CN203810336U - Easily-assembled COB (Chip On Board) lamp bead, lamp bead bracket and simply-assembled LED (Light Emitting Diode) module - Google Patents
Easily-assembled COB (Chip On Board) lamp bead, lamp bead bracket and simply-assembled LED (Light Emitting Diode) module Download PDFInfo
- Publication number
- CN203810336U CN203810336U CN201420146289.3U CN201420146289U CN203810336U CN 203810336 U CN203810336 U CN 203810336U CN 201420146289 U CN201420146289 U CN 201420146289U CN 203810336 U CN203810336 U CN 203810336U
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- CN
- China
- Prior art keywords
- power taking
- lamp pearl
- plate
- assembling
- hole clipping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The utility model relates to the technical field of LED (Light Emitting Diode) package, in particular to an easily-assembled COB (Chip On Board) lamp bead, a bracket for the lamp bead, a method for producing the lamp bead as well as a simply-assembled LED module adopting the lamp bead. According to the LED lamp bead provided by the utility model, a first metal welding layer is arranged on the bottom surface of the LED lamp bead, so that during assembly, the lamp bead is only welded in a heat radiator; due to the adoption of an electricity drawing jack formed by matching a positive plate with a negative plate, one end at which a conducting terminal is arranged, of a driving circuit board is only inserted into the jack during assembly. Therefore the whole assembly process is simple and easy and the assembly efficiency and the quality are effectively improved.
Description
Technical field
The invention relates to LED encapsulation technology field, particularly a kind of COB lamp pearl that is easy to assembling, for the support of this lamp pearl, make the method for this lamp pearl and adopt the simple LED module of assembling of this lamp pearl.
Background technology
LED encapsulation is the important step that LED lamp pearl produces, at present, high-power LED lamp pearl is general adopts SMD (SMD) to encapsulate, although this packaged type technology comparative maturity, but it need to be fixed on wafer and form independently device on lead frame, and then it is upper that the device of a plurality of separation is soldered to substrate (pcb board), has the shortcomings such as complex process, cost is high, thermal resistance is large, for this reason, on trend development plate, encapsulate (COB) technology in the industry.
The advantages such as on plate, encapsulation is about to LED crystal and is directly fixed to (pcb board) on substrate and goes up and encapsulate, and has production efficiency high, and thermal resistance is low, optical quality is good.At present, the electrically-conductive backing plate that on plate, the main substrate adopting of encapsulation is mainly made by conducting metals such as copper and the insulated substrate of being made by insulating materials such as potteries, for electrically-conductive backing plate, its structure is as shown in Fig. 1 (a), mainly that LED wafer B-5 is directly fixed on copper base B-1, then on copper base with PPA forming materials Lamp cup B-2(box dam) to fill packaging plastic B-3, on Lamp cup, copper sheet terminal B-4 is being set, LED wafer B-5 plying is connected with power taking with copper sheet terminal B-4, general, it is exposed that copper sheet terminal B-4 can extend to realize part laterally, thereby being convenient to copper sheet terminal B-4 is connected with drive circuit, for insulated substrate, its structure is as shown in Fig. 1 (b), it is mainly on ceramic substrate B-6, to plate one deck conductive layer B-7, then LED crystal B-5 is fixed on to the crystal bonding area on conductive layer B-7 and connects by bonding wire, after in crystal bonding area moulding Lamp cup B-2(box dam around) to fill packaging plastic B-3, wherein conductive layer B-7 partly extends to B-2 exposed so that be electrically connected with drive circuit outside Lamp cup.
Therefore, the LED lamp bead surface after encapsulation is the exposed conduction region that connects drive circuit that is useful on all, simultaneously for lamp pearl is mounted on radiator, on general substrate, also offers fixed hole position.As disclosed in publication file CN 102853299A, while assembling this type of lamp pearl, generally need first with retaining elements such as hold-down screws, to be fixed position, hole substrate is fixed on radiator, then on conduction region, weld conductive lead wire and the other end of conductive lead wire is soldered to drive circuit board.Significantly, there is following shortcoming in this structure:
Due to auxiliary retention portion parts such as needs screws, the more crisp substrate such as not only fixing operation trouble, and pottery is extremely easily damaged in fixation procedure, causes Product Assembly fraction defective higher;
Conductive lead wire welding trouble, has significantly reduced efficiency of assembling, and easily because the welding quality of pad passes a test, does not cause whole lamp off quality.
