CN102781164B - Novel special circuit board for LED (light-emitting diode) lighting fixture - Google Patents

Novel special circuit board for LED (light-emitting diode) lighting fixture Download PDF

Info

Publication number
CN102781164B
CN102781164B CN201210268734.9A CN201210268734A CN102781164B CN 102781164 B CN102781164 B CN 102781164B CN 201210268734 A CN201210268734 A CN 201210268734A CN 102781164 B CN102781164 B CN 102781164B
Authority
CN
China
Prior art keywords
layer
led
circuit
thermal insulation
heat dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210268734.9A
Other languages
Chinese (zh)
Other versions
CN102781164A (en
Inventor
马志辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WUHAN BRILLIANT TECHNOLOGY CO LTD
Original Assignee
WUHAN BRILLIANT TECHNOLOGY CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUHAN BRILLIANT TECHNOLOGY CO LTD filed Critical WUHAN BRILLIANT TECHNOLOGY CO LTD
Priority to CN201210268734.9A priority Critical patent/CN102781164B/en
Publication of CN102781164A publication Critical patent/CN102781164A/en
Application granted granted Critical
Publication of CN102781164B publication Critical patent/CN102781164B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The invention relates to a novel special circuit board for an LED (light-emitting diode) lighting fixture, which comprises a circuit layer, an insulated heat conduction layer and a heat radiation layer, wherein the circuit layer is a metal layer and is used for electrical connection; the insulated heat conduction layer is used for cutting off the electrical connection between the circuit layer and the heat radiation layer; the heat radiation layer is made of a material having good heat conduction performance; the bottom surface of the circuit layer is connected with the upper surface of the insulated heat conduction layer; and the bottom surface of the insulated heat conduction layer is connected with the upper surface of a bottom plate of the heat radiation layer. The invention has the following beneficial effects: (1) the structure of the LED lighting fixture is simplified, and the process difficulty is lowered; (2) the circuit board is simple in production process, low in manufacturing cost and high in market adaptability; (3) the heat radiation problem of the LED lighting fixture is effectively solved, and the heat resistance of the LED lighting fixture is effectively reduced; (4) the junction temperature of an LED chip is lowered, and the service life of the LED is prolonged; and (5) the circuit board is high in safety, and is less prone to be subjected to electric leakage.

