CN204991763U - LED device - Google Patents
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- CN204991763U CN204991763U CN201520596539.8U CN201520596539U CN204991763U CN 204991763 U CN204991763 U CN 204991763U CN 201520596539 U CN201520596539 U CN 201520596539U CN 204991763 U CN204991763 U CN 204991763U
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- led component
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- sulfuric horizon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model relates to a LED device, include: the LED support sets up LED chip on the LED support covers the encapsulation colloid of LED chip, its characterized in that, layer I is prevented vulcanizing by LED device upper surface and at least partial lateral overlap. In addition, also can the metal electrode of two the mutual insulation in LED device's bottom with the at least partial gap department that the reflective coating combines covers and prevents vulcanizing a layer II, perhaps except main metal electrode foreign, the metal electrode of two mutual insulation with gap department that the reflective coating combines and peripheral region also cover prevents vulcanizing a layer II. Set up the thin layer through the gap department in LED device upper surface and side and bottom, can not only protect the encapsulation colloid face, protected the gap between the different materials of LED device simultaneously, can effectively avoid sulphur molecular motion to device bottom silvered film, prevent the device vulcanization.
Description
Technical field
The utility model relates to LED field, particularly relates to a kind of encapsulating structure of LED component.
Background technology
At present, in order to improve the reflection efficiency of chip in LED encapsulation structure, frame bottom adopts silver plating process process.Chip is fixed on support, after fixing, uses gold thread to be connected to positive and negative the two poles of the earth of support.Then fluorescent material and packaging plastic mixing is adopted to be filled in support.Existing LED uses silica gel or silicone encapsulation to promote the life-span of LED product, solve the problems such as light decay, but because silica gel or silicones itself have the characteristic of moisture-inhibiting oxygen flow, sulfur molecule in air can penetrate into the silver coating of LED support through packing colloid, react with silver the silver sulfide becoming black.In addition, the gap place that the sulfur molecule in air also can be combined with reflective coating through the metal substrate of bottom device penetrates into the silver coating of LED support, reacts with silver the silver sulfide generating black, to such an extent as to the light emission rate of device reduces.
Summary of the invention
The purpose of this utility model is the deficiency of the encapsulating structure for current LED component, provides a kind of LED component preventing sulfuration, can significantly improve the air-tightness of LED component, and the performance of moistureproof anti-sulfuration is stronger, better reliability.
The utility model adopts following technical scheme to realize above-mentioned purpose:
A kind of LED component, comprising: LED support, be arranged on the LED chip on described LED support, cover the packing colloid of described LED chip, it is characterized in that, described LED component upper surface and at least part of side cover anti-sulfuric horizon I.
Preferably, comprise the metal electrode of two mutually insulateds bottom described LED component and surround the reflective coating of described metal electrode, at least part of gap place that the metal electrode of two mutually insulateds bottom described LED component is combined with described reflective coating covers anti-sulfuric horizon II.
Preferably, except main metal electric polar region, the metal electrode of two mutually insulateds bottom described LED component also covers anti-sulfuric horizon II with the peripheral region at the gap place that described reflective coating is combined.
Preferably, described anti-sulfuric horizon I is the densification of one deck continuous print height, high waterproof and transparent thin layer.
Preferably, described anti-sulfuric horizon II is the thin layer of the densification of one deck continuous print height, high waterproof.
Preferably, the reflective coating that described LED support comprises substrate and arranges on the substrate, described substrate comprises the metal electrode of two mutually insulateds, the metal electrode of described two mutually insulateds is respectively the first electrical connection section and the second electrical connection section, described reflective coating is that integrative-structure comprises the reflector being arranged at described thereon, wrap up the coating layer of described substrate surrounding, be positioned at the insulating barrier in the middle of described first electrical connection section and described second electrical connection section, and fill the filling member of described through hole.
