CN201611667U

CN201611667U - LED lighting unit

Info

Publication number: CN201611667U
Application number: CN2010200330615U
Authority: CN
Inventors: 程德诗; 李晟; 陈春根
Original assignee: Jiashan Jinghui Optoelectronics Technology Co Ltd; Shanghai Sansi Technology Co Ltd
Current assignee: Jiashan Jinghui Optoelectronics Technology Co Ltd; Shanghai Sansi Technology Co Ltd
Priority date: 2010-01-14
Filing date: 2010-01-14
Publication date: 2010-10-20
Anticipated expiration: 2020-01-14

Abstract

The utility model discloses an LED lighting unit comprising a heat dissipation substrate and an LED chip mounted thereon, and the LED lighting unit is free from a printed circuit layer. The LED lighting unit is free from both a printed circuit board and an electric conducting layer, and the ability of the LED lighting unit to both dissipate heat and enable electric connectivity is provided by a heat dissipation structure in the LED light unit, which prevents the interlayer and heat resistance from affecting the efficiency of heat dissipation in a heat dissipation loop and immediately transfers heat from the LED chip to a radiator for dissipation, thereby effectively solving the heat dissipation difficulty for LED lighting. Furthermore, the LED lighting unit has the benefits of simplified process and improved production efficiency.

Description

A kind of LED lighting unit

Technical field

The utility model relates to the LED lighting field, in particular, relates to a kind of structure of lighting unit of the LED of formation illuminating lamp.

Background technology

LED is applied to life and industrial lighting is familiar with by people and is accepted, but its heat dissipation problem is a difficult problem that perplexs the designer always, and therefore, the solution heat dissipation problem becomes the LED light fixture at first needs the problem that solves.In the lighting unit that forms the LED illuminating lamp, the scheme that adopts mostly all is that led chip is welded on a printed substrate at present, be on the pcb board, pcb board is placed on the radiator then, and the heat that produces during led chip work passes on the radiator by pcb board and distributes.Because the existence of one deck pcb board is arranged between led chip and radiator, reduced radiating effect, and also had thermal resistance between pcb board and the radiator, further influence heat radiation.Therefore, occurred some improved plans afterwards, and promptly omitted printed substrate, the bottom surface of led chip is directly linked to each other with radiator, its electrode pin then is welded on the electrically conductive layer, and this electrically conductive layer links to each other with radiator.Though this structure has had certain improvement aspect heat radiation, but still does not solve the problem that the heat of led chip will be directly conducted to radiator, its manufacturing cost height, radiating effect are not ideal enough.

The utility model content

The utility model provides a kind of LED lighting unit at above-mentioned technical problem, can very effective solution heat dissipation problem, improve radiating efficiency, and prolong the useful life of led chip, and technology is simple.

For achieving the above object, the technical solution adopted in the utility model is as follows:

A kind of LED lighting unit comprises led chip, the heat radiation matrix of led chip is installed, and it is characterized in that: described LED lighting unit does not contain the printed circuit layer.

Described heat radiation matrix comprises two parts insulated from each other.

Inject megohmite insulant between above-mentioned heat radiation matrix two parts insulated from each other.

Outer surface at described heat radiation matrix is electroplated layer of metal copper.

Two of described led chip extend limbs and are welded on respectively on the two-part copper facing face of described heat radiation matrix, and described led chip bottom heat sink is welded on the copper facing face of a wherein part of described heat radiation matrix.

Be respectively arranged with in described heat radiation matrix two-part lower surface insulated from each other in order to connecting the pin of external power supply, and described pin outer surface is electroplated layer of metal copper.

Remove described pin and described led chip place, in described copper surface spraying or electrophoresis one deck insulating heat-conductive coating.

Above-mentioned insulating heat-conductive coating is a pottery.

Described heat radiation matrix is an aluminum or aluminum alloy.

Above described led chip, be covered with lens, form the LED lighting unit of integral waterproofing sealing.

The beneficial effect that technical solutions of the utility model are brought:

LED lighting unit disclosed in the utility model does not contain the printed circuit layer, and radiator is both as thermal component, again as conductive component.Both avoided traditional led chip and of the influence of this interlayer of the printed circuit board (PCB) between the radiator, saved material again dispelling the heat.And with cheap aluminum or aluminum alloy as the heat radiation matrix, outer surface is electroplated the good copper of one deck heat conductivility, copper surface spraying or the electrophoresis heat dispersion is good and nonconducting pottery further improves radiating effect, guarantees the useful life of led chip.