Description

A kind of LED lighting special circuit plate
Technical field
The present invention relates to a kind of circuit board, particularly a kind of wiring board for LED lighting.
Background technology
LED is because the advantages such as its volume is little, power consumption is low, long service life have obtained being widely used in daily life.At present, the production stage of LED light fixture comprises: pre-designed wiring board; LED light fixture is welded on described wiring board; Driver is connected with described connecting plate, the wiring board and the driver that have welded LED light fixture is separately fixed on lamp radiator or lamp outer casing simultaneously.
Because LED lamp pearl can produce a large amount of heats in the course of the work, how solving LED heat dissipation problem is that the difficult problem overcoming is badly in need of in current each manufacturer.
And the problem that currently used method directly causes has: (1) LED light fixture radiating efficiency is not high; (2) LED radiator volume is excessive; (3) LED light fixture light decay is large; (4) do not reach designing requirement the useful life of LED light fixture; (5) LED light fixture manufacturing cost is high, market adaptability is poor.
In addition, LED light fixture is electric light source, becomes area source after ordered arrangement, for the needs that meet heat radiation are again by LED Design of Luminaires globulate or fluorescent tube shape, more increased LED light fixture volume, limited the range of application of LED light fixture.
Do not have in the market specially for LED characteristic and can better solve the Special circuit board of LED heat dissipation problem, the special circuit plate that LED light fixture uses is still continued to use the traditional circuit-board manufacturing process of other electronic products, mode by traditional welding is welded on LED lamp pearl and LED driver part respectively and on different wiring boards, forms lamp plate and driver, again LED lamp plate and driving are electrically connected, normally work thereby realize LED.Conventionally the fixed form of LED lamp plate and lamp radiator or shell be inlay, heat-conducting silicone grease is bonding, bolted, cannot realize external force compacting, therefore cause between LED lamp plate and radiator or shell and produce bubble, increase widely thermal resistance, the thermal release producing when cannot quickly and efficiently LED lamp pearl be worked, cause LED chip to form junction temperature and raise, reduce LED useful life.What the method adopted is all discrete device, and production technology is comparatively complicated, and production cost is also higher.Meanwhile, LED wiring board is fixed in the shell of light fixture during by this welding or another kind of common gummed mode, the stability of connection is not strong, easily leaks electricity, and the fail safe of equipment is had a strong impact on.
Summary of the invention
For overcome above-mentioned LED light fixture complex process, cost higher, cannot solve LED light fixture heat dissipation problem, reduce the problems such as LED useful life, the invention discloses a kind of LED lighting special circuit plate, comprise: circuit layer, thermal insulation layer and heat dissipating layer, is characterized in that:
Described circuit layer is metal level, for the electrical connection between LED lamp pearl, between LED driver part, between LED lamp pearl and LED driver part and between LED driver part and power supply;
Described thermal insulation layer, for cutting off the electrical connection between circuit layer and heat dissipating layer;
Described heat dissipating layer is the material with good heat conductive performance, and its one side is as the carrier of accepting LED lamp pearl and driving element for printed wiring, and the shell that another side is light fixture is for heat radiation;
Its annexation is:
The bottom surface of described circuit layer is connected above with described thermal insulation layer, and the bottom surface of described thermal insulation layer is connected above with described heat dissipating layer base plate.
Metal level in described circuit layer can be one deck, can be also multilayer.When described metal level is multilayer, isolate by thermal insulation layer between layers; While needing to be electrically connected between described metal level, get through hole filled conductive material in the relevant position of thermal insulation layer; LED lamp pearl and LED driver part can be arranged on same layer circuit layer, also can be arranged on the circuit layer of different layers.
Described heat dissipating layer can use aluminium alloy, magnesium alloy, copper, pottery.
Described heat dissipating layer is thereby that zigzag increases area of dissipation as lamp outer casing.
Described heat dissipating layer is thereby that fish scale-shaped increases area of dissipation as lamp outer casing.
By said structure, a kind of Novel LED lighting lamp of the present invention is realized following technique effect with wiring board:
(1) structure of simplification LED light fixture, has reduced technology difficulty;
(2) production technology is simple, cheap for manufacturing cost, and market adaptability is strong;
(3) effectively solve the heat dissipation problem of LED light fixture, effectively reduce the thermal resistance of LED light fixture;
(4) junction temperature of reduction LED chip, the useful life of having improved LED;
(5) safe, difficult electric leakage.
Detailed content of the present invention can obtain by explanation described later and institute's accompanying drawing.
Brief description of the drawings
Fig. 1 is the vertical view of a kind of LED lighting wiring board of the present invention;
Fig. 2 is the front view of a kind of LED lighting wiring board of the present invention;
In figure, 1-circuit layer, 2-thermal insulation layer, 3-heat dissipating layer, 4-LED lamp pearl, 5-LED driving element.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is further described, following examples are only for technical scheme of the present invention is more clearly described, and can not limit the scope of the invention with this.
As shown in Figure 1 to Figure 2, the concrete technical scheme of implementing of the present invention is:
A kind of LED lighting special circuit plate, comprising: circuit layer 1, thermal insulation layer 2 and heat dissipating layer 3, is characterized in that:
Described circuit layer 1 is metal level, for the electrical connection between LED lamp pearl 4, between LED driver part 5, between LED lamp pearl 4 and LED driver part 5 and between LED driver part 5 and power supply;
Described thermal insulation layer 2, for cutting off the electrical connection between circuit layer 1 and heat dissipating layer 3;
Described heat dissipating layer 3 is for having the material of good heat conductive performance, and its one side is as the carrier of accepting LED lamp pearl 4 and driving element for printed wiring, and the shell that another side is light fixture is for heat radiation;
Its annexation is:
The bottom surface of described circuit layer 1 is connected above with described thermal insulation layer 2, and the bottom surface of described thermal insulation layer 2 is connected above with described heat dissipating layer 3 base plates.
Metal level in described circuit layer 1 can be one deck, can be also multilayer.When described metal level is multilayer, isolate by thermal insulation layer 2 between layers; While needing to be electrically connected between described metal level, get through hole filled conductive material in the relevant position of thermal insulation layer 2; LED lamp pearl 4 and LED driver part 5 can be arranged on same layer circuit layer 1, also can be arranged on the circuit layer 1 of different layers.
Described heat dissipating layer 3 can use aluminium alloy, magnesium alloy, copper, pottery.
Described heat dissipating layer 3 is thereby that zigzag increases area of dissipation as lamp outer casing.
Described heat dissipating layer 3 is thereby that fish scale-shaped increases area of dissipation as lamp outer casing.
It is evident that above description and to record be only for example instead of in order to limit disclosure of the present invention, application or use.Although described in an embodiment and be described in the drawings embodiment, but the present invention does not limit by accompanying drawing example and the optimal mode thought at present of conduct of describing in an embodiment to implement the specific examples of instruction of the present invention, scope of the present invention will comprise any embodiment that falls into specification above and appended claim.

