CN206849859U

CN206849859U - A kind of LED encapsulation structure

Info

Publication number: CN206849859U
Application number: CN201720364430.0U
Authority: CN
Inventors: 朱剑飞; 蔡杰; 裴小明
Original assignee: Shenzhen Refond Optoelectronics Co Ltd
Current assignee: Shenzhen Refond Optoelectronics Co Ltd
Priority date: 2017-04-07
Filing date: 2017-04-07
Publication date: 2018-01-05
Anticipated expiration: 2027-04-07

Abstract

The utility model belongs to LED lamp structure technical field, a kind of LED encapsulation structure is provided, including bracket component and the LED chip being connected electrically on the bracket component, the bracket component includes the reflector for supporting and electrically connecting the support base of the LED chip and be connected in the support base, the LED chip is in the cavity of the reflector, it is provided with the support base and in the region that the reflector encloses and is easy to reflective silver coating, also there is the powder layer for protecting the silver coating outside the silver coating through depositing technology precipitation, the powder layer covers the silver coating；So design can solve the problems, such as existing LED component because silver coating is destroyed and cause light decay.

Description

A kind of LED encapsulation structure

Technical field

The utility model belongs to LED lamp structure technical field, more particularly to a kind of LED encapsulation structure.

Background technology

At present, the functional areas of LED support bottom are substantially silver coating, due to harmful member such as element sulphur, halogen, oxygen element Element is easy to react through the silver coating of packing colloid and functional areas, causes silver coating reflectivity to decline, causes LED component There is the phenomenon of light decay.

Utility model content

The purpose of this utility model is to provide a kind of LED encapsulation structure, it is intended to solves existing LED component due to silver-plated The problem of layer is destroyed and causes light decay.

The utility model so solves：A kind of LED encapsulation structure, including bracket component and it is connected electrically in the support LED chip on component, the bracket component include supporting and electrically connecting the support base of the LED chip and are connected to described Reflector in support base, the LED chip in the support base and are located at described in the cavity of the reflector It is provided with the region that reflector encloses and is easy to reflective silver coating, is also had outside the silver coating through depositing technology precipitation for protecting The powder layer of the silver coating, the powder layer cover the silver coating.

Further, the powder layer is transparent or white.

Further, the powder layer is made up of the granular structure of insulating materials.

Further, the particle diameter of the granular structure is 10 nanometers -300 microns.

Further, the thickness of the powder layer is 1 micron -500 microns.

Further, it is also associated with packing colloid in the cavity of the reflector.

Further, the powder layer is between the packing colloid and the silver coating.

Further, the upper surface of the support base is provided with the crystal bonding area for being easy to electrically connect with the LED chip, institute LED chip is stated to be connected between the crystal bonding area and the powder layer.

Further, the support base is provided with fluting, and the positive pole and negative pole of the LED chip are opened positioned at described respectively The both sides of groove, and the positive pole and the negative pole are electrically connected by bonding line.

Further, the support base is provided with fluting, and the fluting is positioned at the lower section of the LED chip, the LED The positive pole and negative pole of chip are connected to the both sides of the fluting.

The technique effect that LED encapsulation structure provided by the utility model has relative to existing technology is：By anti- Precipitation covering powder layer on the silver coating of cup is penetrated, and then can effectively prevent the elements such as element sulphur, halogen, oxygen element from penetrating into instead Penetrate in glass cavity and reacted with the silver coating of its bottom, so as to avoid silver coating from being destroyed, and then LED can be avoided There is the phenomenon of light decay in device.

Brief description of the drawings

, below will be to embodiment or prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model The required accompanying drawing used is briefly described in description, it should be apparent that, drawings in the following description are only that this practicality is new Some embodiments of type, for those of ordinary skill in the art, without having to pay creative labor, can be with Other accompanying drawings are obtained according to these accompanying drawings.

Fig. 1 be the utility model embodiment provide LED encapsulation structure structural representation, opening wherein in support base Groove is not immediately below the LED chip.