Preferably, described first electrical connection section is integrative-structure, it comprises the first welding disk, to be connected with described first welding disk and in the first side electrode portion of integrative-structure, at least part of upper surface that described first electrical connection section is provided with through hole and described first welding disk is provided with one deck silver mirror layer; Described second electrical connection section is integrative-structure, comprises the second welding disk, is connected and in the second side electrode portion of integrative-structure with described second welding disk, and at least part of upper surface of described second welding disk is provided with one deck silver mirror layer.
Preferably, described anti-sulfuric horizon I covers described LED component upper surface and extends, until the upper surface of two sides electrode section is completely covered respectively to the first side electrode portion and the second side electrode portion.
Preferably, anti-sulfuric horizon II comprises three anti-sulfuric horizons of continuous print altogether, that the gap place that described first electrical connection section and described coating layer and described insulating barrier are formed jointly is coated with the anti-sulfuric horizon of one deck respectively, the gap place that described second electrical connection section is formed jointly with described coating layer and described insulating barrier is respectively coated with the anti-sulfuric horizon of one deck, and the gap place that described first electrical connection section and described filling member are formed is coated with the anti-sulfuric horizon of one deck.
Preferably, anti-sulfuric horizon II comprises two anti-sulfuric horizons of continuous print altogether, be described coating layer respectively, the gap place of described insulating barrier and described coating layer and described insulating barrier and two metal electrodes is coated with the anti-sulfuric horizon of one deck, the gap place that described filling member and described first electrical connection section and described filling member are formed also is coated with the anti-sulfuric horizon of one deck.
The utility model has the following advantages:
1, a kind of LED component of providing of the utility model, cover anti-sulfuric horizon I by surface and side on the led device, the upper surface of LED component packing colloid layer, reflector and the gap place of side and packing colloid layer and reflector cover anti-sulfuric horizon; Like this can not only protection packaging colloid face, protect the gap between LED component unlike material simultaneously, sulfur molecule effectively can be avoided to move to silver coating bottom LED component by gap place, prevent LED component sulfuration; Meanwhile, the exposed or partial denudation of bottom land, side electrode are exposed, and LED component can well be tested and paster.
2, a kind of LED component that the utility model provides, in the bottom of LED component, at least part of gap place that the metal electrode of two mutually insulateds is combined with described reflective coating covers anti-sulfuric horizon II, or except main metal electric polar region, the metal electrode of two mutually insulateds also covers anti-sulfuric horizon II with the gap place that described reflective coating is combined and peripheral region thereof, element sulphur can be avoided to be reacted generation silver sulfide by the inside silver mirror layer arrived bottom reflector that the metal of bottom and the gap place of timbering material enter into support, improve LED product reliability.
Accompanying drawing explanation
The schematic cross-section of the LED component in Fig. 1 the utility model embodiment one;
The schematic cross-section of the LED support in Fig. 2 the utility model embodiment one;
The schematic top plan view that LED support in Fig. 3 the utility model embodiment one is corresponding;
The schematic cross-section of the LED component in Fig. 4 the utility model embodiment two;
The schematic top plan view that LED component in Fig. 5 the utility model embodiment two is corresponding;
The schematic cross-section of other execution mode of LED component in Fig. 6 the utility model embodiment two;
The schematic top plan view that other execution mode of LED component in Fig. 7 the utility model embodiment two is corresponding.
Embodiment
In order to make those skilled in the art understand the technical solution of the utility model better, below in conjunction with accompanying drawing and preferred embodiment, the utility model is described in further detail.
embodiment one
As shown in Figure 1, the utility model provides a kind of LED component 10, and its structure comprises: LED support 1, the LED chip 2 be arranged on described LED support, covers the envelope shape colloid 3 of described LED chip.Wherein, the upper surface of described LED component and at least part of side cover anti-sulfuric horizon I.
Described LED support can be PCB substrate, metal substrate or PLCC support etc., and what in the present embodiment, LED support adopted is metal substrate.
As shown in Figure 2 and Figure 3, described LED support 1 comprises substrate 11 and is arranged on the reflective coating 12 on described substrate 11, and the upper surface of described substrate 11 and the inwall of described reflective coating 12 form reflection cavity 13.
