CN101980389B - Flat plate-type ceramic package radiating module for high-power LED and manufacturing method thereof - Google Patents
Flat plate-type ceramic package radiating module for high-power LED and manufacturing method thereof Download PDFInfo
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Abstract
The invention provides a flat plate-type ceramic package radiating module with a three-dimensional wiring structure and a radiating groove and provides an integrated solution with high efficiency and high reliability for package and/or thermal management of a high-power light emitting diode (LED). The characteristics of insulation and heat conduction which need to be realized respectively through two materials in the traditional scheme are realized at the same time according to the thermoelectrical separation characteristic of a ceramic material by using an integrated ceramic-metal composite material. The flat plate-type ceramic package radiating module has the advantages that: 1, the bottleneck of heat dissipation is solved, so that heat is smoothly conducted to the whole radiating module from an LED chip and is effectively dissipated to air through air natural convection formed by the radiating groove, and reduction in the temperature of the LED chip is facilitated; and 2, a flat plate-type structure with uniform specification is convenient to machine and operate and contributes to mass production and application.
Description
Technical field
The present invention relates to the ceramic packaging substrate of a kind of LED, especially a kind of heat sink and manufacturing approach of ceramic heat-dissipating that is applicable to great power LED.
Background technology
Because nearly two one-tenth residential electricity consumption is used to illumination, and conventional incandescent can only be converted into luminous energy with electric energy with about 5% poor efficiency, the energy-saving illumination technology of high-energy transformation efficiency worldwide all receives special attention so have more.Wherein, the LED technology is attracting most attention because of it possesses luminous efficiency height, long service life, driving voltage is low, fail safe good, switching response speed is fast, advantages of environment protection at present on the market, surplus in the of nearest ten in the period of also develop rapidly of technical merit.
Although the LED lighting technology has outstanding advantage and bright application prospect, up to now, it still is subject to cost and some technical problems in the large-scale commercial applications application facet.Wherein, heat management is an epochmaking technical task during great power LED is used, and it is related to the reliability and the luminous efficiency of great power LED.
Because the place that LED carries out Conversion of energy is on the narrow and small interface of the p-n junction of light-emitting semiconductor thin film; Therefore; Although the overall power of single LEDs device is smaller, the power density on luminescence chip is but very big, and in the LED course of work; Fail to be converted into fully that part of electric energy of luminous energy; Be equivalent to the power density of＞300W/cm2 in the heating chip zone (can reference: A.Christensen and S.Graham, Thermal Effects in Packaging High Power Light Emitting Diode Arrays.Appl.Thermal Eng.29,364 (2009) .).And according to bibliographical information; When the working temperature of led chip rises to 50 ℃ from 40 ℃; Its working life might shorten to 18,000 hours from 42,000 hours at most (can reference: N.Narendran and Y.Gu; Life of LED-Based White Light Sources.IEEE/OSA J.Display Technol.1,167 (2005) .); And, along with chip temperature further improves, also a series of problems such as provisional light decay, aberration will appear in the course of the work.It is thus clear that excessive temperature has totally unfavorable influence to LED; In addition, because the output brightness of simple grain LED can't be compared with conventional light source, often many LED are integrated in the actual illumination application; Concentrate luminous lighting; So, entire system will produce high temperature, and heat-sinking capability is also had more harsh requirement.
The general scheme of great power LED cooling is as shown in Figure 1 in the industry at present: the LED of manufacturer lamp grain 4 is welded on the circuit pattern on PCB3 surface, and then is bonded at pcb board 3 usefulness heat-conducting glues 2 on the metal heat sink 1; Fig. 2 is the side schematic view of this combining structure, and wherein, the effect of pcb board 3 provides circuit, and the effect of metal heat sink 1 is to receive the heat that LED produces and in air, distribute.In this general scheme; PCB and heat-conducting glue can constitute the bottleneck of heat transferred: because the thermal conductivity of the resin material (like FR4) of manufacturing PCB is not higher than 1W/mK usually; So even if heat sink material uses the metal of high heat conductance; Like aluminium (the room temperature thermal conductivity is 237W/mK) even copper (the room temperature thermal conductivity is 401W/mK), also can't solve the heat dissipation problem of great power LED well.In recent years, also there is manufacturer to adopt more high performance MCPCB (metal core printed circuit board, metal-core printed circuit board) to replace common PCB and fixes LED lamp grain; But the thermal conductivity of MCPCB surface film oxide usually also only between 2-5W/mK (can reference: Li Huaping, Chai Guangyue, Peng Wenda and ox are foolish stupid; " encapsulation of great power LED and heat-radiating substrate research thereof "; " semiconductor optoelectronic ", 28,47 (2007).), it is thus clear that it in actual use, remains heat radiation bottleneck place.
