CN104009146A - SMD LED panel support structure and LED chip - Google Patents

SMD LED panel support structure and LED chip Download PDF

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Publication number
CN104009146A
CN104009146A CN201410253709.2A CN201410253709A CN104009146A CN 104009146 A CN104009146 A CN 104009146A CN 201410253709 A CN201410253709 A CN 201410253709A CN 104009146 A CN104009146 A CN 104009146A
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China
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led
pit
support structure
led chip
smd
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CN201410253709.2A
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Chinese (zh)
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李漫铁
屠孟龙
谢玲
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深圳雷曼光电科技股份有限公司
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Priority to CN201410253709.2A priority Critical patent/CN104009146A/en
Publication of CN104009146A publication Critical patent/CN104009146A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The invention relates to the technical field of encapsulating and processing of LED chips, in particular to an SMD LED panel support structure and an LED chip. The SMD LED panel support structure comprises a metal substrate. A concave pit is formed in the position, where an LED wafer is fixed, of the metal substrate, the pit depth of the concave pit is 0.05-0.2 mm, the base area of the concave pit is 0.3-5.5 mm <2>, and the LED wafer is fixed to the bottom surface of the concave pit. The depth of the concave pit is small, the base area of the concave pit is small, less glue for encapsulating the concave pit is used than that for encapsulating a traditional SMD LED bowl-shaped support, and the phenomenon of deviation of the glue face is not prone to occurring when the SMD LED panel support structure is encapsulated. The side walls of the concave pit are made of metal, light reflection capacity of the metal side walls is higher than that of the side walls, made of PPA, of the traditional SMD LED bowl-shaped support, and therefore light-emitting brightness of the LED wafer encapsulated on the SMD LED panel support structure is improved by more than 5 percent compared with an LED wafer encapsulated on the traditional SMD LED bowl-shaped support.

Description

一种SMD LED平板支架结构和LED芯片 One kind of SMD LED flat plate support structure and the LED chip

技术领域 FIELD

[0001] 本发明涉及LED芯片封装加工技术领域,尤其涉及一种SMD LED平板支架结构和LED芯片。 [0001] The present invention relates to packaging LED chip processing technology, and more particularly, to a flat support structure SMD LED and the LED chip.

背景技术 Background technique

[0002] 目前的SMD (Surface Mounted Devices、表面贴装器件)LED (Light EmittingDiode、发光二极管)碗杯支架,一般由注塑结构和金属基板组成且具有碗杯结构,该碗杯结构的侧壁为光线反射能力弱的PPA材质。 [0002] Current SMD (Surface Mounted Devices, surface mount devices) LED (Light EmittingDiode, light emitting diodes) cups stent, typically by the injection structure and the metal substrate and having a bowl structure, the side wall of the bowl structure PPA poor light reflectance material. 如图1和图2所示,其是封装单颗LED晶片于SMD LED碗杯支架的结构俯视图和结构剖面图。 As shown in FIG. 1 and FIG. 2, which is a single LED package wafer and a plan view of a cross-sectional configuration to the configuration of FIG SMD LED cups stand. LED晶片I通过环氧、硅胶或银胶等底胶剂粘接在碗杯结构底部的金属基板区域,并通过BANDING技术在LED晶片I上方的电极处引出导线2与该碗杯支架的正负电极相连,起到电气连接的作用。 I LED wafer by an epoxy, plastic substrates such as silica gel or silver glue bonding metal substrate region at the bottom of the bowl structure, and the negative lead wire 2 by a bracket cups BANDING LED chip technique above the electrode I electrodes are connected, the electrical connection functions. 该碗杯支架的碗杯结构的杯深约为0.3mm以上、杯底面积约为LED晶片I底面积的4倍以上。 Cup bowl structure of the cup holder bowl depth of about 0.3mm or more, LED cup base area of ​​about 4 times higher than the bottom area of ​​the chip I. 灌封该碗杯结构的胶量相对消耗较多,具有该类碗杯支架的LED芯片的出光角度最大只能达到120°且由于PPA材质的弱反射使得其出光亮度较小。 The maximum angle of the light amount of the potting bowl structure relatively large consumption, such cups holder having an LED chip and can reach 120 ° PPA due to the weak reflection material such that the brightness is small. 可见,SMD LED碗杯支架由于设置了碗杯结构而便于胶水的灌封和LED晶片的出光,但同时也限制了灌封胶的成型、封装器件的出光角度和出光亮度。 Visible, SMD LED holder since the cups of the bowl structure is facilitated and the LED light potting glue wafer, but also limits the angle of the light and the potting molding, packaged device brightness.

