CN102781164A - Novel special circuit board for LED (light-emitting diode) lighting fixture - Google Patents
Novel special circuit board for LED (light-emitting diode) lighting fixture Download PDFInfo
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- CN102781164A CN102781164A CN2012102687349A CN201210268734A CN102781164A CN 102781164 A CN102781164 A CN 102781164A CN 2012102687349 A CN2012102687349 A CN 2012102687349A CN 201210268734 A CN201210268734 A CN 201210268734A CN 102781164 A CN102781164 A CN 102781164A
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Abstract
The invention relates to a novel special circuit board for an LED (light-emitting diode) lighting fixture, which comprises a circuit layer, an insulated heat conduction layer and a heat radiation layer, wherein the circuit layer is a metal layer and is used for electrical connection; the insulated heat conduction layer is used for cutting off the electrical connection between the circuit layer and the heat radiation layer; the heat radiation layer is made of a material having good heat conduction performance; the bottom surface of the circuit layer is connected with the upper surface of the insulated heat conduction layer; and the bottom surface of the insulated heat conduction layer is connected with the upper surface of a bottom plate of the heat radiation layer. The invention has the following beneficial effects: (1) the structure of the LED lighting fixture is simplified, and the process difficulty is lowered; (2) the circuit board is simple in production process, low in manufacturing cost and high in market adaptability; (3) the heat radiation problem of the LED lighting fixture is effectively solved, and the heat resistance of the LED lighting fixture is effectively reduced; (4) the junction temperature of an LED chip is lowered, and the service life of the LED is prolonged; and (5) the circuit board is high in safety, and is less prone to be subjected to electric leakage.
Description
Technical field
The present invention relates to a kind of circuit board, particularly a kind of wiring board that is used for the LED lighting.
Background technology
LED is because its volume is little, advantages such as power consumption is low, long service life have obtained being widely used in daily life.At present, the production stage of LED light fixture comprises: pre-designed wiring board; The LED light fixture is welded on the said wiring board; Driver is connected with said connecting plate, and the wiring board and the driver that will weld the LED light fixture simultaneously are separately fixed on lamp radiator or the lamp outer casing.
Because LED lamp pearl can produce great amount of heat in the course of the work, how solving the LED heat dissipation problem is the difficult problem that present each manufacturer's urgent need overcomes.
And the problem that the present method that adopts directly causes has: (1) LED light fixture radiating efficiency is not high; (2) LED radiator volume is excessive; (3) LED light fixture light decay is big; (4) do not reach designing requirement the useful life of LED light fixture; (5) LED light fixture manufacturing cost is high, market adaptability is poor.
In addition, the LED light fixture is an electric light source, after arranging in order, becomes area source, for the needs that satisfy heat radiation again with LED Design of Luminaires globulate or fluorescent tube shape, increased more the LED light fixture volume, limited the range of application of LED light fixture.
There is not the special circuit plate that is directed against the LED characteristic specially and can better solves the LED heat dissipation problem in the market; The employed special circuit plate of LED light fixture is still continued to use the traditional circuit-board manufacturing process of other electronic products; Mode through traditional welding is welded on formation lamp plate and driver on the different wiring boards respectively with LED lamp pearl and led driver spare; Again LED lamp plate and driving are electrically connected, thereby realize the LED operate as normal.Usually the fixed form of LED lamp plate and lamp radiator or shell be inlay, heat-conducting silicone grease is bonding, bolted; Can't realize the external force compacting; Therefore cause between LED lamp plate and radiator or the shell and produce bubble, increased thermal resistance widely, the heat release that produces in the time of can't quickly and efficiently LED lamp pearl being worked; Cause led chip to form junction temperature and raise, reduce LED useful life.What the method adopted all is discrete device, and production technology is comparatively complicated, and production cost is also higher.Simultaneously, when the LED wiring board was fixed in the shell of light fixture through this welding or another kind of common gummed mode, connection stability was not strong, leaks electricity easily, and the fail safe of equipment is had a strong impact on.
Summary of the invention
For overcome above-mentioned LED light fixture complex process, cost higher, can't solve LED light fixture heat dissipation problem, reduce problem such as LED useful life; The invention discloses a kind of New LED lighting special circuit plate; Comprise: circuit layer, insulating heat-conductive layer and heat dissipating layer is characterized in that:
Said circuit layer is a metal level, is used between the LED lamp pearl, between the led driver spare, between LED lamp pearl and the led driver spare and being electrically connected between led driver spare and the power supply;
Said insulating heat-conductive layer is used to cut off being electrically connected between circuit layer and the heat dissipating layer;
Said heat dissipating layer is the material with good heat conductive performance, and its one side is used for printed wiring as the carrier of accepting LED lamp pearl and driving element, and another side is that the shell of light fixture is used for heat radiation;
Its annexation is:
The bottom surface of said circuit layer be connected above the said insulating heat-conductive layer, the bottom surface of said insulating heat-conductive layer be connected above the said heat dissipating layer base plate.