Therefore, current lamp pearl structure is difficult to assembling, thereby causes the problem that efficiency of assembling is low, assembly quality is poor to occur.
Summary of the invention
One of object of the invention is to avoid above-mentioned weak point of the prior art and provides a kind of and can fix with radiator easily, does not need to carry out wire bonds simultaneously, thereby simplifies assembling process, the LED lamp pearl of improving efficiency of assembling and quality.
Two of the object of the invention is to avoid above-mentioned weak point of the prior art and a kind of support for the production of above-mentioned lamp pearl is provided and adopts the LED module of above lamp pearl.
Three of the object of the invention is to avoid above-mentioned weak point of the prior art and manufacture method that a kind of above-mentioned LED lamp pearl is provided, and its step is simple, cost-saving, and production efficiency is high.
The object of the invention is achieved through the following technical solutions:
The support of the COB lamp pearl that is easy to assembling is provided, comprise substrate and be the power taking plate of substrate power supply, one plated surface of described substrate is provided with the first metal solder layer to form solder side, described power taking plate comprises conductive positive plate and negative plate, and described positive plate and negative plate mutually insulated also coordinate formation power taking hole clipping.
Preferably, this support forms by conductive sheet metal is die-cut.
The COB lamp pearl that is easy to assembling is provided, comprise support, the positive bonding LED wafer of described support, described support bottom surface is coated with the first metal solder layer, described support comprises substrate and is the power taking plate of LED wafer power supply, described power taking plate comprises conductive positive plate and negative plate, and described positive plate and negative plate mutually insulated also coordinate formation power taking hole clipping.
Preferably, described support front forms Lamp cup, described Lamp cup includes a glass chamber, described substrate is the exposed crystal bonding area that is formed for fixed L ED wafer in cup chamber, described positive plate and negative plate comprise service area, fixed area and power taking district respectively, described service area is exposed in described cup chamber, and described fixed area is embedded at the sidewall of Lamp cup, and described power taking district is exposed to Lamp cup outside and forms described power taking hole clipping.
Preferably, in described cup chamber, be provided with the first parting bead for isolated substrate and power taking plate.
Preferably, in described cup chamber, be provided with for isolating the second parting bead of positive plate and negative plate.
Preferably, described the first metal solder layer comprises and is covered in the nickel dam of support bottom surface and is covered in the silver layer on nickel dam.
Provide assembling simple LED module, comprise radiator, be fixed on the lamp pearl of radiator and be used to lamp pearl that the drive circuit board of charging current is provided, it is characterized in that: described lamp pearl is that above-mentioned any one is easy to the COB lamp pearl of assembling, on the joint face of described radiator and lamp pearl, be coated with the second metal solder layer, described the first metal solder layer and the second metal solder layer are welded and fixed, described drive circuit board one end is provided with power supply terminal, described conduction region length equals the degree of depth of power taking hole clipping, conduction region one end is connected with the drive circuit board plate body that size is greater than power taking hole clipping size, other end size for connection is greater than the fixed part of power taking hole clipping size.
Preferred described radiator offers inner chamber, described drive circuit board is arranged in described inner chamber, the solder side of described radiator and lamp pearl offers through hole, described drive circuit board is for conduction region and the described conduction hole clipping interference fit of power supply terminal are set, and described conduction region both wings size is greater than the degree of depth that described power taking hole clipping and conduction region length equal power taking hole clipping.
