CN219164976U

CN219164976U - Multilayer high-density circuit board

Info

Publication number: CN219164976U
Application number: CN202223426443.6U
Authority: CN
Inventors: 杨建红; 周行锐; 李运航; 雷海军
Original assignee: Shenzhen Haixiang Circuit Co ltd
Current assignee: Shenzhen Haixiang Circuit Co ltd
Priority date: 2022-12-19
Filing date: 2022-12-19
Publication date: 2023-06-09
Anticipated expiration: 2032-12-19

Abstract

The utility model discloses a multilayer high-density circuit board, which comprises a base and is characterized in that: the upper end fixedly connected with four pillars of base, the common fixedly connected with roof of upper end of four pillars, the common fixedly connected with two connecting plates of opposite ends of four pillars, a plurality of joint groove has all been seted up in the upper end of two connecting plates, joint has radiator unit jointly with a plurality of joint groove of group, the equal fixedly connected with curb plate of upper end left and right sides of two connecting plates, the slot has all been seted up in the opposite ends of four curb plates throughout, all joint has joint protection subassembly in four slots, joint has the circuit board jointly between two joint protection subassemblies of same horizontal plane. According to the multilayer high-density circuit board, the clamping protection assembly is arranged, so that the purposes of rapidly installing the circuit board and protecting the circuit board from damage are achieved; through setting up radiating component, reach the purpose that promotes radiating efficiency, reduce energy loss.

Description

Multilayer high-density circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a multilayer high-density circuit board.

Background

The circuit board, namely the circuit board, is also called a printed circuit board or a printed circuit board, so that the circuit is miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances.

When the prior circuit board is used, the circuit board is generally placed in the packaging box, the circuit board inside the packaging box easily vibrates up and down when in transportation, the circuit board can be impacted to the packaging box by the impact of vibration, the circuit board is easy to deform and damage, the cost of enterprises is increased, and the prior circuit board can be subjected to heat dissipation in the use process, so that normal use is affected. Therefore, we propose a multilayer high-density circuit board.

Disclosure of Invention

The utility model mainly aims to provide a multilayer high-density circuit board which can effectively solve the problems in the background technology.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the utility model provides a multilayer high density circuit board, includes base, its characterized in that: the upper end fixedly connected with four pillars of base, four the common fixedly connected with roof of upper end of pillar, four the common fixedly connected with two connecting plates of opposite end of pillar, two the upper end of connecting plate has all run through and has seted up a plurality of joint groove, a plurality of with group joint groove joint has radiator unit jointly, two the equal fixedly connected with curb plate of upper end left and right sides of connecting plate, four the slot has all been run through to the opposite end of curb plate, four equal joint has joint protection subassembly in the slot, two of same horizontal plane joint has the circuit board jointly between the joint protection subassembly.

Preferably, the joint protection subassembly includes card strip and installation piece, the upper end fixedly connected with of card strip is two the common fixedly connected with handle of upper end of elastic component, first draw-in groove has been seted up to the upper end of installation piece, the one end fixedly connected with picture peg that the installation piece is close to the base, the one end fixedly connected with connecting block that the picture peg is close to the base, the second draw-in groove has been seted up to the one end that the connecting block is close to the base.

Preferably, the size of the clamping strip is matched with the size of the first clamping groove, and the upper end of the elastic piece is fixedly connected with the upper inner wall of the side plate.

Preferably, the size of the plug board is matched with the size of the slot, the size of the mounting block is matched with the size of the side board, and the size of the second clamping groove is matched with the size of the circuit board.

Preferably, the heat dissipation assembly comprises a mounting plate, four connecting holes are formed in the upper end of the mounting plate in a penetrating mode, the four connecting holes are distributed in a bilateral symmetry mode, a plurality of clamping blocks are fixedly connected to the upper end of the mounting plate, and cooling fins are fixedly connected to the upper ends of the clamping blocks.

