CN214411196U

CN214411196U - Drive and control Integrated Circuit (IC) and light-emitting diode (LED) integrated packaging lamp bead

Info

Publication number: CN214411196U
Application number: CN202120814790.2U
Authority: CN
Inventors: 黎杰; 罗亚科; 马明海; 李晓科; 马小其
Original assignee: Shenzhen Wenen Lighting Co ltd
Current assignee: Shenzhen Wenen Lighting Co ltd
Priority date: 2021-04-21
Filing date: 2021-04-21
Publication date: 2021-10-15
Anticipated expiration: 2031-04-21

Abstract

The utility model discloses a driving and controlling IC and LED integrated packaging lamp bead, which comprises a lead frame arranged at the bottom, a lead frame metal conductive layer arranged on the lead frame, the metal conducting layer of the lead frame is provided with an LED light-emitting chip and a drive and control IC which are connected with the metal conducting layer of the lead frame through a connecting colloid, the metal conductive layer of the lead frame is also provided with a plurality of conductive wires which are used for electrically connecting the LED luminous chip, the drive control IC and the metal conductive layer of the lead frame and electrically connecting the LED luminous chip and the drive control IC, the connecting conductive wires among the drive control IC, the LED luminous chip and the metal conductive layer of the lead frame are all connected by coating conductive adhesive, the utility model improves the packaging efficiency, meanwhile, the packaging cost is reduced, the productivity of wire bonding procedures is improved, and the packaging quality and the comprehensive quality of products are also improved.

Description

Drive and control Integrated Circuit (IC) and light-emitting diode (LED) integrated packaging lamp bead

Technical Field

The utility model relates to a LED integrated packaging technology field, in particular to drive accuse IC and LED integrated packaging lamp pearl.

Background

The existing driving and controlling IC is connected with the LED lamp beads through a wire, namely a wire bonding process is adopted, but the failure rate is high due to the fact that the number of wire bonding is large.

The LED lamp beads are easily pulled by stress in a high-temperature environment of reflow soldering, so that a lead frame and an electrode connecting wire are opened, and open points are concentrated at two welding points, so that the function of the lamp beads is failed; as the improvement of the process, a process of adding a solder ball in a second welding mode can be adopted, but the same welding point and continuous welding can damage the electroplated layer of the lead frame, so that new quality hidden danger is caused.

As a further improvement of the packaging process, a double-two-welding process is adopted, namely two welding spots are formed at the same connecting position needing to be welded; although the double-two-wire welding process can overcome the defects of the process, the double-two-wire welding process still has certain defects, namely the productivity of wire bonding is low and is reduced by about 40%, the wire bonding machine is one of devices with the highest investment cost in a semiconductor packaging link, and the yield of the devices is also greatly reduced due to the fact that the productivity is greatly reduced, and the packaging cost is also high.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome the above-mentioned defect among the prior art, provide a drive accuse IC and LED integrated packaging lamp pearl, promoted encapsulation efficiency, reduced the encapsulation cost simultaneously, improved the productivity of bonding wire process, still improved the encapsulation quality and the comprehensive quality of product.

In order to realize the above-mentioned purpose, the utility model provides a drive accuse IC and LED integrated package lamp pearl, including installing the lead frame in the bottom, install the lead frame metallic conduction layer on the lead frame, lead frame metallic conduction layer facial make-up is equipped with the luminous wafer of LED and drives accuse IC, the luminous wafer of LED is connected through being connected the colloid with driving between accuse IC and the lead frame metallic conduction layer, still installed a plurality of conductor wires on the lead frame metallic conduction layer, a plurality of conductor wires are used for being connected the luminous wafer of LED, drive accuse IC and lead frame metallic conduction layer electricity and be connected the luminous wafer of LED and drive accuse IC electricity, drive the connection conductor wire between accuse IC, the luminous wafer of LED and the lead frame metallic conduction layer and all connect through scribbling some conductive adhesive.

Preferably, the LED light emitting chip includes a G chip, an R chip, and a B chip.

Preferably, the driving and controlling IC is provided with a VCC interface, a DIN interface, a GND interface, a DOUT interface, a B wafer interface, an R wafer interface and a G wafer interface.

Preferably, the conductive wires include a first conductive wire for connecting the lead frame metal conductive layer with the VCC interface of the drive and control IC, a second conductive wire for connecting the lead frame metal conductive layer with the DIN interface of the drive and control IC, a third conductive wire for connecting the lead frame metal conductive layer with the GND interface of the drive and control IC, a fourth conductive wire for connecting the lead frame metal conductive layer with the DOUT interface of the drive and control IC, a fifth conductive wire for connecting the B-wafer with the B-wafer interface of the drive and control IC, a sixth conductive wire for connecting the R-wafer with the R-wafer interface of the drive and control IC, a seventh conductive wire for connecting the G-wafer with the G-wafer interface of the drive and control IC, an eighth conductive wire for connecting the lead frame metal conductive layer with the G-wafer, and a ninth conductive wire for connecting the lead frame metal conductive layer with the B-wafer.

