CN215008227U - Packaging substrate convenient to assemble high stability - Google Patents
Packaging substrate convenient to assemble high stability Download PDFInfo
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- CN215008227U CN215008227U CN202120873474.2U CN202120873474U CN215008227U CN 215008227 U CN215008227 U CN 215008227U CN 202120873474 U CN202120873474 U CN 202120873474U CN 215008227 U CN215008227 U CN 215008227U
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Abstract
The utility model discloses a packaging substrate convenient to assemble high stability, include: the packaging substrate comprises a packaging substrate body, wherein a packaging groove is fixedly arranged above the packaging substrate body; the plug-in rods are fixedly arranged on the right side of the packaging substrate body and are uniformly distributed along the right side of the packaging substrate body; and the splicing columns are fixedly arranged at the front end of the packaging substrate body, and the splicing columns are symmetrically distributed about the vertical central line of the packaging substrate body. This packaging substrate convenient to assemble high stability compares with current device, and the concatenation groove can carry out the concatenation of fore-and-aft direction to two the same packaging substrate bodies with mutually supporting of concatenation post, can carry out the concatenation of left right direction to two the same packaging substrate bodies through mutually supporting of inserting groove and inserted bar to the accurate butt joint of packaging substrate body of can being convenient for can increase the inseparable degree between concatenation post and the concatenation groove through the rubber sleeve.
Description
Technical Field
The utility model relates to a packaging substrate technical field specifically is a packaging substrate convenient to assemble high stability.
Background
The package substrate is (SUB). The substrate can provide the effects of electric connection, protection, support, heat dissipation, assembly and the like for the chip so as to realize the purposes of multi-pin, reduction of the volume of a packaged product, improvement of electric performance and heat dissipation, ultrahigh density or multi-chip modularization. The packaging substrate belongs to the technology of interdiscipline and relates to knowledge of electronics, physics, chemical engineering and the like;
the existing packaging substrate is inconvenient to assemble, when a plurality of packaging substrates are needed to be assembled for use, the condition of inaccurate butt joint often occurs, and subsequent use is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a packaging substrate convenient to assemble high stability to propose in solving above-mentioned background art because current packaging substrate is inconvenient to be assembled, when needing a plurality of packaging substrate to splice the use, often appear docking the unsafe condition, influence the problem of follow-up use.
In order to achieve the above object, the utility model provides a following technical scheme: a package substrate facilitating assembly of high stability, comprising:
the packaging substrate comprises a packaging substrate body, wherein a packaging groove is fixedly arranged above the packaging substrate body;
a mounting groove mounted at an intermediate position inside the package groove;
the plug-in rods are fixedly arranged on the right side of the packaging substrate body and are uniformly distributed along the right side of the packaging substrate body;
the splicing columns are fixedly arranged at the front end of the packaging substrate body and are symmetrically distributed about the vertical center line of the packaging substrate body;
a mounting hole opened inside the splicing column;
the mounting panel, its fixed mounting be in the below of concatenation post, the mounting panel with the concatenation post is parallel to each other.
Preferably, the mounting groove is further provided with:
the four separation grooves are arranged in the mounting groove, and the chips are mounted.
Preferably, the separation groove is further provided with:
the elastic patch is connected to the inner side of the separation groove, the elastic patch is made of silica gel, and the air holes are uniformly distributed in the separation groove.
Preferably, the packaging groove is further provided with:
and the radiating fins are arranged at the front end and the rear end of the inner side of the packaging groove, and the radiating fins are provided with heat conducting strips at positions close to the vertical central line of the packaging groove.
Preferably, the air holes are further provided with:
the heat dissipation through holes are formed in the outer sides of the air holes, and the number of the heat dissipation through holes is two, and four heat dissipation through holes are formed in each group.
Preferably, the package substrate body is further provided with:
the splicing groove is formed in the rear end of the packaging substrate body and matched with the splicing column;
and the insertion groove is formed in the left side of the packaging substrate body, and the insertion groove is matched with the insertion rod.
Preferably, the splicing column is further provided with:
the rubber sleeve is arranged on the outer side of the splicing column, a semi-surrounding structure is formed between the rubber sleeve and the splicing column, and the splicing column passes through the rubber sleeve and an elastic structure is formed between the splicing grooves.