As shown in fig. 1 in addition, at present universal scheme be packaged LED lamp grain be welded to heat sink above, its existing problem is: heat sink structure complicacy, and special-shaped shape is unfavorable for large-scale production in commercial production; And the present employed method of manufacturer is that encapsulation and the welding sequence on heat sink with LED lamp grain separately carries out, rather than is potted directly into led chip and has on encapsulation heat sink, thereby its complex production process, and cost is higher.
Summary of the invention
It is strong to the purpose of this invention is to provide a kind of heat-sinking capability, slab construction, and LED encapsulation is with heat-radiating integrated, ceramic packaging heat radiation module and this ceramic packaging that the is beneficial to production manufacture method of module of dispelling the heat.
A kind of great power LED is with flat ceramic packaging heat radiation module; Has multilayer ceramic structure; This multi-layer ceramics is mainly by no groove flat layer and with groove plane layer mutual range upon range of composition; Wherein the groove of with groove plane layer has the inlet, outlet that supplies circulation of air to carry out heat exchange; Said no groove flat layer and with groove plane layer are processed by alumina ceramic material or aluminium nitride ceramics material, and the thermal conductivity of high temperature alumina and aluminium nitride ceramics material is respectively 20-25W/mK and 200-250W/mK, can effectively improve the heat-sinking capability of module; Simultaneously, compare with equal-volume is heat sink, groove structure has increased area of dissipation.
Further improvement as such scheme; Described multi-layer ceramics is equipped with high heating column along thickness direction; Broad ways is folded with high heat-conducting plate, and high heat-conducting plate contacts with high heating column, and the heat that high heating column is used for led chip is produced is derived; High heating column and high heat-conducting plate are formed by fillings such as metal such as tungsten, molybdenum, silver or copper, are used to strengthen vertical heat-transfer effect of module.
The upper and lower ceramic plane in the above-mentioned multi-layer ceramics outside and the interior ceramic plane of groove are provided with and the contacted high heat conduction and heat radiation plate of high heating column.High heat conduction and heat radiation plate is used for the heat cross conduction that high heating column is derived is come out, and the heat that simultaneously conduction is come out looses in air; Wherein high heat conduction and heat radiation plate is by tungsten, molybdenum, silver or firm the forming attached to ceramic surface of copper metal, and the horizontal heat-transfer effect that is used for strengthening module is beneficial to the heat that high heating column and high heat-conducting plate are derived simultaneously and looses to outside air.
As the further improvement of such scheme, the chip Chip Area that is attached with at least one group of led chip encapsulation base and matches on the superiors' ceramic plane of said multi-layer ceramics; Or at least one group of LED lamp grain welding applications circuit and the lamp grain Chip Area that matches; Adopt LED directly to be encapsulated in the structure above the module, reduced the heat radiation thermal resistance, reduced that simultaneously LED encapsulation base or LED lamp grain welding applications circuit are fixed on heat sink this operation that goes up once more.
