CN114400278A - LED packaging substrate and LED packaging equipment using same - Google Patents
LED packaging substrate and LED packaging equipment using same Download PDFInfo
- Publication number
- CN114400278A CN114400278A CN202111619457.7A CN202111619457A CN114400278A CN 114400278 A CN114400278 A CN 114400278A CN 202111619457 A CN202111619457 A CN 202111619457A CN 114400278 A CN114400278 A CN 114400278A
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- Prior art keywords
- led
- packaging
- bottom plate
- frame
- substrate
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
The invention discloses an LED packaging substrate and LED packaging equipment using the LED packaging substrate, comprising an LED bottom plate, a packaging frame, a metal radiating fin, an LED wafer and fluorescent powder, wherein the bottom of the LED bottom plate is provided with the metal radiating fin, the LED bottom plate is internally provided with first grooves at equal intervals, the metal radiating fin is internally provided with second grooves at equal intervals, the top of the LED bottom plate is provided with the packaging frame, the packaging frame is internally and symmetrically and fixedly connected with the packaging substrates, the tops of the two packaging substrates are respectively provided with a printed circuit board, and the LED wafer is arranged at the top of the LED bottom plate and between the two packaging substrates. The influence of silica gel aging on the light extraction rate can be reduced, and the light transmittance of the equipment can be kept.
Description
Technical Field
The invention relates to LED packaging, in particular to an LED packaging substrate and LED packaging equipment using the same, and belongs to the technical field of LED packaging.
Background
The LED packaging technology is developed and evolved based on the discrete device packaging technology, but has great particularity, generally, the die of the discrete device is sealed in the package, the packaging mainly functions to protect the die and complete electrical interconnection, and the LED packaging completes output electrical signals to protect the normal operation of the die, generally, the packaging functions to provide sufficient protection for the chip, so as to prevent the chip from losing effectiveness due to long-term exposure or mechanical damage in the air, so as to improve the stability of the chip, for the LED packaging, it is also required to have good light extraction efficiency and good heat dissipation, the good packaging can make the LED have better light emitting efficiency and heat dissipation environment, so as to improve the life of the LED, the high-power LED packaging is a hotspot in research because of the complex structure and process, and directly affects the service performance and life of the LED, especially the high-power white light LED packaging, if the amount of the LED package can not be rapidly diffused, the junction temperature is too high, a series of problems of light intensity reduction, spectrum deviation, color temperature rise, thermal stress increase, chip accelerated aging and the like can be caused, the service life of the LED is greatly reduced, the package adhesive colloid filled on the chip is accelerated aging, the light transmission efficiency of the LED package is influenced, meanwhile, the bottom plate and the metal radiating fin of the existing LED package are both of a planar structure, the structure not only causes the contact area of the LED package to be small, but also can not be fully contacted with radiating silicone grease, and accordingly poor radiating effect and poor stability of the LED package are caused.
The invention content is as follows:
an object of the present invention is to provide an LED package substrate and an LED package apparatus using the same, which solve the above-mentioned problems.
In order to solve the above problems, the present invention provides a technical solution:
LED packaging substrate and use LED encapsulation equipment of this LED packaging substrate, including LED bottom plate, encapsulation frame, metal fin, LED wafer and phosphor powder, LED bottom plate bottom is equipped with metal fin, first recess has been seted up to the inside equidistance of LED bottom plate, the second recess has been seted up to the inside equidistance of metal fin, LED bottom plate top is equipped with the encapsulation frame, the inside symmetry fixedly connected with encapsulation substrate of encapsulation frame, two the encapsulation substrate top all is equipped with printed circuit board, LED bottom plate top just is located and is equipped with the LED wafer between two encapsulation substrates, the encapsulation frame is inside just to be located and is equipped with the silica gel layer directly over the printed circuit board, the light trap has been seted up to the inside equidistance of silica gel layer, silica gel layer inside packing has phosphor powder.
As a preferred scheme of the present invention, a metal reflector is disposed between the top of the LED base plate and the package frame.