The beneficial effect of the invention: LED lamp pearl provided by the invention, because bottom surface has the first metal solder layer, while therefore assembling, only need lamp pearl to be directly welded in radiator, owing to having by positive plate and negative plate, coordinate the power taking hole clipping forming, while therefore assembling, only need one end drive circuit board to conducting terminal to insert power taking hole clipping, therefore whole assembling process is very simple and easy, has effectively improved efficiency of assembling and quality; LED lamp pearl support of the present invention, because its bottom surface has the first metal solder layer, and the power taking hole clipping of its positive plate and negative plate cooperation formation, therefore adopt the LED lamp pearl that this support is made to there is above-mentioned beneficial effect; LED module provided by the invention, owing to having adopted bottom surface to there is metal solder layer, on the joint face of radiator and lamp pearl, be coated with the second metal solder layer simultaneously, therefore while assembling, only need to adopt tin cream that radiator and lamp pearl are directly welded together all right, technique is simple, simultaneously, the assembling mode of the drive circuit board of this LED module and LED lamp pearl adopts enters the mode in the power taking hole clipping of LED lamp pearl by the power supply terminal clamping of LED drive plate, assembling is simple, and efficiency is high, steady quality.
Accompanying drawing explanation
Utilize accompanying drawing to be described further the invention, but the embodiment in accompanying drawing does not form any restriction to the invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to the following drawings other accompanying drawing.
Fig. 1 is the structural representation of background technology of the present invention;
Fig. 2 is the decomposing schematic representation of embodiments of the invention 1;
Fig. 3 is the structural representation of the lamp pearl of embodiments of the invention 1;
Fig. 4 be embodiments of the invention 1 manufacture process conductive plate schematic diagram;
Fig. 5 is the circuit drives plate structure schematic diagram of embodiments of the invention 2.
At Fig. 3 to Fig. 4, comprise:
1---radiator, 11---lamp pearl installation surface, 12---through hole, 2---drive circuit board, 21---conduction region, 211---positive terminal, 212---negative terminal, 22---fixed part, 3---lamp pearl, 31---substrate, 32---positive plate, 33---negative plate, 34---Lamp cup, 341---cup chamber, 342---the first parting bead, 343---the second parting bead, 35---packaging plastic, 36---power taking hole clipping, 37---power taking district, 38---service area, 4---conductive plate, 41---connection strap.
The specific embodiment
With the following Examples the invention is further described.
embodiment 1
The simple LED module of assembling as shown in Figure 3, comprise that the radiator 1(of column also can be the radiator 1 of other structures such as heronsbill), this radiator 1 one end is hatch frame, the other end, for for lamp pearl 3 installation surfaces 11 of lamp pearl 3 are set, is coated with nickel dam (not shown) in these lamp pearl 3 installation surfaces 11.Radiator 1 offers inner chamber, in inner chamber, be equipped with drive circuit board 2, one end of drive circuit board 2 is provided with power supply terminal to form conduction region 21, power supply terminal comprises positive terminal 211 and negative terminal 212, in the present embodiment, the size of the conduction region 21 of drive circuit board 2 is less than the size at other positions of circuit board, thereby makes drive circuit board 2 only have conduction region 21 can pass the through hole 12 in lamp pearl 3 installation surfaces 11 of radiator 1.Lamp pearl 3 in radiator 1 lamp pearl 3 installation surfaces 11 as shown in Figure 4, comprise support, Lamp cup 34 and packaging plastic 35, the bottom surface of support is electroplate with nickel dam, nickel dam upper surface plating has silver layer, nickel dam and silver layer are metal solder layer, in the time of need to lamp pearl 3 being fixed on radiator 1, only need to utilize the welding compounds such as tin cream can realize lamp pearl 3 and radiator 1 being welded and fixed between the two.