Wherein, described substrate 11 comprises the metal electrode of two mutually insulateds, the metal electrode of described two mutually insulateds is respectively the first electrical connection section 111 and the second electrical connection section 112, wherein, first electrical connection section 111 of described substrate is in integrative-structure, it comprises the first welding disk 1111, to be connected with described first welding disk and in the first side electrode portion 1112 of integrative-structure, described first electrical connection section is provided with through hole and at least part of upper surface of described first welding disk is provided with one deck silver mirror layer, in other embodiments, described first electrical connection section also can not be provided with through hole, described second electrical connection section 112 is in integrative-structure, and it comprises the second welding disk 1121, be connected and the second side electrode portion 1122 in integrative-structure, and at least part of upper surface of described second welding disk is provided with one deck silver mirror layer with described second welding disk.Described the first side electrode portion 1112 and the second side electrode portion 1122 are the outstanding side electrode of the first electrical connection section of described substrate and the second electrical connection section respectively, and LED component can be made well to test and paster.
Described reflective coating 12 comprises the reflector 121 being arranged at thereon, the coating layer 122 of parcel substrate surrounding, be positioned at the insulating barrier 123 in the middle of the first electrical connection section 111 and the second electrical connection section 112, and fill the filling member 124 of described through hole, wherein, the reflector 121 included by described reflective coating 12, coating layer 122, insulating barrier 123, filling member 124 are in integrative-structure.
As shown in Figure 1, described chip 2 can be flip-chip, one pole chip or bipolar slice, adopts bipolar slice in the present embodiment, and described chip 2 is arranged on the first electrical connection section 111.Described LED chip 2 realizes the electric connection of LED chip 2 electrode and the second electrical connection section 112 by wire, and the electric connection between LED chip electrode and the first electrical connection section adopts the conventional electric connection mode in this area, as wire etc.
As shown in Figure 1, described packing colloid 3 can be epoxy resin, silica gel or silicones etc., can be mixed with one or more in scattering particles, red fluorescence powder, yellow fluorescent powder, green emitting phosphor in packing colloid.Preferably be mixed with the organic silica gel of yellow fluorescent powder in the present embodiment, be not limited to the present embodiment.
Described anti-sulfuric horizon I is the densification of continuous print height, high waterproof and transparent thin layer, fluoride, silicide etc. in this way, because high fine and close thin layer has interception to element sulphur, the element sulphur in such external world can not penetrate into fluorescent glue, thus intercepted the contact of S element and LED component, effectively prevent the silver of the silver mirror layer of element sulphur and substrate pads portion upper surface from reacting, generate silver sulfide, thus improve LED product reliability, in addition, transparent sulfuric horizon light transmission is good, therefore also can not have influence on the light-out effect of LED component.
Described anti-sulfuric horizon I can be covered in upper surface and the side of LED component by spraying or impregnating method, in the present embodiment, described anti-sulfuric horizon I is the upper surface and the side that are covered in LED component by the method for spraying.Described anti-sulfuric horizon I covers all gaps of described LED component upper surface and side, and this anti-sulfuric horizon I is one deck continuous print thin layer.In the present embodiment, described anti-sulfuric horizon I covers the upper surface of LED component completely and extends respectively to the first side electrode portion and the second side electrode portion, until the upper surface of two sides electrode section is completely covered, anti-like this sulfuric horizon I can cover the junction of the fluorescent adhesive layer of LED component, the upper surface of reflective coating and side, the bonding part of fluorescent glue and reflective coating, reflector and metal electrode electrode section completely.Because anti-sulfuric horizon I is that one deck continuous print thin layer does not have gap; and cover LED component most surfaces; so both protection packaging colloid faces; protect again the gap between LED component unlike material simultaneously; effectively prevent element sulphur and the frame bottom coat of metal from reacting; generate silver sulfide, thus improve LED product reliability.
embodiment two
Compared with the LED device structure in embodiment one, the LED component encapsulating structure difference that the LED device structure provided in the present embodiment and embodiment one provide is, in embodiment one, the upper surface of described LED component and at least part of side cover anti-sulfuric horizon I, and in the present embodiment, as shown in Fig. 4 to 7, except covering except anti-sulfuric horizon I at the upper surface of described LED component and at least part of side, at least part of gap place that the metal electrode of two mutually insulateds also bottom described LED component is combined with described reflective coating covers anti-sulfuric horizon II.
