CN203481273U - LED light source module based on AlSiC composite substrate - Google Patents
LED light source module based on AlSiC composite substrate Download PDFInfo
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- CN203481273U CN203481273U CN201320617843.7U CN201320617843U CN203481273U CN 203481273 U CN203481273 U CN 203481273U CN 201320617843 U CN201320617843 U CN 201320617843U CN 203481273 U CN203481273 U CN 203481273U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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Abstract
The utility model discloses an LED light source module based on an AlSiC composite substrate comprising a substrate; an insulation layer attached to the surface of the substrate; an LED chip and an electrode, which are disposed on the insulation layer in a sealed manner; and a lead used for connecting the LED chip and the electrode together. The substrate is the AlSiC composite substrate, and the insulation layer is an aluminium nitride film. The back surface of the substrate adopts one of the following structures: 1) a ripple-shaped structure, 2) a structure provided with a plurality of grooves, which are parallel to each other, 3) a structure provided with a plurality of recesses. During the working of the LED, a great amount of energy can be converted into the heat energy, and can be aggregated in the LED chip, and then the heat energy can be transmitted from the chip substrate to the insulation layer because of the reasonable heat sink design, and then the heat energy can be transmitted to the AlSiC composite substrate through the insulation layer, and at last the heat energy can be dissipated in the air by the substrate. The LED light source module adopting the above mentioned structure has advantages of simple structure, good heat dissipation performance, long service lifetime, and easy applicability in production.
Description
Technical field
The utility model relates to a kind of LED light source module, particularly a kind of LED light source module based on AlSiC composite base plate.
Background technology
Light-emitting diode (LED), as a kind of green light source of efficient energy-saving, is paid attention to by people more and more, and it is imperative that light source of new generation replaces old light source.But along with the high-power of LED, heat dissipation problem is badly in need of solving.Because the luminous efficiency of LED is very low, during work, most energy is all converted into heat, and the heat of concentrations can make LED produce such as changing colour temperature, reducing the harmful effects such as luminous efficiency, even causes LED permanent failure.Therefore, solving heat dissipation problem, is that LED is to the most important thing of high-power development.
The heat-radiating substrate material of new research and development has metal-core printed circuit board (MCPCB), covers copper ceramic wafer (DBC) and Metal Substrate low-temperature sintered ceramics substrate (LTCC-M) both at home and abroad.Wherein, metal-core printed circuit board thermal conductivity is subject to the restriction of insulating barrier, and thermal conductivity is low, and can not realize on plate and encapsulating; Cover copper ceramic wafer adopt Direct Bonding mode by pottery together with metal bonding, improved thermal conductivity, make thermal coefficient of expansion be controlled at a suitable scope simultaneously, but metal and ceramic respond are low, and wetability is bad, makes bonding difficulty high, interface bond strength is low, easily comes off; Metal Substrate low-temperature sintered ceramics substrate is high to compact dimensions required precision, and complex process exists bad, the caducous difficult problem of metal and ceramic wetability too.
Summary of the invention
The purpose of this utility model is to provide the LED light source module based on AlSiC composite base plate of a kind of chip difficult drop-off and perfect heat-dissipating.
A LED light source module based on AlSiC composite base plate, the wire that it comprises substrate, be attached to the insulating barrier of substrate surface, be encapsulated in LED chip on insulating barrier and electrode and be connected described LED chip and electrode.Described substrate is AlSiC composite base plate, and described insulating barrier is aluminium nitride film, and the back side of described substrate is a kind of in lower array structure: 1) be corrugated, 2) be formed with many grooves that are parallel to each other, 3) be formed with a plurality of pits.
Preferably, the thickness of described AlSiC composite base plate is 2 ~ 2.5mm, and its one side contacting with described insulating barrier is minute surface.
Preferably, when the back side of described substrate is corrugated, the trough of described ripple is 0.8 ~ 1mm deeply, the peak-to-peak 0.9 ~ 1.1mm that is spaced apart of ripple, and ripple presents the structure of parallel lines; When the back side of described substrate has many grooves, the degree of depth of described groove is 0.8 ~ 1mm, and the distance between the bottom of adjacent groove is 0.9 ~ 1.1mm.
Preferably, described electrode is copper film electrode.
Preferably, the syndeton of described LED chip and described substrate is COB encapsulating structure.
The substrate of LED light source module of the present utility model is AlSiC composite base plate, AlSiC composite material is because the prices of raw and semifnished materials are cheap, energy near-net-shape complicated shape, and have that thermal conductivity is high, the coefficient of expansion is adjustable, specific stiffness is large, density is little, make encapsulating structure have that power density is high, the chip life-span is long, reliability is high and the feature such as quality is light, in Electronic Packaging field, shown good application prospect.By regulating the thermal coefficient of expansion of AlSiC composite material, itself and LED chip material are matched; Heat dissipation problem while adopting AlSiC composite base plate not only effectively to solve LED chip work, heat-radiating substrate and the unmatched problem of chip material thermal expansion have been solved simultaneously, make the LED chip difficult drop-off encapsulating on plate, in the useful life of having improved LED, be applicable to the manufacture of low cost high power LED.Coordinate the aluminium nitride film with high heat conductance, improved the thermal conductivity of substrate integral body, good heat dissipation.Substrate back is formed with ripple or groove or pit, has increased the area of dissipation of substrate.
Accompanying drawing explanation
Fig. 1 is the figure that decides what is right and what is wrong of the LED light source module based on AlSiC composite base plate of an embodiment of the present utility model.
Embodiment
Below in conjunction with embodiment, the utility model is described in further detail, but execution mode of the present utility model is not limited to this.
Please refer to Fig. 1, a kind of LED light source module based on AlSiC composite base plate of the utility model mainly comprises substrate 5, be attached to the insulating barrier 4 on substrate 5 surfaces, be encapsulated in LED chip 3 on insulating barrier 4 with electrode 1 and be connected LED chip 3 and the wire 2 of electrode 1.
Wherein, substrate 5 adopts AlSiC composite base plate, its thickness is 2 ~ 2.5mm, the one side of itself and insulating barrier 4 combinations is polished to minute surface, its back side can be corrugated, or is formed with many grooves that are parallel to each other, or is formed with a plurality of pits, to increase the efficiently radiates heat area of substrate, improve the heat dispersion of substrate.Ripple, groove and pit can be to utilize laser etching on the surface of substrate.Concrete, when the back side of substrate 5 is corrugated, the trough of ripple is 0.8 ~ 1mm(millimeter deeply), the peak-to-peak 0.9 ~ 1.1mm that is spaced apart of ripple, and ripple presents the structure of parallel lines.When the back side of substrate 5 has many grooves, the degree of depth of groove is 0.8 ~ 1mm, and the distance between the bottom of adjacent groove is 0.9 ~ 1.1mm.
Insulating barrier 4 is aluminium nitride film, and insulating barrier 4 is to utilize the method for magnetron sputtering to sputter on substrate 5.Electrode 1 is copper film electrode.
AlSiC composite material is because the prices of raw and semifnished materials are cheap, energy near-net-shape complicated shape, and have that thermal conductivity is high, the coefficient of expansion is adjustable, specific stiffness is large, density is little, make encapsulating structure have that power density is high, the chip life-span is long, reliability is high and the feature such as quality is light, in Electronic Packaging field, shown good application prospect.By regulating the thermal coefficient of expansion of AlSiC composite material, itself and LED chip material are matched; Heat dissipation problem while adopting AlSiC composite base plate not only effectively to solve LED chip work, heat-radiating substrate and the unmatched problem of chip material thermal expansion have been solved simultaneously, make the LED chip difficult drop-off encapsulating on plate, in the useful life of having improved LED, be applicable to the manufacture of low cost high power LED.Coordinate the aluminium nitride film with high heat conductance, improved the thermal conductivity of substrate integral body, good heat dissipation.Substrate back is formed with ripple or groove or pit, has increased the area of dissipation of substrate.
During LED work, a large amount of Conversion of Energies is heat and is gathered in LED chip, and due to rational heat sink design, heat energy is sent to insulating barrier by chip substrate, then see through this insulating barrier and conduct to AlSiC composite base plate, finally by substrate by dissipation of heat to air.The LED light source modular structure of this structure is simple, and in being easily applied to produce, and perfect heat-dissipating, life-span are long.
Above-described embodiment is preferably execution mode of the utility model; but execution mode of the present utility model is not limited by the examples; other any do not deviate from change, the modification done under Spirit Essence of the present utility model and principle, substitutes, combination, simplify; all should be equivalent substitute mode, within being included in protection range of the present utility model.