The technical effect of adopting the further scheme is as follows: the scattered light source can be reflected out, thereby increasing the illuminating lumens of the LED assembly.
As a preferable aspect of the present invention, a resin lens is fixedly connected to the top of the package frame and directly above the light-transmitting hole.
The technical effect of adopting the further scheme is as follows: the LED wafer can be protected, so that the loss of the LED wafer is reduced, and the service life of the device is prolonged.
As a preferable scheme of the invention, the tops of the two printed circuit boards are fixedly connected with conducting wires, and one ends of the conducting wires far away from the printed circuit boards are fixedly connected with the LED chips.
The technical effect of adopting the further scheme is as follows: the current is conveniently transmitted, so that the LED wafer can emit light, and the normal work of the equipment is ensured.
As a preferable aspect of the present invention, a heat dissipation silicone layer is provided between the LED base plate and the metal heat sink.
The technical effect of adopting the further scheme is as follows: can be with the heat transfer in the equipment to the metal cooling fin on to heat transfer treatment is carried out to these heats, greatly alleviated because of the equipment damage that high temperature caused.
The invention has the beneficial effects that: through the cooperation of the second groove and the first groove of seting up on LED bottom plate and metal heat dissipation, can improve the filling effect of heat dissipation silicone grease to strengthen the joint strength and the radiating effect of LED bottom plate and metal fin, use through the phosphor powder cooperation light trap that sets up in the silica gel layer, can reduce the ageing influence to the light-emitting rate of silica gel, be favorable to keeping the luminousness of equipment, thereby improve the result of use.
Description of the drawings:
for ease of illustration, the invention is described in detail by the following detailed description and the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a cross-sectional view of the present invention.
In the figure: 1. an LED backplane; 2. a metal reflector; 3. packaging the frame; 4. a metal heat sink; 5. an LED wafer; 6. a silica gel layer; 7. a light-transmitting hole; 8. a resin lens; 9. a package substrate; 10. a printed circuit board; 11. a heat-dissipating silicone layer; 12. a first groove; 13. a second groove; 14. a wire; 15. and (3) fluorescent powder.
The specific implementation mode is as follows:
the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1 and 2, the present invention provides a technical solution: an LED packaging substrate and an LED packaging device using the LED packaging substrate comprise an LED bottom plate 1, a packaging frame 3, a metal radiating fin 4, an LED wafer 5 and fluorescent powder 15, wherein the bottom of the LED bottom plate 1 is provided with the metal radiating fin 4, the LED bottom plate 1 is internally provided with first grooves 12 at equal intervals, the metal radiating fin 4 is internally provided with second grooves 13 at equal intervals, the filling effect of radiating silicone grease can be improved, so that the connecting strength and the radiating effect of the LED bottom plate 1 and the metal radiating fin 4 are enhanced, the top of the LED bottom plate 1 is provided with the packaging frame 3, the packaging frame 3 is internally and symmetrically and fixedly connected with packaging substrates 9, the tops of the two packaging substrates 9 are respectively provided with a printed circuit board 10, the LED wafer 5 is arranged at the top of the LED bottom plate 1 and positioned between the two packaging substrates 9, a silica gel layer 6 is arranged in the packaging frame 3 and positioned right above the printed circuit board 10, and light holes 7 are equidistantly arranged in the silica gel layer 6, the fluorescent powder 15 is filled in the silica gel layer 6, so that the influence of silica gel aging on the light extraction rate can be reduced, and the light transmittance of the equipment can be kept.
Furthermore, a metal reflector 2 is arranged between the top of the LED bottom plate 1 and the packaging frame 3, so that scattered light sources can be reflected and emitted.
Further, the resin lens 8 is fixedly connected to the top of the package frame 3 and located right above the light-transmitting hole 7, so that the LED chip 5 can be protected, and loss of the LED chip is reduced.
