CN201869439U - High heat dissipation metal base circuit board - Google Patents
High heat dissipation metal base circuit board Download PDFInfo
- Publication number
- CN201869439U CN201869439U CN2010206578845U CN201020657884U CN201869439U CN 201869439 U CN201869439 U CN 201869439U CN 2010206578845 U CN2010206578845 U CN 2010206578845U CN 201020657884 U CN201020657884 U CN 201020657884U CN 201869439 U CN201869439 U CN 201869439U
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- CN
- China
- Prior art keywords
- metal substrate
- heating panel
- high heat
- electric component
- base circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 63
- 239000002184 metal Substances 0.000 title claims abstract description 63
- 230000017525 heat dissipation Effects 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 230000005855 radiation Effects 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000009413 insulation Methods 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 36
- 238000005452 bending Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 abstract description 2
- 239000004411 aluminium Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high heat dissipation metal-based circuit board, which comprises a metal substrate, wherein one surface of the metal substrate is provided with a circuit layer made of high-insulation low-thermal resistance material, and an electrical element is electrically connected with the circuit layer; at least one wing of the metal substrate is bent towards the other surface of the metal substrate without the electric element to form an extension radiating plate, and a certain gap is formed between the extension radiating plates to form a convection channel; the extension heat dissipation plate is provided with a heat radiation layer; the metal substrate is integrated with the extended heat dissipation plate. The utility model overcomes above-mentioned technique is not enough, provides a high heat dissipation metal-based circuit board that radiating efficiency is high, simple structure.
Description
[technical field]
The present invention relates to circuit board, particularly a kind of high heat radiating metal base circuit board.
[background technology]
Along with the continuous progress of electronic technology, electronic devices and components are miniaturization day by day, and integrated level is more and more higher, and the heat that is produced in the electronic devices and components work is also more and more concentrated, total amount is also more and more higher.If the radiating mode that neither one is good in time conducts the heat that is produced in the electronic devices and components work, the electronic devices and components temperature inside will raise gradually, overheated, its inner stress will increase, performance will reduce, life-span will shorten, even can be because overheated and burn.So the heat dissipation problem of electronic devices and components, especially power component is a problem that can not be ignored.
Traditional circuit board is provided with electric component, and circuit board connects down radiator, and circuit board is the connected mode of connecting with radiator, and the connected mode of this series connection generally is both are clinged or by fastening mode both to be connected by adhesive.Adhesive or fastening short and difficult construction of mode cost height, life-span.Have, the heat that electric component distributes is to be conducted to radiator by circuit board again, and the mode of being connected in series makes that thermal resistance increases, radiating efficiency is not high.
For this reason, the inventor has designed this patent, to overcome the problems referred to above.
[summary of the invention]
The present invention has overcome the deficiency of above-mentioned technology, and a kind of radiating efficiency height, high heat radiating metal base circuit board simple in structure are provided.
For achieving the above object, the present invention has adopted following technical proposal:
A kind of high heat radiating metal base circuit board comprises metal substrate, and the metal substrate one side is provided with the line layer that high insulation low thermal resistance material is made, and electric component and line layer are electrically connected; The another side bending that at least one wing of metal substrate is not installed electric component to metal substrate forms and extends heating panel, and extending between the heating panel has certain clearance, forms convection channel; Extend heating panel and be provided with heat radiation layer; Metal substrate is integral with the extension heating panel;
Metal substrate left and right sides both wings are not all installed the another side bending of electric component to metal substrate as mentioned above, form to extend heating panel;
The another side bending that both wings are not all installed electric component before and after the metal substrate to metal substrate as mentioned above forms and extends heating panel;
Extending heating panel as mentioned above is provided with discharge orifice;
Heat radiation layer is arranged on the extension heating panel parallel with electric component as mentioned above;
Heat radiation layer is arranged on the extension heating panel vertical with electric component as mentioned above;
Extending heating panel as mentioned above is arc-shaped curved surface, and heat radiation layer also is arranged on the arc-shaped curved surface.
Compared with prior art, the present invention has following advantage:
1, three kinds of modes of the present invention heat radiation are conducted, convection current, radiation all made full use of, radiating efficiency improves greatly, the present invention can move quickly and effectively after powerful electric component energising, the very high heat of chip moment generation, having solved junction temperature of chip gathers rapidly, cause chip temperature sharply to rise, even burn the problem of electric component.