Fig. 2 be the utility model embodiment provide LED encapsulation structure structural representation, opening wherein in support base Groove is located at immediately below the LED chip.

Embodiment

In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining The utility model, it is not used to limit the utility model.

It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another On one element or it is connected on another element.When an element is known as " being connected to " another element, it can To be directly to another element or be indirectly connected on another element.

It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ", The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position System, it is for only for ease of and describes the utility model and simplified description, rather than the device or element of instruction or hint meaning is necessary With specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.

In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or Implicitly include one or more this feature.In description of the present utility model, " multiple " are meant that two or two More than, unless otherwise specifically defined.

It refer to shown in accompanying drawing 1 and Fig. 2, in the utility model embodiment, there is provided a kind of LED encapsulation structure, including branch Frame component 10 and the LED chip 20 being connected electrically on the bracket component 10, the bracket component 10 include supporting and electrically connecting the LED The support base 101 of chip 20 and the reflector 102 being connected in the support base 101, the reflector 102 are in horn-like, and One end cross-sectional area being connected in the support base 101 is minimum, so can be designed so that lighting area is bigger, light extraction efficiency It is higher.The LED chip 20 is located in the cavity of the reflector 102, namely the LED chip 20 is located at the bottom institute of reflector 102 In the region surrounded, and the LED chip 20 is preferably arranged on the middle of the bottom area defined of reflector 102. It is provided with the support base 101 and in the region that the reflector 102 encloses and is easy to reflective silver coating 30, the silver coating 30 Setting can strengthen the reflector efficiency of reflector 102, and then make it that light extraction efficiency is higher.Also through precipitator outside the silver coating 30 Skill precipitation has the powder layer 40 for protecting the silver coating 30, and the powder layer 40 covers the silver coating 30.The mode precipitated herein Including centrifugation and gravitational settling, so design causes without complicated equipment in operating process, simple for process.

Above is the LED encapsulation structure of design, by precipitating covering powder layer 40 on the silver coating 30 of reflector 102, And then it is interior and silver-plated with its bottom effectively to prevent the elements such as element sulphur, halogen, oxygen element from penetrating into the cavity of reflector 102 Layer 30 reacts, and so as to avoid silver coating 30 destroyed, and then LED component can be avoided the phenomenon of light decay occur.

Specifically, in the utility model embodiment, the powder layer 40 is transparent or white.So design can ensure powder While the protection of 40 pairs of silver coating 30 of body layer, it can also be ensured that the light that the silver coating 30 is sent to LED chip 20 it is anti- Penetrate efficiency.

Specifically, in the utility model embodiment, the powder layer 40 is made up of the granular structure of insulating materials.The powder The insulation of layer 40 can avoid LED chip 20 that short circuit occurs, while can also form protection to the surface of the LED chip 20.

Specifically, in the utility model embodiment, the particle diameter of the granular structure is 10 nanometers -300 microns.Herein according to Different demands can select the granular structure of different-grain diameter to form powder layer 40, so as to complete the protection to silver coating 30.

Specifically, in the utility model embodiment, the thickness of the powder layer 40 is 1 micron -500 microns.The powder layer 40 on the surface of the silver coating 30, and the single layer structure that the powder layer 40 can be made up of granular structure, can also It is the sandwich construction of granular structure composition.

Specifically, refer to shown in accompanying drawing 1 and Fig. 2, in the utility model embodiment, in the cavity of the reflector 102 Packing colloid 50 is also associated with, fluorescent material can be provided with the packing colloid 50.The packing colloid 50 is provided for protection LED Chip 20 and silver coating 30, and the emergent light of LED chip 20 can be prevented when being mixed with fluorescent material in the packing colloid 50 Line produces dazzle.

