CN110034223A - A kind of large power white light LED lamp bead - Google Patents
A kind of large power white light LED lamp bead Download PDFInfo
- Publication number
- CN110034223A CN110034223A CN201910190752.1A CN201910190752A CN110034223A CN 110034223 A CN110034223 A CN 110034223A CN 201910190752 A CN201910190752 A CN 201910190752A CN 110034223 A CN110034223 A CN 110034223A
- Authority
- CN
- China
- Prior art keywords
- adhesive layer
- lamp bead
- led lamp
- large power
- white light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 title claims abstract description 55
- 239000012790 adhesive layer Substances 0.000 claims abstract description 57
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052709 silver Inorganic materials 0.000 claims abstract description 35
- 239000004332 silver Substances 0.000 claims abstract description 35
- 238000000576 coating method Methods 0.000 claims abstract description 30
- 239000011248 coating agent Substances 0.000 claims abstract description 29
- 239000000843 powder Substances 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- VQLYBLABXAHUDN-UHFFFAOYSA-N bis(4-fluorophenyl)-methyl-(1,2,4-triazol-1-ylmethyl)silane;methyl n-(1h-benzimidazol-2-yl)carbamate Chemical compound C1=CC=C2NC(NC(=O)OC)=NC2=C1.C=1C=C(F)C=CC=1[Si](C=1C=CC(F)=CC=1)(C)CN1C=NC=N1 VQLYBLABXAHUDN-UHFFFAOYSA-N 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 5
- 239000003292 glue Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 206010023126 Jaundice Diseases 0.000 description 1
- 208000003351 Melanosis Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses a kind of large power white light LED lamp bead, including bracket and three LED chips, a recess is offered on bracket, three LED chips are arranged in recess；The recess is disposed with silver coating, white adhesive layer and the first fluorescent adhesive layer, the second fluorescent adhesive layer and third fluorescent adhesive layer from bottom upwards；The upper surface of the white adhesive layer is plane, and the upper surface of white adhesive layer is lower than the upper surface of each LED chip；First fluorescent adhesive layer includes red light fluorescent powder, and the second fluorescent adhesive layer includes yellow fluorescent powder, and third fluorescent adhesive layer includes green light fluorescent powder.Large power white light LED lamp bead provided by the invention is higher than the LED lamp bead luminous efficiency of three common chips, and brightness will not be gradually dimmed after a period of use.
Description
Technical field
The present invention relates to LED manufacture technology field, in particular to a kind of large power white light LED lamp bead.
Background technique
In LED lamp bead, the bottom of bracket bowl is provided with silver coating.Existing large power white light LED lamp bead can be in bowl
Multiple LED chips are set to improve light emission luminance in cup, but lamp bead is lighted in rear bowl Base Heat quantity set, and a period of time is used
Silver coating jaundice even melanism herein afterwards, causes lamp bead to shine gradually dimmed.If bowl bottom to be arranged smaller, it may be assumed that
The area for reducing bowl bottom silver coating, the light for allowing LED to issue are contacted and are reflected with bowl side wall as far as possible；Then bowl
Bottom is too small to lead to that multiple LED chips cannot be arranged.In addition, being equably mixed in fluorescent adhesive layer in existing white light LEDs lamp bead
Two or more different fluorescent powder haves the shortcomings that luminous efficiency is not high.Therefore, it is necessary to propose a kind of scheme, energy
The reflecting effect of bowl bottom is enough improved, in order to bowl bottom is arranged relatively large to accommodate multiple LED chips, and
The structure of fluorescent adhesive layer is improved, luminous efficiency is improved.
As it can be seen that the prior art could be improved and improve.
Summary of the invention
Place in view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of large power white light LED lamp bead,
Aim to solve the problem that the bowl bottom silver coating reflecting effect of large power white light LED lamp bead in the prior art is general, lamp bead luminous efficiency
Not high technical problem.
In order to achieve the above object, this invention takes following technical schemes:
A kind of large power white light LED lamp bead, including bracket and three LED chips, offer a recess on bracket, and three
LED chip is arranged in recess；The recess be disposed with upwards from bottom silver coating, white adhesive layer and the first fluorescent adhesive layer,
Second fluorescent adhesive layer and third fluorescent adhesive layer；The upper surface of the white adhesive layer is plane, and the upper surface of white adhesive layer is lower than each LED
The upper surface of chip；First fluorescent adhesive layer includes red light fluorescent powder, and the second fluorescent adhesive layer includes yellow fluorescent powder, and third is glimmering
Optical cement layer includes green light fluorescent powder；The upper surface of the third fluorescent adhesive layer is concordant with the upper surface of bracket.
In the large power white light LED lamp bead, three LED chip specifications are identical, the height and position phase of three LED chips
Together.
In the large power white light LED lamp bead, three LED chips are arranged in a manner of equilateral triangle.
In the large power white light LED lamp bead, be arranged in the silver coating of notched bottoms with a thickness of 10~20 microinch.
