CN201638847U - LED lighting unit without printed circuit layer - Google Patents
LED lighting unit without printed circuit layer Download PDFInfo
- Publication number
- CN201638847U CN201638847U CN2010201392591U CN201020139259U CN201638847U CN 201638847 U CN201638847 U CN 201638847U CN 2010201392591 U CN2010201392591 U CN 2010201392591U CN 201020139259 U CN201020139259 U CN 201020139259U CN 201638847 U CN201638847 U CN 201638847U
- Authority
- CN
- China
- Prior art keywords
- electrode
- led chip
- lighting unit
- heat sink
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009413 insulation Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 2
- 238000004078 waterproofing Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses an LED lighting unit without a printed circuit layer, which comprises an LED chip and a heat radiating structure. A positive electrode and a negative electrode which are mutually insulated are inserted in the heat radiating structure, the electrodes and the heat radiating structure are fixed into a whole in an insulation way, the upper end faces of the two electrodes are respectively welded with the positive pole and the negative pole of the LED chip and a heat sink, and the lower end faces of the two electrodes lead out two electrode pins. The LED lighting unit with the structure not only can improve the heat radiation efficiency but also can prolong the service life of the LED chip, and the production efficiency can be improved without a large area surface treating process.
Description
Technical field
The utility model relates to the LED lighting field, in particular, relates to a kind of structure that does not contain the LED lighting unit of printed circuit layer.
Background technology
LED is applied to life and industrial lighting is familiar with by people and is accepted, but its heat dissipation problem is a difficult problem that perplexs the designer always, and therefore, the solution heat dissipation problem becomes the LED light fixture at first needs the problem that solves.The applicant discloses a kind of LED lighting unit in Chinese utility application 201020033061.5, this LED lighting unit has been abandoned the printed circuit board that adopts in the traditional scheme, but, omitted self-existent electrically conductive layer with the double electrically conductive usefulness of doing of the radiator structure in the lighting unit.This scheme can effectively improve the radiating efficiency of lighting unit, but because radiator structure will doublely be done electric action, therefore, its electric insulation problem is just very important.The scheme that adopts in above-mentioned patent application is an aluminium matter radiator structure external application layer of metal copper, the insulation of the ceramic coated more outward realization entire heat dissipation structure of metallic copper.This coating and the spraying coating process of need adopting carries out the surface-treated scheme, exists difficultly to operate in actual production, and actual effect neither be very desirable.
The utility model content
The utility model provides a kind of LED lighting unit that does not contain the printed circuit layer at above-mentioned technical problem, not only can improve radiating efficiency, prolongs the useful life of led chip, and does not need to carry out large-area process of surface treatment, can enhance productivity.
For achieving the above object, the technical solution adopted in the utility model is as follows:
A kind of LED lighting unit that does not contain the printed circuit layer, comprise led chip and radiator structure, in the middle of described radiator structure, insert two positive and negative electrodes insulated from each other, the fixing one that forms of described electrode and the insulation of described radiator structure, weld the both positive and negative polarity of led chip and heat sink respectively in the upper surface of described electrode, two electrode pins of its lower end stretch out from the radiator structure lower surface.
Inject insulating material between described radiator structure and the described metal electrode.
Described metal electrode is made of copper.
Described metal electrode is made by aluminum or aluminum alloy, electroplates layer of copper at its welding led chip place.
When described led chip is heat sink during with form that negative pole is connected, the heat sink and negative pole of led chip is welded on the negative electrode, its anodal by a wire bonds on positive electrode; When described led chip was the heat sink and anodal form that is connected, the heat sink and positive pole of led chip was welded on the positive electrode, and its negative pole passes through a wire bonds on negative electrode; When described led chip is heat sink during not with form that arbitrary pin links to each other, heat sink can being welded on arbitrary electrode.
The surface area of the electrode that described welding led chip is heat sink is greater than the surface area of another electrode.
Above described led chip, be covered with lens, form the LED lighting unit of integral waterproofing sealing.
The beneficial effect that technical solutions of the utility model are brought:
The LED lighting unit that does not contain the printed circuit layer disclosed in the utility model has been avoided the influence to heat radiation of thermal resistance that the existence owing to printed circuit layer on the radiator structure produces.In the actual production, in the middle of positive and negative two metal electrodes insertion radiator structure, fixedly connected by between the injection moulding filling insulating material electrode and the space between electrode and the radiator structure and with the three then, led chip bottom heat sink and pin are welded on the upper surface of electrode, the another pin then by wire bonds in another electrode upper surface.Because most of heat of led chip, therefore is welded with the surface area of relative another electrode of surface area of heat sink electrode by heat sink the dispersing of its bottom and wants big.For waterproof, above led chip, be covered with lens again.Above technical scheme has been omitted large-area heat conduction and insulating treatment process has been carried out in the radiator structure surface, thereby reliability is higher, and actual production efficient also can improve.
