CN201897096U - Heat radiating structure of LED (light-emitting diode) lamp - Google Patents
Heat radiating structure of LED (light-emitting diode) lamp Download PDFInfo
- Publication number
- CN201897096U CN201897096U CN2010205337517U CN201020533751U CN201897096U CN 201897096 U CN201897096 U CN 201897096U CN 2010205337517 U CN2010205337517 U CN 2010205337517U CN 201020533751 U CN201020533751 U CN 201020533751U CN 201897096 U CN201897096 U CN 201897096U
- Authority
- CN
- China
- Prior art keywords
- heat
- led
- heat radiating
- conducting medium
- radiating shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
A heat radiating structure of an LED (light-emitting diode) lamp comprises a heat radiating shell with heat-conducting property, a preformed copper foil circuit and an LED electrically connected with the copper coil circuit, wherein the copper coil circuit is directly adhered to the heat radiating shell through a heat-conducting medium film. The heat radiating structure has the obvious effects that as the preformed copper coil circuit is closely adhered to the heat radiating shell through the heat-conducting medium film, the LED is die bonded on the copper coil circuit, the heat-conducting medium film is not only used as an insulating material but also can be used as a heat-conducting and bonding material, the heat of the LED can be efficiently and quickly transferred to the heat radiating shell for dispersing, the heat radiating effect is good, and the quality and the service life of the lamp are improved; meanwhile, the production process can be greatly simplified, the cost is saved, the production efficiency is improved, and the automatic production of the lamps can be easily realized.
Description
Technical field
The utility model belongs to technical field of lamps, specifically is meant a kind of LED lamp cooling structure.
Background technology
The LED lamp is as a kind of emerging lighting apparatus, and it is widely used in every field with energy-conservation highlighted characteristic.
The led light source and the heat abstractor of existing LED lighting are two groups of independently parts, must be in the making with connecting material they combinations, just can make a complete LED lamp, there is following defective in this series products LED lamp: the one, in the LED encapsulation process, adopt multiple material, for example pliability wiring board, thermal paste form the multilayered thermally-conductive layer, cause LED thermal resistance height, the light fixture weak heat-dissipating influences light fixture service life; The 2nd, adopt the multilayered thermally-conductive layer, the production process complexity, material requested is many, production cost height, and the difficult automated production that realizes light fixture.
Simultaneously, the heat-conducting medium film that has good heat conductive, insulation effect along with development of science and technology is also more common, and it is the problem of existing scientific research personnel's research that this class heat-conducting medium film is fully used.
The utility model content
Technical problem to be solved in the utility model provides a kind of good heat dissipation effect, LED lamp cooling structure easy to make.
For solving the problems of the technologies described above, the utility model is realized by the following technical solutions:
Design a kind of LED lamp cooling structure, comprise a LED who has the radiating shell of heat conductivility, preformed copper foil circuit and be electrically connected with copper foil circuit, described copper foil circuit directly is affixed on the radiating shell by the heat-conducting medium film.
As the improvement to such scheme, described heat-conducting medium film wire mark is on radiating shell, and the heat-conducting medium film is an anisotropy thermosetting heat-conducting glue.
In order to be beneficial to heat radiation, described radiating shell is copper housing or aluminium casing or magnalium housing or ceramic shell or magnesium copper shell.
The utlity model has following remarkable result:
The utility model LED lamp cooling structure will be close to prefabricated copper foil circuit on the radiating shell by the heat-conducting medium film, again that LED is solid brilliant on copper foil circuit, the heat-conducting medium film is promptly as insulating materials, again as heat conduction, adhesives, make the heat of LED can efficiently, express delivery conduct on the radiating shell lost, good heat dissipation effect, the quality and the service life that has increased light fixture of light fixture have been improved, simultaneously also can simplify production process greatly, save cost, enhance productivity, also realize the automated production of such light fixture easily.
Description of drawings
Accompanying drawing 1 is the utility model embodiment decomposition texture schematic diagram.
The specific embodiment
For the ease of those skilled in the art's understanding, the utility model structural principle is further described in detail below in conjunction with specific embodiment and accompanying drawing:
As shown in Figure 1, present embodiment disclosed is a kind of good heat dissipation effect, LED lamp cooling structure easy to make.This LED light fixture comprises radiating shell 1, preformed copper foil circuit 3 with heat conductivility and the LED4 that is electrically connected with copper foil circuit 3, and wherein, this copper foil circuit 3 directly is affixed on the radiating shell 1 by heat-conducting medium film 2.But on radiating shell 1, and heat-conducting medium film 2 is an anisotropy thermosetting heat-conducting glue to this heat-conducting medium film 2 as insulation, heat conduction, adhesives wire mark.When LED4 worked, the heat that is sent conducted on the radiating shell 1 by heat-conducting medium film 2 and scatters and disappears, and does not have thermoresistance layer compared to existing technology, has better radiating effect.
The radiating shell 1 that the utility model adopted can be copper housing or aluminium casing or magnalium housing or ceramic shell or magnesium copper shell.
During making, at first can adopt traditional wire mark or multiple film mode that heat-conducting medium film 2 is fixed on the radiating shell 1, adopt multiple film mode that copper foil circuit 3 is fixed on the heat-conducting medium film 2 then, at last LED4 is packaged in copper foil circuit plate 3.
Making of the present utility model can realize by adopting automation equipment, therefore the LED lamp cooling structure under this version can be realized mass automatic production, compare with the single Assembling Production of existing craft and to have simplified production process greatly, saved cost, production efficiency is greatly improved.
It more than is the preferable implementation of the utility model; in addition; there is other implementation down in the utility model that coexists design; need to prove; the preferred version that the foregoing description is only realized for the utility model; and non-limiting exhaustive, under the prerequisite that does not break away from the utility model design, any conspicuous replacement is all within the utility model protection domain.
Claims (3)
1. LED lamp cooling structure, comprise a LED (4) who has the radiating shell (1) of heat conductivility, preformed copper foil circuit (3) and be electrically connected with copper foil circuit, it is characterized in that: described copper foil circuit directly is affixed on the radiating shell by heat-conducting medium film (2).
2. LED lamp cooling structure according to claim 1 is characterized in that: described heat-conducting medium film wire mark is on radiating shell, and the heat-conducting medium film is an anisotropy thermosetting heat-conducting glue.
3. according to the arbitrary described LED lamp cooling structure of claim 1～2, it is characterized in that: described radiating shell is copper housing or aluminium casing or magnalium housing or ceramic shell or magnesium copper shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205337517U CN201897096U (en) | 2010-09-15 | 2010-09-15 | Heat radiating structure of LED (light-emitting diode) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205337517U CN201897096U (en) | 2010-09-15 | 2010-09-15 | Heat radiating structure of LED (light-emitting diode) lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201897096U true CN201897096U (en) | 2011-07-13 |
Family
ID=44255003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205337517U Expired - Fee Related CN201897096U (en) | 2010-09-15 | 2010-09-15 | Heat radiating structure of LED (light-emitting diode) lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201897096U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013097314A1 (en) * | 2011-12-31 | 2013-07-04 | 苏州晶品光电科技有限公司 | Led array light source without circuit substrate |
| CN103791258A (en) * | 2012-10-31 | 2014-05-14 | 郭青磊 | LED lamp structure |
-
2010
- 2010-09-15 CN CN2010205337517U patent/CN201897096U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013097314A1 (en) * | 2011-12-31 | 2013-07-04 | 苏州晶品光电科技有限公司 | Led array light source without circuit substrate |
| CN103791258A (en) * | 2012-10-31 | 2014-05-14 | 郭青磊 | LED lamp structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101980389B (en) | Flat plate-type ceramic package radiating module for high-power LED and manufacturing method thereof | |
| CN102709278A (en) | Plane thin sheet type LED (Light-Emitting Diode) array light source of fluorescent thin film | |
| CN101482233A (en) | LED spot light | |
| CN202469553U (en) | LED two-dimensional array light source having flexible circuit board | |
| CN102781164B (en) | Novel special circuit board for LED (light-emitting diode) lighting fixture | |
| CN102162583A (en) | LED lamp manufacturing method | |
| CN201655852U (en) | LED backlight light bar encapsulated by adopting surface mount technology | |
| CN102593317B (en) | High-power high-brightness light-emitting diode (LED) light source packaging structure and packaging method thereof | |
| CN201897096U (en) | Heat radiating structure of LED (light-emitting diode) lamp | |
| CN103296184A (en) | Manufacturing method for light-emitting diode (LED) lamp strip using sapphire as chip support | |
| CN201608205U (en) | Novel LED packaging circuit board | |
| CN202712175U (en) | Fluorescent film planar sheet type LED array light source | |
| CN102012010A (en) | LED lamp heat radiating structure | |
| CN202487666U (en) | Packaging structure for high-power LEDs | |
| CN202473912U (en) | LED array light source without circuit substrate | |
| CN201416866Y (en) | Plate type radiator structure used for LEDs | |
| CN201853745U (en) | High-power light emitting diode (LED) ceramic heat sink | |
| CN203131523U (en) | Light-emitting diode (LED) light source module with heat conduction column | |
| CN202633383U (en) | Integrally-packaged light-emitting diode (LED) illumination lamp | |
| CN201344395Y (en) | LED spot light | |
| CN202712177U (en) | Two-sided light emitting plane sheet type LED package structure | |
| CN102376659A (en) | Radiating structure of heat source | |
| CN201475950U (en) | Heat dissipation substrate of LED lamp | |
| CN203298237U (en) | High-efficiency heat dissipating power-supply-integrated LED (light emitting diode) light source module | |
| CN203596351U (en) | LED-COB (chip on board) light source |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110713 Termination date: 20140915 |
|
| EXPY | Termination of patent right or utility model |