Preferably, the clamping blocks are distributed in a rectangular array, and the positions and the sizes of the clamping blocks and the clamping grooves are correspondingly matched.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, the clamping protection assembly is arranged, and the handle is pulled to drive the clamping strips to clamp the mounting blocks, so that the circuit board is rapidly mounted, and the purposes of rapidly mounting the circuit board and protecting the circuit board from damage are achieved;

2. according to the utility model, the heat dissipation assembly is arranged, the assembly is installed in a clamping manner, and meanwhile, the heat dissipation is carried out through the plurality of heat dissipation plates, so that the heat dissipation efficiency of the circuit board is improved, and the mounting plates are connected through the connecting holes, so that the purposes of improving the heat dissipation efficiency and reducing the energy loss are achieved.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a multilayer high-density circuit board according to the present utility model;

FIG. 2 is a schematic structural view of a fixing member of a multilayer high-density circuit board according to the present utility model;

FIG. 3 is a schematic view of a multi-layered high-density circuit board card connection protection assembly according to the present utility model;

fig. 4 is a schematic structural diagram of a heat dissipating assembly of a multi-layered high-density circuit board according to the present utility model.

In the figure: 1. a base; 2. a support post; 3. a connecting plate; 4. a side plate; 5. the clamping protection assembly; 6. a heat dissipation assembly; 7. a circuit board; 8. a top plate; 31. a clamping groove; 41. a slot; 51. clamping strips; 52. an elastic member; 53. a handle; 54. a mounting block; 55. a first clamping groove; 56. inserting plate; 57. a connecting block; 58. a second clamping groove; 61. a mounting plate; 62. a connection hole; 63. a clamping block; 64. a heat sink.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1-4, a multilayer high-density circuit board comprises a base 1, four pillars 2 are fixedly connected to the upper end of the base 1, a top plate 8 is fixedly connected to the upper ends of the four pillars 2, two connecting plates 3 are fixedly connected to opposite ends of the four pillars 2, a plurality of clamping grooves 31 are formed in the upper ends of the two connecting plates 3 in a penetrating mode, a heat dissipation assembly 6 is clamped in the same group of the plurality of clamping grooves 31, side plates 4 are fixedly connected to the left and right portions of the upper ends of the two connecting plates 3, slots 41 are formed in the opposite ends of the four side plates 4 in a penetrating mode, clamping protection assemblies 5 are clamped in the four slots 41, and a circuit board 7 is clamped between the two clamping protection assemblies 5 on the same horizontal plane.

In this embodiment, the clamping protection assembly 5 includes a clamping strip 51 and a mounting block 54, the upper ends of the clamping strip 51 are fixedly connected with two elastic pieces 52, the upper ends of the two elastic pieces 52 are fixedly connected with a handle 53 together, a first clamping groove 55 is formed in the upper end of the mounting block 54, one end of the mounting block 54, which is close to the base 1, is fixedly connected with a plugboard 56, one end of the plugboard 56, which is close to the base 1, is fixedly connected with a connecting block 57, a second clamping groove 58 is formed in one end of the connecting block 57, which is close to the base 1, the size of the clamping strip 51 is matched with the size of the first clamping groove 55, the upper end of the elastic piece 52 is fixedly connected with the upper inner wall of the side plate 4, the size of the plugboard 56 is matched with the size of the slot 41, the size of the mounting block 54 is matched with the size of the side plate 4, and the size of the second clamping groove 58 is matched with the size of the circuit board 7; pulling handle 53 makes handle 53 with card strip 51 lifting under the drive of elastic component 52, later places installation piece 54 in corresponding position department, passes through picture peg 56 joint with installation piece 54 in corresponding slot 41, later releases handle 53, and handle 53 resets under the drive of elastic component 52, and card strip 51 falls in first draw-in groove 55, with installation piece 54 chucking, conveniently carries out fixed mounting to circuit board 7, and both ends all block in corresponding second draw-in groove 58 about circuit board 7, convenient dismantlement maintenance of circuit board 7.

In this embodiment, the heat dissipation assembly 6 includes a mounting plate 61, four connection holes 62 are provided at the upper end of the mounting plate 61 in a penetrating manner, the four connection holes 62 are symmetrically distributed in pairs, the upper end of the mounting plate 61 is fixedly connected with a plurality of clamping blocks 63, the upper ends of the plurality of clamping blocks 63 are fixedly connected with heat dissipation fins 64, the plurality of clamping blocks 63 are distributed in a rectangular array, and the plurality of clamping blocks 63 are correspondingly matched with the positions and the sizes of the plurality of clamping grooves 31; in the use of the circuit board 7, heat is generated, the heat generated by the circuit board 7 is dissipated through the radiating fins 64, the clamping blocks 63 are clamped in the clamping grooves 31 to install the radiating components 6, the upper ends of the mounting plates 61 penetrate through the connecting holes 62, the connecting holes 62 are utilized to install the radiating components 6, the radiating components 6 are convenient to use, the radiating efficiency is improved due to the arrangement of the radiating fins 64, the connecting plates 3 are provided with multiple layers, and the utilization efficiency of the circuit board 7 is improved.