Description of drawings

Below by accompanying drawing technical solutions of the utility model are done and to be described in further detail:

Fig. 1 is the structural representation of the utility model lighting unit embodiment;

Fig. 2 is the upper surface schematic diagram of Fig. 1 embodiment;

Fig. 3 is the lower surface schematic diagram of Fig. 1 embodiment;

Fig. 4 be shown in Figure 2 along A-A to profile;

Fig. 5 is the partial enlarged drawing in a shown in Figure 4 zone;

Fig. 6 is the partial enlarged drawing in b shown in Figure 4, c zone;

Fig. 7 is the partial enlarged drawing in d shown in Figure 4 zone.

Embodiment

As Fig. 1～shown in Figure 7, LED lighting unit disclosed in the utility model, comprise led chip 1, there are two to extend pin on the led chip 1, be respectively 11 and 12, led chip 1 is installed on the heat radiation matrix 2, and this heat radiation matrix is made by aluminum or aluminum alloy, present embodiment adopts cheap, and electric conductivity is aluminum alloy material preferably.This heat radiation matrix 2 is made up of two parts insulated from each other, respectively as shown in FIG. 21 and 22, between these two parts insulated from each other 21,22, be one deck insulating material 3, this insulating material 3 connects as one by will dispel the heat two

parts

21,22 of matrix 2 of embedding and injection molding.Outer surface at heat radiation matrix 2 is electroplated layer of metal copper 4, then heat sink 13 of led chip 1 bottom directly is welded on the upper end copper facing face of one of them part 21 of heat radiation matrix 2 (can be any one part of 2 two parts of heat radiation matrix), two of led chip 1 extend on the upper end copper facing face of two

parts

21,22 insulated from each other that

pins

11,12 are welded on heat radiation matrix 2 respectively the partial enlarged drawing in a zone as shown in Figure 5.And being respectively arranged with pin 5 with the external power supply electrical communication in the lower surface of two

parts

21,22 insulated from each other of heat radiation matrix 2, the outer surface of this pin 5 is also electroplated layer of metal copper 4, the partial enlarged drawing in b as shown in Figure 6 and c zone.At last spraying one deck pottery 6 again on the copper facing face of the All Ranges beyond the zone shown in a, b and the c, is that example is illustrated with the partial enlarged drawing in d zone shown in Figure 7.

For the light configuration that makes the LED illuminating lamp meets the requirements more, can also lens be set above led chip 1, these lens cover led chip 1 fully, use the glue fixed bonding on every side.

Claims

1. LED lighting unit comprises led chip, the heat radiation matrix of led chip is installed, and it is characterized in that: described LED lighting unit does not contain the printed circuit layer.

2. LED lighting unit according to claim 1 is characterized in that: described heat radiation matrix comprises two parts insulated from each other.

3. LED lighting unit according to claim 2 is characterized in that: inject megohmite insulant between described heat radiation matrix two parts insulated from each other.

4. LED lighting unit according to claim 3 is characterized in that: the outer surface at described heat radiation matrix is electroplated layer of metal copper.

5. LED lighting unit according to claim 4, it is characterized in that: two of described led chip extend limbs and are welded on respectively on the two-part copper facing face of described heat radiation matrix, and described led chip bottom heat sink is welded on the copper facing face of a wherein part of described heat radiation matrix.

6. LED lighting unit according to claim 5 is characterized in that: be respectively arranged with the pin in order to the connection external power supply in described heat radiation matrix two-part lower surface insulated from each other, and described pin outer surface is electroplated layer of metal copper.

7. LED lighting unit according to claim 6 is characterized in that: remove described pin and described led chip place, in described copper surface spraying or electrophoresis one deck insulating heat-conductive coating.

8. LED lighting unit according to claim 7 is characterized in that: described insulating heat-conductive coating is a pottery.

9. LED lighting unit according to claim 1 is characterized in that: described heat radiation matrix is an aluminum or aluminum alloy.

10. according to arbitrary described LED lighting unit in the claim 1 to 9, it is characterized in that: above described led chip, be covered with lens, form the LED lighting unit of integral waterproofing sealing.