Preferably, the splicing groove is further provided with:
and the reference scales are arranged above the splicing grooves and are uniformly distributed along the upper end face of the packaging substrate body.
Preferably, the mounting plate is further provided with:
the fixing bolts are installed inside the mounting plate and are symmetrically distributed about the vertical center line of the mounting plate.
Compared with the prior art, the utility model provides a packaging substrate convenient to assemble high stability possesses following beneficial effect: this packaging substrate convenient to assemble high stability can carry out the concatenation of fore-and-aft direction to two the same packaging substrate bodies through mutually supporting of splice groove and concatenation post, can carry out the concatenation of left right direction to two the same packaging substrate bodies through mutually supporting of splice groove and inserted bar.
1. The utility model discloses a mounting groove can be separated through the separating groove to be convenient for install a plurality of chips, can increase the inseparability between separating groove and the chip through the elasticity paster, thereby can improve the fastness of chip installation, avoid the chip not hard up influence use, can be convenient for the inside thermal diffusion of separating groove through the bleeder vent, can absorb the heat that diffuses in the separating groove through the heat conduction strip, pass to fin department again, the fin can be through the heat transmission to the external world of heat dissipation through-hole, thereby reach radiating effect;
2. the utility model discloses a concatenation groove can carry out the concatenation of fore-and-aft direction to two the same packaging substrate bodies with the mutually supporting of concatenation post, can carry out the concatenation of left and right directions to two the same packaging substrate bodies through the mutually supporting of insertion groove and inserted bar, thereby can be convenient for the accurate butt joint of packaging substrate body, can increase the inseparability between concatenation post and the concatenation groove through the rubber sleeve, thereby can improve its fastness of assembling, can more accurate finding both splice department through referring to the scale, also can improve the assembly efficiency when improving the accuracy, solve the inconvenient assembly of current packaging substrate, when needing a plurality of packaging substrate to splice the use, the inaccurate condition of butt joint often appears, influence the problem of follow-up use;
3. the utility model discloses a mounting panel can be convenient for install the packaging substrate body on PCB, can fix the position of mounting panel through fixing bolt.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural view of the package substrate body of the present invention;
fig. 3 is a schematic rear view of the package substrate body of the present invention;
fig. 4 is the utility model discloses structural schematic after a plurality of packaging substrate bodies splice.
In the figure: 1. a package substrate body; 2. a packaging groove; 3. mounting grooves; 4. a separation tank; 5. an elastic patch; 6. air holes are formed; 7. a heat sink; 8. a heat dissipating through hole; 9. a heat conducting strip; 10. a plug rod; 11. referring to the scale; 12. mounting holes; 13. splicing grooves; 14. inserting grooves; 15. splicing the columns; 16. a rubber sleeve; 17. mounting a plate; 18. and (5) fixing the bolt.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 and 4, a package substrate with high stability and easy assembly includes: the packaging substrate comprises a packaging substrate body 1, wherein a packaging groove 2 is fixedly arranged above the packaging substrate body 1; the heat radiating fins 7 are arranged at the front end and the rear end of the inner side of the packaging groove 2, and the heat conducting strips 9 are arranged at the positions, close to the vertical central line of the packaging groove 2, of the heat radiating fins 7; a mounting groove 3 mounted at an intermediate position inside the package groove 2; the four separation grooves 4 are formed in the mounting groove 3, so that the chip is mounted; the elastic patch 5 is connected to the inner side of the separation groove 4, the elastic patch 5 is made of silica gel, and the air holes 6 are uniformly distributed along the inner part of the separation groove 4; the heat dissipation through holes 8 are formed on the outer sides of the air holes 6, and two groups of four heat dissipation through holes 8 are arranged; the separate groove 4 can separate the mounting groove 3, thereby be convenient for install a plurality of chips, can increase the inseparable degree between separate groove 4 and the chip through elasticity paster 5, thereby can improve the fastness of chip installation, avoid the not hard up influence use of chip, can be convenient for distribute of 4 inside heats in separate groove through bleeder vent 6, can absorb the heat that distributes in the separate groove 4 through heat conduction strip 9, pass to fin 7 department again, fin 7 can be through heat transfer to the external world with heat dissipation through-hole 8, thereby reach radiating effect.
Referring to fig. 1-4, a package substrate with high stability for easy assembly includes: the plug-in rods 10 are fixedly arranged on the right side of the packaging substrate body 1, and the plug-in rods 10 are uniformly distributed along the right side of the packaging substrate body 1; the plug groove 14 is formed on the left side of the packaging substrate body 1, and the plug groove 14 is matched with the plug rod 10; the rubber sleeve 16 is arranged on the outer side of the splicing column 15, a semi-surrounding structure is formed between the rubber sleeve 16 and the splicing column 15, and an elastic structure is formed between the splicing column 15 and the splicing groove 13 through the rubber sleeve 16; the reference scales 11 are arranged above the splicing grooves 13, and the reference scales 11 are uniformly distributed along the upper end face of the packaging substrate body 1; the splicing columns 15 are fixedly arranged at the front end of the packaging substrate body 1, and the splicing columns 15 are symmetrically distributed about the vertical center line of the packaging substrate body 1; the splicing groove 13 is formed in the rear end of the packaging substrate body 1, the splicing groove 13 and the splicing column 15 are matched with each other to form the mounting hole 12, and the splicing groove 13 is formed in the splicing column 15; can carry out the concatenation of fore-and-aft direction to two the same packaging substrate bodies 1 through mutually supporting of splice groove 13 and splice column 15, can carry out the concatenation of left right direction to two the same packaging substrate bodies 1 through mutually supporting of splice groove 14 and inserted bar 10, thereby can be convenient for packaging substrate body 1's accurate butt joint, can increase the inseparable degree between splice column 15 and the splice groove 13 through rubber sleeve 16, thereby can improve its fastness of assembling, can be more accurate through referring to scale 11 and finding both concatenation departments, also can improve the assembly efficiency when improving the accuracy, the inconvenient assembly of current packaging substrate has been solved, when needing a plurality of packaging substrate to splice the use, the inaccurate condition of butt joint often appears, influence the problem of follow-up use.
Referring to fig. 1 and 4, a package substrate with high stability and easy assembly includes: the mounting plate 17 is fixedly arranged below the splicing column 15, and the mounting plate 17 is parallel to the splicing column 15; fixing bolts 18 installed inside the mounting plate 17, the fixing bolts 18 being symmetrically distributed about a vertical center line of the mounting plate 17; the mounting plate 17 can facilitate the mounting of the package substrate body 1 on the PCB, and the position of the mounting plate 17 can be fixed by the fixing bolt 18.
The working principle is as follows: when the packaging substrate convenient for assembling and high in stability is used, the packaging substrate body 1 is firstly installed on a PCB through the installation plate 17, and then the fixing bolt 18 penetrates through the installation plate 17 and is screwed down, so that the packaging substrate body 1 can be fixed on the PCB; secondly, when a plurality of identical packaging substrate bodies 1 need to be spliced for use, the splicing positions of the packaging substrate bodies 1 and the splicing grooves are accurately found by referring to the scales 11, the splicing groove 13 of one packaging substrate body 1 is aligned to the splicing column 15 of the other packaging substrate body 1, the packaging substrate bodies 1 can be spliced in the front-back direction, the tightness between the splicing column 15 and the splicing groove 13 is increased through the rubber sleeve 16, and therefore the splicing firmness is improved; then, the plug-in groove 14 of one packaging substrate body 1 is aligned to the plug-in rod 10 of the other packaging substrate body 1 and the two are mutually plugged, so that the packaging substrate bodies 1 can be spliced in the left-right direction, the packaging substrate bodies 1 are connected by matching bolts with the mounting holes 12, and then the packaging substrate bodies are fixed by using glue at the splicing gaps, and at the moment, two identical packaging substrate bodies 1 can be completely and accurately butted, so that the problem that the butt joint is often inaccurate and the subsequent use is influenced when a plurality of packaging substrates are spliced and used is solved; install the chip at last, once install the chip to the mounting groove 3 in the separate tank 4, inseparable degree between separate tank 4 and the chip has been increased through elasticity paster 5, thereby improve the fastness of chip installation, avoid the chip not hard up influence its use, the inside heat of separate tank 4 distributes out through bleeder vent 6 in the use, the heat that gives off in the separate tank 4 is absorbed to heat conduction strip 9, pass to 7 departments of fin again, 7 rethread heat dissipation through-holes 8 of fin are with heat transfer to the external world, thereby can reach radiating effect, this is exactly this be convenient for assemble high stability's packaging substrate's theory of operation.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a packaging substrate convenient to assemble high stability which characterized in that includes:
the packaging substrate comprises a packaging substrate body (1), wherein a packaging groove (2) is fixedly arranged above the packaging substrate body (1);
a mounting groove (3) mounted at an intermediate position inside the package groove (2);
the plug-in rods (10) are fixedly arranged on the right side of the packaging substrate body (1), and the plug-in rods (10) are uniformly distributed along the right side of the packaging substrate body (1);
the splicing columns (15) are fixedly arranged at the front end of the packaging substrate body (1), and the splicing columns (15) are symmetrically distributed relative to the vertical center line of the packaging substrate body (1);
a mounting hole (12) opened inside the splicing column (15);
mounting panel (17), its fixed mounting in the below of concatenation post (15), mounting panel (17) with concatenation post (15) are parallel to each other.