Characteristics such as 2, the present invention has the series connection avoided, and material is integrated, and is simple in structure, easy for installation, attractive and durable, and energy-saving effect is remarkable.
[description of drawings]
Fig. 1 is the structure chart of metal substrate embodiment one of the present invention;
Fig. 2 is the structure chart of metal substrate embodiment two of the present invention;
Fig. 3 is the structure chart of metal substrate embodiment three of the present invention;
Fig. 4 is the structure chart of metal substrate embodiment four of the present invention.
[embodiment]
Be described in further detail below in conjunction with accompanying drawing and embodiments of the present invention:
Referring to Fig. 1-4, the present invention is a kind of high heat radiating metal base circuit board, comprises metal substrate 1, and the metal substrate one side is provided with the line layer that high insulation low thermal resistance material is made, and electric component 2 is electrically connected with line layer; The another side bending that at least one wing 3 of metal substrate is not installed electric component to metal substrate forms and extends heating panel 4, and extending between the heating panel has certain clearance, forms convection channel 5; Extend heating panel and be provided with heat radiation layer 6; Metal substrate is integral with the extension heating panel.Electric component is finished light source or thermal source configuration.
Line layer is set directly on the metal substrate, thermal resistance is little, use a kind of low thermal resistance material to form the heat conduction that thermal difference is quickened metal inside in the metal substrate both sides, by the heat radiation layer of the other end heat is dispersed again and caused localized temperature gradients and then produce convection current, improve radiating effect;
Metal substrate is integral with extending heating panel, and heat conduction is fast, and the efficient height does not increase any thermal resistance in the middle of the process of thermal source heat conduction, makes thermal source because the relation of thermal difference is in splendid radiating state always; Solved circuit board effectively and be connected the big problem of thermal resistance that exists with general fastening means with metal substrate; Extend heating panel and bend to different shape, increased area of dissipation;
The another side that metal substrate is not installed electric component arrives the substrate back zone in conjunction with heat radiation layer with thermal radiation, and form heat on the substrate metal two sides poor; Heat radiation layer utilizes the mode of radiation to dispel the heat.Convection channel utilizes the mode of gaseous exchange to dispel the heat; Thermal difference makes air produce convection current in the same heat radiation layer manufacturing pipe of the outside, convection channel exit use, forms conduction, radiation, the complete heat radiation approach of convection current.
Metal substrate left and right sides both wings are not all installed the another side bending of electric component to metal substrate, form to extend heating panel, and extending between the heating panel has certain clearance, forms convection channel.
The another side bending that both wings are not all installed electric component before and after the metal substrate to metal substrate forms and extends heating panel, and extending between the heating panel has certain clearance, forms convection channel.
Extend heating panel and be provided with, allow heat distributes faster in the convection channel discharge orifice 7.
See Fig. 1, embodiment one, and heat radiation layer 6 is arranged on the extension heating panel parallel with electric component 2;
See Fig. 2, embodiment one, and heat radiation layer 6 is arranged on the extension heating panel parallel and vertical with electric component 2;
See that it can be that arc-shaped curved surface is arranged that Fig. 3,4 extends heating panel, just has radian in the place of bending.See Fig. 3, embodiment three, and heat radiation layer 6 is arranged on the extension heating panel parallel with electric component 2; See Fig. 4, embodiment four, and heat radiation layer 6 is arranged on the extension heating panel parallel with electric component 2, and heat radiation layer 6 also is arranged on the arc-shaped curved surface.