It should be noted that, the present utility model is a multilayer high-density circuit board, in this process, first pull the handle 53, make the handle 53 lift the card strip 51 under the drive of the elastic member 52, afterwards place the installation piece 54 in corresponding position department, the installation piece 54 passes through the picture peg 56 joint in corresponding slot 41, afterwards release the handle 53, the handle 53 resets under the drive of the elastic member 52, the card strip 51 falls in first draw-in groove 55, the installation piece 54 chucking, the convenience carries out fixed mounting to the circuit board 7, both ends card in corresponding second draw-in groove 58 about the circuit board 7, the convenience dismantlement maintenance of circuit board 7, can produce heat in the use of circuit board 7, and the heat that the circuit board 7 produced is dispelled through fin 64, fixture block 63 card is installed to radiator module 6 in draw-in groove 31, the upper end of mounting panel 61 has run through and has seted up connecting hole 62, and utilize connecting hole 62 to install radiator module 6, the convenience radiator module 6 uses, the setting up of a plurality of fin 64 has improved radiating efficiency, the efficiency is improved, the efficiency of the circuit board 7 is set up to the connecting plate 7, the efficiency is improved, the use of the connecting plate is provided with the connecting plate 7.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a multilayer high density circuit board, includes base (1), its characterized in that: the utility model discloses a circuit board, including base (1), base, socket, circuit board, four upper end fixedly connected with four pillar (2), four pillar (2) are fixed connection in the upper end of base (1), four pillar (2)'s upper end is fixed connection roof (8) jointly, four the opposite end of pillar (2) is fixed connection in common two connecting plates (3), two a plurality of joint groove (31) have all been run through to the upper end of connecting plate (3), a plurality of joint groove (31) joint has radiator unit (6) with same group, two the upper end left and right sides of connecting plate (3) is fixed connection curb plate (4), four slot (41) have all been run through to the opposite end of curb plate (4), four equal joint has joint protection component (5) in slot (41), two joint protection component (5) of same horizontal plane have circuit board (7) jointly.

2. The multilayer high density circuit board of claim 1, wherein: the clamping protection assembly (5) comprises clamping strips (51) and mounting blocks (54), wherein two elastic pieces (52) are fixedly connected to the upper ends of the clamping strips (51), two handles (53) are fixedly connected to the upper ends of the elastic pieces (52) together, a first clamping groove (55) is formed in the upper ends of the mounting blocks (54), a plugboard (56) is fixedly connected to one end, close to the base (1), of the mounting blocks (54), a connecting block (57) is fixedly connected to one end, close to the base (1), of the plugboard (56), and a second clamping groove (58) is formed in one end, close to the base (1), of the connecting block (57).

3. The multilayer high density circuit board of claim 2, wherein: the size of the clamping strip (51) is matched with the size of the first clamping groove (55), and the upper end of the elastic piece (52) is fixedly connected with the upper inner wall of the side plate (4).

4. The multilayer high density circuit board of claim 2, wherein: the size of the plugboard (56) is matched with the size of the slot (41), the size of the mounting block (54) is matched with the size of the side plate (4), and the size of the second clamping groove (58) is matched with the size of the circuit board (7).

5. The multilayer high density circuit board of claim 1, wherein: the heat dissipation assembly (6) comprises a mounting plate (61), four connecting holes (62) are formed in the upper end of the mounting plate (61) in a penetrating mode, the four connecting holes (62) are symmetrically distributed in a left-right mode, a plurality of clamping blocks (63) are fixedly connected to the upper end of the mounting plate (61), and heat dissipation fins (64) are fixedly connected to the upper ends of the clamping blocks (63).

6. The multilayer high density circuit board of claim 5, wherein: the clamping blocks (63) are distributed in a rectangular array, and the clamping blocks (63) are correspondingly matched with the clamping grooves (31) in position and size.