CN203351647U - Led packaging structure - Google Patents
Led packaging structure Download PDFInfo
- Publication number
- CN203351647U CN203351647U CN 201320297477 CN201320297477U CN203351647U CN 203351647 U CN203351647 U CN 203351647U CN 201320297477 CN201320297477 CN 201320297477 CN 201320297477 U CN201320297477 U CN 201320297477U CN 203351647 U CN203351647 U CN 203351647U
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- led
- substrate
- chip
- encapsulating structure
- conductive layer
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Abstract
Disclosed is an LED packaging structure which comprises at least one LED chip and a substrate. The structure is characterized in that the structure also comprises a plurality of segments of conducting layers which are disposed corresponding to the LED chips, that the conducting layers are disposed on the top surface of the substrate and mutually spaced to form insulating taps, that the conducting layers at two sides of each insulating layer are respectively provided with a chip electrode, and that two chip electrodes at two sides of each insulating layer are respectively in electrical connection with one LED chip. The LED packaging structure provided by the utility model is simple in structure.
Description
Technical field
The utility model relates to LED encapsulation technology field, particularly a kind of LED encapsulating structure.
Background technology
The method for packing of LED is many, and the common method for packing of current a kind of industry is: first LED chip is fixed on a substrate, then utilizes encapsulated layer that this LED chip is encapsulated on this substrate, form an integral body.The utility model that for example application number of application on January 18th, 2008 is 200810002321.X, disclosed a kind of LED packaging part.This LED packaging part comprises: package body, and it comprises the depressed part that forms mounting portion; The first lead frame and the second lead frame, be installed on package body and expose with the lower surface place at depressed part; LED chip, be installed on the lower surface of depressed part to be electrically connected to the first lead frame and the second lead frame; And sealer, form and be formed on depressed part inside with the sealing LED chip by mixed transparent resin and fluorescer.
Yet, realize being electrically connected to structure and manufacturing process's more complicated to this first lead frame and the second lead frame because this LED chip need to adopt wire bonds.
The utility model content
In view of this, be necessary to provide a kind of LED encapsulating structure simple in structure.
A kind of LED encapsulating structure, comprise at least one LED chip and substrate, it is characterized in that, also comprise the multistage conductive layer that corresponding described LED chip arranges, end face and space that described conductive layer is arranged on this substrate form insulating tape, be respectively equipped with a chip electrode on the conductive layer of each insulating tape both sides, two chip electrodes of each insulating tape both sides are electrically connected to a LED chip respectively.
Compared with prior art, this LED encapsulating structure utilizes coated with conductive layer on substrate, and make between conductive layer to form insulating tape, make the LED chip electrode can be directly installed on the both sides of insulating tape, therefore electrode does not need to realize by welded wire with being electrically connected to of described LED chip, and the series connection of a plurality of LED chip does not need to be welded to connect line yet.Owing to not welding any connecting line on LED chip, make the stability that encapsulating structure and processing step are simplified, LED is electrically connected to be strengthened.Therefore this LED encapsulating structure has advantages of simple in structure.
The accompanying drawing explanation
Fig. 1 is fixed on the schematic diagram on substrate by conductive layer and electrode in the LED method for packing of the utility model the first embodiment.
Fig. 2 is the cutaway view along A-A line in Fig. 1.
Fig. 3 is the schematic diagram after the method for packing of LED shown in Fig. 1 forms insulating tape.
Fig. 4 is the schematic diagram after the method for packing of LED shown in Fig. 3 is installed LED chip.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the utility model is described in further detail.
Fig. 1 to Fig. 4 is the schematic diagram of the utility model LED encapsulating structure and method for packing.Fig. 4 is the front view of this LED encapsulating structure 100 after having encapsulated.This LED encapsulating structure 100 comprises two LED chips 40, substrate 12, four chip electrodes 20, two external electrodes 30, two insulating tapes 162, a conductive layer 14.Encapsulated layer (not shown) encapsulation of the packed layer of described LED chip 40 and substrate 12 is fixing.
Please refer to Fig. 2, this substrate 12 is made by transparent or semitransparent material, for example transparent ceramic.These substrate 12 tops are coated with conductive layer 14, and this conductive layer 14 is made by transparent tin indium oxide (ITO) material.The luminous energy that these LED chips 40 send is outwards launched through this conductive layer 14 and this substrate 12.
Please refer to Fig. 3 and Fig. 4, on this conductive layer 14, interval forms two insulating tapes 162, be respectively equipped with a chip electrode 20 on the both sides of each insulating tape 162 conductive layer 14, the chip electrode 20 of each insulating tape 162 both sides is electrically connected to a LED chip 40 respectively, thereby makes these conductive layers 14 and this two LED chip 40 form series circuit.These two external electrodes 30 are separately positioned on the two ends of the circuit of conductive layer 14 and LED chip 40 series connection formation.
Please refer to Fig. 2, around described LED chip 40 and substrate 12, be coated with one deck encapsulated layer, this encapsulated layer, for transforming, mixing the monochromatic light that these LED chips 40 send, makes final LED encapsulating structure 100 send white light.This encapsulated layer is provided with fluorescent material, and this encapsulated layer coats the front and back of described LED chip 40 place substrates 12.Because this substrate 12 is transparent, so this encapsulated layer not only needs to cover the face at these two LED chips, 40 places on this substrate 12, but also needs cover side and the back side of this substrate 12.This encapsulated layer is for the protection of these LED chips 40, and provides certain structural strength for whole LED encapsulating structure 100.