Preferably, a first conductive adhesive bonding point is arranged at one end of the first conductive wire connected with the lead frame metal conductive layer, a second conductive adhesive bonding point is arranged at one end of the second conductive wire connected with the lead frame metal conductive layer, a third conductive adhesive bonding point is arranged at one end of the third conductive wire connected with the lead frame metal conductive layer, a fourth conductive adhesive bonding point is arranged at one end of the fourth conductive wire connected with the lead frame metal conductive layer, a fifth conductive adhesive bonding point is arranged at one end of the eighth conductive wire connected with the lead frame metal conductive layer, and a sixth conductive adhesive bonding point is arranged at one end of the ninth conductive wire connected with the lead frame metal conductive layer.

Preferably, the lead frame is further provided with a protective colloid filled among the metal conductive layer of the lead frame, the LED light-emitting chip and the control IC.

Preferably, the connecting colloid is conductive adhesive or solid crystal adhesive.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the utility model discloses a conducting resin is fixed between with conductor wire and drive accuse IC, the luminous wafer of LED, the lead frame metallic conduction layer, the conducting resin has the fastness of electric conductivity and bonding, can make to drive between accuse IC, the luminous wafer of LED and the lead frame metallic conduction layer the electricity connect inseparabler and firm, can also avoid the local high temperature that the welding produced to cause the damage to conductor wire and lead frame metallic conduction layer, cause the encapsulation product unqualified, adopt the fixed mode of conducting resin, make bonding wire process productivity rise 40%, product encapsulation comprehensive efficiency promotes 30%, reduce the encapsulation cost by a wide margin, the encapsulation quality and the comprehensive quality of product have still been improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic front structural view of a driving and controlling IC and LED integrated packaging lamp bead provided by the present invention;

FIG. 2 is a sectional view of a driving control IC and LED integrated packaging lamp bead provided by the utility model;

fig. 3 is a driving and controlling IC schematic diagram of the driving and controlling IC and the LED integrated package lamp bead provided by the utility model.

The figure includes:

the LED light-emitting diode comprises a 1-lead frame, a 2-lead frame metal conducting layer, a 3-LED light-emitting chip, a 5-drive control IC, a 9-connecting colloid, a 4-conducting wire, a 7-conducting adhesive, a 41-first conducting wire, a 42-second conducting wire, a 43-third conducting wire, a 44-fourth conducting wire, a 45-fifth conducting wire, a 46-sixth conducting wire, a 47-seventh conducting wire, a 48-eighth conducting wire, a 49-ninth conducting wire, a 71-first conducting adhesive bonding point, a 72-second conducting adhesive bonding point, a 73-third conducting adhesive bonding point, a 74-fourth conducting adhesive bonding point, a 75-fifth conducting adhesive bonding point, a 76-sixth conducting adhesive bonding point and a 6-protective colloid.

Detailed Description

The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present embodiment, and it is obvious that the described embodiment is an embodiment of the present invention, not all embodiments. Based on this embodiment in the present invention, all other embodiments obtained by the ordinary skilled person in the art without creative work all belong to the protection scope of the present invention.

Please refer to fig. 1 to fig. 3, the utility model provides a drive and control IC and LED integrated package lamp pearl, including installing lead frame 1 in the bottom, install lead frame metal conducting layer 2 on lead frame 1, lead frame metal conducting layer 2 facial make-up is equipped with the luminous wafer 3 of LED and drives and control IC5, the luminous wafer 3 of LED and drive and control IC5 and be connected through being connected colloid 9 between lead frame metal conducting layer 2, it is concrete, it is conductive adhesive or solid crystal glue to connect colloid 9, and lead frame metal conducting layer 2 is last to bond luminous wafer 3 of LED and drive and control IC5 on lead frame 1 and toast fixedly through high temperature according to predetermined position through conductive adhesive or solid crystal glue.

As shown in fig. 1 and 2, the lead frame metal conductive layer 2 is further provided with a plurality of conductive wires 4, the conductive wires 4 are used for electrically connecting the LED light emitting chip 3, the driving and controlling IC5 with the lead frame metal conductive layer 2 and electrically connecting the LED light emitting chip 3 with the driving and controlling IC5, the conductive wires 4 are connected with the driving and controlling IC5, the LED light emitting chip 3 and the lead frame metal conductive layer 2 through conductive adhesives 7, in this embodiment, the conductive adhesives 7 are bonded between the conductive wires 4 and the driving and controlling IC5, the LED light emitting chip 3 and the lead frame metal conductive layer 2 by means of dispensing, and then the conductive adhesives 7 are bonded and fixed by high-temperature baking, so that the damage to the conductive wires 4 and the lead frame metal conductive layer 2 caused by local high temperature generated by welding can be avoided, the packaged product is not qualified, the fixing manner of the conductive adhesives is adopted, the productivity of the wire bonding process is increased by 40%, the comprehensive packaging efficiency of the product is improved by 30%, the packaging cost is greatly reduced, and the packaging quality and the comprehensive quality of the product are also improved.

