CN102646922A - Tandem type semiconductor laser with circuit board - Google Patents
Tandem type semiconductor laser with circuit board Download PDFInfo
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- CN102646922A CN102646922A CN201210126936XA CN201210126936A CN102646922A CN 102646922 A CN102646922 A CN 102646922A CN 201210126936X A CN201210126936X A CN 201210126936XA CN 201210126936 A CN201210126936 A CN 201210126936A CN 102646922 A CN102646922 A CN 102646922A
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- base
- shaping lens
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Abstract
The invention discloses a tandem type semiconductor laser with a circuit board, which comprises a base as well as a power supply module, a laser module, lenses and an optical fiber connector that are distributed in sequence, wherein the base is provided with a notch from the top of the base in a downward-extending way, the laser module is arranged into the notch in a side standing way and is packaged into the base by a cover plate, the laser module comprises a step heat sink and a plurality of single-tube lasers, the plurality of single-tube lasers are sequentially arranged on the surfaces of steps of the step heat sink and are connected in series by a circuit board, and one reshaping lens is arranged in front of each single-tube laser. In the tandem type semiconductor laser, the plurality of single-tube lasers are connected in series by the circuit board, and the laser intensity is enhanced through the power stack of the plurality of single-tube lasers, so as to realize the effect of enhancing wattage and facilitate assembly and detection; meanwhile, the laser module is arranged in a side standing way, thereby effectively saving the transverse space, so that the plurality of single-tube lasers can keep heat resistance consistent.
Description
Technical field
The present invention relates to field of lasers, relate in particular to a kind of tandem semiconductor laser of tool circuit board.
Background technology
Semiconductor laser is to do working medium and produce the device of stimulated emission effect with semi-conducting material; Its operation principle: through the certain range of excitation mode; Being with between (conduction band and valence band) of semiconductor substance, perhaps semiconductor substance can be with and impurity (being led or the alms giver) energy level between, realize the population inversion of non equilibrium carrier; When a large amount of electronics that are in the population inversion state and hole-recombination, just produce the stimulated emission effect.Semiconductor laser through fiber plant output has the comparison application fields; For example; Laser cutting, laser marking etc.; The main method that realizes high power density optical fiber output laser at present is after a plurality of semiconductor lasers are exported optical coupling, to be exported by optical fiber again; Its implementation mainly contains two kinds: the one, semiconductor laser is processed the monolithic array form in the chip one-level, and parallel operation is arranged the output light of each laser in the array again through the shaping system and to be combined output; Another kind of mode is that the output light with a plurality of independently semiconductor lasers combines output through shaping; Laser can also can be connected in parallel connection; Because discrete lasers can be at the coupling row filter that advances; And can adopt separate refrigeration, the assembly reliability, consistency and the life-span that therefore are combined into all are better than the assembly that uses array.So how in a plurality of independent semiconductor laser coupling process, improve stability and reliability of structure as much as possible, becoming has a difficult problem to be solved.
Summary of the invention
The objective of the invention is to solve the problems of the technologies described above, a kind of tandem semiconductor laser of tool circuit board is provided, it adopts circuit board that a plurality of independently lasers are connected, and has strengthened laser intensity, and simple in structure, easy accessibility.
For reaching this purpose, the present invention adopts following technical scheme:
A kind of tandem semiconductor laser of tool circuit board; Comprise the supply module, laser module, lens, the optical fiber splice that are disposed in order; Said laser module comprises the heat sink and a plurality of single tube lasers of ladder; Described a plurality of single tube laser is successively set on the heat sink step surface of said ladder, and described a plurality of single tube laser is connected in series through a circuit board, in the place ahead of each single tube laser shaping lens is set all.
Further; Also comprise base; Said base has notch by its top to extending below, and said laser module side is loaded in the said notch, and is packaged in the said base through a cover plate; Said lens scioptics support is installed on the base front side, and said supply module is installed on the rear side of said base.
Preferably; Said shaping lens is installed on the shaping lens support, and said shaping lens support is fixed in the front side of said single tube laser, and said single tube laser top all is fixed with electrode; Said single tube laser is fixed on the heat sink step surface of said ladder; Said circuit board is fixed in the heat sink top of said ladder, and said electrode contacts with circuit board, so that both are electrically connected.