[0003] 为满足覆膜成型工艺和更大出光角度的需求,后续出现了SMD LED平板支架,该类平板支架一般不具有碗杯结构,LED晶片直接粘接于该平板支架的金属基板上。 [0003] The film forming process and to meet the needs of larger beam angle, subsequent occurrence of the SMD LED flat bracket, the bracket generally do not have such flat bowl structure, the LED chip is bonded directly to the metal substrate of the plate holder. 具有该类平板支架的LED芯片的出光角度可以达到120° -160°的大角度范围,但点胶时容易出现胶面偏移的现象。 Light having an angle bracket plate such LED chips can achieve a large angular range of 120 ° -160 °, but plastic surface offset phenomenon tends to occur during dispensing. 且即使采用点围坝胶或专用的粘度相对较高的胶水,出现胶面偏移现象的情况也没有得到改善。 And even if the point or special glue dam relatively high viscosity glue, adhesive surface where shift phenomenon occurs not improved. 胶面偏移对LED芯片的显指、色温、角度、光通量和光效的影响不大,但会使得LED芯片的配光曲线严重变形。 Adhesive surface of the LED chip offset CRI, color temperature has little effect, the angle, and the light flux efficiency, but such that the light distribution curves of the LED chip is severely deformed. 如图3和图4所示,其是点胶正常的LED芯片的配光曲线图和点胶偏移的LED芯片的配光曲线图。 As shown in FIG. 3 and FIG. 4, which is a graph showing a light distribution of the LED chip and a light distribution curve point Dispense normal LED chip offset.

发明内容 SUMMARY

[0004] 本发明的目的在于提出一种SMD LED平板支架结构和LED芯片,灌封该支架结构的胶量消耗小,灌封时不易出现胶面偏移现象,且使得具有该支架结构的LED芯片的出光亮度大。 [0004] The object of the present invention is to provide a support structure SMD LED flat plate and the LED chip, the amount of the potting support structure consumption, less prone to the offset phenomenon potting adhesive surface, and the LED having the scaffold structure the brightness chip is large.

[0005] 为达此目的,本发明采用以下技术方案: [0005] To achieve this object, the present invention employs the following technical solution:

[0006] 第一方面,提供一种SMD LED平板支架结构,包括金属基板,在所述金属基板固定LED晶片的位置开设一凹坑,所述凹坑的坑深为0.05-0.2mm、坑底面积为0.3-5.5mm2。 [0006] In a first aspect, there is provided a SMD LED flat support structure, comprising a metallic substrate, pits defines a fixed position of the metal substrate of the LED chip, the pit depth of the pits is 0.05-0.2 mm, Bottom area 0.3-5.5mm2.

[0007] 其中,所述凹坑包括圆台形坑,所述圆台形坑的轴对称的两条侧棱延长线的夹角为5-60° 。 [0007] wherein said dimple-shaped pits comprising a truncated cone, the angle of the truncated cone-shaped pits axisymmetric two side edges of the extension line is 5-60 °.

[0008] 其中,所述凹坑还包括圆柱形坑,所述圆柱形坑的柱高为0.01-0.1mm,所述圆柱形坑位于圆台形坑的正上方,所述圆柱形坑的直径和圆台形坑的上表面直径相等,所述圆台形坑和圆柱形坑一体成型。 [0008] wherein said recesses further includes a cylindrical hole, the cylindrical pit column height is 0.01-0.1 mm, the cylindrical hole is directly above the truncated cone of the hole, and the diameter of the cylindrical pit equal to the upper surface of the truncated cone of the hole diameter, the truncated cone-shaped pits and the pits formed integrally cylindrical. [0009] 其中,所述凹坑的侧壁覆盖Cu镀Ag层。 [0009] wherein the pit sidewall coverage Cu Ag plating layer.

[0010] 其中,所述凹坑为冲压成型或蚀刻成型。 [0010] wherein the pit formed as stamping or etching.

