CN203150541U - LED light source based on COB packaging - Google Patents
LED light source based on COB packaging Download PDFInfo
- Publication number
- CN203150541U CN203150541U CN 201320077412 CN201320077412U CN203150541U CN 203150541 U CN203150541 U CN 203150541U CN 201320077412 CN201320077412 CN 201320077412 CN 201320077412 U CN201320077412 U CN 201320077412U CN 203150541 U CN203150541 U CN 203150541U
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- Prior art keywords
- led
- light source
- led light
- circuit board
- drive circuit
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- Expired - Fee Related
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Abstract
The utility model discloses an LED light source based on COB packaging, comprising a metal substrate, LED wafers, a heat sink and a drive circuit board. The metal substrate is arranged above the heat sink and is provided with at least two LED wafers; an upper surface of each LED wafer is covered by a layer of fluorescent powder glue; the drive circuit board is arranged under the heat sink; the heat sink is provided with a wiring hole used as a wiring channel between the LED wafers and the drive circuit board. The beneficial effects are that LED light source based on COB packaging has better heat dissipation effects; an LED is allowed to possess good luminous efficiency, high and uniform light intensity of emitted light and a long service life; meanwhile, the LED light source based on COB packaging has a simple structure, is convenient to process and reduces LED packaging structure material and processing costs.
Description
Technical field
The utility model relates to a kind of led light source, relates in particular to a kind of based on COB encapsulated LED light source.
Background technology
Along with the LED technology rapid development, LED almost has application in industry-by-industry, and in gradually replacement conventional light source.At present, in order to satisfy the needs in different application field, the LED encapsulation technology is in continuous progress, packing forms becomes more diversified, COB namely is a kind of of packing forms, commercially available COB packaged LED comprises three kinds of forms substantially at present: the one, adopt ceramic substrate, and ceramic substrate is done the positive and negative circuit of LED, and this kind base plate line cost is higher; The 2nd, metal substrate and electric plastics injection mo(u)lding, its substrate is generally the PPA material, loses most encapsulation glue during production, and the too thick output energy that can lose light source of the glue of mixed fluorescent powder, reduces light efficiency; The 3rd, the metal substrate PCB that processes, the LED radiating effect of this kind COB encapsulating structure is relatively poor.
The utility model content
The technical problem that the utility model mainly solves provides a kind of based on COB encapsulated LED light source, the led light source light efficiency height of this structure, and good heat dissipation effect, convenient for production.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: provide a kind of based on COB encapsulated LED light source, comprise metal substrate, the LED wafer, heating panel and drive circuit board, the top of described heating panel is provided with metal substrate, and described metal substrate is provided with at least two described LED wafers, and every described LED upper wafer surface is enclosed with the layer of fluorescent powder glue-line; The below of described heating panel is provided with drive circuit board, has wiring hole on the described heating panel as the wiring passage of described LED wafer and drive circuit board.
Wherein, the skin of described phosphor gel also is provided with the encapsulation glue-line.
Wherein, the lower surface of described encapsulation glue-line is circular, and upper surface is the cambered surface projection.
Wherein, scribble thermal grease conduction between described metal substrate and heating panel.
The beneficial effects of the utility model are: have better radiating effect, make LED have good light efficiency, the brightness of sending is high and even, long service life; Simultaneously, also have simple in structure, be convenient to machining characteristics, reduced material and the processing cost of LED encapsulating structure.
Description of drawings
Fig. 1 is a kind of structural representation based on COB encapsulated LED light source of the utility model.
The main element symbol description:
1, metal substrate; 2, LED wafer; 3, heating panel; 4, encapsulation glue-line; 5, fluorescent material glue-line; 6, thermal grease conduction; 7, drive circuit board; 8, wiring hole.