Claims (2)

1. a LED lighting special circuit plate, comprising: circuit layer, thermal insulation layer and heat dissipating layer, is characterized in that:
Described circuit layer is metal level, for the electrical connection between LED lamp pearl, between LED driver part, between LED lamp pearl and LED driver part and between LED driver part and power supply;
Described thermal insulation layer, for cutting off the electrical connection between circuit layer and heat dissipating layer;
Described heat dissipating layer is the material with good heat conductive performance, and its one side is as the carrier of accepting LED lamp pearl and driving element for printed wiring, and the shell that another side is light fixture is for heat radiation;
Its annexation is:
The bottom surface of described circuit layer is connected above with described thermal insulation layer, and the bottom surface of described thermal insulation layer is connected above with described heat dissipating layer base plate;
Described heat dissipating layer is selected from one in aluminium alloy, magnesium alloy, copper, pottery or is multiple;
Described heat dissipating layer is zigzag or fish scale-shaped as the another side of lamp outer casing;
Described circuit layer is multilayer, isolates between layers by thermal insulation layer.
2. a kind of LED lighting special circuit plate according to claim 1, is characterized in that, described while being electrically connected between layers, gets through hole filled conductive material in the relevant position of thermal insulation layer; LED lamp pearl and LED driver part can be arranged on same layer circuit layer, also can be arranged on the circuit layer of different layers.
CN201210268734.9A 2012-07-31 2012-07-31 Novel special circuit board for LED (light-emitting diode) lighting fixture Expired - Fee Related CN102781164B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210268734.9A CN102781164B (en) 2012-07-31 2012-07-31 Novel special circuit board for LED (light-emitting diode) lighting fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210268734.9A CN102781164B (en) 2012-07-31 2012-07-31 Novel special circuit board for LED (light-emitting diode) lighting fixture

Publications (2)

Publication Number Publication Date
CN102781164A CN102781164A (en) 2012-11-14
CN102781164B true CN102781164B (en) 2014-12-03

Family

ID=47125864

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210268734.9A Expired - Fee Related CN102781164B (en) 2012-07-31 2012-07-31 Novel special circuit board for LED (light-emitting diode) lighting fixture

Country Status (1)

Country Link
CN (1) CN102781164B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104411086A (en) * 2014-11-04 2015-03-11 广东明路电力电子有限公司 Power PCB and processing method thereof
CN105870301A (en) * 2016-06-08 2016-08-17 广州硅能照明有限公司 LED (Light Emitting Diode) optical engine packaging structure and processing method thereof
CN106122783A (en) * 2016-06-24 2016-11-16 安庆市奥立德光电有限公司 A kind of LED light source board
CN105977364A (en) * 2016-07-20 2016-09-28 广州硅能照明有限公司 Multilayer LED light engine structure and processing method thereof
CN108679583A (en) * 2018-04-08 2018-10-19 伍连彬 A kind of lighting apparatus and its manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201349384Y (en) * 2008-12-24 2009-11-18 彭泰企业有限公司 High conduction and heat dissipation aluminum coated metal substrate structure
CN201781689U (en) * 2010-07-13 2011-03-30 海洋王照明科技股份有限公司 Led circuit board
CN102469691A (en) * 2010-11-10 2012-05-23 三星电机株式会社 Printed circuit board and method of manufacturing the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101077378B1 (en) * 2010-06-23 2011-10-26 삼성전기주식회사 Heat-radiating substrate and manufacturing method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201349384Y (en) * 2008-12-24 2009-11-18 彭泰企业有限公司 High conduction and heat dissipation aluminum coated metal substrate structure
CN201781689U (en) * 2010-07-13 2011-03-30 海洋王照明科技股份有限公司 Led circuit board
CN102469691A (en) * 2010-11-10 2012-05-23 三星电机株式会社 Printed circuit board and method of manufacturing the same

Also Published As

Publication number Publication date
CN102781164A (en) 2012-11-14

Similar Documents

Publication Publication Date Title
CN102907183B (en) For the plating systems of LED
CN101296564B (en) Light source module group with excellent heat dispersion performance
WO2013090176A1 (en) Light emitting system
CN101539279B (en) LED module
CN1953164A (en) Encapsulation method and structure of light emitting diode
CN203744086U (en) Bulb with light emitting diode flexible lamp filament
CN101776248B (en) Lamp and illumination device thereof
CN201803246U (en) High-efficiency radiating light-emitting diode (LED) street lamp
CN201909192U (en) Improved LED (light-emitting diode) module
CN201918430U (en) Integral heat dissipation structure for LED substrate
CN104075142A (en) Led lamp
TW201250154A (en) Structure of plastic heat sink for LED bulb and method of making the same
CN203481273U (en) LED light source module based on AlSiC composite substrate
CN103608622A (en) Heat sink assembly for opto-electronic components and a method for producing the same
CN102889480A (en) Three-dimensional luminous light emitting diode (LED) lamp bulb module and manufacturing method thereof
US20110272179A1 (en) Printed Circuit Board with Embossed Hollow Heatsink Pad
CN101980389B (en) Flat plate-type ceramic package radiating module for high-power LED and manufacturing method thereof
CN102790161B (en) Light-emitting diode carrier
CN102135248A (en) Liquid metal heat dissipation-based high-power LED (Light Emitting Diode) light source with threaded connection structure
CN104421682B (en) LED light source module and the LEDbulb lamp comprising the module
CN101182919A (en) High power LED lamp
CN104896330A (en) Led light source module
CN101752354A (en) Packaging substrate structure for LED and production method thereof
CN201149869Y (en) LED encapsulation structure
CN102062306A (en) LED (Light Emitting Diode) strip, manufacturing method thereof and LED tube

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141203

Termination date: 20180731