Further, the top of each of the two printed circuit boards 10 is fixedly connected with a lead 14, and one end of the lead 14 far away from the printed circuit board 10 is fixedly connected with the LED chip 5, so that current is conveniently transmitted, and the LED chip 5 emits light.
Further, a heat dissipation silicone layer 11 is arranged between the LED base plate 1 and the metal heat dissipation sheet 4, so that heat can be transferred to the metal heat dissipation sheet 4, and heat exchange treatment can be carried out on the heat.
Specifically, the heat dissipation silicone grease is filled between the LED base plate 1 and the metal heat sink 4 in a pressure mode, the heat dissipation silicone grease can enter the first groove 12 and the second groove 13, the heat dissipation silicone grease layer 11 is formed after the heat dissipation silicone grease is cured, because the LED wafer 5 consists of a P-type semiconductor and an N-type semiconductor, a cavity in the P-type semiconductor is the dominant position, the N-type semiconductor is mainly electrons, when current acts on the LED wafer 5 through a lead 14, the electrons are pushed to a P region, are compounded with the cavities in the P region, and then emit energy in a photon form, the emitted light penetrates through a light hole 7 in the silica gel layer 6 and is fully contacted with fluorescent powder 15 in the silica gel layer 6, so that the phenomenon of light attenuation is reduced, the emitted light is emitted through a resin lens 8, a scattered light source is reflected through the metal reflector 2, and the heat on the LED base plate 1 is transferred to the metal heat sink 4 through the heat dissipation silicone grease layer 11, at this time, the metal heat radiating fins 4 can perform heat exchange treatment on the heat, so that the temperature reduction of the equipment is completed.
Example 2
As shown in fig. 1 and 2, the present invention provides a technical solution: including LED bottom plate 1, encapsulation frame 3, metal radiating fin 4, LED wafer 5 and phosphor powder 15, 1 bottom of LED bottom plate is equipped with metal radiating fin 4, first recess 12 has been seted up to 1 inside equidistance of LED bottom plate, second recess 13 has been seted up to 4 inside equidistance of metal radiating fin, 1 top of LED bottom plate is equipped with encapsulation frame 3, the inside symmetry fixedly connected with packaging substrate 9 of encapsulation frame 3, two packaging substrate 9 tops all are equipped with printed circuit board 10, 1 top of LED bottom plate just is located and is equipped with LED wafer 5 between two packaging substrate 9, encapsulation frame 3 is inside just to be located and is equipped with silica gel layer 6 directly over printed circuit board 10, light trap 7 has been seted up to the inside equidistance in silica gel layer 6, the inside packing of silica gel layer 6 has phosphor powder 15.
In this embodiment, through the cooperation of second recess 13 and the first recess 12 of seting up on LED bottom plate 1 and metal cooling fin 4, can improve the filling effect of heat dissipation silicone grease, thereby strengthen the joint strength and the radiating effect of LED bottom plate 1 and metal cooling fin 4, use through the phosphor powder 15 cooperation light trap 7 that sets up in silica gel layer 6, can reduce the ageing influence to the light-emitting rate of silica gel, be favorable to keeping the luminousness of equipment, thereby improve the result of use.
Example 3
As shown in fig. 1 and 2, a metal reflector 2 is arranged between the top of the LED base plate 1 and the package frame 3; a resin lens 8 is fixedly connected to the top of the packaging frame 3 and is positioned right above the light hole 7; the top parts of the two printed circuit boards 10 are fixedly connected with leads 14, and one ends of the leads 14 far away from the printed circuit boards 10 are fixedly connected with the LED chips 5; a heat dissipation silicone grease layer 11 is arranged between the LED bottom plate 1 and the metal heat dissipation sheet 4.
In the embodiment, the metal reflector 2 can reflect the scattered light source out, so that the irradiation lumens of the LED assembly are improved; the LED wafer 5 can be protected through the resin lens 8, so that the loss of the LED wafer is reduced, and the service life of equipment is prolonged; the current can be transmitted through the lead 14, so that the LED wafer 5 emits light, and the normal work of the device can be ensured; can be with heat transfer to metal fin 4 in the equipment on through heat dissipation silicone grease layer 11 to carry out heat exchange treatment to these heats, greatly alleviated because of the equipment damage that high temperature caused.
