CN205956787U - Thermoelectric separation type LED dot matrix light source - Google Patents

Thermoelectric separation type LED dot matrix light source Download PDF

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Publication number
CN205956787U
CN205956787U CN201620792456.0U CN201620792456U CN205956787U CN 205956787 U CN205956787 U CN 205956787U CN 201620792456 U CN201620792456 U CN 201620792456U CN 205956787 U CN205956787 U CN 205956787U
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CN
China
Prior art keywords
led
dot matrix
light source
chip
groove
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620792456.0U
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Chinese (zh)
Inventor
蒋书兵
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Individual
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Individual
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Priority to CN201620792456.0U priority Critical patent/CN205956787U/en
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Publication of CN205956787U publication Critical patent/CN205956787U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a thermoelectric separation type LED dot matrix light source, including the dot matrix module of at least one, the dot matrix module includes a thermoelectric separation type's base plate, the array is provided with a plurality of recesses on the base plate, dispose the LED unit in the recess, have one or more's LED chip in each LED unit, the base plate up end be provided with the intercommunication each LED unit the LED circuit in the carrier roller device, the recess bottom has heat conduction surface, the LED chip direct package contact with heat conduction surface on the recess, then the LED circuit electric connection through the base plate up end, form the thermoelectric separation structure, two -layer thermal resistance has been lacked than ordinary SMD dot matrix to its heat dissipation, and the radiation efficiency is improved, the temperature of the work of chip is reduced, chip life increases, and one or more's LED chip package is in same recess, make its chip fully arousing phosphor powder, increase luminous efficacy.

Description

Thermoelectric separated LED array light source
Technical field
This utility model is related to a kind of LED light source, particularly a kind of thermoelectric separated LED array light source.
Background technology
LED array light source is conventional light sources in LED lamp, and at present, LED array light source generally includes substrate and some Paster LED chip, substrate arranges circuit, and paster LED chip is directly mounted on circuit, forms LED circuit, LED chip At least need to conduct heat on substrate through patch support and this two-layer thermoresistance layer aspect of circuit layer, radiating efficiency is low, shadow Ring the service life of LED chip.
Content of the invention
In order to overcome the deficiencies in the prior art, this utility model provides a kind of thermoelectric separated LED array light source.
This utility model solves its technical problem and be employed technical scheme comprise that:
Thermoelectric separated LED array light source, including the dot matrix module of at least one, described dot matrix module includes a thermoelectricity and divides On the substrate of formula, described substrate, array is provided with some grooves, and bottom portion of groove has thermal conductive surface, is configured with described groove LED unit, has one or more LED chips in each LED unit, described substrate upper surface is provided with each LED of connection The LED circuit of unit.
At least two LED unit is in parallel to form light sources in parallel, with power supply circuits after adjacent light sources series connection in parallel Connect, form the circuit structure of series connection after first parallel connection.
Described groove is circular groove.
Described substrate is made up of aluminum or copper material.
Including at least two dot matrix module, adjacent dot matrix module is connected in series.
One or more LED chips is encapsulated in groove by packing colloid, is configured with fluorescence in described packing colloid Bisque.
The beneficial effects of the utility model are:Thermoelectric separated LED array light source, including the dot matrix module of at least one, Described dot matrix module includes the substrate of a thermoelectric separated, and on described substrate, array is provided with some grooves, joins in described groove It is equipped with LED unit, there are in each LED unit one or more LED chips, described substrate upper surface is provided with and connects each The LED circuit of LED unit, in this utility model, bottom portion of groove has thermal conductive surface, LED chip be directly encapsulated on groove with Thermal conductive surface contacts, and is then electrically connected with by the LED circuit of substrate upper surface, forms thermoelectricity isolating construction, and its radiating is than general Lead to SMD dot matrix and lacked two-layer thermal resistance, improve radiating efficiency, reduce the operating temperature of chip, chip service life increases, And one or more LED chips is encapsulated in same groove so as to chip fully exciting to fluorescent material, increase luminous effect Rate.
Brief description
With reference to the accompanying drawings and examples this utility model is further illustrated.
Fig. 1 is the front schematic view of this utility model substrate;
Fig. 2 is this utility model circuit theory schematic diagram.
Specific embodiment
With reference to Fig. 1, Fig. 2, Fig. 1, Fig. 2 are the structural representations of one specific embodiment of this utility model, as illustrated, hot Electric separation type LED array light source, including the dot matrix module 1 of at least one, described dot matrix module 1 includes the base of a thermoelectric separated Plate 2, on described substrate 2, array is provided with some grooves 21, and groove 21 bottom has thermal conductive surface, is configured with described groove 21 LED unit, is packaged with one or more LED chips by packing colloid in each LED unit, is configured with glimmering in packing colloid Light powder, forms phosphor powder layer, and described substrate 2 upper surface is provided with the LED circuit connecting each LED unit, in this utility model In, groove 21 bottom has thermal conductive surface, and LED chip is directly encapsulated into and is contacted with thermal conductive surface on groove 21, and heat is direct Conduct to substrate 2, be then electrically connected with by the LED circuit of substrate upper surface, form thermoelectricity isolating construction, its radiating is than common SMD dot matrix has lacked two-layer thermal resistance, improves radiating efficiency, reduces the operating temperature of chip, and chip service life increases, and One or more LED chips is encapsulated in same groove so as to chip fully exciting to fluorescent material, increase luminous efficiency.
Preferably, in this utility model, adopt circuit structure in parallel after first connecting, as shown in Fig. 2 at least two LED unit is in parallel to form light sources in parallel, is connected with power supply circuits, goes here and there after forming first parallel connection after adjacent light sources series connection in parallel The circuit structure of connection, reducing operating current difference between lamp bead so as to light uniformly, even if breaking down a chip, also will not make Large area is become not work.
Preferably, in the present embodiment, described groove 21 is circular groove, certainly, in specific implementation process, also can adopt With the groove of other shapes, such as square, oval etc., it is not described in detail here.
In this utility model, described substrate 2 is the heat-conducting substrate being made up of Heat Conduction Materials such as aluminum or copper materials.
In specific implementation process, multiple dot matrix modules 1 can form LED array light source in modes such as logical series, parallel, Form the light sources of different capacity, to meet different use demands.
Above preferable enforcement of the present utility model is illustrated, certainly, this utility model can also using with The different form of above-mentioned embodiment, those of ordinary skill in the art without prejudice to the present invention spirit on the premise of made etc. Same conversion or corresponding change, all should belong in protection domain of the present utility model.

Claims (6)

1. thermoelectric separated LED array light source it is characterised in that:Including the dot matrix module (1) of at least one, described dot matrix module (1) include the substrate (2) of a thermoelectric separated, the upper array of described substrate (2) is provided with some grooves (21), groove (21) bottom There is thermal conductive surface, be configured with LED unit in described groove (21), in each LED unit, there are one or more LED chips, Described substrate (2) upper surface is provided with the LED circuit connecting each LED unit.
2. thermoelectric separated LED array light source according to claim 1 it is characterised in that:At least two LED unit is simultaneously Connection forms light sources in parallel, is connected with power supply circuits, forms the circuit of series connection after first parallel connection after adjacent light sources series connection in parallel Structure.
3. thermoelectric separated LED array light source according to claim 1 it is characterised in that:Described groove (21) is circle Groove.
4. thermoelectric separated LED array light source according to claim 1 it is characterised in that:Described substrate (2) by aluminum or Copper material is made.
5. thermoelectric separated LED array light source according to claim 1 it is characterised in that:Including at least two dot matrix Module (1), adjacent dot matrix module (1) is connected in series.
6. thermoelectric separated LED array light source according to claim 1 it is characterised in that:One or more LED chips It is encapsulated in groove (21) by packing colloid, in described packing colloid, be configured with phosphor powder layer.
CN201620792456.0U 2016-07-26 2016-07-26 Thermoelectric separation type LED dot matrix light source Expired - Fee Related CN205956787U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620792456.0U CN205956787U (en) 2016-07-26 2016-07-26 Thermoelectric separation type LED dot matrix light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620792456.0U CN205956787U (en) 2016-07-26 2016-07-26 Thermoelectric separation type LED dot matrix light source

Publications (1)

Publication Number Publication Date
CN205956787U true CN205956787U (en) 2017-02-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620792456.0U Expired - Fee Related CN205956787U (en) 2016-07-26 2016-07-26 Thermoelectric separation type LED dot matrix light source

Country Status (1)

Country Link
CN (1) CN205956787U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109802027A (en) * 2019-02-22 2019-05-24 佛山市国星光电股份有限公司 A kind of light source module group and its manufacturing method and its die cutting die
CN112325251A (en) * 2020-06-17 2021-02-05 深圳市海洋王照明工程有限公司 High-temperature-resistant illuminating lamp
CN109802027B (en) * 2019-02-22 2024-04-09 佛山市国星光电股份有限公司 Light source module, manufacturing method thereof and punching die thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109802027A (en) * 2019-02-22 2019-05-24 佛山市国星光电股份有限公司 A kind of light source module group and its manufacturing method and its die cutting die
CN109802027B (en) * 2019-02-22 2024-04-09 佛山市国星光电股份有限公司 Light source module, manufacturing method thereof and punching die thereof
CN112325251A (en) * 2020-06-17 2021-02-05 深圳市海洋王照明工程有限公司 High-temperature-resistant illuminating lamp
CN112325251B (en) * 2020-06-17 2023-02-17 深圳市海洋王照明工程有限公司 High-temperature-resistant illuminating lamp

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170215

Termination date: 20210726