In the large power white light LED lamp bead, it is provided with transparent layer of silica gel above the fluorescent adhesive layer, the layer of silica gel
Entire rack upper surface is covered.
In the large power white light LED lamp bead, the horizontal cross-section of the recess is rounded.
In the large power white light LED lamp bead, the side wall of the recess is provided with the second silver coating, second silver coating
For mirror surface silver lustre.
In the large power white light LED lamp bead, the side wall of the recess is frosting.
In the large power white light LED lamp bead, the roughness Ra of the side wall of recess is 50~80 microns.
The utility model has the advantages that the present invention provides in a kind of large power white light LED lamp bead, compared with prior art, by bracket
Notched bottoms be arranged silver coating, and on silver coating be arranged white adhesive layer be used to it is reflective, improve the reflecting effect of notched bottoms,
So that lamp bead of the present invention is higher than the luminous efficiency of the lamp bead of three common chips.And after a period of use, even if
The reflecting effect that oxidation has no effect on white adhesive layer occurs for the silver coating of notched bottoms, and the Integral luminous effect of lamp bead is uninfluenced；
In addition, light is reduced by the energy loss of the first fluorescent adhesive layer, the second fluorescent adhesive layer and third fluorescent adhesive layer.Letter speech
It, large power white light LED lamp bead luminous efficiency provided by the invention is improved, and will not be made as existing LED lamp bead
It is gradually dimmed with brightness after a period of time.
Detailed description of the invention
Fig. 1 is the main view of large power white light LED lamp bead provided by the invention.
Fig. 2 is the top view of large power white light LED lamp bead provided by the invention.
Specific embodiment
The present invention provides a kind of large power white light LED lamp bead, to keep the purpose of the present invention, technical solution and effect more clear
Chu defines, and the present invention is described in more detail as follows in conjunction with drawings and embodiments.It should be appreciated that tool described herein
Body embodiment only to explain the present invention, is not intended to limit the present invention.
Fig. 1 and Fig. 2 are please referred to, the present invention provides a kind of large power white light LED lamp bead."upper" described herein, "lower", "bottom"
Equal 1 visual angle of nouns of locality schematic diagram is described, it is therefore intended that convenient for illustrating, and does not lie in the restriction present invention.Attached drawing is closely used to solve
The structural principle of the large power white light LED lamp bead is released, it is not proportional to actual product.
The large power white light LED lamp bead includes bracket 1 and three LED chips 2 (preferably blue chip), on bracket 1
It offers a recess 101 (being commonly called as " bowl "), three LED chips 2 are arranged in recess 101；The recess is upward from bottom
It is disposed with silver coating 31, white adhesive layer 4, the first fluorescent adhesive layer 51, the second fluorescent adhesive layer 52 and third fluorescent adhesive layer 53；It is described
The upper surface of white adhesive layer 4 is plane, and the upper surface of white adhesive layer 4 is lower than the upper surface of each LED chip 2；First fluorescent glue
Layer 51 includes red light fluorescent powder, and the second fluorescent adhesive layer 52 includes yellow fluorescent powder, third fluorescent adhesive layer 53；The third fluorescent glue
The upper surface of layer 53 is concordant with the upper surface of bracket 1.
When actual production, white glue can be sprayed or other modes are arranged on silver coating, form white adhesive layer after solidification.
It is equably mixed with fluorescent powder in the fluorescent adhesive layer, but does not limit the design parameter of fluorescent powder herein, because do not limit herein
Lamp bead is actually sent out the light of which kind of color.In addition, not limiting each LED chip herein as formal dress or upside-down mounting, due to LED chip
Die bond and the processes such as welding itself belong to routine techniques and not within the scope of the present invention, therefore attached drawing is not drawn specifically
The conventional structures such as die bond and welding (such as gold thread, pad, heat sink).
After the lamp bead is lighted, some light that three LED chips 2 issue can reach the bottom of recess, and white adhesive layer 4
Reflex (reflect bowl, or be reflected into recess sidewall and project again) is played to this some light.It is anti-due to white adhesive layer
Optical property is preferable, and lamp bead of the present invention is higher than the luminous efficiency of the lamp bead of three common chips.It is set in the present invention
The silver coating part that is mainly used for preventing bracket from corresponding to notched bottoms aoxidize, due to silver coating be then not used in it is reflective,
Therefore, for the surface quality requirements of silver coating then relative reduction, the requirement of silver plating process is reduced, is increased easy to process.LED
After chip is lighted, due to setting gradually red light fluorescent powder, yellow fluorescent powder and green light fluorescent powder from bottom to top, what is be inspired is red
Light will not further excite yellow fluorescent powder and green light fluorescent powder, and the yellow light being inspired will not further excite green light
Fluorescent powder reduces energy loss, therefore whole lighting efficiency is improved.
Preferably, three 2 specifications of LED chip are identical, and the height and position of three LED chips 2 is identical.The setting is convenient for practical
The light of injection is more equal.
As shown in Figure 2, it is preferable that three LED chips 2 are arranged in a manner of equilateral triangle, it may be assumed that three LED chips
The line of centres constitutes equilateral triangle, further increases the uniformity of the light of injection.