As shown in fig. 1, the LED light emitting chip 3 used in this embodiment includes a G chip, an R chip, and a B chip, and in other embodiments, the LED light emitting chip 3 is not limited to the three RGB colors used in this embodiment, and may be any single color or a combination of two or more colors, or may be any other three colors or four colors.

As shown in fig. 3, the driving and controlling IC5 used in the present embodiment has a VCC interface, a DIN interface, a GND interface, a DOUT interface, a B chip interface, an R chip interface, and a G chip interface; in other embodiments, the driving IC5 is not limited to the embodiments shown, and can be applied to other driving ICs with different functions and appearances.

As shown in fig. 1, the conductive line 4 in this embodiment includes a first conductive line 41 for connecting the lead frame metal conductive layer 2 to the VCC interface of the driving IC5, a second conductive line 42 for connecting the leadframe metal conductive layer 2 to the DIN interface of the driver IC5, a third conductive line 43 for connecting the lead frame metal conductive layer 2 to the GND interface of the driving IC5, a fourth conductive line 44 for connecting the leadframe metal conductive layer 2 to the DOUT interface of the driver IC5, a fifth conductive line 45 for connecting the B-wafer with the B-wafer interface of the drive and control IC5, a sixth conductive line 46 for the R-wafer interface with the R-wafer of the drive and control IC5, a seventh conductive line 47 for connecting the G-die to the G-die interface of the driver IC5, an eighth conductive line 48 for connecting the lead frame metal conductive layer 2 to the G-die, and a ninth conductive line 49 for connecting the lead frame metal conductive layer 2 to the B-die.

As shown in fig. 1, a first conductive adhesive bonding point 71 is disposed at one end of the first conductive wire 41 connected to the leadframe metal conductive layer 2, a second conductive adhesive bonding point 72 is disposed at one end of the second conductive wire 42 connected to the leadframe metal conductive layer 2, a third conductive adhesive bonding point 73 is disposed at one end of the third conductive wire 43 connected to the leadframe metal conductive layer 2, a fourth conductive adhesive bonding point 74 is disposed at one end of the fourth conductive wire 44 connected to the leadframe metal conductive layer 2, a fifth conductive adhesive bonding point 75 is disposed at one end of the eighth conductive wire 48 connected to the leadframe metal conductive layer 2, and a sixth conductive adhesive bonding point 76 is disposed at one end of the ninth conductive wire 49 connected to the leadframe metal conductive layer 2.

Specifically, the first conductive wire 41 is fixedly connected to the leadframe metal conductive layer 2 through a first conductive adhesive bonding point 71 formed by dispensing, the second conductive wire 42 is fixedly connected to the leadframe metal conductive layer 2 through a second conductive adhesive bonding point 72 formed by dispensing, the third conductive wire 43 is fixedly connected to the leadframe metal conductive layer 2 through a third conductive adhesive bonding point 73 formed by dispensing, the fourth conductive wire 44 is fixedly connected to the leadframe metal conductive layer 2 through a fourth conductive adhesive bonding point 74 formed by dispensing, the fifth conductive wire 45 is fixedly connected to the leadframe metal conductive layer 2 through a fifth conductive adhesive bonding point 75 formed by dispensing, and the sixth conductive wire 46 is fixedly connected to the leadframe metal conductive layer 2 through a sixth conductive adhesive bonding point 76 formed by dispensing.

As shown in fig. 2, the lead frame 1 is further provided with a protective colloid 6 filled among the metal conductive layer 2 of the lead frame, the LED chip 3 and the driving IC5, after the conductive wires 4 are bonded, the protective colloid 6 is filled in the cup of the lead frame 1 to cover the conductive wires 4, the LED chip 3 and the driving IC5, and the protective layer is formed by baking and curing.

Further, the protective colloid 6 in this embodiment is not limited to a transparent glue, but is also applicable to other colored or opaque glues.

In other embodiments, the lead frame 1 is not limited to the four-pin lead frame in the present embodiment, but may be a six-pin, eight-pin, two-pin lead frame, and is not limited to a transparent or opaque lead frame, and other appearance structures of the lead frame 1 are also applicable.

