CN102945908A - Substrate for light source module - Google Patents
Substrate for light source module Download PDFInfo
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- CN102945908A CN102945908A CN2012103877162A CN201210387716A CN102945908A CN 102945908 A CN102945908 A CN 102945908A CN 2012103877162 A CN2012103877162 A CN 2012103877162A CN 201210387716 A CN201210387716 A CN 201210387716A CN 102945908 A CN102945908 A CN 102945908A
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- light source
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Abstract
The invention relates to a substrate for a light source module, which comprises a substrate body; an insulating layer, a conductive layer and a light focusing layer are arranged on a chip installation region of the substrate body in turns; and a positive electrode and a negative electrode are arranged on the edge of the substrate body; a plurality of independent bowl cups are uniformly distributed on the light focusing layer. The substrate is characterized in that a bottom part of the bowl cup is contacted with the conductive layer; a routing layer is arranged on each of the left side and the right side of the the conductive layer on the bottom part of the bowl cup; the routing layers on the left side and the right side of the conductive layer are connected with the positive electrode and the negative electrode respectively. A chip installation hole is formed in the middle of the conductive layer on the bottom part of the bowl cup; and the bottom part of the chip installation hole is contacted with the substrate. Sidewalls of the bowl cups form a light focusing cup, and an inner wall of the light focusing cup is plated with silver. The substrate for the light source module decreases the dosage of potting adhesive and the fluorescent powder, realizes the separation of thermal conduction and electric conduction, and improves the luminous efficiency and the luminous uniformity.
Description
Technical field
The present invention relates to a kind of light source module substrate, especially a kind of light source module substrate of realizing that the heat conduction separates with conductivity.
Background technology
The LED light fixture has the characteristics of life-span length, electric power saving, is applied to more and more widely lighting field.In the prior art, the led light source module mostly adopts aluminium base, aluminium base be circuit board be again heating panel, the individual particle led chip of evenly arranging on aluminium base is packaged into integral body by packaging body with led chip.The light source module chips die bond that existing knot is wanted is on conductive layer, and conductivity is realized by conductive layer, is delivered to substrate after the heat conduction also is passed to insulating barrier by conductive layer again; The mode that this hot conduction and conductivity are all passed through the conductive layer conduction can affect radiating effect, thereby makes fluorescent glue easy xanthochromia in long-time use the, the useful life of reducing led light source.
On the other hand, the routing layer of existing led light source module is arranged on the outside of bowl cup mostly, and wire passes fluorescent glue and is connected with the routing layer, thereby need to carry out encapsulating to the upper surface integral body of substrate; The use amount of this kind mode casting glue and fluorescent material is larger.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of light source module substrate is provided, this substrate can be realized single glass of encapsulating mode on the one hand, reduces the use amount of casting glue and fluorescent material; Can realize on the other hand separating of heat conduction and conductivity, have the excessive heat conductance; The third aspect can improve light extraction efficiency and light-emitting uniformity.
According to technical scheme provided by the invention, described light source module substrate comprises the substrate plate body, sets gradually insulating barrier, conductive layer and light collecting layer in the chip installation area territory of substrate plate body, at the edge of substrate plate body positive electrode and negative electrode is set; It is characterized in that: the bowl cup of a plurality of independent distribution evenly is set on described light collecting layer, and the bottom of bowl cup contacts with conductive layer, about on the conductive layer of bowl cup bottom the routing layer is set respectively, and the routing layer of both sides is connected with negative electrode with positive electrode respectively.
Centre at described bowl cup bottom conductive layer is provided with the chip installing hole, and the bottom of chip installing hole contacts with substrate.The sidewall of described bowl cup forms prefocus cup, is coated with silver at the inwall of prefocus cup.The material of described substrate plate body is aluminium, copper or pottery.Described light collecting layer (material be aluminium or pottery.
The present invention has the following advantages: (1) the present invention is produced on bowl cup bottom with conductive layer and routing layer, can realize single glass of encapsulating of bowl cup, has reduced the use amount of casting glue and fluorescent material; (2) the present invention has realized separating of hot conduction and conductivity, can significantly improve the LED heat dissipation problem on the lighting power rank, fluorescent glue xanthochromia speed in using is for a long time effectively reduced, thereby it is lower that light source module is decayed under operating position identical with the common LED light source, and actual life is longer; (3) the present invention has carried out silver-platedly at the inwall of bowl cup, has improved reflectivity, possesses higher light emission rate therefore light source module of the present invention is compared common COB light source module, obtains higher light output.