In the present embodiment, the supporting structure adopted is identical with embodiment one, as shown in Fig. 4 to 7, described LED support is metal substrate, it comprises the metal electrode of two mutually insulateds and surrounds the reflective coating of described metal electrode, and the metal electrode of described two mutually insulateds is respectively the first electrical connection section and the second electrical connection section.Described reflective coating 12 comprises the reflector 121 being arranged at thereon, the coating layer 122 of parcel substrate surrounding, be positioned at the insulating barrier 123 in the middle of the first electrical connection section 111 and the second electrical connection section 112, and fill the filling member 124 of described through hole, wherein, the reflector 121 included by described reflective coating 12, integument 122, insulating barrier 123, filling member 124 are in integrative-structure.
Described anti-sulfuric horizon II can be covered in the bottom of LED component by spraying or additive method, in the present embodiment, described anti-sulfuric horizon II is covered in the bottom of device by the method for spraying.At least part of gap place that the metal electrode that described anti-sulfuric horizon II covers two mutually insulateds bottom LED component is combined with described reflective coating, there is a lot of execution modes in its region covered, in the present embodiment, as Fig. 4, shown in Fig. 5, in the bottom of LED component, each gap place that two metal electrodes are formed with reflective coating respectively is all coated with the anti-sulfuric horizon II of one deck, in the bottom of LED component, anti-sulfuric horizon II comprises three anti-sulfuric horizons of continuous print altogether: be that described first electrical connection section 111 is coated with the anti-sulfuric horizon of one deck continuous print with described coating layer 122 and the common gap place formed of described insulating barrier 123 respectively, the gap place that described second electrical connection section 112 and described coating layer 122 and described insulating barrier 123 are formed jointly is coated with the anti-sulfuric horizon of one deck continuous print, and the gap place that described first electrical connection section 111 and described filling member 124 are formed is coated with the anti-sulfuric horizon of one deck continuous print.
In other embodiments, except main metal electric polar region, the gap place that the metal electrode of two mutually insulateds not only bottom LED component is combined with reflective coating covers anti-sulfuric horizon II, the metal electrode of two mutually insulateds bottom described LED component can also also cover anti-sulfuric horizon II with the peripheral region at the gap place that described reflective coating is combined.As shown in Figure 6, Figure 7, in the bottom of LED component, anti-sulfuric horizon II comprises two anti-sulfuric horizons of continuous print: be that the gap place of described coating layer 122, described insulating barrier 123 and described coating layer 122 and described insulating barrier 123 and two metal electrodes is coated with the anti-sulfuric horizon of one deck continuous print respectively, and the gap place that described first filling member, described first electrical connection section 111 are formed with described filling member 124 is also coated with the anti-sulfuric horizon of one deck continuous print.
Due to the gap place that the metal substrate bottom described anti-sulfuric horizon II covering LED component is combined with reflective coating, element sulphur so just can be avoided to arrive the silver mirror layer bottom reflector by the inside that the metal of bottom and the gap place of reflective coating enter into support, and generation silver sulfide that reacts with it, LED product reliability can be improved.What needs further illustrated is, described anti-sulfuric horizon I is a kind of high densification, high waterproof and transparent one deck continuous print thin layer, because anti-sulfuric horizon I covers the exiting surface of LED component, require that the characteristic of anti-sulfuric horizon I must meet transparent and light transmission good, so just can not have influence on the light-out effect of LED component.And anti-sulfuric horizon II only covers the bottom surface of LED component, can not the exiting surface of covering device, its material can not affect the light-out effect of LED component, in case the material of sulfuric horizon II is without requiring transparent, the characteristic such as the densification of demand fulfillment height, high waterproof, Gu the material of described anti-sulfuric horizon I and anti-sulfuric horizon II can be the same or different, in the present embodiment, the anti-sulfuric horizon I of selection is identical material with anti-sulfuric horizon II.