Claims (5)
1. the LED light source module based on AlSiC composite base plate, comprises substrate, is attached to the insulating barrier of substrate surface, the wire that is encapsulated in LED chip on insulating barrier and electrode and is connected described LED chip and electrode; It is characterized in that, described substrate is AlSiC composite base plate, and described insulating barrier is aluminium nitride film, and the back side of described substrate is a kind of in lower array structure: 1) be corrugated, 2) be formed with many grooves that are parallel to each other, 3) be formed with a plurality of pits.
2. LED light source module according to claim 1, is characterized in that, the thickness of described AlSiC composite base plate is 2 ~ 2.5mm, and its one side contacting with described insulating barrier is minute surface.
3. LED light source module according to claim 1, is characterized in that, when the back side of described substrate is corrugated, the trough of described ripple is 0.8 ~ 1mm deeply, the peak-to-peak 0.9 ~ 1.1mm that is spaced apart of ripple, and ripple presents the structure of parallel lines; When the back side of described substrate has many grooves, the degree of depth of described groove is 0.8 ~ 1mm, and the distance between the bottom of adjacent groove is 0.9 ~ 1.1mm.
4. LED light source module according to claim 1, is characterized in that, described electrode is copper film electrode.
5. LED light source module according to claim 1, is characterized in that, the syndeton of described LED chip and described substrate is COB encapsulating structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320617843.7U CN203481273U (en) | 2013-10-09 | 2013-10-09 | LED light source module based on AlSiC composite substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320617843.7U CN203481273U (en) | 2013-10-09 | 2013-10-09 | LED light source module based on AlSiC composite substrate |
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| CN203481273U true CN203481273U (en) | 2014-03-12 |
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| CN201320617843.7U Expired - Fee Related CN203481273U (en) | 2013-10-09 | 2013-10-09 | LED light source module based on AlSiC composite substrate |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106946583A (en) * | 2017-04-07 | 2017-07-14 | 西安明科微电子材料有限公司 | A kind of preparation method of aluminium silicon carbide unitary substrate |
| CN107731992A (en) * | 2017-11-28 | 2018-02-23 | 西安科锐盛创新科技有限公司 | LED encapsulation structure |
| CN107990267A (en) * | 2017-11-28 | 2018-05-04 | 西安科锐盛创新科技有限公司 | A kind of solar LED Lawn lamp |
| CN108006566A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | Solar street light |
| CN108006490A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | Led tunnel lamp |
| CN108006488A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | A kind of New LED wall lamp |
| CN108006491A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | Led tunnel lamp |
| CN108011008A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | LED encapsulation structure |
| CN116360159A (en) * | 2023-06-02 | 2023-06-30 | 惠科股份有限公司 | Light-emitting module and display device |
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2013
- 2013-10-09 CN CN201320617843.7U patent/CN203481273U/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106946583A (en) * | 2017-04-07 | 2017-07-14 | 西安明科微电子材料有限公司 | A kind of preparation method of aluminium silicon carbide unitary substrate |
| CN106946583B (en) * | 2017-04-07 | 2023-03-21 | 西安明科微电子材料有限公司 | Preparation method of aluminum silicon carbide integrated substrate |
| CN108006491A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | Led tunnel lamp |
| CN108006566A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | Solar street light |
| CN108006490A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | Led tunnel lamp |
| CN108006488A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | A kind of New LED wall lamp |
| CN107990267A (en) * | 2017-11-28 | 2018-05-04 | 西安科锐盛创新科技有限公司 | A kind of solar LED Lawn lamp |
| CN108011008A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | LED encapsulation structure |
| CN108006566B (en) * | 2017-11-28 | 2020-06-05 | 高邮市诚顺照明电器有限公司 | Solar street lamp |
| CN108006488B (en) * | 2017-11-28 | 2020-06-26 | 广东胜和照明实业有限公司 | LED wall washer |
| CN108006490B (en) * | 2017-11-28 | 2020-07-07 | 江苏明月照明电器有限公司 | LED tunnel lamp |
| CN107990267B (en) * | 2017-11-28 | 2020-08-25 | 扬州本色光艺照明科技有限公司 | Solar LED lawn lamp |
| CN107731992A (en) * | 2017-11-28 | 2018-02-23 | 西安科锐盛创新科技有限公司 | LED encapsulation structure |
| CN116360159A (en) * | 2023-06-02 | 2023-06-30 | 惠科股份有限公司 | Light-emitting module and display device |
| CN116360159B (en) * | 2023-06-02 | 2023-09-05 | 惠科股份有限公司 | Light-emitting module and display device |
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| CF01 | Termination of patent right due to non-payment of annual fee |