2. The packaging substrate convenient for assembling high stability according to claim 1, wherein the mounting groove (3) is further provided with:
the four separation grooves (4) are formed in the mounting groove (3), and the four separation grooves (4) are used for mounting the chips.
3. The packaging substrate convenient for assembling high stability according to claim 2, wherein the separation groove (4) is further provided with:
the elastic patch (5) is connected to the inner side of the separation groove (4), the elastic patch (5) is made of silica gel, and the air holes (6) are uniformly distributed in the separation groove (4).
4. The package substrate facilitating assembly of high stability as claimed in claim 1, wherein: the packaging groove (2) is also provided with:
and the radiating fins (7) are arranged at the front end and the rear end of the inner side of the packaging groove (2), and the radiating fins (7) are provided with heat conducting strips (9) at positions close to the vertical central line of the packaging groove (2).
5. The packaging substrate convenient for assembling high stability as claimed in claim 3, wherein the ventilation holes (6) are further provided with:
and the heat dissipation through holes (8) are formed in the outer sides of the air holes (6), and the heat dissipation through holes (8) are provided with two groups, wherein each group is four.
6. The packaging substrate convenient for assembling high stability according to claim 1, wherein the packaging substrate body (1) is further provided with:
the splicing groove (13) is formed in the rear end of the packaging substrate body (1), and the splicing groove (13) is matched with the splicing column (15);
the plug groove (14) is formed in the left side of the packaging substrate body (1), and the plug groove (14) is matched with the plug rod (10).
7. The packaging substrate convenient for assembling high stability according to claim 6, wherein the assembling column (15) is further provided with:
the rubber sleeve (16) is arranged on the outer side of the splicing column (15), a semi-surrounding structure is formed between the rubber sleeve (16) and the splicing column (15), and the splicing column (15) is in an elastic structure through the rubber sleeve (16) and the splicing groove (13).
8. The package substrate facilitating assembly of high stability as claimed in claim 6, wherein the splicing groove (13) is further provided with:
the reference scales (11) are arranged above the splicing grooves (13), and the reference scales (11) are uniformly distributed along the upper end face of the packaging substrate body (1).
9. A package substrate facilitating assembly with high stability as claimed in claim 1, wherein the mounting board (17) further has:
fixing bolts (18) installed inside the mounting plate (17), the fixing bolts (18) being symmetrically distributed about a vertical center line of the mounting plate (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120873474.2U CN215008227U (en) | 2021-04-26 | 2021-04-26 | Packaging substrate convenient to assemble high stability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120873474.2U CN215008227U (en) | 2021-04-26 | 2021-04-26 | Packaging substrate convenient to assemble high stability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215008227U true CN215008227U (en) | 2021-12-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120873474.2U Active CN215008227U (en) | 2021-04-26 | 2021-04-26 | Packaging substrate convenient to assemble high stability |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215008227U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114400278A (en) * | 2021-12-27 | 2022-04-26 | 江苏国中芯半导体科技有限公司 | LED packaging substrate and LED packaging equipment using same |
-
2021
- 2021-04-26 CN CN202120873474.2U patent/CN215008227U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114400278A (en) * | 2021-12-27 | 2022-04-26 | 江苏国中芯半导体科技有限公司 | LED packaging substrate and LED packaging equipment using same |
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