Above-mentioned great power LED is characterized in that comprising the steps: with the manufacturing approach of flat ceramic packaging heat radiation module
The present invention compared with prior art has following characteristics:
1, thermal diffusivity is good; Great power LED of the present invention uses flat ceramic packaging heat radiation module base material to be aluminium oxide (Al2O3) or aluminium nitride (AlN) pottery; Thermal conductivity is high; And module vertically be provided with tungsten (W), molybdenum (Mo), silver (Ag) or copper metal filled high heating column auxiliary heat dissipations such as (Cu), strengthen heat sink vertical heat conduction; Laterally be provided with simultaneously tungsten (W), molybdenum (Mo), silver (Ag) or copper metals such as (Cu) at module adhere to high heat conduction and heat radiation plate auxiliary heat dissipation, strengthen heat sink horizontal heat conduction and heat radiation; In addition, the heat sink encapsulation that direct packaged chip is arranged has reduced the bottleneck thermal resistance of LED packaged chip and heat sink welding; Therefore, heat conduction and radiating effect that the flat ceramic packaging of great power LED of the present invention heat radiation module can integrated, comprehensive enhancing led chip, heat-sinking capability is remarkable;
2, dull and stereotyped many plough groove types structure of the present invention's employing, volume is little, and area of dissipation is big; Being easy to industry installs and uses; The applied chimney principle of plough groove type structure is strengthened cross-ventilation, has improved and has waited the radiating efficiency under the area of dissipation situation; And the plough groove type structure has also increased with the heat sink area of dissipation of volume, improves radiating effect;
3, the plate armature of the present invention's employing helps heat sink large-scale industrialization production, also helps the industrial applications of final products.；
4, led chip can directly encapsulate on heat sink, has reduced in the current production process that led chip is encapsulated back and heat sink this operation of welding once more, has simplified production procedure, has reduced production cost.
To sum up visible, great power LED provided by the present invention possesses heat dispersion is preferably arranged with flat heat radiation module, and it is being applied on the great power LED, can improve led chip and reach the problem that the life-span descends greatly because of the caused light decay that generates heat; And the present invention has simplified heat sink structure, helps installing and using and large-scale industrial production, also helps the large-scale industrialization production of LED, has reduced production process, has reduced production cost.
Description of drawings
Further explain below in conjunction with accompanying drawing and embodiment:
Fig. 1 is the existing heat sink fractionation structural representation of great power LED;
Fig. 2 is the existing heat sink integrally-built end view of great power LED;
Fig. 3 is the overall structure cutaway view of the embodiment of the invention one;
Fig. 4 is the overall structure vertical view of the embodiment of the invention one;
Fig. 5 is the overall structure upward view of the embodiment of the invention one;
Fig. 6 is the overall structure cutaway view of the embodiment of the invention two;
Fig. 7 is the overall structure vertical view of the embodiment of the invention two;
Fig. 8 is the overall structure upward view of the embodiment of the invention two;
Fig. 9 is the overall structure cutaway view of the embodiment of the invention three;
Figure 10 is the overall structure vertical view of the embodiment of the invention three;
Figure 11 is the overall structure upward view of the embodiment of the invention three;
Figure 12 is for setting up the structural representation of lamp grain welding applications circuit and lamp grain Chip Area among the present invention.
Embodiment
With reference to Fig. 9 and embodiment three shown in Figure 11; A kind of great power LED provided by the present invention is with flat ceramic packaging heat radiation module, and this module is made up of no groove flat layer 1 and with groove plane layer 2 mutual cross layered multilayer ceramic structures, wherein; The groove of with groove plane layer 2 has air inlet and gas outlet; Can make gas communication and carry out heat exchange, and groove can increase the area that contacts with air, the radiating efficiency of module under the raising equal volume; In addition, described no groove flat layer 1 and with groove plane layer 2 are processed by alumina ceramic material or aluminium nitride ceramics material, and the thermal conductivity of aluminium oxide and aluminium nitride ceramics material is respectively 20-25W/mK and 200-250W/mK, has the higher capacity of heat transmission.
As preferred embodiment, on the superiors' ceramic plane of said multi-layer ceramics directly firm attachment LED is arranged, can be at least one group of led chip encapsulation base 5 and the chip Chip Area 6 that matches.LED directly is encapsulated in above the module, has reduced the heat radiation thermal resistance, reduced that simultaneously LED encapsulation base 5 or LED lamp grain welding applications circuit 5 are fixed on heat sink this operation that goes up once more.
