CN202905774U - Substrate for light source module - Google Patents
Substrate for light source module Download PDFInfo
- Publication number
- CN202905774U CN202905774U CN 201220524699 CN201220524699U CN202905774U CN 202905774 U CN202905774 U CN 202905774U CN 201220524699 CN201220524699 CN 201220524699 CN 201220524699 U CN201220524699 U CN 201220524699U CN 202905774 U CN202905774 U CN 202905774U
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- substrate
- light source
- source module
- conductive layer
- plate body
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- Expired - Lifetime
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Abstract
The utility model relates to a substrate for a light source module. The substrate comprises a substrate plate body. A chip mounting area of the substrate plate body is provided with an insulating layer, a conductive layer and a light gathering layer orderly. An edge of the substrate plate body is provided with a positive electrode and a negative electrode. The substrate is characterized in that the light gathering layer is uniformly provided with a plurality of independently distributed bowls; bottoms of the bowls are in contact with the conductive layer; the conductive layer at the bottoms of the bowls is provided with routing layers at left and right sides respectively; and the routing layers at the left and right sides are respectively connected with the positive electrode and the negative electrode. The middle of the conductive layer at the bottoms of the bowls is provided with chip mounting holes, and bottoms of the chip mounting holes are in contact with the substrate. Side walls of the bowls are formed with light gathering cups, and inner walls of the light gathering cups are plated with silver. According to the substrate for the light source module, the usage amount of casting glue and fluorescent powder is reduced; the separation of heat conduction and electric conduction is realized; and light emitting efficiency and light emitting uniformity are enhanced.
Description
Technical field
The utility model relates to a kind of light source module substrate, especially a kind of light source module substrate of realizing that the heat conduction separates with conductivity.
Background technology
The LED light fixture has the characteristics of life-span length, electric power saving, is applied to more and more widely lighting field.In the prior art, the led light source module mostly adopts aluminium base, aluminium base be circuit board be again heating panel, the individual particle led chip of evenly arranging on aluminium base is packaged into integral body by packaging body with led chip.The light source module chips die bond that existing knot is wanted is on conductive layer, and conductivity is realized by conductive layer, is delivered to substrate after the heat conduction also is passed to insulating barrier by conductive layer again; The mode that this hot conduction and conductivity are all passed through the conductive layer conduction can affect radiating effect, thereby makes fluorescent glue easy xanthochromia in long-time use the, the useful life of reducing led light source.
On the other hand, the routing layer of existing led light source module is arranged on the outside of bowl cup mostly, and wire passes fluorescent glue and is connected with the routing layer, thereby need to carry out encapsulating to the upper surface integral body of substrate; The use amount of this kind mode casting glue and fluorescent material is larger.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of light source module substrate is provided, and this substrate can be realized single glass of encapsulating mode on the one hand, reduces the use amount of casting glue and fluorescent material; Can realize on the other hand separating of heat conduction and conductivity, have the excessive heat conductance; The third aspect can improve light extraction efficiency and light-emitting uniformity.
According to the technical scheme that the utility model provides, described light source module substrate comprises the substrate plate body, sets gradually insulating barrier, conductive layer and light collecting layer in the chip installation area territory of substrate plate body, at the edge of substrate plate body positive electrode and negative electrode is set; It is characterized in that: the bowl cup of a plurality of independent distribution evenly is set on described light collecting layer, and the bottom of bowl cup contacts with conductive layer, about on the conductive layer of bowl cup bottom the routing layer is set respectively, and the routing layer of both sides is connected with negative electrode with positive electrode respectively.
Centre at described bowl cup bottom conductive layer is provided with the chip installing hole, and the bottom of chip installing hole contacts with substrate.The sidewall of described bowl cup forms prefocus cup, is coated with silver at the inwall of prefocus cup.The material of described substrate plate body is aluminium, copper or pottery.Described light collecting layer (material be aluminium or pottery.
The utlity model has following advantage: (1) the utility model is produced on bowl cup bottom with conductive layer and routing layer, can realize single glass of encapsulating of bowl cup, has reduced the use amount of casting glue and fluorescent material; (2) the utility model has been realized separating of hot conduction and conductivity, can significantly improve the LED heat dissipation problem on the lighting power rank, fluorescent glue xanthochromia speed in using is for a long time effectively reduced, thereby it is lower that light source module is decayed under operating position identical with the common LED light source, and actual life is longer; (3) the utility model has carried out silver-platedly at the inwall of bowl cup, has improved reflectivity, possesses higher light emission rate therefore light source module of the present utility model is compared common COB light source module, obtains higher light output.