Metal level in the said circuit layer can be one deck, also can be multilayer.When said metal level is multilayer, isolate through the insulating heat-conductive layer between layer and the layer; In the time of need being electrically connected between the said metal level, get through hole and filled conductive material in the relevant position of insulating heat-conductive layer; LED lamp pearl and led driver spare can be installed in on one deck circuit layer, also can be installed on the circuit layer of different layers.
Said heat dissipating layer can use aluminium alloy, magnesium alloy, copper, pottery.
Said heat dissipating layer is thereby that zigzag increases area of dissipation as lamp outer casing.
Said heat dissipating layer is thereby that the fish scale shape increases area of dissipation as lamp outer casing.
Through said structure, a kind of New LED lighting of the present invention is realized following technique effect with wiring board:
(1) structure of simplification LED light fixture has reduced technology difficulty;
(2) production technology is simple, and is cheap for manufacturing cost, and market adaptability is strong;
(3) effectively solve the heat dissipation problem of LED light fixture, effectively reduce the thermal resistance of LED light fixture;
(4) junction temperature of reduction led chip, the useful life of having improved LED;
(5) safe, the difficult electric leakage.
Detailed content of the present invention can through after explanation and the institute's accompanying drawing stated obtain.
Description of drawings
Fig. 1 is the vertical view of a kind of New LED lighting of the present invention with wiring board;
Fig. 2 is the front view of a kind of New LED lighting of the present invention with wiring board;
Among the figure, 1-circuit layer, 2-insulating heat-conductive layer, 3-heat dissipating layer, 4-LED lamp pearl, 5-LED driving element.
Embodiment
Further describe below in conjunction with accompanying drawing and embodiment specific embodiments of the invention, following examples only are used for technical scheme of the present invention more clearly is described, and can not limit protection scope of the present invention with this.
To shown in Figure 2, the technical scheme of practical implementation of the present invention is like Fig. 1:
A kind of New LED lighting special circuit plate, comprising: circuit layer 1, insulating heat-conductive layer 2 and heat dissipating layer 3 is characterized in that:
Said circuit layer 1 is a metal level, is used between the LED lamp pearl 4, between the led driver spare 5, between LED lamp pearl 4 and the led driver spare 5 and being electrically connected between led driver spare 5 and the power supply;
Said insulating heat-conductive layer 2 is used to cut off being electrically connected between circuit layer 1 and the heat dissipating layer 3;
Said heat dissipating layer 3 is for having the material of good heat conductive performance, and its one side is used for printed wiring as the carrier of accepting LED lamp pearl 4 and driving element, and another side is that the shell of light fixture is used for heat radiation;
Its annexation is:
The bottom surface of said circuit layer 1 be connected above the said insulating heat-conductive layer 2, the bottom surface of said insulating heat-conductive layer 2 be connected above said heat dissipating layer 3 base plates.
Metal level in the said circuit layer 1 can be one deck, also can be multilayer.When said metal level is multilayer, isolate through insulating heat-conductive layer 2 between layer and the layer; In the time of need being electrically connected between the said metal level, get through hole and filled conductive material in the relevant position of insulating heat-conductive layer 2; LED lamp pearl 4 can be installed in on one deck circuit layer 1 with led driver spare 5, also can be installed on the circuit layer 1 of different layers.
Said heat dissipating layer 3 can use aluminium alloy, magnesium alloy, copper, pottery.
Said heat dissipating layer 3 is thereby that zigzag increases area of dissipation as lamp outer casing.
Said heat dissipating layer 3 is thereby that the fish scale shape increases area of dissipation as lamp outer casing.
It is obvious that, and above description and record only are for example rather than in order to limit disclosure of the present invention, application or use.Though described and be described in the drawings embodiment in an embodiment; But the optimal mode that the present invention does not limit by the accompanying drawing example and the conduct of describing is in an embodiment thought at present is with the specific examples of the instruction of embodiment of the present invention, and scope of the present invention will comprise any embodiment of the specification that falls into the front and appended claim.
Claims (6)
1. New LED lighting special circuit plate, comprising: circuit layer, insulating heat-conductive layer and heat dissipating layer is characterized in that:
Said circuit layer is a metal level, is used between the LED lamp pearl, between the led driver spare, between LED lamp pearl and the led driver spare and being electrically connected between led driver spare and the power supply;
Said insulating heat-conductive layer is used to cut off being electrically connected between circuit layer and the heat dissipating layer;
Said heat dissipating layer is the material with good heat conductive performance, and its one side is used for printed wiring as the carrier of accepting LED lamp pearl and driving element, and another side is that the shell of light fixture is used for heat radiation;
Its annexation is:
The bottom surface of said circuit layer be connected above the said insulating heat-conductive layer, the bottom surface of said insulating heat-conductive layer be connected above the said heat dissipating layer base plate.
2. a kind of New LED lighting special circuit plate according to claim 1, it is characterized in that: said circuit layer is one deck.
3. a kind of New LED lighting special circuit plate according to claim 1, it is characterized in that: said circuit layer is a multilayer, isolates through the insulating heat-conductive layer between layer and the layer; In the time of need being electrically connected between said layer and the layer, get through hole and filled conductive material in the relevant position of insulating heat-conductive layer; LED lamp pearl and led driver spare can be installed in on one deck circuit layer, also can be installed on the circuit layer of different layers.
4. according to claim 1,2 or 3 described a kind of New LED lighting special circuit plates, it is characterized in that: said heat dissipating layer can use aluminium alloy, magnesium alloy, copper, pottery.
5. according to claim 1,2 or 3 described a kind of New LED lighting special circuit plates, it is characterized in that: thus said heat dissipating layer increases area of dissipation as lamp outer casing for zigzag.
6. according to claim 1,2 or 3 described a kind of New LED lighting special circuit plates, it is characterized in that: thus said heat dissipating layer increases area of dissipation as lamp outer casing for the fish scale shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210268734.9A CN102781164B (en) | 2012-07-31 | 2012-07-31 | Novel special circuit board for LED (light-emitting diode) lighting fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210268734.9A CN102781164B (en) | 2012-07-31 | 2012-07-31 | Novel special circuit board for LED (light-emitting diode) lighting fixture |
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| Publication Number | Publication Date |
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| CN102781164A true CN102781164A (en) | 2012-11-14 |
| CN102781164B CN102781164B (en) | 2014-12-03 |
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| CN201210268734.9A Expired - Fee Related CN102781164B (en) | 2012-07-31 | 2012-07-31 | Novel special circuit board for LED (light-emitting diode) lighting fixture |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411086A (en) * | 2014-11-04 | 2015-03-11 | 广东明路电力电子有限公司 | Power PCB and processing method thereof |
| CN105870301A (en) * | 2016-06-08 | 2016-08-17 | 广州硅能照明有限公司 | LED (Light Emitting Diode) optical engine packaging structure and processing method thereof |
| CN105977364A (en) * | 2016-07-20 | 2016-09-28 | 广州硅能照明有限公司 | Multilayer LED light engine structure and processing method thereof |
| CN106122783A (en) * | 2016-06-24 | 2016-11-16 | 安庆市奥立德光电有限公司 | A kind of LED light source board |
| CN108679583A (en) * | 2018-04-08 | 2018-10-19 | 伍连彬 | A kind of lighting apparatus and its manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201349384Y (en) * | 2008-12-24 | 2009-11-18 | 彭泰企业有限公司 | High conduction and heat dissipation aluminum coated metal substrate structure |
| CN201781689U (en) * | 2010-07-13 | 2011-03-30 | 海洋王照明科技股份有限公司 | Led circuit board |
| US20110316035A1 (en) * | 2010-06-23 | 2011-12-29 | Samsung Electro-Mechanics Co., Ltd. | Heat dissipating substrate and method of manufacturing the same |
| CN102469691A (en) * | 2010-11-10 | 2012-05-23 | 三星电机株式会社 | Printed circuit board and method of manufacturing the same |
-
2012
- 2012-07-31 CN CN201210268734.9A patent/CN102781164B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201349384Y (en) * | 2008-12-24 | 2009-11-18 | 彭泰企业有限公司 | High conduction and heat dissipation aluminum coated metal substrate structure |
| US20110316035A1 (en) * | 2010-06-23 | 2011-12-29 | Samsung Electro-Mechanics Co., Ltd. | Heat dissipating substrate and method of manufacturing the same |
| CN201781689U (en) * | 2010-07-13 | 2011-03-30 | 海洋王照明科技股份有限公司 | Led circuit board |
| CN102469691A (en) * | 2010-11-10 | 2012-05-23 | 三星电机株式会社 | Printed circuit board and method of manufacturing the same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411086A (en) * | 2014-11-04 | 2015-03-11 | 广东明路电力电子有限公司 | Power PCB and processing method thereof |
| CN105870301A (en) * | 2016-06-08 | 2016-08-17 | 广州硅能照明有限公司 | LED (Light Emitting Diode) optical engine packaging structure and processing method thereof |
| CN106122783A (en) * | 2016-06-24 | 2016-11-16 | 安庆市奥立德光电有限公司 | A kind of LED light source board |
| CN105977364A (en) * | 2016-07-20 | 2016-09-28 | 广州硅能照明有限公司 | Multilayer LED light engine structure and processing method thereof |
| CN108679583A (en) * | 2018-04-08 | 2018-10-19 | 伍连彬 | A kind of lighting apparatus and its manufacturing method |
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| CN102781164B (en) | 2014-12-03 |
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