With reference to Fig. 3 to first kind of embodiment shown in Figure 5; Same; It has by no groove flat layer 1 and with groove plane layer 2 mutual cross layered multilayer ceramic structures, and the groove of with groove plane layer 2 has air inlet and gas outlet, and no groove flat layer 1 and with groove plane layer 2 are processed by alumina ceramic material or aluminium nitride ceramics material; Same, can also on the superiors' ceramic plane, directly adhere to the structure that LED is installed: led chip encapsulation base 5 and Chip Area 6.
In the present embodiment; The overlapped way of no groove flat layer 1 and with groove plane layer 2 is: the no groove flat layer 1 of stack respectively up and down of a with groove plane layer 2, form one group of multi-layer ceramics, and multi-layer ceramics is stack combinations successively again; Become module; This external should the basis on, described multi-layer ceramics is equipped with high heating column 7 along thickness direction, the heat that high heating column 7 is used for producing when led chip worked exports to the below by the superiors; And being provided with the high heat-conducting plate 3 that contacts high heating column 7 at Width along ceramic layer, high heat-conducting plate 3 is organized the structure between multi-layer ceramics for being located in each, and its area shape is identical with the area shape of multi-layer ceramics, is beneficial to heat dispersing; High heating column 7 forms by tungsten, molybdenum, silver or copper are metal filled with high heat-conducting plate 3, is used to strengthen vertical heat-transfer effect of module, so that heat is transmitted between ceramic layer fast.
And; In the ceramic plane that multi-layer ceramics contacts with outside air, comprise last ceramic plane 4, the ceramic plane 8, and the interior ceramic plane 9 of above-mentioned groove down in the multi-layer ceramics outside; Also can set up and high heating column 7 contacted high heat conduction and heat radiation plates; This high heat conduction and heat radiation plate is used to strengthen the horizontal heat-transfer effect of module by tungsten, molybdenum, silver or firm the forming attached to ceramic surface of copper metal, is beneficial to the heat that high heating column 7 and high heat-conducting plate 9 are derived simultaneously and looses in outside air.
With reference to Fig. 6 to Fig. 8 is second kind of embodiment of the present invention; Its basic structure is same as the previously described embodiments; All have by no groove flat layer 1 and with groove plane layer 2 mutual cross layered multilayer ceramic structures; The groove of with groove plane layer 2 has air inlet and gas outlet; No groove flat layer 1 and with groove plane layer 2 are processed by alumina ceramic material or aluminium nitride ceramics material, and can on the superiors' ceramic plane, directly adhere to led chip encapsulation base 5 and the Chip Area 6 that led chip is installed.It is equipped with high heating column 7 at multi-layer ceramics along thickness direction; Broad ways is folded with high heat-conducting plate 3, in the ceramic plane that multi-layer ceramics contacts with outside air, comprises the last ceramic plane 4 in the multi-layer ceramics outside, following ceramic plane 8; And the interior ceramic plane 9 of above-mentioned groove; Also can be provided with continuous high heat conduction and heat radiation plate, be used to strengthen the horizontal heat-transfer effect of module, be beneficial to the heat that high heating column 7 and high heat-conducting plate 9 are derived simultaneously and loose in outside air.
In this embodiment, high heat-conducting plate 3 and contacts with high heating column 7 between high heating column 7, can be used for strengthening the whole vertical heat-transfer effect of module like this, is beneficial to the heat transferred between the interlayer pottery.
On the basis of above-mentioned several kinds of embodiment, described high heating column 7, high heat-conducting plate 3 and high heat conduction and heat radiation plate preferred version are for to form by tungsten is metal filled, and its thermal conductivity can be reached for 200W/mK approximately, possesses fabulous heat-conducting effect.And except the chip Chip Area 6 that can adhere to led chip encapsulation base 5 and match, concrete applied environment is depended in the lamp grain Chip Area 6 that also can adhere at least one group of LED lamp grain welding applications circuit 5 and match.
Great power LED provided by the present invention is with flat ceramic packaging heat radiation module, and its technological process of production is:
Raw material dispersion → curtain coating → moulding → punching (groove) → filling perforation (seal hole) → planographic → lamination and pressurization → cutting → binder removal and sintering → plating (chemical plating).
Wherein,
Raw material are separated into, and by certain proportioning ceramic powders, organic dispersing agent, organic binder bond, solvent and other auxiliary agent are processed through dispersions such as ball milling, hybrid technique and are formed ceramic size;
Curtain coating does, the ceramic size that processes is coated on the film equably, and oven dry obtains ceramic green;
Be shaped to, the ceramic green band that curtain coating is processed is processed the ceramic green of certain size with mould or cutting knife;
Punching does, according to the product design needs, and punching out through hole, cavity or groove on the ceramic green of well cutting;
Filling perforation does, as required, fills the through hole on the ceramic green with metal paste, or on the wall of the through hole on the ceramic green, cavity or groove the close plating slurry;
Planographic does, according to product design, at ceramic green surface printing conductive pattern or heating panel;
Lamination and being pressurised into, according to product design, several single-layer ceramic green compact that machined are superimposed together and pressurize forms whole ceramic module;
Be cut into, with lamination and add the ceramic module that presses, form the groove of certain depth, so that follow-uply be divided into single product by the designing requirement cutting.
Binder removal and being sintered to is got rid of the organic substance in the green compact that machine totally through high temperature, and sintering forms fine and close integral body under reducing atmosphere, because it is heat technology, therefore can carry out at the same time;
Electroplate or chemical plating does,, plate required bright metal layer like the surface of tungsten, molybdenum, copper, silver etc., like nickel, copper, silver, gold etc. at the printed metallization layer.
Through above-mentioned steps, can produce flat ceramic packaging heat radiation module of the present invention, it possesses heat dispersion is preferably arranged, and therefore is applied on the great power LED, can improve led chip and reach the problem that the life-span descends greatly because of the caused light decay that generates heat.
Certainly; Only be that a kind of great power LED of the present invention is with the preferred embodiment of flat ceramic packaging heat radiation module above; Be not that technical scope of the present invention is done any restriction; Therefore, any trickle modification, equivalent variations or modification that every foundation technical spirit of the present invention is done top instance all still belong in the scope of technology contents of the present invention.
Claims (8)
1. a great power LED is with flat ceramic packaging heat radiation module; Has multilayer ceramic structure; It is characterized in that: said multi-layer ceramics is by no groove flat layer (1) and with groove plane layer (2) mutual range upon range of composition; Wherein the groove of with groove plane layer (2) has the inlet, outlet that supplies circulation of air to carry out heat exchange, and said no groove flat layer (1) and with groove plane layer (2) are processed by alumina ceramic material or aluminium nitride ceramics material.
2. a kind of great power LED according to claim 1 is with flat ceramic packaging heat radiation module; It is characterized in that: described multi-layer ceramics is equipped with high heating column (7) along thickness direction; Broad ways is folded with and the contacted high heat-conducting plate of high heating column (7) (3), and said high heating column (7) and high heat-conducting plate (3) are filled by tungsten, molybdenum, silver or copper and formed.
3. a kind of great power LED according to claim 2 is with flat ceramic packaging heat radiation module; It is characterized in that: the upper and lower ceramic plane (4,8) in the said multi-layer ceramics outside and the interior ceramic plane (9) of said groove are provided with and the contacted high heat conduction and heat radiation plate of high heating column (7), and high heat conduction and heat radiation plate is formed attached to ceramic surface by tungsten, molybdenum, silver or copper metal.
According to claim 1 or 2 or 3 described a kind of great power LEDs with flat ceramic packaging heat radiation module, it is characterized in that: the chip Chip Area (6) that is attached with at least one group of led chip encapsulation base (5) on the superiors' ceramic plane of said multi-layer ceramics and matches.