Concrete, as shown in Figure 3, described support comprises substrate 31 and by positive plate 32, the power taking plate that negative plate 33 forms, substrate 31, thereby positive plate 32 is fixedly connected with and makes substrate 31 with Lamp cup 34 respectively with negative plate 33, positive plate 32 and negative plate 33 three's relative positions are fixed, wherein, Lamp cup 34 includes glass chamber 341, substrate 31 is exposed formation crystal bonding area in cup chamber 341, on crystal bonding area, be provided with a plurality of LED crystal (not shown), between LED crystal (or between LED crystal and substrate 31, between LED crystal and power taking plate) by bonding wire, conduct electricity and be connected, particularly, LED is specifically fixed to the conventional method that can adopt this area on substrate 31, repeat no more herein, as shown in FIG., positive plate 32 and negative plate 33 are U-shaped structure, the part of its part in cup chamber 341 service area 38 that exposed formation is powered to LED crystal respectively, also there is respectively part to be embedded in Lamp cup 34 to realize positive plate 32 and negative plate 33 is fixed by Lamp cup 34, this part is the fixed area of positive plate 32 and negative plate 33, what is more important, positive plate 32 and negative plate 33 all have part be exposed to Lamp cup 34 outsides with form can be directly from the power taking district 37 of drive circuit board 2 power takings, the power taking district 37 of positive plate 32, the power taking district 37 of negative plate 33 coordinates formation power taking hole clipping 36.This power taking hole clipping 36 is for plugging the conduction region 21 of above-mentioned drive circuit board 2, conduction region 21 is set to and power taking hole clipping 36 interference fit, when conduction region 21 plugs in power taking hole clipping 36 time, the positive terminal 211 of drive circuit board 2 can be connected with positive plate 32, negative terminal 212 can be connected with negative plate 33, thereby makes to form conducting loop between power taking plate and drive circuit board 2.
As fully visible, above-mentioned LED module assembling is very simple and easy, only need on radiator 1, apply the solder resists such as tin cream, then LED lamp pearl 3 is soldered on radiator 1, then from the opening insertion of radiator 1 lower end, make its conduction region 21 through the through hole 12 of radiator 1 lamp pearl 3 installation surfaces 11 drive circuit board 2, until conduction region 21 plugs to power taking hole clipping 36, complete assembling.Installation step is simple, is beneficial to automation processing, can effectively improve efficiency of assembling and assembly quality.
It should be noted that:
(1) in the present embodiment, at the back side of support, adopt nickel coating while silver coating to be used as metal solder layer, this is mainly to provide corresponding defencive function because silver layer and nickel dam can be respectively lamp pearl 3, and according to actual needs, also can be at cradle back only nickel coating or silver coating only, as long as suitably increase thickness; Further, be no matter nickel dam on radiator 1 or nickel dam and the silver layer of cradle back, those skilled in the art it all can adopt other metal materials that are beneficial to welding to substitute, and it will not go into details herein.
(2) situation of " the power taking district 37 of positive plate 32, the power taking district of negative plate 33 37 coordinate formation power taking hole clipping 36 " described in literary composition comprises the power taking district 37 of positive plate 32,37 cooperations of the power taking district of negative plate 33 form the situation that the miscellaneous part of power taking hole clippings 36 and lamp pearl 3 forms power taking hole clipping 36, if the strength employing power taking district 37 of positive plate 32 own is, the power taking district 37 of negative plate 33 and Lamp cup 34 outer walls together form power taking hole clipping 36.
(3) support in the present embodiment is to adopt directly die-cut forming of copper product, certainly also can adopt as required other materials (as described in the background art) to carry out this support of moulding, as what adopt, be insulating materials, only need to make it have electric conductivity at its coating surface one deck conducting film.
(4) in the present embodiment, positive plate 32 and negative plate 33 all adopt U-shaped structure, but those skilled in the art also can adopt other shape and structures as required, as L-type shape, as long as can realize positive plate 32 and negative plate 33, can in cup chamber 341, select service area 38, in the outer formation power taking of Lamp cup 34 district, 37 also can coordinate formation power taking hole clipping 36.
In addition, as shown in Figure 3, the cup of Lamp cup 34 is provided with the first parting bead 342 of being isolated between substrate 31 and power taking plate in chamber 341, is isolated from the second parting bead 343 between positive plate 32 and negative plate 33.The first parting bead 342 and the second parting bead 343 can effectively improve between substrate 31 and power taking plate, the safety performance between positive plate 32 and negative plate 33, such as insulating properties between the creep age distance between substrate 31 and power taking plate, positive plate 32 and negative plate 33 etc.
