CN203481273U - LED light source module based on AlSiC composite substrate - Google Patents

Abstract

The utility model discloses an LED light source module based on an AlSiC composite substrate, which comprises a substrate, an insulating layer attached to the surface of the substrate, an LED chip and an electrode packaged on the insulating layer, and wires connecting the LED chip and the electrode. The substrate is an AlSiC composite substrate, the insulating layer is an aluminum nitride film, and the back of the substrate is one of the following structures: 1) corrugated, 2) formed with multiple parallel grooves, 3 ) formed with multiple pits. When the LED is working, a large amount of energy is converted into heat and accumulated in the LED chip. Due to the reasonable design of the heat sink, the heat energy is transmitted from the chip substrate to the insulating layer, and then through the insulating layer to the AlSiC composite substrate, and finally the substrate transfers the heat energy to the AlSiC composite substrate. The heat is dissipated into the air. The LED light source module with this structure has a simple structure, is easy to be applied in production, and has good heat dissipation performance and long service life.

Description

A LED light source module based on AlSiC composite substrate

technical field

The utility model relates to an LED light source module, in particular to an LED light source module based on an AlSiC composite substrate.

Background technique

As an energy-saving and efficient green light source, light-emitting diode (LED) has attracted more and more attention. It is imperative to replace the old light source with a new generation of light source. However, with the increasing power of LEDs, the problem of heat dissipation needs to be solved urgently. Due to the low luminous efficiency of LEDs, most of the energy is converted into heat during operation, and excessively concentrated heat will cause adverse effects on LEDs such as changing color temperature and reducing luminous efficiency, and even lead to permanent failure of LEDs. Therefore, solving the heat dissipation problem is the top priority for the development of LEDs to high power.

Newly developed heat dissipation substrate materials at home and abroad include metal core printed circuit board (MCPCB), copper-clad ceramic board (DBC) and metal-based low-temperature sintered ceramic substrate (LTCC-M). Among them, the thermal conductivity of the metal core printed circuit board is limited by the insulating layer, the thermal conductivity is low, and on-board packaging cannot be realized; the copper-clad ceramic board adopts a direct bonding method to bond ceramics and metals together, which improves the thermal conductivity. At the same time, the thermal expansion coefficient is controlled in an appropriate range, but the reaction ability of metal and ceramics is low, and the wettability is not good, which makes the bonding difficult, the interface bonding strength is low, and it is easy to fall off; The requirements for dimensional accuracy are high and the process is complicated. There are also problems of poor wettability and easy falling off of metal and ceramics.

Contents of the invention

The purpose of the utility model is to provide an LED light source module based on an AlSiC composite substrate that the chip is not easy to fall off and has good heat dissipation performance.

An LED light source module based on an AlSiC composite substrate, which includes a substrate, an insulating layer attached to the surface of the substrate, LED chips and electrodes packaged on the insulating layer, and wires connecting the LED chips and electrodes. The substrate is an AlSiC composite substrate, the insulating layer is an aluminum nitride film, and the back of the substrate is one of the following structures: 1) corrugated, 2) formed with multiple parallel grooves, 3 ) formed with multiple pits.

Preferably, the thickness of the AlSiC composite substrate is 2-2.5 mm, and the side in contact with the insulating layer is a mirror surface.

Preferably, when the back of the substrate is corrugated, the trough depth of the corrugation is 0.8-1mm, the interval between the crests is 0.9-1.1mm, and the corrugation presents a structure of parallel straight lines; when the back of the substrate When there are multiple grooves, the depth of the grooves is 0.8-1 mm, and the distance between the bottoms of adjacent grooves is 0.9-1.1 mm.

Preferably, the electrodes are copper film electrodes.

Preferably, the connection structure between the LED chip and the substrate is a COB packaging structure.

The substrate of the LED light source module of the present invention is an AlSiC composite substrate. Due to the low price of raw materials, the AlSiC composite material can form complex shapes near net, and has high thermal conductivity, adjustable expansion coefficient, high specific stiffness, and low density. The structure has the characteristics of high power density, long chip life, high reliability and light weight, and has shown good application prospects in the field of electronic packaging. By adjusting the thermal expansion coefficient of the AlSiC composite material, it matches the material of the LED chip; the use of the AlSiC composite substrate not only effectively solves the problem of heat dissipation when the LED chip is working, but also solves the problem of thermal expansion mismatch between the heat dissipation substrate and the chip material, making the board The upper-packaged LED chip is not easy to fall off, which improves the service life of the LED and is suitable for the manufacture of low-cost and high-power LEDs. With the aluminum nitride film with high thermal conductivity, the overall thermal conductivity of the substrate is improved, and the heat dissipation is good. Corrugations or grooves or pits are formed on the back of the substrate, which increases the heat dissipation area of the substrate. the

Description of drawings

FIG. 1 is a sectional view of an LED light source module based on an AlSiC composite substrate according to an embodiment of the present invention.