Description of drawings
Fig. 1 is the plane graph that light source module of the present invention is used substrate.
Fig. 2 is the cutaway view of bowl cup of the present invention.
Embodiment
The invention will be further described below in conjunction with concrete accompanying drawing.
Such as Fig. 1 ~ shown in Figure 2: as described in light source module comprise substrate plate body 1, insulating barrier 2, conductive layer 3, routing layer 4, prefocus cup 5, bowl cup 6, light collecting layer 7, positive electrode 8, negative electrode 9, chip installing hole 10 with substrate.
Such as Fig. 1 ~ shown in Figure 2, the present invention includes substrate plate body 1, set gradually insulating barrier 2, conductive layer 3 and light collecting layer 7 in the chip installation area territory of substrate plate body 1, positive electrode 8 and negative electrode 9 are set at the edge of substrate plate body 1; The bowl cup 6 of a plurality of independent distribution evenly is set on described light collecting layer 7, and the bottom of bowl cup 6 contacts with conductive layer 3, about on the conductive layer 3 of bowl cup 6 bottoms routing layer 4 is set respectively, and the routing layer 4 of left and right sides is connected with negative electrode with positive electrode 8 respectively and is connected; Centre at described bowl cup 6 bottom conductive layers 3 is provided with chip installing hole 10, the bottom of chip installing hole 10 contacts with substrate plate body 1, thereby after in chip installing hole 10, chip being installed, chip directly contacts with substrate plate body 1, the conductivity of chip is realized by routing layer 4 and conductive layer 3, the conduction of the heat of chip directly realizes by substrate plate body 1, realized that conductivity separates with heat conducting, can significantly improve the LED heat dissipation problem on the lighting power rank;
As shown in Figure 2, the sidewall of described bowl cup 6 forms prefocus cup 5, is coated with silver at the inwall of prefocus cup 5, to improve reflectivity, therefore light source module of the present invention possesses higher light emission rate than common COB light source module, namely obtains higher light output;
The material of described substrate plate body 1 is the high-thermal conductive metal such as aluminium or copper or is ceramic contour heat-conducting insulation material, but is not limited only to aluminium, copper, pottery; The material of described light collecting layer 7 is aluminium or ceramic contour reflecting material, but is not limited only to aluminium, pottery; Being shaped as of described substrate plate body 1 is circular, square, strip or other symmetries, asymmetric figure.
The manufacturing process of light source module of the present invention is: (1) at first on substrate plate body 1 by printing, turn and the mode such as be coated with and make a layer insulating 2; (2) by methods such as photoetching, corrosion insulating barrier 2 is carried out processing and fabricating, erode away chip installing hole 10 in insulating barrier 2 corresponding chip installation sites, the bottom of chip installing hole 10 contacts with substrate plate body 1; (3) by methods such as photoetching, evaporation, plating, make one deck conductive layer 3 at insulating barrier 2; (4) by methods such as photoetching, evaporation, plating, the both sides of corresponding chip installing hole 10 respectively make one deck routing layer 4 on conductive layer 3; (5) by methods such as photoetching, evaporation, plating, make light collecting layer 7 at conductive layer 3, light collecting layer 7 forms bowl cup 6 in the position of chip installing hole 10, and the bottom of bowl cup 6 contacts with routing layer 4.
The substrate of light source module of the present invention has realized that conductivity and heat conduction are separated, and has that reliability is high, the thermal conductivity high, and thermal conductivity reaches more than 200 W/mK, can be widely used in LED Down lamp, street lamp constant power type light source.The present invention has the following advantages: (1) is produced on bowl cup bottom with conductive layer and routing layer, can realize single glass of encapsulating of bowl cup, has reduced the use amount of casting glue and fluorescent material; (2) the present invention has realized separating of hot conduction and conductivity, can significantly improve the LED heat dissipation problem on the lighting power rank, fluorescent glue xanthochromia speed in using is for a long time effectively reduced, thereby it is lower that light source module is decayed under operating position identical with the common LED light source, and actual life is longer; (3) the present invention has carried out silver-platedly at the inwall of bowl cup, has improved reflectivity, possesses higher light emission rate therefore light source module of the present invention is compared common COB light source module, obtains higher light output.