Concrete, the installation method of above-mentioned lamp pearl 3 comprises the following steps:
Plate-making step: as shown in Figure 5, punch out support on conductive plate 4, described support comprises substrate 31, positive plate 32 and negative plate 33, substrate 31, positive plate 32 and negative plate 33 keep being connected by connection strap 41 and sheet material respectively;
Injection step: have an injection mo(u)lding Lamp cup 34 in stock sheet material die-cut;
Die bond step: fixed L ED wafer on the crystal bonding area of substrate 31, and make substrate 31 be connected with positive plate 32, negative plate 33 conductions respectively;
Filler step: fill packaging plastic 35 with moulding lamp pearl 3 in cup chamber 341;
Separating step: the connection strap 41 cutting off between substrate 31, positive plate 32 and negative plate 33 and sheet material makes lamp pearl 3 depart from sheet material.
embodiment 2
The another kind of embodiment that the simple LED module of assembling is provided, its main technical schemes is identical with embodiment 1, and unaccounted feature, adopts the explanation in embodiment 1 in the present embodiment, at this, no longer repeats.The difference of the present embodiment and embodiment 1 is: as shown in Figure 5, described conduction region 21 length equal the degree of depth of power taking hole clipping 36, conduction region 21 one end are the plate body that size is greater than the drive circuit board 2 of power taking hole clipping size, the other end is connected with the fixed part 22 that size is greater than power taking hole clipping 36 sizes, in the upper end of conduction region 21, be also provided with a fixed part 22, this fixed part 22 can be connected with conduction region 21 is separated, during assembling, drive circuit board 2 is plugged after putting in place fixed part 22 is being fixedly connected with conduction region 21, thereby make drive circuit board 2, more firmly combination between lamp pearl 3 and radiator 1 three.Certainly, this fixed part 22 can be also integrated with drive circuit board 2, now in order to realize assembling, can make that size is different in different directions with power taking hole clipping 36 by through hole 12, thereby make fixed part 22 realize clamping along rotating an angle to reduced size direction after the large-size direction of through hole 12 and power taking hole clipping 36 is inserted.
Finally should be noted that; above embodiment is only in order to illustrate the technical scheme of the invention; but not restriction to the invention protection domain; although the invention has been done to explain with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement the technical scheme of the invention, and not depart from essence and the scope of the invention technical scheme.
Claims (9)
1. be easy to the support of the COB lamp pearl of assembling, it is characterized in that: comprise substrate and be the power taking plate of substrate power supply, one plated surface of described substrate is provided with the first metal solder layer to form solder side, described power taking plate comprises conductive positive plate and negative plate, and described positive plate and negative plate mutually insulated also coordinate formation power taking hole clipping.
2. the support that is easy to the COB lamp pearl of assembling as claimed in claim 1, is characterized in that: this support forms by conductive sheet metal is die-cut.
3. be easy to the COB lamp pearl of assembling, comprise support, the positive bonding LED wafer of described support, it is characterized in that: described support bottom surface is coated with the first metal solder layer, described support comprises substrate and is the power taking plate of LED wafer power supply, described power taking plate comprises conductive positive plate and negative plate, and described positive plate and negative plate mutually insulated also coordinate formation power taking hole clipping.
As claimed in claim 3 be easy to assembling COB lamp pearl, it is characterized in that: described support front forms Lamp cup, described Lamp cup includes a glass chamber, described substrate is the exposed crystal bonding area that is formed for fixed L ED wafer in cup chamber, described positive plate and negative plate comprise service area, fixed area and power taking district respectively, described service area is exposed in described cup chamber, and described fixed area is embedded at the sidewall of described Lamp cup, and described power taking district is exposed to Lamp cup outside and forms described power taking hole clipping.
5. the COB lamp pearl that is easy to assembling as claimed in claim 4, is characterized in that: described cup is provided with the first parting bead for isolated substrate and power taking plate in chamber.
6. the COB lamp pearl that is easy to assembling as claimed in claim 4, is characterized in that: described cup is provided with for isolating the second parting bead of positive plate and negative plate in chamber.