Description of drawings
Below by accompanying drawing technical solutions of the utility model are done and to be described in further detail:
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the front view of Fig. 1 embodiment;
Fig. 3 is the rearview of Fig. 1 embodiment;
Fig. 4 is the schematic diagram of radiator structure among Fig. 1 embodiment;
Fig. 5 be Fig. 2 along A-A to profile;
Embodiment
As Fig. 1～shown in Figure 5, the LED lighting unit that does not contain the printed circuit layer disclosed in the utility model comprises led chip 1 and radiator structure 2.Radiator structure 2 has cavity 21 for the centre, is formed the aluminium alloy structure of some heat dissipation channels 23 on every side by radiation tooth 22, as shown in Figure 4.Two copper electrodes, positive electrode 5 and negative electrode 4 insert in the cavity 21 in the middle of the radiator structures 2, and two electrode pins 51 and the 41 electrode fairleads 24 from radiator structure 2 lower ends that draw its lower surface stretch out, and are connected on the external circuits.Behind two metal electrode positive electrodes 5 and negative electrode 4 insertion radiator structures 2, be fixed as one by between the injection insulating material 6 filling electrodes and the space between electrode and the radiator structure and with the three again.Have an installing and locating hole 25 in the centre position, lower surface of radiator structure 2, be used to install and fix the LED lighting unit and use.On the upper surface of two metal electrodes, weld the heat sink of led chip 1 and both positive and negative polarity pin respectively.In the present embodiment, led chip 1 belongs to the heat sink form that links to each other with the negative pole pin, then heat sink and negative pole pin is welded on the upper surface of negative electrode 4, lead-in wire 3 of welding on the anodal pin, and this lead-in wire 3 is connected across the upper surface of positive electrode 5.Because most of heat will be transmitted on the radiator structure 2 by the heat sink negative electrode 4 that is transmitted to again, therefore, the surface area of negative electrode 4 is greater than the surface area of positive electrode 5.Metal electrode also can adopt aluminum or aluminum alloy in the utility model, in order to weld, electroplates layer of copper on the solder side of aluminum or aluminum alloy.
For the light configuration that makes the LED illuminating lamp meets the requirements more, lens (meaning not shown in the figures) can also be set above led chip 1, these lens cover led chip 1 fully, use the glue fixed bonding on every side.
Claims (7)
1. LED lighting unit that does not contain the printed circuit layer, comprise led chip and radiator structure, it is characterized in that: in the middle of described radiator structure, insert two positive and negative electrodes insulated from each other, the fixing one that forms of described electrode and the insulation of described radiator structure, weld the both positive and negative polarity of led chip and heat sink respectively in the upper surface of described electrode, two electrode pins of its lower end stretch out from the radiator structure lower surface.
2. the LED lighting unit that does not contain the printed circuit layer according to claim 1 is characterized in that: inject insulating material between described radiator structure and the described positive and negative electrode.
3. the LED lighting unit that does not contain the printed circuit layer according to claim 1, it is characterized in that: described positive and negative electrode is made of copper.
4. the LED lighting unit that does not contain the printed circuit layer according to claim 1, it is characterized in that: described positive and negative electrode is made by aluminum or aluminum alloy, electroplates layer of copper at its welding led chip place.
5. the LED lighting unit that does not contain the printed circuit layer according to claim 1, it is characterized in that: when described led chip is heat sink during with form that negative pole is connected, heat sink and the negative pole of led chip is welded on the negative electrode, and its anodal wire bonds of passing through is on positive electrode; When described led chip was the heat sink and anodal form that is connected, the heat sink and positive pole of led chip was welded on the positive electrode, and its negative pole passes through a wire bonds on negative electrode; When described led chip is heat sink during not with form that arbitrary pin links to each other, heat sink can being welded on arbitrary electrode.
6. the LED lighting unit that does not contain the printed circuit layer according to claim 5 is characterized in that: the surface area of the electrode that described welding led chip is heat sink is greater than the surface area of another electrode.
7. according to arbitrary described LED lighting unit that does not contain the printed circuit layer in the claim 1 to 6, it is characterized in that: above described led chip, be covered with lens, form the LED lighting unit of integral waterproofing sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201392591U CN201638847U (en) | 2010-03-24 | 2010-03-24 | LED lighting unit without printed circuit layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201392591U CN201638847U (en) | 2010-03-24 | 2010-03-24 | LED lighting unit without printed circuit layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201638847U true CN201638847U (en) | 2010-11-17 |
Family
ID=43083351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201392591U Expired - Lifetime CN201638847U (en) | 2010-03-24 | 2010-03-24 | LED lighting unit without printed circuit layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201638847U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102162593A (en) * | 2011-06-03 | 2011-08-24 | 上海三思电子工程有限公司 | Lighting device |
| CN103307470A (en) * | 2012-03-16 | 2013-09-18 | 欧司朗股份有限公司 | Light emitting device |
| CN108091753A (en) * | 2018-01-22 | 2018-05-29 | 扬州大学 | A kind of light source component |
-
2010
- 2010-03-24 CN CN2010201392591U patent/CN201638847U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102162593A (en) * | 2011-06-03 | 2011-08-24 | 上海三思电子工程有限公司 | Lighting device |
| CN102162593B (en) * | 2011-06-03 | 2015-07-15 | 上海三思电子工程有限公司 | Lighting device |
| CN103307470A (en) * | 2012-03-16 | 2013-09-18 | 欧司朗股份有限公司 | Light emitting device |
| CN103307470B (en) * | 2012-03-16 | 2017-05-17 | 欧司朗有限公司 | Light emitting device |
| CN108091753A (en) * | 2018-01-22 | 2018-05-29 | 扬州大学 | A kind of light source component |
| CN108091753B (en) * | 2018-01-22 | 2023-08-25 | 扬州大学 | Light source element |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101117 |