Metal substrate can be copper base, aluminium base etc., and metal substrate is such such as the structure of aluminium base: aluminium base is that aluminium base copper-clad plate is a kind of metallic circuit panel material, is made up of Copper Foil, heat conductive insulating layer and metal substrate, and its structure is divided three layers:
1, line layer: be equivalent to the copper-clad plate of common PCB; 2, insulating barrier: insulating barrier is one deck low thermal resistance heat-conducting insulation material; 3, basic unit: be metal substrate, generally be aluminium or can selected copper, aluminium base copper-clad plate etc.Line layer (being Copper Foil) forms printed circuit through etching usually, and each parts of assembly are interconnected, and generally speaking, circuit layer requires to have very big current capacity, thereby should use thicker Copper Foil; The heat conductive insulating layer generally is to be made of the specific polymers that special cermacis is filled, and thermal resistance is little, and viscoelastic property is good, has the ability of resistant to thermal aging, can bear machinery and thermal stress.Metal-based layer is the supporting member of aluminium base, requires to have high-termal conductivity, and generally be aluminium sheet, also can use copper coin (wherein copper coin can provide better thermal conductivity), be suitable for conventional mechanical processing such as boring, punching and cutting.
Claims (7)
1. one kind high heat radiating metal base circuit board comprises metal substrate (1), and the metal substrate one side is provided with the line layer that high insulation low thermal resistance material is made, and electric component (2) is electrically connected with line layer; The another side bending that at least one wing of metal substrate (3) is not installed electric component to metal substrate forms and extends heating panel (4), and extending between the heating panel has certain clearance, forms convection channel (5); Extend heating panel and be provided with heat radiation layer (6); Metal substrate is integral with the extension heating panel.
2. high heat radiating metal base circuit board according to claim 1 is characterized in that described metal substrate (1) left and right sides both wings are not all installed another side bending from electric component to metal substrate, forms to extend heating panel (4).
3. high heat radiating metal base circuit board according to claim 1 is characterized in that described metal substrate (1) front and back both wings are not all installed another side bending from electric component to metal substrate, forms and extends heating panel (4).
4. according to claim 2 or 3 described high heat radiating metal base circuit boards, it is characterized in that described extension heating panel (4) is provided with discharge orifice (7).
5. according to claim 2 or 3 described high heat radiating metal base circuit boards, it is characterized in that described heat radiation layer (6) is arranged on the extension heating panel (4) parallel with electric component (2).
6. according to claim 2 or 3 described high heat radiating metal base circuit boards, it is characterized in that described heat radiation layer (6) is arranged on the extension heating panel (4) vertical with electric component (2).
7. according to claim 2 or 3 described high heat radiating metal base circuit boards, it is characterized in that described extension heating panel (4) is an arc-shaped curved surface, heat radiation layer (6) also is arranged on the arc-shaped curved surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206578845U CN201869439U (en) | 2010-12-05 | 2010-12-05 | High heat dissipation metal base circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206578845U CN201869439U (en) | 2010-12-05 | 2010-12-05 | High heat dissipation metal base circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201869439U true CN201869439U (en) | 2011-06-15 |
Family
ID=44140579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206578845U Expired - Lifetime CN201869439U (en) | 2010-12-05 | 2010-12-05 | High heat dissipation metal base circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201869439U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036470A (en) * | 2010-12-05 | 2011-04-27 | 新高电子材料（中山）有限公司 | Metal base circuit board with low thermal resistance and high heat dissipation |
| CN108370642A (en) * | 2015-12-02 | 2018-08-03 | 株式会社电装 | Have the electronic component module and its manufacturing method of the substrate and heat sink of installation electronic unit |
| CN110290635A (en) * | 2019-07-26 | 2019-09-27 | 中国科学院半导体研究所 | A low thermal resistance circuit board |
-
2010
- 2010-12-05 CN CN2010206578845U patent/CN201869439U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036470A (en) * | 2010-12-05 | 2011-04-27 | 新高电子材料（中山）有限公司 | Metal base circuit board with low thermal resistance and high heat dissipation |
| CN102036470B (en) * | 2010-12-05 | 2012-11-21 | 新高电子材料（中山）有限公司 | Low-thermal-resistance high-heat-dissipation metal-based circuit board |
| CN108370642A (en) * | 2015-12-02 | 2018-08-03 | 株式会社电装 | Have the electronic component module and its manufacturing method of the substrate and heat sink of installation electronic unit |
| CN110290635A (en) * | 2019-07-26 | 2019-09-27 | 中国科学院半导体研究所 | A low thermal resistance circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20110615 Effective date of abandoning: 20130227 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20110615 Effective date of abandoning: 20130227 |
|
| RGAV | Abandon patent right to avoid regrant |