Claims (5)
1. light source module substrate, comprise substrate plate body (1), set gradually insulating barrier (2), conductive layer (3) and light collecting layer (7) in the chip installation area territory of substrate plate body (1), positive electrode (8) and negative electrode (9) are set at the edge of substrate plate body (1); It is characterized in that: the bowl cup (6) that a plurality of independent distribution evenly are set on described light collecting layer (7), the bottom of bowl cup (6) contacts with conductive layer (3), about the conductive layer (3) of bowl cup (6) bottom is upper routing layer (4) is set respectively, the routing layer (4) of both sides is connected 9 with positive electrode (8) with negative electrode respectively) be connected.
2. light source module substrate as claimed in claim 1 is characterized in that: the centre at described bowl cup (6) bottom conductive layer (3) is provided with chip installing hole (10), and the bottom of chip installing hole (10) contacts with substrate (1).
3. light source module substrate as claimed in claim 1 is characterized in that: the sidewall of described bowl cup (6) forms prefocus cup (5), is coated with silver at the inwall of prefocus cup (5).
4. light source module as claimed in claim 1, it is characterized in that: the material of described substrate plate body (1) is aluminium, copper or pottery.
5. light source module as claimed in claim 1, it is characterized in that: the material of described light collecting layer (7) is aluminium or pottery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103877162A CN102945908A (en) | 2012-10-13 | 2012-10-13 | Substrate for light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103877162A CN102945908A (en) | 2012-10-13 | 2012-10-13 | Substrate for light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102945908A true CN102945908A (en) | 2013-02-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103877162A Pending CN102945908A (en) | 2012-10-13 | 2012-10-13 | Substrate for light source module |
Country Status (1)
| Country | Link |
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| CN (1) | CN102945908A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2596555Y (en) * | 2002-10-21 | 2003-12-31 | 佛山市光电器材公司 | Power type LED based on metal circuit board |
| CN201273537Y (en) * | 2008-09-11 | 2009-07-15 | 杭州友旺科技有限公司 | Packaging structure of high power light-emitting diode chip |
| CN202905774U (en) * | 2012-10-13 | 2013-04-24 | 江苏新广联科技股份有限公司 | Substrate for light source module |
-
2012
- 2012-10-13 CN CN2012103877162A patent/CN102945908A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2596555Y (en) * | 2002-10-21 | 2003-12-31 | 佛山市光电器材公司 | Power type LED based on metal circuit board |
| CN201273537Y (en) * | 2008-09-11 | 2009-07-15 | 杭州友旺科技有限公司 | Packaging structure of high power light-emitting diode chip |
| CN202905774U (en) * | 2012-10-13 | 2013-04-24 | 江苏新广联科技股份有限公司 | Substrate for light source module |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING CO Free format text: FORMER OWNER: JIANGSU XINGUANGLIAN TECHNOLOGY CO., LTD. Effective date: 20140113 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20140113 Address after: 214111, No. 18, unity North Road, Xishan Economic Development Zone, Xishan District, Jiangsu, Wuxi Applicant after: JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING CO., LTD. Address before: 214111, No. 18, unity North Road, Xishan Economic Development Zone, Xishan District, Jiangsu, Wuxi Applicant before: Jiangsu Xinguanglian Technology Co., Ltd. |
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| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 214192 Wuxi, Xishan, Xishan Economic Development Zone, North Road, unity, No. 18, No. Applicant after: JIANGSU XGL OPTOELECTRONICS CO., LTD. Address before: 214111, No. 18, unity North Road, Xishan Economic Development Zone, Xishan District, Jiangsu, Wuxi Applicant before: JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING CO., LTD. |
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| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING CO., LTD. TO: JIANGSU XINGUANGLIAN OPTOELECTRONIC CO., LTD. |
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130227 |