A kind of LED component that the utility model provides, its beneficial effect is:
1, a kind of LED component of providing of the utility model, cover anti-sulfuric horizon I by surface and side on the led device, the upper surface of LED component packing colloid layer, reflector and the gap place of side and packing colloid layer and reflector cover anti-sulfuric horizon; Like this can not only protection packaging colloid face, protect the gap between LED component unlike material simultaneously, sulfur molecule effectively can be avoided to move to silver coating bottom LED component by gap place, prevent LED component sulfuration; Meanwhile, the exposed or partial denudation of bottom land, side electrode are exposed, and LED component can well be tested and paster.
2, a kind of LED component that the utility model provides, in the bottom of LED component, at least part of gap place that the metal electrode of two mutually insulateds is combined with described reflective coating covers anti-sulfuric horizon II, or except main metal electric polar region, the metal electrode of two mutually insulateds also covers anti-sulfuric horizon II with the gap place that described reflective coating is combined and peripheral region thereof, element sulphur can be avoided to be reacted generation silver sulfide by the inside silver mirror layer arrived bottom reflector that the metal of bottom and the gap place of timbering material enter into support, improve LED product reliability.
Be described in detail the utility model above, apply specific case and set forth principle of the present utility model and execution mode in literary composition, the explanation of above embodiment just understands method of the present utility model and core concept thereof for helping.Should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model principle, can also carry out some improvement and modification to the utility model, these improve and modify and also fall in the protection range of the utility model claim.
Claims (10)
1. a LED component, comprising: LED support, is arranged on the LED chip on described LED support, covers the packing colloid of described LED chip, it is characterized in that, described LED component upper surface and at least part of side cover anti-sulfuric horizon I.
2. a kind of LED component according to claim 1, it is characterized in that, comprise the metal electrode of two mutually insulateds bottom described LED component and surround the reflective coating of described metal electrode, at least part of gap place that the metal electrode of two mutually insulateds bottom described LED component is combined with described reflective coating covers anti-sulfuric horizon II.
3. a kind of LED component according to claim 2, it is characterized in that, except main metal electric polar region, the metal electrode of two mutually insulateds bottom described LED component also covers anti-sulfuric horizon II with the peripheral region at the gap place that described reflective coating is combined.
4. a kind of LED component according to claim 1, is characterized in that, described anti-sulfuric horizon I is the densification of one deck continuous print height, high waterproof and transparent thin layer.
5. a kind of LED component according to claim 2, is characterized in that, described anti-sulfuric horizon II is the thin layer of the densification of one deck continuous print height, high waterproof.
6. a kind of LED component according to claim 1 and 2, it is characterized in that, the reflective coating that described LED support comprises substrate and arranges on the substrate, described substrate comprises the metal electrode of two mutually insulateds, the metal electrode of described two mutually insulateds is respectively the first electrical connection section and the second electrical connection section, described reflective coating is that integrative-structure comprises the reflector being arranged at described thereon, wrap up the coating layer of described substrate surrounding, be positioned at the insulating barrier in the middle of described first electrical connection section and described second electrical connection section, and fill the filling member of described through hole.
7. a kind of LED component according to claim 6, it is characterized in that, described first electrical connection section is integrative-structure, it comprises the first welding disk, to be connected with described first welding disk and in the first side electrode portion of integrative-structure, at least part of upper surface that described first electrical connection section is provided with through hole and described first welding disk is provided with one deck silver mirror layer; Described second electrical connection section is integrative-structure, comprises the second welding disk, is connected and in the second side electrode portion of integrative-structure with described second welding disk, and at least part of upper surface of described second welding disk is provided with one deck silver mirror layer.
8. a kind of LED component according to claim 7, is characterized in that, described anti-sulfuric horizon I covers described LED component upper surface and extends, until the upper surface of two sides electrode section is completely covered respectively to the first side electrode portion and the second side electrode portion.
