CN203150615U - Efficient heat dissipation LED light source module - Google Patents
Efficient heat dissipation LED light source module Download PDFInfo
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- CN203150615U CN203150615U CN 201320058142 CN201320058142U CN203150615U CN 203150615 U CN203150615 U CN 203150615U CN 201320058142 CN201320058142 CN 201320058142 CN 201320058142 U CN201320058142 U CN 201320058142U CN 203150615 U CN203150615 U CN 203150615U
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Abstract
Description
技术领域 technical field
本实用新型涉及LED照明领域,特别涉及一种高效散热LED光源模块。 The utility model relates to the field of LED lighting, in particular to a high-efficiency heat dissipation LED light source module.
背景技术 Background technique
LED光源产生光的同时也会产生大量的热,如果不将这些热量散去就会缩短LED光源的使用寿命。传统1W以上的功率级LED光源要通过金属或陶瓷基线路板完成电气连接和散热,铜柱组合成光源模块,但金属基线路板为了实现电气隔离在电气连接层和金属基板之间存在一个导热系数很难超越3w/m·k的绝缘层,陶瓷基板在结构上虽然没有绝缘层但导热系数也很难超越150w/m·k且工艺复杂价格昂贵。所以目前广泛应用的金属基线路板成为LED芯片和灯具散热结构通道上的最大瓶颈,这样一来无论灯具采用何种高效的散热结构都无法从根本上解决问题,最终造成LED芯片大量的热积累,严重影响LED光源的使用寿命。本发明涉及一种LED光源封装结构,能更好的保护降低LED芯片结温,延长使用寿命。 When the LED light source produces light, it also generates a lot of heat. If the heat is not dissipated, the service life of the LED light source will be shortened. The traditional power level LED light source above 1W needs to complete the electrical connection and heat dissipation through the metal or ceramic base circuit board. It is difficult to exceed the insulating layer with a coefficient of 3w/m·k. Although there is no insulating layer in the structure of the ceramic substrate, the thermal conductivity is difficult to exceed 150w/m·k, and the process is complicated and expensive. Therefore, the widely used metal-based circuit board has become the biggest bottleneck in the heat dissipation structure channel of LED chips and lamps. In this way, no matter what kind of efficient heat dissipation structure the lamp adopts, it cannot fundamentally solve the problem, and eventually cause a large amount of heat accumulation of LED chips. , Seriously affect the service life of the LED light source. The invention relates to an LED light source packaging structure, which can better protect and reduce the junction temperature of LED chips and prolong the service life.
实用新型内容 Utility model content
为了提高LED光源的使用寿命,本实用新型实施例提供了一种散热好,且光效高的高效散热LED光源模块。所述技术方案如下: In order to improve the service life of the LED light source, the embodiment of the utility model provides a high-efficiency heat-dissipating LED light source module with good heat dissipation and high light efficiency. Described technical scheme is as follows:
本实用新型提出一种高效散热LED光源模块,包括铜质的柱状LED热沉铜柱,所述铜柱端部设有用于放置LED芯片的凹槽,所述LED铜柱固定在用于电气连接的玻纤覆铜板上。 The utility model proposes a high-efficiency heat dissipation LED light source module, which includes a copper columnar LED heat sink copper column, the end of the copper column is provided with a groove for placing an LED chip, and the LED copper column is fixed on a glass fiber copper clad board.
作为上述技术方案的优选,所述铜柱端部用于放置LED芯片的凹槽形状经过光学设计,且表面具有高反射率镀银层。 As a preference of the above technical solution, the shape of the groove at the end of the copper pillar for placing the LED chip is optically designed, and the surface has a silver-plated layer with high reflectivity.
作为上述技术方案的优选,所述LED热沉铜柱套接在通孔内固定在玻纤覆铜板上。 As a preference of the above technical solution, the LED heat sink copper column is socketed in the through hole and fixed on the glass fiber copper clad board.
本实用新型实施例提供的技术方案带来的有益效果是:本实用新型提出的一种高效散热环保LED光源模块,充分利用了玻纤覆铜板的电气性能和成熟工艺;而且利用了纯铜优异的导热性,并通过结构优化设计最大限度的降低了贵重金属材料的用量;再有本实用新型充分利用了电镀银层对光的高反射性能,并通过结构优化设计最大限度的降低了贵重金属材料的用量,既节约了成本又减轻了环境压力而且能获得更好的光效。 The beneficial effects brought by the technical solution provided by the embodiment of the utility model are: a high-efficiency heat-dissipating and environmentally friendly LED light source module proposed by the utility model fully utilizes the electrical performance and mature technology of the glass fiber copper-clad laminate; and utilizes the excellent performance of pure copper thermal conductivity, and the consumption of precious metal materials is reduced to the greatest extent through structural optimization design; moreover, the utility model makes full use of the high reflection performance of the electroplated silver layer to light, and reduces the precious metal material consumption to the greatest extent through structural optimization design. The amount of materials used not only saves costs, but also reduces environmental pressure and can obtain better light effects.