[0011] 第二方面,提供一种LED芯片,包括LED晶片和上述的SMD LED平板支架结构,所述LED晶片固定于凹坑底面。 [0011] In a second aspect, there is provided a LED chip includes an LED wafer and said support structure of the flat SMD LED, the LED chip is fixed to the bottom surface of the pit.

[0012] 其中,所述LED晶片为45Mil的LED晶片,所述坑底面积为1.9-5.2mm2。 [0012] wherein the LED chip is an LED chip 45Mil, the bottom of the pit area is 1.9-5.2mm2.

[0013] 其中,所述LED晶片为20Mil的LED晶片,所述坑底面积为0.3-1.1mm2。 [0013] wherein the LED chip is an LED chip 20Mil, the bottom of the pit area is 0.3-1.1mm2.

[0014] 其中,所述LED晶片与凹坑底面之间设置银胶层。 [0014] wherein the silver paste layer is provided between the bottom surface of the LED chip and the pit.

[0015] 其中,所述凹坑的正上方设置与凹坑形状配合的灌封胶。 [0015] wherein, disposed directly above the pit and pit shape with potting.

[0016] 本发明的有益效果在于:一种SMD LED平板支架结构和LED芯片,包括金属基板,在所述金属基板固定LED晶片的位置开设一凹坑,所述凹坑的坑深为0.05-0.2mm、坑底面积为0.3-5.5mm2。 [0016] Advantageous effects of the present invention: SMD LED flat one kind of LED chips and a support structure, comprising a metal substrate, pits defines a fixed position of the metal substrate of the LED chip, the pit depth of the pits is 0.05 0.2mm, Bottom area 0.3-5.5mm2. 所述LED晶片固定于凹坑底面。 The LED chip is fixed to the bottom surface of the pit. 凹坑的深度浅、底面积小,灌封该凹坑的胶量比灌封传统SMD LED碗杯支架的胶量消耗少,且由于凹坑的存在,灌封该平板支架结构时不易出现胶面偏移现象。 The shallow depth of the pit, a small bottom area, the pit potting potting adhesive than conventional SMD LED holder cups glue consumption, and less prone to gel due to the presence of pits, the plate support structure potting surface offset phenomenon. 在金属基板上直接开设凹坑,凹坑的侧壁为金属材质,金属材质侧壁的光反射能力比传统SMD LED碗杯支架的PPA材质侧壁的光反射能力强,使封装的LED晶片的出光亮度相对于封装在传统SMD LED碗杯支架的LED晶片的出光亮度提升5%以上。 Directly on a metal substrate defines dimples, pits made of metal sidewall, the sidewall material of the light reflectance of the metal material stronger than the light reflectance sidewall PPA conventional SMD LED cups brackets so that packaged LED chip the relative brightness of the light brightness of the LED package in the conventional wafer holder cups SMD LED improvement more than 5%. 可见,该SMD LED平板支架结构和LED芯片,灌封该支架结构的胶量消耗小,灌封时不易出现胶面偏移现象,且使得具有该支架结构的LED芯片的出光亮度大。 Seen, the SMD LED flat plate support structure and the LED chip, the amount of the potting support structure consumption, less prone to the offset phenomenon potting adhesive surface, and such that the light having high brightness of the LED chip support structure.

附图说明 BRIEF DESCRIPTION

[0017] 为了更清楚地说明本发明实施例中的技术方案,下面将对本发明实施例描述中所需要使用的附图作简单的介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据本发明实施例的内容和这些附图获得其他的附图。 [0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following embodiments the present invention will be described accompanying drawings as required simple introduction Apparently, the drawings in the following description of the present invention are merely Some embodiments of the present art ordinary skill, without any creative effort, and also an example of the contents of these drawings other drawings according to an embodiment of the present invention is obtained.

[0018] 图1是封装单颗LED晶片于SMD LED碗杯支架的结构俯视图。 [0018] FIG. 1 is a top view of the package of FIG single LED chip SMD LED cups on the structure of the stent.

[0019] 图2是封装单颗LED晶片于SMD LED碗杯支架的结构剖面图。 [0019] FIG. 2 is a cross-sectional view of the package in a single LED chip SMD LED cups stand.

[0020] 图3是点胶正常的LED芯片的配光曲线图。 [0020] FIG. 3 is a graph showing a light distribution normal dispensing LED chip.