9. a kind of LED component according to claim 6, it is characterized in that, anti-sulfuric horizon II comprises three anti-sulfuric horizons of continuous print altogether, that the gap place that described first electrical connection section and described coating layer and described insulating barrier are formed jointly is coated with the anti-sulfuric horizon of one deck respectively, the gap place that described second electrical connection section is formed jointly with described coating layer and described insulating barrier is respectively coated with the anti-sulfuric horizon of one deck, and the gap place that described first electrical connection section and described filling member are formed is coated with the anti-sulfuric horizon of one deck.
10. a kind of LED component according to claim 6, it is characterized in that, anti-sulfuric horizon II comprises two anti-sulfuric horizons of continuous print altogether, be described coating layer respectively, the gap place of described insulating barrier and described coating layer and described insulating barrier and two metal electrodes is coated with the anti-sulfuric horizon of one deck, the gap place that described filling member, described first electrical connection section and described filling member are formed also is coated with the anti-sulfuric horizon of one deck.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520596539.8U CN204991763U (en) | 2015-08-10 | 2015-08-10 | LED device |
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| CN201520596539.8U CN204991763U (en) | 2015-08-10 | 2015-08-10 | LED device |
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| CN204991763U true CN204991763U (en) | 2016-01-20 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107134521A (en) * | 2016-02-26 | 2017-09-05 | 光宝光电(常州)有限公司 | Opto-semiconductor device |
| CN107482100A (en) * | 2017-07-31 | 2017-12-15 | 信利半导体有限公司 | A kind of TOP LED supports with great heat radiation effect |
| CN107507905A (en) * | 2017-07-21 | 2017-12-22 | 广州慧谷化学有限公司 | A kind of LED component |
| CN110190157A (en) * | 2018-12-11 | 2019-08-30 | 深圳市长方集团股份有限公司 | A kind of anti-vulcanization packaging technology of LED with sulfuration resistant liquid |
| CN110190166A (en) * | 2018-12-11 | 2019-08-30 | 深圳市长方集团股份有限公司 | A kind of anti-vulcanization packaging technology of LED with release agent |
| CN110190165A (en) * | 2018-12-11 | 2019-08-30 | 深圳市长方集团股份有限公司 | A kind of anti-vulcanization packaging technology of LED with sulfuration resistant liquid and release agent |
| CN110277478A (en) * | 2019-06-28 | 2019-09-24 | 旭宇光电（深圳）股份有限公司 | LED device and light emitting device |
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2015
- 2015-08-10 CN CN201520596539.8U patent/CN204991763U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107134521A (en) * | 2016-02-26 | 2017-09-05 | 光宝光电(常州)有限公司 | Opto-semiconductor device |
| CN107507905A (en) * | 2017-07-21 | 2017-12-22 | 广州慧谷化学有限公司 | A kind of LED component |
| CN107482100A (en) * | 2017-07-31 | 2017-12-15 | 信利半导体有限公司 | A kind of TOP LED supports with great heat radiation effect |
| CN110190157A (en) * | 2018-12-11 | 2019-08-30 | 深圳市长方集团股份有限公司 | A kind of anti-vulcanization packaging technology of LED with sulfuration resistant liquid |
| CN110190166A (en) * | 2018-12-11 | 2019-08-30 | 深圳市长方集团股份有限公司 | A kind of anti-vulcanization packaging technology of LED with release agent |
| CN110190165A (en) * | 2018-12-11 | 2019-08-30 | 深圳市长方集团股份有限公司 | A kind of anti-vulcanization packaging technology of LED with sulfuration resistant liquid and release agent |
| CN110277478A (en) * | 2019-06-28 | 2019-09-24 | 旭宇光电（深圳）股份有限公司 | LED device and light emitting device |
| CN110277478B (en) * | 2019-06-28 | 2021-03-30 | 旭宇光电（深圳）股份有限公司 | Light emitting diode device and light emitting apparatus |
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