Embodiment
By describing technology contents of the present utility model, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, present embodiment comprises metal substrate 1, LED wafer 2, heating panel 3 and drive circuit board 7, the top of described heating panel 3 is provided with metal substrate 1, scribble thermal grease conduction 6 therebetween, described metal substrate 1 is provided with at least two described LED wafers 2, every described LED wafer 2 upper surfaces are enclosed with layer of fluorescent powder glue-line 5, be used for promoting light efficiency, the skin of this fluorescent material glue-line 5 also is provided with encapsulation glue-line 4, can improve the stability of electric connection like this, the lower surface of described encapsulation glue-line 4 is circular, and upper surface is the cambered surface projection; The below of described heating panel 3 is provided with drive circuit board 7, has wiring hole 8 on the described heating panel 3 as the wiring passage of described LED wafer 2 and drive circuit board 7.
The beneficial effects of the utility model are: have better radiating effect, make LED have good light efficiency, the brightness of sending is high and even, long service life; Simultaneously, also have simple in structure, be convenient to machining characteristics, reduced material and the processing cost of LED encapsulating structure.
The above only is embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (4)
1. one kind based on COB encapsulated LED light source, it is characterized in that: comprise metal substrate, the LED wafer, heating panel and drive circuit board, the top of described heating panel is provided with metal substrate, described metal substrate is provided with at least two described LED wafers, and every described LED upper wafer surface is enclosed with the layer of fluorescent powder glue-line; The below of described heating panel is provided with drive circuit board, has wiring hole on the described heating panel as the wiring passage of described LED wafer and drive circuit board.
2. according to claim 1 a kind of based on COB encapsulated LED light source, it is characterized in that: the skin of described fluorescent material glue-line also is provided with the encapsulation glue-line.
3. according to claim 2 a kind of based on COB encapsulated LED light source, it is characterized in that: the lower surface of described encapsulation glue-line is for circular, and upper surface is the cambered surface projection.
4. according to claim 1 a kind of based on COB encapsulated LED light source, it is characterized in that: scribble thermal grease conduction between described metal substrate and heating panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320077412 CN203150541U (en) | 2013-02-19 | 2013-02-19 | LED light source based on COB packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320077412 CN203150541U (en) | 2013-02-19 | 2013-02-19 | LED light source based on COB packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203150541U true CN203150541U (en) | 2013-08-21 |
Family
ID=48978049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320077412 Expired - Fee Related CN203150541U (en) | 2013-02-19 | 2013-02-19 | LED light source based on COB packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203150541U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576898A (en) * | 2013-10-22 | 2015-04-29 | 隆达电子股份有限公司 | Integrated packaging light-emitting diode and manufacturing method thereof |
| CN107507898A (en) * | 2017-08-16 | 2017-12-22 | 广东聚科照明股份有限公司 | A kind of LED illumination COB encapsulating structures |
| CN114400278A (en) * | 2021-12-27 | 2022-04-26 | 江苏国中芯半导体科技有限公司 | LED packaging substrate and LED packaging equipment using same |
| CN117276457A (en) * | 2023-11-23 | 2023-12-22 | 惠州市炬能量电子科技有限公司 | LED packaging structure and packaging method |
-
2013
- 2013-02-19 CN CN 201320077412 patent/CN203150541U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576898A (en) * | 2013-10-22 | 2015-04-29 | 隆达电子股份有限公司 | Integrated packaging light-emitting diode and manufacturing method thereof |
| CN107507898A (en) * | 2017-08-16 | 2017-12-22 | 广东聚科照明股份有限公司 | A kind of LED illumination COB encapsulating structures |
| CN107507898B (en) * | 2017-08-16 | 2023-11-03 | 广东天基光电有限公司 | LED illumination COB packaging structure |
| CN114400278A (en) * | 2021-12-27 | 2022-04-26 | 江苏国中芯半导体科技有限公司 | LED packaging substrate and LED packaging equipment using same |
| CN117276457A (en) * | 2023-11-23 | 2023-12-22 | 惠州市炬能量电子科技有限公司 | LED packaging structure and packaging method |
| CN117276457B (en) * | 2023-11-23 | 2024-02-06 | 惠州市炬能量电子科技有限公司 | LED packaging structure and packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130821 Termination date: 20200219 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |