CN201518324U - Aluminum base plate without thermal resistance - Google Patents
Aluminum base plate without thermal resistance Download PDFInfo
- Publication number
- CN201518324U CN201518324U CN200920189347XU CN200920189347U CN201518324U CN 201518324 U CN201518324 U CN 201518324U CN 200920189347X U CN200920189347X U CN 200920189347XU CN 200920189347 U CN200920189347 U CN 200920189347U CN 201518324 U CN201518324 U CN 201518324U
- Authority
- CN
- China
- Prior art keywords
- insulating layer
- copper foil
- thermal resistance
- led
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides an aluminum base plate without thermal resistance. The aluminum base plate comprises a copper foil, a heat-conducting insulating layer and an aluminum plate, wherein the aluminum plate is arranged at the bottommost side, the heat-conducting insulating layer is arranged on the upper side of the aluminum plate, the copper foil is arranged on the upper side of the heat-conducting insulating layer. The aluminum base plate without thermal resistance is characterized in that the copper foil and the corresponding heat-conducting insulating layer are provided with seat holes for mounting LED, and two electrodes matching with the LED are arranged on the surface of the copper foil on two sides of each seat hole. The aluminum base plate without thermal resistance has the advantages of simple structure,, excellent heat radiation effect and the like, and can greatly improve stability and reliability of the work of the LED.
Description
Technical field
The utility model relates to a kind of aluminium base, relates in particular to a kind of high-power LED aluminum substrate, belongs to field of semiconductor illumination.
Background technology
Existing aluminium base is made up of for three layers Copper Foil, heat conductive insulating layer and aluminium sheet, described Copper Foil is done circuit and is used, described heat conductive insulating layer is that the heat that LED produces is passed to aluminium sheet fast, described aluminium sheet is the heat conductive insulating layer to be derived the heat that comes pass to Lamp cup again, and existing LED is installed on the Copper Foil, and the heat of its generation needs to pass to the heat conductive insulating layer by Copper Foil, pass to aluminium sheet by the heat conductive insulating layer again, heat transfer path is too much, causes the diffusing effect of heat bad, influences the stability of LED work.
Summary of the invention
The purpose of this utility model is exactly at above-mentioned deficiency, and a kind of no thermal resistance aluminium base is provided.This aluminium base can directly be passed to aluminium sheet to the heat that LED produces, and need not to reduce thermal resistance through the transmission of heat conductive insulating layer, improves the diffusing effect of heat of LED, improves the stability and the reliability of LED work.
The purpose of this utility model can realize by following scheme: a kind of no thermal resistance aluminium base, form for three layers by Copper Foil, heat conductive insulating layer and aluminium sheet, the bottom is an aluminium sheet, it above the aluminium sheet heat conductive insulating layer, it above the heat conductive insulating layer Copper Foil, it is characterized in that being provided with the seat hole of installing for LED at Copper Foil and corresponding heat conductive insulating layer place thereof, the surface of the Copper Foil of seat both sides, hole is provided with matching used two electrodes with LED.
The utlity model has characteristics such as simple in structure, good heat dissipation effect.Can improve the stability and the reliability of LED work greatly.
Description of drawings
Fig. 1 the utility model cross-sectional view
Embodiment
Contrast Fig. 1 as can be known, the utility model is made up of for 3 three layers Copper Foil 1, heat conductive insulating layer 2 and aluminium sheet, the bottom is an aluminium sheet, it above the aluminium sheet heat conductive insulating layer, it above the heat conductive insulating layer Copper Foil, it is characterized in that being provided with the seat hole 4 of installing for LED at Copper Foil 1 and corresponding heat conductive insulating layer 2 place thereof, the surface of the Copper Foil of seat 4 both sides, hole is provided with matching used two electrodes 5 with LED.
Claims (1)
1. no thermal resistance aluminium base, form for (3) three layers by Copper Foil (1), heat conductive insulating layer (2) and aluminium sheet, the bottom is an aluminium sheet, it above the aluminium sheet heat conductive insulating layer, it above the heat conductive insulating layer Copper Foil, it is characterized in that locating to be provided with the seat hole (4) of installing for LED at Copper Foil (1) and corresponding heat conductive insulating layer (2) thereof, the surface of the Copper Foil of seat both sides, hole (4) is provided with and matching used two electrodes of LED (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920189347XU CN201518324U (en) | 2009-09-28 | 2009-09-28 | Aluminum base plate without thermal resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920189347XU CN201518324U (en) | 2009-09-28 | 2009-09-28 | Aluminum base plate without thermal resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201518324U true CN201518324U (en) | 2010-06-30 |
Family
ID=42499046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920189347XU Expired - Fee Related CN201518324U (en) | 2009-09-28 | 2009-09-28 | Aluminum base plate without thermal resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201518324U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102842671A (en) * | 2011-06-21 | 2012-12-26 | 海洋王照明科技股份有限公司 | LED (Light Emitting Diode) heat dissipation structure and machining method thereof |
-
2009
- 2009-09-28 CN CN200920189347XU patent/CN201518324U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102842671A (en) * | 2011-06-21 | 2012-12-26 | 海洋王照明科技股份有限公司 | LED (Light Emitting Diode) heat dissipation structure and machining method thereof |
| CN102842671B (en) * | 2011-06-21 | 2015-05-06 | 海洋王照明科技股份有限公司 | LED (Light Emitting Diode) heat dissipation structure and machining method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100630 Termination date: 20120928 |