In this embodiment, the port definition of the lead frame 1 only represents one of the driving and controlling IC5 and LED light emitting chip 3 integrated package lamp bead port definitions, and the lead frame has different pin positions according to different product design functions, the utility model is also suitable for driving and controlling IC and LED integrated package lamp beads with different pin positions; while the number and bonding positions of conductive lines 4 are also determined according to product function definitions, the number is reduced or increased or the positions are changed according to the product function definitions.

The specific process of the packaged lamp bead is as follows: firstly, fixing an LED light-emitting chip 3 and a drive control IC5 on a lead frame metal conducting layer 2 through a connecting colloid 9 by using a die bonder, baking and finishing the first die bonding operation; secondly, performing wire bonding operation on all the conductive wires 4; thirdly, carrying out glue dispensing operation on the conductive wire 4, wherein the glue is conductive glue, baking and finishing the second die bonding operation; and finally, filling the protective colloid 6 on the upper surface of the lead frame 1, and baking and curing to form a protective layer, thereby completing the packaging operation.

The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be equivalent replacement modes, and all are included in the scope of the present invention.

Claims

1. A driving and controlling IC and LED integrated packaging lamp bead is characterized by comprising a lead frame (1) arranged at the bottom, a lead frame metal conductive layer (2) arranged on the lead frame (1), the metal conducting layer (2) of the lead frame is provided with an LED light-emitting chip (3) and a drive control IC (5), the LED light-emitting chip (3) and the drive and control IC (5) are connected with the metal conducting layer (2) of the lead frame through a connecting colloid (9), the metal conducting layer (2) of the lead frame is also provided with a plurality of conducting wires (4), the conductive wires (4) are used for electrically connecting the LED light-emitting chip (3), the drive control IC (5) and the lead frame metal conductive layer (2) and electrically connecting the LED light-emitting chip (3) and the drive control IC (5), and the driving and controlling IC (5), the LED light-emitting chip (3) and the connecting conducting wire (4) among the metal conducting layers (2) of the lead frame are all connected through a point-coated conducting adhesive (7).

2. The drive and control IC and LED integrated packaging lamp bead as claimed in claim 1, wherein the LED light emitting chip (3) comprises a G chip, an R chip and a B chip.

3. The drive and control IC and LED integrated packaging lamp bead according to claim 2, wherein the drive and control IC (5) has a VCC interface, a DIN interface, a GND interface, a DOUT interface, a B wafer interface, an R wafer interface and a G wafer interface.

4. The drive and control IC and LED integrated package lamp bead according to claim 3, wherein the conductive wires (4) comprise a first conductive wire (41) for connecting the lead frame metal conductive layer (2) with the VCC interface of the drive and control IC (5), a second conductive wire (42) for connecting the lead frame metal conductive layer (2) with the DIN interface of the drive and control IC (5), a third conductive wire (43) for connecting the lead frame metal conductive layer (2) with the GND interface of the drive and control IC (5), a fourth conductive wire (44) for connecting the lead frame metal conductive layer (2) with the DOUT interface of the drive and control IC (5), a fifth conductive wire (45) for connecting the B wafer with the B wafer interface of the drive and control IC (5), a sixth conductive wire (46) for connecting the R wafer with the R wafer interface of the drive and control IC (5), a seventh conductive wire (47) for connecting the G wafer with the G wafer interface of the drive and control IC (5), an eighth conductive wire (48) for connecting the lead frame metal conductive layer (2) with the G wafer, and a ninth conductive wire (49) for connecting the lead frame metal conductive layer (2) with the B wafer.

5. The drive and control IC and LED integrated packaging lamp bead as claimed in claim 4, one end of the first conductive wire (41) connected with the metal conductive layer (2) of the lead frame is provided with a first conductive adhesive bonding point (71), one end of the second conductive wire (42) connected with the metal conductive layer (2) of the lead frame is provided with a second conductive adhesive bonding point (72), one end of the third conductive wire (43) connected with the metal conductive layer (2) of the lead frame is provided with a third conductive adhesive bonding point (73), one end of the fourth conductive wire (44) connected with the metal conductive layer (2) of the lead frame is provided with a fourth conductive adhesive bonding point (74), one end of the eighth conductive wire (48) connected with the metal conductive layer (2) of the lead frame is provided with a fifth conductive adhesive bonding point (75), and a sixth conductive adhesive bonding point (76) is arranged at one end of the ninth conductive wire (49) connected with the metal conductive layer (2) of the lead frame.

6. The drive and control Integrated Circuit (IC) and light-emitting diode (LED) packaging lamp bead as claimed in claim 1, wherein the lead frame (1) is further provided with a protective colloid (6) filled among the metal conductive layer (2) of the lead frame, the LED light-emitting chip (3) and the drive and control IC (5).

7. The drive and control IC and LED integrated packaging lamp bead as claimed in claim 1, wherein the connection colloid (9) is conductive adhesive or solid crystal adhesive.