During work, the light that these LED chip 40 energisings are sent upwards can outwards be launched by this encapsulated layer, can outwards launch by this conductive layer 14 and substrate 12 downwards.Due to reflection ray seldom, the wide part that these LED chips 40 send is directly penetrated outside this LED encapsulating structure 100, thereby improves light extraction efficiency.Because this LED chip electrode 20 is connected electrically on the conductive layer 14 of insulating tape 162 both sides, avoided the welding of metal wire, so have advantages of simple in structure.
In sum, this LED encapsulating structure utilizes coated with conductive layer on substrate, and make between conductive layer to form insulating tape, make the LED chip electrode can be directly installed on the both sides of insulating tape, therefore electrode does not need to realize by welded wire with being electrically connected to of described LED chip, and the series connection of a plurality of LED chip does not need to be welded to connect line yet.Owing to not welding any connecting line on LED chip, make the stability that encapsulating structure and processing step are simplified, LED is electrically connected to be strengthened.Therefore this LED encapsulating structure has advantages of simple in structure.Because this conductive layer 14 is transparent material with this substrate 12, so, have advantages of that light extraction efficiency is higher.。
Understandable, the number of LED chip 40 can be for two or more.If LED chip itself can emit white light, this encapsulated layer can not arrange.
Please refer to Fig. 1 to Fig. 4, the utility model also provides a kind of method for packing that can realize this encapsulating structure 100:
At first, please refer to Fig. 1 and Fig. 2, apply whole layer conductive layer 14 on substrate 12, and two external electrodes 30 and four chip electrodes 20 are set at the two ends of this conductive layer.
Please refer to Fig. 3, etch two to spacer insulator band 162 on conductive layer 14, these two insulating tapes 162 are formed between two chip electrodes.
Then, please refer to Fig. 4, LED chip 40 is installed on adjacent chip electrode 20, LED chip 40 is electrically connected to chip electrode 20.
Finally, around described LED chip 40 and substrate 12, encapsulated layer is set.
Through above-mentioned encapsulation step, both can obtain the LED encapsulating structure 100 of the utility model the first embodiment.
Claims (6)
1. a LED encapsulating structure, comprise at least one LED chip and substrate, it is characterized in that, also comprise the multistage conductive layer that corresponding described LED chip arranges, end face and space that described conductive layer is arranged on this substrate form insulating tape, be respectively equipped with a chip electrode on the conductive layer of each insulating tape both sides, two chip electrodes of each insulating tape both sides are electrically connected to a LED chip respectively.
2. LED encapsulating structure according to claim 1 is characterized in that: also comprise two external electrodes, these two each external electrodes are separately positioned on the two ends of the circuit that described conductive layer and LED chip series connection form.
3. LED encapsulating structure according to claim 1, it is characterized in that: described substrate is made by transparent or semitransparent material.
4. LED encapsulating structure according to claim 3, it is characterized in that: described substrate is made by transparent ceramic.
5. LED encapsulating structure according to claim 3, it is characterized in that: described conductive layer is made by transparent tin indium oxide material.
6. according to the described LED encapsulating structure of any one in claim 1 to 5, it is characterized in that: also comprise encapsulated layer, this encapsulated layer is provided with fluorescent material, and this encapsulated layer coats the front and back of described LED chip place substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320297477 CN203351647U (en) | 2013-05-27 | 2013-05-27 | Led packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320297477 CN203351647U (en) | 2013-05-27 | 2013-05-27 | Led packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203351647U true CN203351647U (en) | 2013-12-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320297477 Expired - Fee Related CN203351647U (en) | 2013-05-27 | 2013-05-27 | Led packaging structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN203351647U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103280510A (en) * | 2013-05-27 | 2013-09-04 | 立达信绿色照明股份有限公司 | LED (light-emitting diode) packaging structure and packaging method thereof |
| CN104916626A (en) * | 2015-04-20 | 2015-09-16 | 深圳市旭宇光电有限公司 | LED packaging method and LED packaging structure |
-
2013
- 2013-05-27 CN CN 201320297477 patent/CN203351647U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103280510A (en) * | 2013-05-27 | 2013-09-04 | 立达信绿色照明股份有限公司 | LED (light-emitting diode) packaging structure and packaging method thereof |
| CN104916626A (en) * | 2015-04-20 | 2015-09-16 | 深圳市旭宇光电有限公司 | LED packaging method and LED packaging structure |
| CN104916626B (en) * | 2015-04-20 | 2017-07-18 | 旭宇光电（深圳）股份有限公司 | LED encapsulation method and LED encapsulation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170125 Address after: Xingtai Industrial Park Economic Development Zone, Changtai County, Fujian city of Zhangzhou province 363999 Patentee after: ZHANGZHOU LIDAXIN PHOTOELECTRON TECHNOLOGY CO., LTD. Address before: 363999 Xingda Road, Fujian city of Zhangzhou province Changtai Xingtai County Development Zone Patentee before: Leedarson Green Lighting Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131218 Termination date: 20190527 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |