) support that LED adopted is a plastic rubber material, is mainly the PPA material, and electrode mainly is copper or the silver that plating one deck has certain electrode pattern in the groove of plastic rubber material.Because plastic rubber material is an insulating material, thermal conductivity is very poor, and to heat-radiating substrate certain thickness being arranged bottom the led chip, the electrode of the layer of copper of plating or silver is also very thin, so after making SMD LED, the heat that gives out during led chip work can not be transmitted to heat-radiating substrate timely, the junction temperature of LED can raise, and this will cause poor stability, and the light efficiency of LED and luminous flux are descended, and the wavelength of LED can drift about to long wave, and the rising of junction temperature also can have a strong impact on the useful life of LED.
Summary of the invention
For solving the shortcoming and defect in the above-mentioned technology, the utility model main purpose is: provide a kind of new LED paster thermoelectric separating support, the heat that distributes when making led chip work can be transmitted on the heat-radiating substrate in time, thereby improved the stability of LED performance, also can improve accordingly useful life.
For realizing above-mentioned purpose, the thermoelectric separating support of a kind of New LED paster of the present utility model, it is made of substrate, connection support and support bar, described substrate matches with the two sides that are connected support, described support bar is positioned at bottom surface one side that connects support, is used to make the separation of two electrodes in use of thermoelectric separating support; It is characterized in that described substrate is an electrically-conductive backing plate, led chip is fixed on the substrate with insulating cement, and described connection support connects support for insulation, and described substrate is provided with the first bonding wire zone; Be provided with the second bonding wire zone on the described connection support equally, describedly be provided with electrode connecting on the support, electrode is connected with second bonding wire is regional, and first, second bonding wire zone is connected with the both positive and negative polarity of led chip respectively; The other end places and connects the support bottom surface, is used for and being connected of pcb board.
Described connection support is
Shape, described substrate is a step; Be connected the support corresponding matching, connect support and be flush-mounted on the substrate; Described connection support
The shape concave surface is provided with the connection cylinder of two protrusions; The step of described substrate is provided with the joint pin hole, and it is used for substrate and is connected being connected and fixed of support.
Described connection support is provided with two two electrode holes, described electrode is two, pass through process for pressing, electrode is pressed into electrode hole respectively, expose and connect the support lower end, the institute protruding end is as plumb joint, and the electrode upper end connects second weld zone with Copper Foil, is connecting the zone plating insulating barrier that removes second weld zone on the support;
Described substrate is that high heat conduction red metal is made.
Described connection support is made for ceramic or resistant to elevated temperatures PC resin.
Described support bar is convenient to processing with to be connected support integrally formed.
Described substrate is fit to the above led chip of 40mil to be used.
Compare with existing led support, the thermoelectric separating support of New LED paster provided by the utility model, the heat that distributes in the time of can making led chip work is transmitted on the heating panel by copper base in time, its simple in structure, compact, stable performance, in the useful life of corresponding raising LED lamp, help producing in enormous quantities.
Description of drawings
Fig. 1 is the scheme of installation of thermoelectric separating support of the present utility model.
Fig. 2 is the cutaway view that insulation of the present utility model connects support.
Fig. 3 be the utility model finally finish thermoelectric separating support schematic diagram.
Fig. 4 is the schematic diagram of thermoelectric separating support practical application of the present utility model.
Specific implementation method
Below in conjunction with accompanying drawing the utility model is described further:
The thermoelectric separating support of a kind of New LED paster of the present utility model, it is made of substrate 1, connection support 2 and support bar 3, described substrate 1 matches with the two sides that are connected support 2, described support bar 3 is positioned at bottom surface one side that connects support 2, is used to make the separation of two electrodes in use of thermoelectric separating support; Described substrate 1 is a conductive copper plate, and led chip 4 usefulness insulating cements are fixed on the substrate, and described connection support 2 connects support for insulation, and described substrate 1 is provided with the first bonding wire zone 11; The described connection on the support 2, at the Copper Foil that a certain size is set near a side of substrate 1 as the second bonding wire zone 21, describedly be provided with electrode 22 connecting on the support 2, electrode 22 is connected with second bonding wire regional 21, and first, second bonding wire zone is connected with the both positive and negative polarity of led chip 4 respectively; Other end c is for connecting support 2 bottom surfaces, is used for and being connected of pcb board.
Described connection support 2 is
Shape, described 1 substrate, 1 one sides are a step 12; Be connected support 2 corresponding matching, connect support 2 and be flush-mounted on the substrate 1; Described connection support 1
Shape concave surface 23 is provided with the cylinder 24 of two protrusions; The step 12 of described 1 substrate 1 is provided with cylindrical hole 13, and the cylindrical hole 13 on described cylinder 24 and the step 12 is complementary, and it is used for substrate 1 and is connected being connected and fixed of support 2.
Described connection support 2 is provided with two two electrode holes 25, described electrode 22 is two, pass through process for pressing, electrode 22 is pressed into electrode hole 25 respectively, expose and connect support 2 lower ends, institute protruding end 26 is as plumb joint, a little less than the height of support bar 3, electrode 22 upper ends connect second weld zone 21 with Copper Foil 27, are connecting the zone plating insulating barrier that removes second weld zone 21 on the support 2;
Described substrate 1 is made for high heat conduction red metal, described red metal conductive coefficient is 398W/mK, be higher than common aluminium far away, purity is 99.9%, the heat that distributes when adopting high heat conduction red metal can make led chip work can be transmitted on the heat-radiating substrate by substrate 1 in time, thereby has improved the stability of LED performance.
Described connection support 2 is an insulating ceramics, also can change according to different requirements, as resistant to elevated temperatures PC resin etc.
Described support bar 3 is with to be connected support 2 integrally formed, support bar 3 be one protrude rectangular, the height of protruding end be about 0.1mm both can, be convenient to processing like this.
Its specification of described substrate is fit to the above led chip of 40mil and uses.
The thermoelectric separating support of New LED paster of the present utility model, the insulation that to finish the electrode assembling earlier connects two cylinders 24 of support with respect to two cylindrical holes 13 on the substrate 1, connection support 2 is flush-mounted on 1 step 12 of substrate, is connected and fixed, finish the separating support combination; Led chip 4 usefulness insulating cements are fixed on the substrate 1, and the both positive and negative polarity of led chip 4 is connected with first, second bonding wire zone difference lead, then in 5 encapsulation of led chip 4 top silica gel, finishes the making of SMD LED.
The thermoelectric separating support of New LED paster of the present utility model adopts the electrically-conductive backing plate of high heat conduction red metal as the high-power LED support, can make heat in time lead on the heat-radiating substrate, and the insulation of another electrode connection support Design is reasonable, it is firm to connect, improved the stability of LED work like this, also can improve accordingly useful life, and this thermoelectric separating support can be produced in enormous quantities.
The above; it only is the utility model preferred embodiment; be not that technical scope of the present utility model is imposed any restrictions, both all any modification, equivalents and modifications of being done according to claim scope of the present utility model all still belong in the utility model protection range.
Claims (8)
1. the thermoelectric separating support of a New LED paster, it by substrate, connect support and support bar constitutes, described substrate matches with the two sides that are connected support, support bar is positioned at bottom surface one side of connection support; It is characterized in that: described substrate is an electrically-conductive backing plate, and described connection support connects support for insulation, and described substrate is provided with the first bonding wire zone; Be provided with the second bonding wire zone on the described connection support equally; Describedly be provided with electrode connecting on the support, electrode is connected with second bonding wire zone, and the other end places connection support bottom surface, is used for being connected with pcb board.
2. the thermoelectric separating support of a kind of New LED paster according to claim 1, it is characterized in that: described connection support is
Shape, described substrate is a step; Be connected the support corresponding matching; Described connection support
The shape concave surface is provided with the connection cylinder of two protrusions; The step of described substrate is provided with the joint pin hole, and it is used for substrate and is connected being connected and fixed of support.
3. the thermoelectric separating support of a kind of New LED paster according to claim 1, it is characterized in that: described connection support is provided with two electrode holes, described electrode is two, pass electrode hole respectively, expose and connect the support lower end, the institute protruding end is as plumb joint, and the electrode upper end connects second weld zone.
4. the thermoelectric separating support of a kind of New LED paster according to claim 1, it is characterized in that: described substrate is that high heat conduction red metal is made.
5. the thermoelectric separating support of a kind of New LED paster according to claim 1, it is characterized in that: described connection support is that insulating ceramics is made.
6. the thermoelectric separating support of a kind of New LED paster according to claim 1, it is characterized in that: described connection support is that resistant to elevated temperatures PC resin is made.
7. the thermoelectric separating support of a kind of New LED paster according to claim 1 is characterized in that: described support bar is with to be connected support integrally formed.
8. the thermoelectric separating support of a kind of New LED paster according to claim 1 is characterized in that: described substrate is fit to the above led chip of 40mil to be used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205683651U CN201820792U (en) | 2010-10-08 | 2010-10-08 | Novel LED patch thermoelectric insulation support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205683651U CN201820792U (en) | 2010-10-08 | 2010-10-08 | Novel LED patch thermoelectric insulation support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201820792U true CN201820792U (en) | 2011-05-04 |
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ID=43918736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205683651U Expired - Fee Related CN201820792U (en) | 2010-10-08 | 2010-10-08 | Novel LED patch thermoelectric insulation support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201820792U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102034920A (en) * | 2010-10-08 | 2011-04-27 | 上海衡世光电科技有限公司 | Novel thermoelectric separation bracket for light-emitting diode (LED) surface mounted device (SMD) |
| CN103377952A (en) * | 2012-04-13 | 2013-10-30 | 南亚科技股份有限公司 | Fixation method for bonding wires |
| CN113644183A (en) * | 2021-09-03 | 2021-11-12 | 昆山兴协和科技股份有限公司 | Light emitting diode and manufacturing method thereof |
-
2010
- 2010-10-08 CN CN2010205683651U patent/CN201820792U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102034920A (en) * | 2010-10-08 | 2011-04-27 | 上海衡世光电科技有限公司 | Novel thermoelectric separation bracket for light-emitting diode (LED) surface mounted device (SMD) |
| CN102034920B (en) * | 2010-10-08 | 2013-08-14 | 上海衡世光电科技有限公司 | Thermoelectric separation bracket for light-emitting diode (LED) surface mounted device (SMD) |
| CN103377952A (en) * | 2012-04-13 | 2013-10-30 | 南亚科技股份有限公司 | Fixation method for bonding wires |
| CN113644183A (en) * | 2021-09-03 | 2021-11-12 | 昆山兴协和科技股份有限公司 | Light emitting diode and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110504 Termination date: 20131008 |