The working principle is as follows: the heat dissipation silicone grease is filled between the LED bottom plate 1 and the metal radiating fin 4 in a pressure mode, the heat dissipation silicone grease can enter the first groove 12 and the second groove 13, the heat dissipation silicone grease layer 11 is formed after the heat dissipation silicone grease is solidified, because the LED wafer 5 consists of a P-type semiconductor and an N-type semiconductor, a cavity in the P-type semiconductor is in a dominant position, the N-type semiconductor is mainly electrons, when current acts on the LED wafer 5 through a lead 14, the electrons are pushed to a P area, are compounded with the cavities in the P area, and then emit energy in a photon form, the emitted light penetrates through a light hole 7 in the silica gel layer 6 and is fully contacted with fluorescent powder 15 in the silica gel layer 6, so that the light attenuation phenomenon is reduced, the emitted light is emitted through a resin lens 8, a scattered light source is reflected through the metal reflecting plate 2, and the heat on the LED bottom plate 1 is transferred to the metal radiating fin 4 through the heat dissipation silicone grease layer 11, at this time, the metal heat radiating fins 4 can perform heat exchange treatment on the heat, so that the temperature reduction of the equipment is completed.
In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second", "third", "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", "fourth" may explicitly or implicitly include at least one such feature.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
- The LED packaging substrate and the LED packaging equipment using the LED packaging substrate are characterized by comprising an LED bottom plate (1), a packaging frame (3), metal radiating fins (4), LED wafers (5) and fluorescent powder (15), wherein the metal radiating fins (4) are arranged at the bottom of the LED bottom plate (1), first grooves (12) are formed in the LED bottom plate (1) at equal intervals, second grooves (13) are formed in the metal radiating fins (4) at equal intervals, the packaging frame (3) is assembled at the top of the LED bottom plate (1), the packaging substrates (9) are symmetrically and fixedly connected in the packaging frame (3), printed circuit boards (10) are assembled at the tops of the two packaging substrates (9), the LED wafers (5) are assembled between the two packaging substrates (9) at the top of the LED bottom plate (1), and a silica gel layer (6) is arranged in the packaging frame (3) and right above the printed circuit boards (10), light-transmitting holes (7) are formed in the silica gel layer (6) at equal intervals, and fluorescent powder (15) is filled in the silica gel layer (6).
- 2. The LED packaging substrate and the LED packaging equipment using the same as claimed in claim 1, wherein a metal reflector (2) is arranged between the top of the LED base plate (1) and the packaging frame (3).
- 3. The LED package substrate and the LED package device using the same as claimed in claim 1, wherein a resin lens (8) is fixedly connected to the top of the package frame (3) and directly above the light-transmitting hole (7).
- 4. The LED packaging substrate and the LED packaging equipment using the same as claimed in claim 1, wherein the top of each of the two printed circuit boards (10) is fixedly connected with a conducting wire (14), and one end of the conducting wire (14) far away from the printed circuit board (10) is fixedly connected with the LED chip (5).
- 5. The LED package substrate and the LED package apparatus using the same as claimed in claim 1, wherein a heat-dissipating silicone layer (11) is disposed between the LED base plate (1) and the metal heat sink (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111619457.7A CN114400278A (en) | 2021-12-27 | 2021-12-27 | LED packaging substrate and LED packaging equipment using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111619457.7A CN114400278A (en) | 2021-12-27 | 2021-12-27 | LED packaging substrate and LED packaging equipment using same |
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| Publication Number | Publication Date |
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| CN114400278A true CN114400278A (en) | 2022-04-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202111619457.7A Pending CN114400278A (en) | 2021-12-27 | 2021-12-27 | LED packaging substrate and LED packaging equipment using same |
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