[0021] 图4是点胶偏移的LED芯片的配光曲线图。 [0021] FIG. 4 is a graph showing a light distribution of the LED chip offset dispensing.

[0022] 图5是本发明提供的封装于SMD LED平板支架结构的LED芯片结构俯视图。 [0022] FIG. 5 is a top view of the present invention to provide a package of the LED chip structure of FIG SMD LED support structure plate.

[0023] 图6是本发明提供的封装于SMD LED平板支架结构的LED芯片结构主视图。 [0023] FIG. 6 is a package of the present invention provides a front view of the LED chip structure SMD LED support structure plate.

[0024] 图7是本发明提供的封装于SMD LED平板支架结构的LED芯片结构侧视图。 [0024] FIG. 7 is a side view of the present invention to provide a package of the LED chip structure SMD LED flat plate support structure.

[0025] 图8是本发明提供的倒装晶片封装于SMD LED平板支架结构的LED芯片结构俯视图。 [0025] FIG. 8 is a flip chip according to the present invention provides an LED chip is packaged in a flat configuration SMD LED plan view of the support structure.

[0026] 图9是本发明提供的倒装晶片封装于SMD LED平板支架结构的LED芯片结构主视图。 [0026] FIG. 9 is a flip-chip package of the present invention provides a front view of the LED chip structure SMD LED support structure plate.

[0027] 图10是本发明提供的倒装晶片封装于SMD LED平板支架结构的LED芯片结构侧视图。 [0027] FIG. 10 is a flip-chip package of the present invention provides a side view of the structure of the LED chip SMD LED support structure plate.

[0028] 附图标记说明如下: [0028] reference numerals as follows:

[0029] 1-LED晶片;2_导线;3_金属基板;4_注塑结构;5_凹坑;6_灌封胶。 [0029] 1-LED wafer; 2_ wire; 3_ metal substrate; 4_ injection structure; 5_ pits; 6_ potting. 具体实施方式 Detailed ways

[0030] 为使本发明解决的技术问题、采用的技术方案和达到的技术效果更加清楚,下面将结合附图对本发明实施例的技术方案作进一步的详细描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。 [0030] In order that the invention solves the technical problem, technical solutions adopted and achieved technical effect more clearly, the following technical solutions will be further described in detail with the accompanying drawings embodiments of the present invention, obviously, the described embodiments are merely some embodiments of the present invention rather than all embodiments. 基于本发明中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。 Based on the embodiments of the present invention, those skilled in the art to make all other embodiments without creative work obtained by, it falls within the scope of the present invention.

[0031] 请参考图5、图6和图7,其分别是本发明提供的封装于SMD LED平板支架结构的LED芯片结构俯视图、结构主视图和结构侧视图。 [0031] Please refer to FIG. 5, 6 and 7, which are provided by the present invention, the package plan view, a front view and a structural side view of the structure of the LED chip structure SMD LED support structure plate.

[0032] 一种SMD LED平板支架结构,包括金属基板3,在所述金属基板3固定LED晶片I的位置开设一凹坑5,所述凹坑5的坑深为0.05-0.2mm、坑底面积为0.3-5.5mm2。 [0032] A SMD LED flat support structure, comprising a metal substrate 3, defines a pit 5 at the location of the LED chip 3 is fixed to the metal substrate I, the pit depth of the pit 5 of 0.05-0.2 mm, Bottom area 0.3-5.5mm2.

[0033] 本发明提供的SMD LED平板支架结构,凹坑5的深度浅、底面积小,灌封该凹坑5的胶量比灌封传统SMD LED碗杯支架的胶量消耗少,且由于凹坑5的存在,灌封该平板支架结构时不易出现胶面偏移现象。 [0033] SMD LED holder plate structure of the present invention provides, shallow depth of the pit 5, a small bottom area, the pit potting adhesive potting than 5 cups a conventional SMD LED holder glue consumption, and since the presence of the pit 5, less prone to the offset phenomenon potting adhesive surface of the plate support structure. 在金属基板3上直接开设凹坑5,凹坑5的侧壁为金属材质,金属材质侧壁的光反射能力比传统SMDLED碗杯支架的PPA材质侧壁的光反射能力强,使封装的LED晶片I的出光亮度相对于封装在传统SMD LED碗杯支架的LED晶片I的出光亮度提升5%以上。 Directly on the metal substrate 3 defines 5 dimples, dimples side wall 5 is made of metal, the light reflectance of the metal sidewall material stronger than the light reflectance of the material of the side wall SMDLED cups PPA conventional brackets so that packaged LED light luminance I with respect to the wafer in the light brightness of the LED package wafer I cups conventional SMD LED holder lifting more than 5%. 可见,该SMD LED平板支架结构,灌封该支架结构的胶量消耗小,灌封时不易出现胶面偏移现象,且使得具有该支架结构的LED芯片的出光亮度大。 Seen, the SMD LED flat support structure, the support structure potting amount of consumption, less prone to the offset phenomenon potting adhesive surface, and such that the LED chips having the scaffold structure of a large brightness.

[0034] 其中,所述凹坑5包括圆台形坑,所述圆台形坑的轴对称的两条侧棱延长线的夹角为5-60°。 [0034] wherein said dimples pits 5 comprises a truncated cone, the angle of the truncated cone-shaped pits axisymmetric two side edges of the extension line is 5-60 °.

[0035] 根据圆台形坑的轴对称的两条侧棱延长线的夹角和几何关系,可计算出圆台形坑的上表面面积。 [0035] The angle of the truncated cone hole axisymmetric two side edges of the extension line and geometric relationships, calculated on the surface area of ​​the truncated cone-shaped pits.

[0036] 凹坑5的底面积小,约为固定的LED晶片I底面积的1.5-4倍,配合延长线互相成5-60°夹角的两条侧棱,可使具有该支架结构的LED芯片的出光角度达到120-160°。 [0036] The small bottom area of ​​the pit 5, about 1.5-4 times the fixed area of ​​the bottom LED chip I, with the extension line to each other two side edges 5-60 ° angle, the support structure can have light angle of the LED chip reaches 120-160 °.

[0037] 其中,所述凹坑5还包括圆柱形坑,所述圆柱形坑的柱高为0.01-0.1mm,所述圆柱形坑位于圆台形坑的正上方,所述圆柱形坑的直径和圆台形坑的上表面直径相等,所述圆台形坑和圆柱形坑一体成型。 [0037] wherein the dimples 5 further comprising a cylindrical hole, the cylindrical pit column height is 0.01-0.1 mm, the cylindrical hole is directly above the truncated cone of the hole, the diameter of the cylindrical pit and the truncated cone surface of the hole is equal to the diameter of the cylindrical truncated cone-shaped pits and pit integrally formed.

[0038] 当然,基于本发明的技术背景和设计需求,凹坑5还可以是碗型或其他形状,只要达到本发明实现的技术效果即可,此处不作赘述。 [0038] Of course, based on the technical background of the invention and design requirements, 5 may also be dimples or other bowl shape as long to achieve the technical effect of the invention can be achieved, is not repeated here.

[0039] 对于封装单颗LED晶片I于SMD LED平板支架结构,分割该支架结构与导线2连接的正负极的注塑结构4位置可以根据实际需求在金属基板3的区域内作相应调整。 [0039] For a single LED package wafer SMD LED flat plate I in the stent structure, the stent structure divides the positive and negative electrodes 2 and conductor 4 position of the connecting structure of the injection may be adjusted in the region of the metal substrate 3 according to the actual needs. 通过调整金属基板3、注塑结构4和凹坑5尺寸就可以把该支架结构应用于单颗和多颗LED晶片I的固晶封装。 By adjusting the metal substrate 3, the structure 4 and the injection size dimples 5 can be applied to the single support structure and the multiple LED package wafer I crystalline solid.

[0040] 其中,所述凹坑5的侧壁覆盖Cu镀Ag层。 [0040] wherein the dimples cover side wall 5 Cu Ag plating layer.

[0041] 凹坑5的侧壁覆盖Cu镀Ag层,Cu镀Ag即为金属基板3材质,该Cu镀Ag层使凹坑5侧壁的光反射率提高,使封装的蓝宝石衬底的LED芯片的出光亮度相对于封装于传统SMD LED碗杯支架的LED芯片的出光亮度提升5%以上。 Side walls [0041] 5 pit cover layer Ag-plated Cu, Ag plated Cu material is the metal substrate 3, the Ag Cu plating layer 5 so that light reflectance of the pit sidewalls increase the sapphire substrate of the LED package the brightness of the light with respect to the luminance chip SMD LED package in the conventional LED chip holder cups lift more than 5%.

[0042] 其中,所述凹坑5为冲压成型或蚀刻成型。 [0042] wherein the dimples 5 is a stamping or etching forming.

[0043] 本发明提供的SMD LED平板支架结构通过冲压或蚀刻在金属基板3上表面直接开设凹坑5,帮助LED晶片I侧面的发光光线更多的反射到LED晶片I的上面,提升封装LED芯片的光效,且能有效控制点胶量,保证点胶的形状一致,使色区集中度更高。 [0043] SMD LED flat plate structure of the present invention provides a stent by stamping or etching the surface of the dimples 5 is directly opened on the metal substrate 3, I help LED light emitting side surface of the wafer to more reflective LED chip I, above, to enhance the LED package chip light efficiency, and can effectively control the amount of dispensing, to ensure consistent dispensing of the shape of the color region of higher concentration. [0044] 请参考图8、图9和图10,其分别是本发明提供的倒装晶片封装于SMD LED平板支架结构的LED芯片结构俯视图、结构主视图和结构侧视图。 [0044] Please refer to FIG. 8, 9 and 10, which are respectively a plan view of the present invention provides a flip-chip package structure of the LED chip SMD LED flat support structure diagram, a structure and the structure of a front view side.

[0045] 一种LED芯片,包括LED晶片I和上述的SMD LED平板支架结构,所述LED晶片I固定于凹坑5底面。 [0045] An LED chip includes an LED chip and said I SMD LED flat support structure, the LED chip I 5 is fixed to the bottom surface of the pit.

[0046] 上述的SMD LED平板支架结构既适用于传统正装晶片的封装,也适用于倒装晶片的封装,广泛应用于锡膏或助焊剂批量印刷。 [0046] The scaffold of the SMD LED flat plate applicable to both traditional dress chip package, the package is also applicable to the flip chip, solder paste or flux is widely used in batch printing.

[0047] LED晶片I直接放置在金属基板3热沉,缩短散热路径、降低热阻、提升散热效果,并有效降低LED晶片I的结温。 [0047] I LED chip 3 is placed directly on the metal substrate, heat sink, to shorten the heat radiation path, reduce the thermal resistance and enhance heat dissipation effect, lower junction temperature of the LED chip I.

[0048] 其中,所述LED晶片I为45Mil的LED晶片1,所述坑底面积为1.9-5.2mm2。 [0048] wherein I is 45Mil the LED chip LED chip 1, the bottom of the pit area is 1.9-5.2mm2.

[0049] 45ΜΪ1的LED晶片I为6寸硅衬底的LED晶片1,采用IW大功率LED晶片1,性能稳定,抗人体和环境静电达8000V以上,光效能达到1401m/W以上,是目前市面上最大的LED晶片I。 [0049] 45ΜΪ1 I LED chip is an LED 6 inch silicon wafer substrate 1, using high-power LED chip 1 IW, stability, resistance to humans and the environment of 8000V electrostatic above, luminous efficacy reaches 1401m / W or more, the market is largest LED chip I.

[0050] 其中,所述LED晶片I为20Mil的LED晶片1,所述坑底面积为0.3-1.1mm2。 [0050] wherein I is the LED chip 20Mil LED chip 1, the bottom of the pit area is 0.3-1.1mm2.

[0051] 规格尺寸低于20Mil的LED晶片I光效能较低,市场应用率低且采购周期长。 Low luminous efficacy I LED chip [0051] Size 20Mil below, the market is low and the procurement application cycle is long.

[0052] 其中,所述LED晶片I与凹坑5底面之间设置银胶层。 [0052] wherein the silver paste layer is provided between the LED chip 5 and the pit bottom surface I.

[0053] 其中,所述凹坑5的正上方设置与凹坑5形状配合的灌封胶6。 [0053] wherein the dimple is provided immediately above the potting pit 5 of the form-fitting 65.