Detailed ways

The utility model will be described in further detail below in conjunction with the examples, but the implementation of the utility model is not limited thereto.

Please refer to Fig. 1, a kind of LED light source module based on AlSiC composite substrate of the utility model mainly comprises substrate 5, the insulation layer 4 that is attached to the surface of substrate 5, the LED chip 3 and electrode 1 that are packaged on the insulation layer 4, and connect LED Chip 3 and wire 2 of electrode 1.

Among them, the substrate 5 is an AlSiC composite substrate with a thickness of 2 to 2.5mm, and the side combined with the insulating layer 4 is polished to a mirror surface, and the back surface can be corrugated, or formed with multiple parallel grooves, or formed There are multiple pits to increase the effective heat dissipation area of the substrate and improve the heat dissipation performance of the substrate. Dimples, grooves and pits can be etched into the surface of the substrate using a laser. Specifically, when the back surface of the substrate 5 is corrugated, the depth of the trough of the corrugation is 0.8-1 mm (millimeter), the interval between the crests is 0.9-1.1 mm, and the corrugation presents a parallel straight line structure. When the back of the substrate 5 has multiple grooves, the depth of the grooves is 0.8-1 mm, and the distance between the bottoms of adjacent grooves is 0.9-1.1 mm. the

The insulating layer 4 is an aluminum nitride film, and the insulating layer 4 is sputtered on the substrate 5 by magnetron sputtering. Electrode 1 is a copper film electrode.

The LED chip 3 is packaged on the AlSiC composite substrate 5 by means of COB packaging.

Due to the low price of raw materials, AlSiC composite materials can form complex shapes near net, and have high thermal conductivity, adjustable expansion coefficient, high specific stiffness, and low density, so that the packaging structure has high power density, long chip life, high reliability and Light weight and other characteristics have shown good application prospects in the field of electronic packaging. By adjusting the thermal expansion coefficient of the AlSiC composite material, it matches the material of the LED chip; the use of the AlSiC composite substrate not only effectively solves the problem of heat dissipation when the LED chip is working, but also solves the problem of thermal expansion mismatch between the heat dissipation substrate and the chip material, making the board The upper-packaged LED chip is not easy to fall off, which improves the service life of the LED and is suitable for the manufacture of low-cost and high-power LEDs. With the aluminum nitride film with high thermal conductivity, the overall thermal conductivity of the substrate is improved, and the heat dissipation is good. Corrugations or grooves or pits are formed on the back of the substrate, which increases the heat dissipation area of the substrate.

When the LED is working, a large amount of energy is converted into heat and accumulated in the LED chip. Due to the reasonable design of the heat sink, the heat energy is transmitted from the chip substrate to the insulating layer, and then through the insulating layer to the AlSiC composite substrate, and finally the substrate transfers the heat energy to the AlSiC composite substrate. The heat is dissipated into the air. The LED light source module with this structure has a simple structure, is easy to be applied in production, and has good heat dissipation performance and long service life.

The above-mentioned embodiment is a preferred implementation mode of the present utility model, but the implementation mode of the present utility model is not limited by the described embodiment, and any other changes, modifications, modifications, Substitution, combination, and simplification should all be equivalent replacement methods, and are all included in the protection scope of the present utility model.

Claims (5)

1. A LED light source module based on an AlSiC composite substrate, comprising a substrate, an insulating layer attached to the surface of the substrate, LED chips and electrodes packaged on the insulating layer, and wires connecting the LED chips and electrodes; it is characterized in that, The substrate is an AlSiC composite substrate, the insulating layer is an aluminum nitride film, and the back of the substrate is one of the following structures: 1) corrugated, 2) formed with multiple parallel grooves, 3 ) formed with multiple pits. 2. The LED light source module according to claim 1, wherein the thickness of the AlSiC composite substrate is 2-2.5mm, and the side in contact with the insulating layer is a mirror surface. 3. The LED light source module according to claim 1, wherein when the back surface of the substrate is corrugated, the depth of the trough of the corrugation is 0.8-1mm, and the interval between the crests is 0.9-1.1mm, And the corrugation presents a structure of parallel straight lines; when the back of the substrate has multiple grooves, the depth of the grooves is 0.8-1 mm, and the distance between the bottoms of adjacent grooves is 0.9-1.1 mm. 4. The LED light source module according to claim 1, wherein the electrodes are copper film electrodes. 5. The LED light source module according to claim 1, wherein the connection structure between the LED chip and the substrate is a COB packaging structure.

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