7. the COB lamp pearl that is easy to assembling as claimed in claim 3, is characterized in that: described the first metal solder layer comprises and is covered in the nickel dam of support bottom surface and is covered in the silver layer on nickel dam.
8. assemble simple LED module, comprise radiator, be fixed on the lamp pearl of radiator and be used to lamp pearl that the drive circuit board of electric current is provided, it is characterized in that: described lamp pearl is any one COB lamp pearl that is easy to assembling in claim 3-7, on the joint face of described radiator and lamp pearl, be coated with the second metal solder layer, described the first metal solder layer and the second metal solder layer are welded and fixed, described drive circuit board one end is provided with power supply terminal, and described power supply terminal is connected in described power taking hole clipping to power to described power taking plate.
9. the simple LED module of assembling as claimed in claim 8, it is characterized in that: described radiator offers inner chamber, described drive circuit board is arranged in described inner chamber, the solder side of described radiator and lamp pearl offers through hole, described drive circuit board is for arranging conduction region and the described conduction hole clipping interference fit of power supply terminal, described conduction region length equals the degree of depth of power taking hole clipping, conduction region one end is connected with the drive circuit board plate body that size is greater than power taking hole clipping size, and other end size for connection is greater than the fixed part of power taking hole clipping size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420146289.3U CN203810336U (en) | 2014-03-28 | 2014-03-28 | Easily-assembled COB (Chip On Board) lamp bead, lamp bead bracket and simply-assembled LED (Light Emitting Diode) module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420146289.3U CN203810336U (en) | 2014-03-28 | 2014-03-28 | Easily-assembled COB (Chip On Board) lamp bead, lamp bead bracket and simply-assembled LED (Light Emitting Diode) module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203810336U true CN203810336U (en) | 2014-09-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420146289.3U Withdrawn - After Issue CN203810336U (en) | 2014-03-28 | 2014-03-28 | Easily-assembled COB (Chip On Board) lamp bead, lamp bead bracket and simply-assembled LED (Light Emitting Diode) module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203810336U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103883995A (en) * | 2014-03-28 | 2014-06-25 | 木林森股份有限公司 | COB lamp bead easy to assemble, support used for lamp bead, method for manufacturing lamp bead and easily-assembled LED module |
| CN112709937A (en) * | 2020-12-30 | 2021-04-27 | 深圳市新亿光光电有限公司 | COB lamp pearl |
-
2014
- 2014-03-28 CN CN201420146289.3U patent/CN203810336U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103883995A (en) * | 2014-03-28 | 2014-06-25 | 木林森股份有限公司 | COB lamp bead easy to assemble, support used for lamp bead, method for manufacturing lamp bead and easily-assembled LED module |
| CN103883995B (en) * | 2014-03-28 | 2017-07-18 | 木林森股份有限公司 | The COB lamp beads, lamp bead support and the lamp bead preparation method that are easily assembled, assemble simple LED modules |
| CN112709937A (en) * | 2020-12-30 | 2021-04-27 | 深圳市新亿光光电有限公司 | COB lamp pearl |
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Effective date of registration: 20161017 Address after: Guangdong province Zhongshan City Linsen road 528400 Xiaolan Town No. 1 building 1-10 building /11 building 12-15 (an additional 2 business premises Yucheng Xiaolan Town Three Street No. 6 Xiaolan Town Nantai Street No. 1) Patentee after: Zhongshan M.L.S. Electronics Co., Ltd. Address before: Limited by Share Ltd No. 1 road 528415 Guangdong Linsen wood Linsen Zhongshan City Xiaolan Town Patentee before: MLS Co., Ltd. |
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Effective date of registration: 20170413 Address after: Limited by Share Ltd No. 1 road 528415 Guangdong Linsen wood Linsen Zhongshan City Xiaolan Town Patentee after: MLS Co., Ltd. Address before: Guangdong province Zhongshan City Linsen road 528400 Xiaolan Town No. 1 building 1-10 building /11 building 12-15 (an additional 2 business premises Yucheng Xiaolan Town Three Street No. 6 Xiaolan Town Nantai Street No. 1) Patentee before: Zhongshan M.L.S. Electronics Co., Ltd. |
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