[0054] 在SMD LED平板支架结构的金属基板3上冲压或蚀刻出一个凹坑5,使采用点胶方式灌封该支架结构时,更易于操作和色区集中度更高。 [0054] When the metal substrate SMD LED holder plate structure 3 stamped or etched out of a pit 5, making use of the casting dispensing mode supporting structure, easier to handle and higher concentration of the color area. 该凹坑5的深度浅,底面积小,可灵活设计灌封胶6光形并大范围调整出光角度。 The shallow depth of the pit 5, a small bottom area can be flexibly designed potting 6 and light-shaped wide angle light adjustment. 凹坑5可适用于多种灌封胶6方式,如点胶、覆膜、MOLDING等,且点胶时对胶量和胶面的控制容易,色区集中度相比没凹坑5结构的更高。 5 applied to a variety dimples potting 6 manner, such as dispensing, coating, MOLDING like, and when control of the dispensing of glue and adhesive surface easily, compared to the concentration of color region structure without dimples 5 higher. LED晶片I置于凹坑5的底部,凹坑5的Cu镀Ag材质侧壁将LED晶片I侧边的发光光线反射出来,提高了LED芯片的整体亮度,使光形饱满。 I LED chip 5 placed on the bottom of the pit, the pit Cu 5 Ag plating material will be reflected sidewall light emitting side of the LED chip I improve the overall brightness of the LED chip, the light-shaped full.

[0055] 优选实施例:一种SMD LED平板支架结构,包括金属基板3,在所述金属基板3固定45ΜΪ1的LED晶片I的位置开设一凹坑5,所述凹坑5的坑深为0.1mm、坑底面积为4.5mm2。 [0055] The preferred embodiments: one kind SMD LED flat support structure, comprising a metal substrate 3, defines a pit 5 at the position 3 of the metal substrate is fixed 45ΜΪ1 LED chip I, the pit depth of the pit is 0.1 5 mm, Bottom area of ​​4.5mm2. 所述凹坑5包括圆台形坑,所述圆台形坑的轴对称的两条侧棱延长线的夹角为60°。 The dimples 5 comprises a truncated cone shaped hole, the included angle of the truncated cone-shaped pits axisymmetric two side edges of the extension line is 60 °. 所述凹坑5还包括圆柱形坑,所述圆柱形坑的柱高为0.01mm,所述圆柱形坑位于圆台形坑的正上方,所述圆柱形坑的直径和圆台形坑的上表面直径相等,所述圆台形坑和圆柱形坑一体成型。 The dimples 5 further comprising a cylindrical hole, the cylindrical pit column height is 0.01mm, a cylindrical hole is directly above the truncated cone hole, the upper surface of the cylindrical pit diameter and truncated cone pit equal to the diameter of the cylindrical truncated cone-shaped pits and pit integrally formed. 该优选实施例解决了灌封传统SMD LED碗杯支架的胶量消耗较多、具有该传统SMDLED碗杯支架的LED芯片的出光角度较小、侧表面的光线反射率较低和灌封传统SMD LED平板支架容易出现胶面偏移的技术问题;达到了灌封该SMD LED平板支架结构的胶量消耗小,灌封时不易出现胶面偏移现象的技术效果,使具有该支架结构的LED芯片的出光角度达到160°,光亮度相对于侧面为PPA材质的碗杯结构提升6%,且光形饱满、点胶形状一致、色区集中度高。 This preferred embodiment solves the angle of the light volume of the plastic potting conventional SMD LED holder consume more cups, cups with the conventional stent SMDLED LED chip is small, the lower side surface of the light reflectance and potting conventional SMD problem LED flat plastic surface deviation prone stent; reached SMD LED encapsulating the glue consumption is small plates of the support structure, the technical effect of plastic surface deviation phenomenon is less likely to occur when the potting, the LED having the scaffold structure chip light angle reaches 160 °, the brightness with respect to the side surface of the bowl structure lifting 6% PPA material, shape and full light, dispensing uniform shape, color high concentration region.

[0056] 一种SMD LED平板支架结构和LED芯片,灌封该支架结构的胶量消耗小,灌封时不易出现胶面偏移现象,且使得具有该支架结构的LED芯片的出光亮度大,出光角度达到120-160°,散热效果好。 [0056] A SMD LED flat plate support structure and the LED chip, the amount of plastic potting support structure consumption, less prone to shift phenomenon potting adhesive surface when the light of high brightness and such that the support structure having an LED chip, light angle reaches 120-160 °, cooling effect.