附图说明 Description of drawings
图1是本实用新型实施例1中提供的高效散热LED光源模块结构示意图; Fig. 1 is a schematic structural diagram of a high-efficiency heat dissipation LED light source module provided in Embodiment 1 of the present utility model;
图2是图1剖面图。 Fig. 2 is a sectional view of Fig. 1 .
具体实施方式 Detailed ways
为使本实用新型的目的、技术方案和优点更加清楚,下面将结合附图对本实用新型实施方式作进一步地详细描述。 In order to make the purpose, technical solutions and advantages of the present utility model clearer, the implementation of the present utility model will be further described in detail below in conjunction with the accompanying drawings.
实施例1 Example 1
本实用新型提出一种高效散热LED光源模块,包括铜质的柱状LED热沉铜柱1,所述铜柱端1部设有用于放置LED芯片的凹槽2,所述LED铜柱1固定在用于电气连接的玻纤覆铜板3上。
The utility model proposes a high-efficiency heat dissipation LED light source module, which includes a copper columnar LED heat sink copper column 1, and the end 1 of the copper column is provided with a groove 2 for placing LED chips, and the LED copper column 1 is fixed on On the glass fiber
所述铜柱1端部用于放置LED芯片的凹槽形状经过光学设计,且表面具有高反射率镀银层。 The shape of the groove for placing the LED chip at the end of the copper pillar 1 is optically designed, and the surface has a silver-plated layer with high reflectivity.
所述玻纤覆铜板具有通孔,所述LED铜柱3套接设置在通孔,所述LED热沉铜柱套接在通孔内固定在玻纤覆铜板上。
The glass fiber copper clad board has a through hole, the
实用新型实施例提供的技术方案带来的有益效果是:本实用新型提出的一种高效散热环保LED光源模块,充分利用了玻纤覆铜板的电气性能和成熟工艺;而且利用了纯铜优异的导热性,并通过结构优化设计最大限度的降低了贵重金属材料的用量;再有本实用新型充分利用了电镀银层对光的高反射性能,并通过结构优化设计最大限度的降低了贵重金属材料的用量,既节约了成本又减轻了环境压力而且能获得更好的光效。 The beneficial effects brought by the technical solution provided by the embodiment of the utility model are: a high-efficiency heat-dissipating and environmentally friendly LED light source module proposed by the utility model fully utilizes the electrical properties and mature technology of the glass fiber copper-clad laminate; and utilizes the excellent properties of pure copper Thermal conductivity, and the consumption of precious metal materials is reduced to the greatest extent through structural optimization design; and the utility model makes full use of the high reflection performance of the electroplated silver layer to light, and the maximum reduction of precious metal materials is achieved through structural optimization design The dosage, not only saves the cost but also reduces the environmental pressure and can obtain better light effect.
最后应说明的是:以上实施例仅用以说明本实用新型的技术方案,而非对其限制;尽管参照前述实施例对本实用新型进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本实用新型各实施例技术方案的精神和范围。 Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present utility model, and are not intended to limit it; although the utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit of the technical solutions of the various embodiments of the present invention. and range.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320058142 CN203150615U (en) | 2013-02-01 | 2013-02-01 | Efficient heat dissipation LED light source module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201320058142 CN203150615U (en) | 2013-02-01 | 2013-02-01 | Efficient heat dissipation LED light source module |
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| CN203150615U true CN203150615U (en) | 2013-08-21 |
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| CN 201320058142 Expired - Fee Related CN203150615U (en) | 2013-02-01 | 2013-02-01 | Efficient heat dissipation LED light source module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104393162A (en) * | 2014-11-05 | 2015-03-04 | 共青城超群科技股份有限公司 | Copper column type substrate-encapsulated LED |
| US9379300B2 (en) | 2013-09-06 | 2016-06-28 | Yung Pun Cheng | Floating heat sink support with copper sheets and LED package assembly for LED flip chip package |
-
2013
- 2013-02-01 CN CN 201320058142 patent/CN203150615U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9379300B2 (en) | 2013-09-06 | 2016-06-28 | Yung Pun Cheng | Floating heat sink support with copper sheets and LED package assembly for LED flip chip package |
| CN104393162A (en) * | 2014-11-05 | 2015-03-04 | 共青城超群科技股份有限公司 | Copper column type substrate-encapsulated LED |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130821 Termination date: 20160201 |