Preferably, be arranged in the silver coating 31 of 101 bottom of recess with a thickness of 10~20 microinch, compared to the prior art
Reflecting effect is improved by increasing the thickness of silver coating, by white adhesive layer come reflective therefore can reduce silver coating in the present invention
Thickness, reduce the requirement of silver-plated process.
Further, it is provided with transparent layer of silica gel 6 above the fluorescent adhesive layer 5, the layer of silica gel is by table on entire bracket
Face covering.Protection, waterproof action are played by the way that layer of silica gel is arranged, guarantees that LED chip and white adhesive layer are without damage.
Preferably, as shown in Fig. 2, the horizontal cross-section of the recess 101 is rounded, as shown in Figure 1, recess is wide at the top and narrow at the bottom,
But the tilt angle of the side wall of recess is not limited herein.
Further, the side wall of the recess 101 is provided with the second silver coating 32, which is mirror surface silver lustre.
" second " herein is only used for difference nominally.Since mirror surface silver lustre reflecting effect is preferable, the hair of lamp bead is further improved
Light efficiency.
Preferably, the side wall of the recess 101 is frosting, and the setting is convenient for improving the second silver coating and recess sidewall
Connectivity robustness, the second silver coating is not susceptible to fall off in use process.
Preferably, the roughness Ra of the side wall of recess 101 is 50~80 microns.
By above-mentioned analysis it is found that passing through the notched bottoms in bracket in large power white light LED lamp bead provided by the invention
Be arranged silver coating, and on silver coating be arranged white adhesive layer be used to it is reflective, the reflecting effect of notched bottoms is improved, so that of the invention
The lamp bead is higher than the luminous efficiency of the lamp bead of three common chips.And after a period of use, even if notched bottoms
The reflecting effect that oxidation has no effect on white adhesive layer occurs for silver coating, and the Integral luminous effect of lamp bead is uninfluenced；In addition, light passes through
The energy loss for crossing the first fluorescent adhesive layer, the second fluorescent adhesive layer and third fluorescent adhesive layer is reduced.In short, the present invention provides
Large power white light LED lamp bead luminous efficiency be improved, and will not be bright after a period of use as existing LED lamp bead
It spends gradually dimmed.
It, can according to the technique and scheme of the present invention and its hair it is understood that for those of ordinary skills
Bright design is subject to equivalent substitution or change, and all these changes or replacement all should belong to protection scope of the present invention.
Claims (9)
1. a kind of large power white light LED lamp bead, including bracket and three LED chips, which is characterized in that offer one on bracket
Recess, three LED chips are arranged in recess；The recess is disposed with silver coating, white adhesive layer and first from bottom upwards
Fluorescent adhesive layer, the second fluorescent adhesive layer and third fluorescent adhesive layer；The upper surface of the white adhesive layer is plane, and the upper surface of white adhesive layer is low
In the upper surface of each LED chip；First fluorescent adhesive layer includes red light fluorescent powder, and the second fluorescent adhesive layer includes yellow light fluorescence
Powder, third fluorescent adhesive layer include green light fluorescent powder；The upper surface of the third fluorescent adhesive layer is concordant with the upper surface of bracket.
2. large power white light LED lamp bead according to claim 1, which is characterized in that three LED chip specifications are identical, and three
The height and position of a LED chip is identical.
3. large power white light LED lamp bead according to claim 8, which is characterized in that three LED chips are with equilateral triangle
Mode arrange.
4. large power white light LED lamp bead according to claim 1, which is characterized in that the silver coating of notched bottoms is arranged in
With a thickness of 10~20 microinch.
5. large power white light LED lamp bead according to claim 1, which is characterized in that be provided with above the fluorescent adhesive layer
Transparent layer of silica gel, the layer of silica gel cover entire rack upper surface.
6. large power white light LED lamp bead according to claim 1, which is characterized in that the horizontal cross-section of the recess is in circle
Shape.
7. large power white light LED lamp bead according to claim 4, which is characterized in that the side wall of the recess is provided with
Two silver coatings, second silver coating are mirror surface silver lustre.
8. large power white light LED lamp bead according to claim 5, which is characterized in that the side wall of the recess is frosting.
9. large power white light LED lamp bead according to claim 6, which is characterized in that the roughness Ra of the side wall of recess is
50~80 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910190752.1A CN110034223A (en) | 2019-03-13 | 2019-03-13 | A kind of large power white light LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910190752.1A CN110034223A (en) | 2019-03-13 | 2019-03-13 | A kind of large power white light LED lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110034223A true CN110034223A (en) | 2019-07-19 |
Family
ID=67235950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910190752.1A Pending CN110034223A (en) | 2019-03-13 | 2019-03-13 | A kind of large power white light LED lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110034223A (en) |
Citations (19)
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2019
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| JP2009200403A (en) * | 2008-02-25 | 2009-09-03 | Toyoda Gosei Co Ltd | Light-emitting apparatus |
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Application publication date: 20190719 |