[0057] 以上内容仅为本发明的较佳实施例,对于本领域的普通技术人员,依据本发明的思想,在具体实施方式及应用范围上均会有改变之处,本说明书内容不应理解为对本发明的限制。 [0057] The above is only preferred embodiments of the present invention, those of ordinary skill in the art, according to the ideas of the present invention, may make modifications at specific embodiments and application scope, the present specification shall not be as limiting the present invention.

Claims (10)

1.一种SMD LED平板支架结构,包括金属基板(3),其特征在于:在所述金属基板(3)固定LED晶片(I)的位置开设一凹坑(5),所述凹坑(5)的坑深为0.05-0.2mm、坑底面积为0.3-5.5mm2。 An SMD LED flat support structure, comprising a metal substrate (3), wherein: the metal substrate (3) fixing the position of the LED wafer (I) defines a concavity (5), said pits ( 5) deep pit 0.05-0.2mm, pit bottom area of ​​0.3-5.5mm2.
2.根据权利要求1所述的SMD LED平板支架结构,其特征在于,所述凹坑(5)包括圆台形坑,所述圆台形坑的轴对称的两条侧棱延长线的夹角为5-60°。 The SMD LED flat plate support structure according to claim 1, wherein said pits (5) comprises two lateral edges of the angle of the extended line of the truncated cone-shaped axisymmetric hole, the truncated cone-shaped pit is 5-60 °.
3.根据权利要求2所述的SMD LED平板支架结构,其特征在于,所述凹坑(5)还包括圆柱形坑,所述圆柱形坑的柱高为0.01-0.1mm,所述圆柱形坑位于圆台形坑的正上方,所述圆柱形坑的直径和圆台形坑的上表面直径相等,所述圆台形坑和圆柱形坑一体成型。 The SMD LED flat plate support structure according to claim 2, wherein said pits (5) further comprises a cylindrical hole, the cylindrical pit column height is 0.01-0.1 mm, the cylindrical pit truncated cone located directly above the pit, the pit is equal to the diameter of the cylindrical surface of the truncated cone and the diameter of the hole, the truncated cone-shaped pits and the pits formed integrally cylindrical.
4.根据权利要求1所述的SMD LED平板支架结构,其特征在于,所述凹坑(5)的侧壁覆盖Cu锻Ag层ο The SMD LED flat plate support structure according to claim 1, characterized in that said pit sidewall (5) covering the Ag layer ο forging Cu
5.根据权利要求1所述的SMD LED平板支架结构,其特征在于,所述凹坑(5)为冲压成型或蚀刻成型。 5. SMD LED flat plate support structure according to claim 1, wherein said pits (5) is a stamping or etching forming.
6.一种LED芯片,其特征在于,包括LED晶片(I)和如权利要求1_5任意一项所述的SMD LED平板支架结构,所述LED晶片⑴固定于凹坑(5)底面。 An LED chip, wherein the chip includes an LED (I) and the support structure as SMD LED flat 1_5 according to any one of claims, the LED chip is fixed to the dimples ⑴ (5) bottom surface.
7.根据权利要求6所述的LED芯片,其特征在于,所述LED晶片(I)为45Mil的LED晶片(I),所述坑底面积为1.9-5.2mm2。 The LED chip according to claim 6, wherein said LED chip (I) is an LED wafer 45Mil (I), the bottom of the pit area is 1.9-5.2mm2.
8.根据权利要求6所述的LED芯片,其特征在于,所述LED晶片(I)为20Mil的LED晶片(I),所述坑底面积为0.3-1.1mm2。 LED chip according to claim 6, wherein said LED chip (I) is an LED wafer 20Mil (I), the bottom of the pit area is 0.3-1.1mm2.
9.根据权利要求6所述的LED芯片,其特征在于,所述LED晶片⑴与凹坑(5)底面之间设置银胶层。 LED chip according to claim 6, wherein said LED chip ⑴ pit (5) disposed between the bottom surface of the silver paste.
10.根据权利要求6所述的LED芯片,其特征在于,所述凹坑(5)的正上方设置与凹坑(5)形状配合的灌封胶(6)。 10. The LED chip according to claim 6, wherein the potting pits (5) is disposed immediately above the pit (5) form-fitting (6).
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