According to claim 1 or 2 or 3 described a kind of great power LEDs with flat ceramic packaging heat radiation module, it is characterized in that: the lamp grain Chip Area (6 ') that is attached with at least one group of LED lamp grain welding applications circuit (5 ') and matches on the superiors' ceramic plane of said multi-layer ceramics.
6. a kind of great power LED according to claim 2 is with flat ceramic packaging heat radiation module, and it is characterized in that: said high heating column (7) and high heat-conducting plate (3) are metal filled the forming of tungsten of 200W/mK by thermal conductivity.
7. a kind of great power LED according to claim 3 is with flat ceramic packaging heat radiation module, and it is characterized in that: said high heat conduction and heat radiation plate is metal filled the forming of tungsten of 200W/mK by thermal conductivity.
8. a great power LED is characterized in that comprising the steps: with the manufacturing approach of flat ceramic packaging heat radiation module
Step 1, raw material disperse: by certain proportioning ceramic powders, organic dispersing agent, organic binder bond, solvent and auxiliary agent are processed through Ball milling, hybrid technique and formed ceramic size;
Step 2, curtain coating: the ceramic size that processes is coated on the film equably, and oven dry obtains the ceramic green band;
Step 3, moulding: the ceramic green band that curtain coating is processed is processed the ceramic green of certain size with mould or cutting knife;
Step 4, punching: punching out hole on ceramic green, said hole are through hole, cavity or groove;
Step 5, filling perforation: fill the hole on the ceramic green with metal paste, or the hole wall close plating slurry in the hole on ceramic green;
Step 6, planographic: at ceramic green surface printing conductive pattern or heating panel;
Step 7, lamination and pressurization: multi-disc is superimposed together and pressurizes through the single-layer ceramic green compact of processing forms whole ceramic module;
Step 8, cutting: with lamination and add the ceramic module that presses, cutting forms the groove of certain depth on request;
Step 9, binder removal and sintering are got rid of the organic substance in the ceramic module of well cutting totally through high temperature, and ceramic module placed sintering forms fine and close integral body under the reducibility gas;
Step 10 is electroplated or chemical plating: plate required bright metal layer on the surface of metal layer.
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| CN102368532A (en) * | 2011-06-03 | 2012-03-07 | 王双喜 | LED (light emitting diode) encapsulation structure with metal radiating fins |
| CN103951469B (en) * | 2014-04-02 | 2015-06-24 | 西安理工大学 | Preparation method of metal ceramic composite heat radiation material |
| CN104129920A (en) * | 2014-07-29 | 2014-11-05 | 研创光电科技（赣州）有限公司 | Co-fired glass ceramic material and preparation method thereof, and method for preparing LED package substrate by utilizing co-fired glass ceramic material |
| CN104609866B (en) * | 2015-01-08 | 2016-06-29 | 深圳顺络电子股份有限公司 | A kind of laminar electronic component and preparation method thereof |
| CN105977364A (en) * | 2016-07-20 | 2016-09-28 | 广州硅能照明有限公司 | Multilayer LED light engine structure and processing method thereof |
| CN107567181A (en) * | 2017-09-08 | 2018-01-09 | 苏州晶品新材料股份有限公司 | A kind of metal filled ceramic substrate preparation method |
| CN108617086A (en) * | 2018-05-17 | 2018-10-02 | 山西高科华兴电子科技有限公司 | A kind of composite material by multilayer PCB circuit board and preparation method thereof |
| CN110922172B (en) * | 2019-12-23 | 2022-01-07 | 潮州三环（集团）股份有限公司 | Ceramic packaging base material composition and application thereof |
| CN113896513B (en) * | 2021-11-02 | 2022-10-04 | 珠海粤科京华科技有限公司 | High-performance alumina ceramic substrate and preparation method thereof |
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| CN101006031A (en) * | 2004-08-18 | 2007-07-25 | 株式会社德山 | Ceramic substrate for mounting light-emitting device and method for producing same |
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| JP2009040627A (en) * | 2007-08-08 | 2009-02-26 | Sumitomo Metal Electronics Devices Inc | Aluminum nitride ceramic substrate and method of manufacturing the same |
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