Description of drawings
Fig. 1 is the plane graph that light source module described in the utility model is used substrate.
Fig. 2 is the cutaway view of bowl cup described in the utility model.
Embodiment
The utility model is described in further detail below in conjunction with concrete accompanying drawing.
Such as Fig. 1 ~ shown in Figure 2: as described in light source module comprise substrate plate body 1, insulating barrier 2, conductive layer 3, routing layer 4, prefocus cup 5, bowl cup 6, light collecting layer 7, positive electrode 8, negative electrode 9, chip installing hole 10 with substrate.
Such as Fig. 1 ~ shown in Figure 2, the utility model comprises substrate plate body 1, sets gradually insulating barrier 2, conductive layer 3 and light collecting layer 7 in the chip installation area territory of substrate plate body 1, and positive electrode 8 and negative electrode 9 are set at the edge of substrate plate body 1; The bowl cup 6 of a plurality of independent distribution evenly is set on described light collecting layer 7, and the bottom of bowl cup 6 contacts with conductive layer 3, about on the conductive layer 3 of bowl cup 6 bottoms routing layer 4 is set respectively, and the routing layer 4 of left and right sides is connected with negative electrode with positive electrode 8 respectively and is connected; Centre at described bowl cup 6 bottom conductive layers 3 is provided with chip installing hole 10, the bottom of chip installing hole 10 contacts with substrate plate body 1, thereby after in chip installing hole 10, chip being installed, chip directly contacts with substrate plate body 1, the conductivity of chip is realized by routing layer 4 and conductive layer 3, the conduction of the heat of chip directly realizes by substrate plate body 1, realized that conductivity separates with heat conducting, can significantly improve the LED heat dissipation problem on the lighting power rank;
As shown in Figure 2, the sidewall of described bowl cup 6 forms prefocus cup 5, is coated with silver at the inwall of prefocus cup 5, to improve reflectivity, therefore light source module described in the utility model possesses higher light emission rate than common COB light source module, namely obtains higher light output;
The material of described substrate plate body 1 is the high-thermal conductive metal such as aluminium or copper or is ceramic contour heat-conducting insulation material, but is not limited only to aluminium, copper, pottery; The material of described light collecting layer 7 is aluminium or ceramic contour reflecting material, but is not limited only to aluminium, pottery; Being shaped as of described substrate plate body 1 is circular, square, strip or other symmetries, asymmetric figure.
The manufacturing process of light source module described in the utility model is: (1) at first on substrate plate body 1 by printing, turn and the mode such as be coated with and make a layer insulating 2; (2) by methods such as photoetching, corrosion insulating barrier 2 is carried out processing and fabricating, erode away chip installing hole 10 in insulating barrier 2 corresponding chip installation sites, the bottom of chip installing hole 10 contacts with substrate plate body 1; (3) by methods such as photoetching, evaporation, plating, make one deck conductive layer 3 at insulating barrier 2; (4) by methods such as photoetching, evaporation, plating, the both sides of corresponding chip installing hole 10 respectively make one deck routing layer 4 on conductive layer 3; (5) by methods such as photoetching, evaporation, plating, make light collecting layer 7 at conductive layer 3, light collecting layer 7 forms bowl cup 6 in the position of chip installing hole 10, and the bottom of bowl cup 6 contacts with routing layer 4.
The substrate of light source module described in the utility model has realized that conductivity and heat conduction are separated, and has that reliability is high, the thermal conductivity high, and thermal conductivity reaches more than 200 W/mK, can be widely used in LED Down lamp, street lamp constant power type light source.The utlity model has following advantage: (1) is produced on bowl cup bottom with conductive layer and routing layer, can realize single glass of encapsulating of bowl cup, has reduced the use amount of casting glue and fluorescent material; (2) the utility model has been realized separating of hot conduction and conductivity, can significantly improve the LED heat dissipation problem on the lighting power rank, fluorescent glue xanthochromia speed in using is for a long time effectively reduced, thereby it is lower that light source module is decayed under operating position identical with the common LED light source, and actual life is longer; (3) the utility model has carried out silver-platedly at the inwall of bowl cup, has improved reflectivity, possesses higher light emission rate therefore light source module of the present utility model is compared common COB light source module, obtains higher light output.