Specifically, refer to shown in accompanying drawing 1 and Fig. 2, in the utility model embodiment, the powder layer 40 is located at the encapsulation Between colloid 50 and the silver coating 30.So design can effectively prevent element sulphur, halogen, oxygen element etc. from passing through packing colloid 50 And reacted with silver coating 30, and then the phenomenon for avoiding silver coating 30 destroyed and causing LED component light decay occur.

Specifically, it refer to shown in accompanying drawing, in the utility model embodiment, set on the upper surface of the support base 101 There is the crystal bonding area for being easy to electrically connect with the LED chip 20, the LED chip 20 is connected between the crystal bonding area and the powder layer 40. So design can ensure the electrical connection between LED chip 20 and support base 101, while powder layer 40 can also be to the LED The surface of chip 20 forms protection.

Specifically, refer to shown in accompanying drawing 1, in one embodiment of the present utility model, the support base 101 is provided with Fluting 1011, the fluting 1011 are not located at the lower section of the LED chip 20 preferably, so can be designed so that LED chip 20 exists Enhanced convenience during die bond.The positive pole and negative pole of the LED chip 20 respectively be located at the fluting 1011 both sides, and the positive pole and should Negative pole is electrically connected by bonding line.And in two parts that the support base 101 separates through the fluting 1011, area is bigger That part is electrically connects and then forms the positive pole of whole encapsulating structure with the positive pole of LED chip 20, the smaller part of area Electrically connected by bonding line with LED chip 20 so as to form the negative pole of whole encapsulating structure.

Specifically, it refer to shown in accompanying drawing 2, in another embodiment of the present utility model, set in the support base 101 There is fluting 1011, the fluting 1011 is located at the lower section of the LED chip 20, and the positive pole and negative pole of the LED chip 20 are connected to The both sides of the fluting 1011.So design causes the positive pole of whole encapsulating structure and negative pole respectively to account for the half of the support base 101, And the both positive and negative polarity of the LED chip 20 can be respectively welded at the both sides of the fluting 1011.

Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model Protection domain within.

Claims

A kind of 1. LED encapsulation structure, it is characterised in that：Including bracket component and the LED core being connected electrically on the bracket component Piece, the bracket component include supporting and electrically connecting the support base of the LED chip and are connected in the support base Reflector, the LED chip enclose in the cavity of the reflector in the support base and positioned at the reflector It is provided with region and is easy to reflective silver coating, is also had outside the silver coating through depositing technology precipitation for protecting the silver coating Powder layer, the powder layer cover the silver coating.
2. LED encapsulation structure as claimed in claim 1, it is characterised in that：The powder layer is transparent or white.
3. LED encapsulation structure as claimed in claim 1, it is characterised in that：The powder layer by insulating materials granular structure Composition.
4. LED encapsulation structure as claimed in claim 3, it is characterised in that：The particle diameter of the granular structure is 10 nanometer -300 Micron.
5. LED encapsulation structure as claimed in claim 1, it is characterised in that：The thickness of the powder layer is 1 micron -500 micro- Rice.
6. the LED encapsulation structure as described in claim any one of 1-5, it is characterised in that：Also connect in the cavity of the reflector It is connected to packing colloid.
7. LED encapsulation structure as claimed in claim 6, it is characterised in that：The powder layer is located at the packing colloid and institute State between silver coating.
8. LED encapsulation structure as claimed in claim 6, it is characterised in that：The upper surface of the support base, which is provided with, to be easy to The crystal bonding area electrically connected with the LED chip, the LED chip are connected between the crystal bonding area and the powder layer.
9. the LED encapsulation structure as described in claim any one of 1-5, it is characterised in that：The support base is provided with fluting, The positive pole and negative pole of the LED chip are located at the both sides of the fluting respectively, and the positive pole and the negative pole pass through bonding line Electrical connection.
10. the LED encapsulation structure as described in claim any one of 1-5, it is characterised in that：The support base is provided with and opened Groove, for the fluting positioned at the lower section of the LED chip, the positive pole and negative pole of the LED chip are connected to the fluting Both sides.