Claims (5)
1. light source module substrate, comprise substrate plate body (1), set gradually insulating barrier (2), conductive layer (3) and light collecting layer (7) in the chip installation area territory of substrate plate body (1), positive electrode (8) and negative electrode (9) are set at the edge of substrate plate body (1); It is characterized in that: the bowl cup (6) that a plurality of independent distribution evenly are set on described light collecting layer (7), the bottom of bowl cup (6) contacts with conductive layer (3), about the conductive layer (3) of bowl cup (6) bottom is upper routing layer (4) is set respectively, the routing layer (4) of both sides is connected 9 with positive electrode (8) with negative electrode respectively) be connected.
2. light source module substrate as claimed in claim 1 is characterized in that: the centre at described bowl cup (6) bottom conductive layer (3) is provided with chip installing hole (10), and the bottom of chip installing hole (10) contacts with substrate (1).
3. light source module substrate as claimed in claim 1 is characterized in that: the sidewall of described bowl cup (6) forms prefocus cup (5), is coated with silver at the inwall of prefocus cup (5).
4. light source module substrate as claimed in claim 1, it is characterized in that: the material of described substrate plate body (1) is aluminium, copper or pottery.
5. light source module substrate as claimed in claim 1, it is characterized in that: the material of described light collecting layer (7) is aluminium or pottery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220524699 CN202905774U (en) | 2012-10-13 | 2012-10-13 | Substrate for light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220524699 CN202905774U (en) | 2012-10-13 | 2012-10-13 | Substrate for light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202905774U true CN202905774U (en) | 2013-04-24 |
Family
ID=48126405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220524699 Expired - Lifetime CN202905774U (en) | 2012-10-13 | 2012-10-13 | Substrate for light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202905774U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102945908A (en) * | 2012-10-13 | 2013-02-27 | 江苏新广联科技股份有限公司 | Substrate for light source module |
| CN104183580A (en) * | 2013-05-20 | 2014-12-03 | 新灯源科技有限公司 | Integrated LED element with epitaxial structure and packaging substrate which are integrated, and manufacturing method thereof |
| CN110034223A (en) * | 2019-03-13 | 2019-07-19 | 东莞中之光电股份有限公司 | A kind of large power white light LED lamp bead |
-
2012
- 2012-10-13 CN CN 201220524699 patent/CN202905774U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102945908A (en) * | 2012-10-13 | 2013-02-27 | 江苏新广联科技股份有限公司 | Substrate for light source module |
| CN104183580A (en) * | 2013-05-20 | 2014-12-03 | 新灯源科技有限公司 | Integrated LED element with epitaxial structure and packaging substrate which are integrated, and manufacturing method thereof |
| CN104183580B (en) * | 2013-05-20 | 2018-03-02 | 香港北大青鸟显示有限公司 | The integrated LED element and preparation method that epitaxial structure is integrated with package substrate |
| CN110034223A (en) * | 2019-03-13 | 2019-07-19 | 东莞中之光电股份有限公司 | A kind of large power white light LED lamp bead |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING CO Free format text: FORMER OWNER: JIANGSU XINGUANGLIAN TECHNOLOGY CO., LTD. Effective date: 20140113 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140113 Address after: 214111, No. 18, unity North Road, Xishan Economic Development Zone, Xishan District, Jiangsu, Wuxi Patentee after: JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING Co.,Ltd. Address before: 214111, No. 18, unity North Road, Xishan Economic Development Zone, Xishan District, Jiangsu, Wuxi Patentee before: JIANGSU XINGUANGLIAN TECHNOLOGY Co.,Ltd. |
|
| C56 | Change in the name or address of the patentee |
Owner name: JIANGSU XINGUANGLIAN OPTOELECTRONIC CO., LTD. Free format text: FORMER NAME: JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 214192 Wuxi, Xishan, Xishan Economic Development Zone, North Road, unity, No. 18, No. Patentee after: JIANGSU XGL OPTOELECTRONICS Co.,Ltd. Address before: 214111, No. 18, unity North Road, Xishan Economic Development Zone, Xishan District, Jiangsu, Wuxi Patentee before: JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING Co.,Ltd. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20180319 Address after: 214192 Wuxi, Xishan Province Economic Development Zone, North Road, unity, No. 18, No. Patentee after: JIANGSU XINGUANGLIAN TECHNOLOGY Co.,Ltd. Address before: 214192 Wuxi, Xishan, Xishan Economic Development Zone, North Road, unity, No. 18, No. Patentee before: JIANGSU XGL OPTOELECTRONICS Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130424 |
|
| CX01 | Expiry of patent term |