Preferably, the underrun screw that said ladder is heat sink is connected with the pocket side wall of said base, so that said laser module side is loaded in the said notch.
Preferably; All bonding between said cover plate and said base, said lens and said lens carrier, said lens carrier and the said base through bonding agent; Said supply module passes through screw in the rear side of said base; Said optical fiber splice passes through screw in the base front side, and is positioned at the outside of said lens.
Preferably; In the front side of said single tube laser, said single tube laser top is connected in series electrode, packing ring through screw to said shaping lens support successively through screw, and through said screw overall fixed on the heat sink step surface of said ladder; The bottom of said circuit board is provided with insulating circuit board; And pass through screw in the lump in the heat sink top of said ladder, said electrode contacts with circuit board, so that both are electrically connected.
Preferably; Said shaping lens comprises the fast axle of laser beam shaping lens, laser beam slow axis shaping lens; The top center of said shaping lens support is offered first groove part and second groove part downwards successively; Said laser beam slow axis shaping lens is adhered to said shaping lens support upper surface through bonding agent, and is positioned at said first groove part top, and the fast axle of said laser beam shaping lens is adhered to said laser beam slow axis shaping lens bottom through bonding agent.
Preferably, said supply module is provided with power supply terminal and signal output terminal.
Beneficial effect of the present invention: supply module connects external power source; And through the single tube laser power supply of circuit board to a plurality of mutual series connection; The place ahead of each single tube laser all is provided with shaping lens; Can reach laser beam collimation effect, scioptics have further been strengthened laser intensity again, at last the optical fiber output through joining with optical fiber splice.Contrast prior art, this laser use circuit board that a plurality of single tube lasers are connected in series, through a plurality of single tube laser power stacks; Reach and strengthen the laser intensity purpose; Realize strengthening the effect of wattage, be convenient to assembling, the convenient detection, have stronger replaceability; Laser module adopts edge-on installation simultaneously, effectively saves horizontal space, and the thermal resistance that a plurality of single tube lasers are consistent.
Description of drawings
Fig. 1 is the three-dimensional structure diagram of the tandem semiconductor laser of the described tool circuit board of embodiment;
Fig. 2 is the three-dimensional structure diagram of the described laser module of embodiment;
Fig. 3 is the three-dimensional exploded view of the tandem semiconductor laser of the tool circuit board shown in Fig. 1;
Fig. 4 is the three-dimensional exploded view of the laser module shown in Fig. 2;
Fig. 5 is the scheme of installation of the shaping lens shown in Fig. 4.
Among the figure:
1, base; 2, cover plate; 3, optical fiber splice; 4, supply module; 5, laser module; 51, ladder is heat sink; 52, power supply circuits plate; 53, single tube laser; 54, electrode; 55, shaping lens support; 551, first groove part; 552, second groove part; 56, insulating circuit board; 57, laser beam slow axis shaping lens; 58, the fast axle of laser beam shaping lens; 6, lens; 7, lens carrier; 8, securing member.
Embodiment
Further specify technical scheme of the present invention below in conjunction with accompanying drawing and through embodiment.
The tandem semiconductor laser of tool circuit board of the present invention comprises base and the supply module that is disposed in order, laser module, lens, optical fiber splice, and base has notch by its top to extending below; The laser module side is loaded in the said notch, and is packaged in the base through a cover plate, and laser module comprises the heat sink and a plurality of single tube lasers of ladder; Described a plurality of single tube laser is successively set on the heat sink step surface of said ladder; And described a plurality of single tube laser is connected in series through a circuit board, in the place ahead of each single tube laser shaping lens is set all, through circuit board a plurality of single tube lasers is connected in series; Adopt a plurality of single tube laser power stacks; Reach and strengthen the laser intensity purpose, realize strengthening the effect of wattage, be convenient to assembling, the convenient detection; Laser module adopts edge-on installation simultaneously, effectively saves horizontal space, and the thermal resistance that a plurality of single tube lasers are consistent.
Shown in Fig. 1～5; Provided a kind of tandem 30W semiconductor laser specific embodiment of tool circuit board, it mainly forms (referring to Fig. 1, shown in Figure 3) by supply module 4, base 1, cover plate 2, laser module 5, lens 6, lens carrier 7, optical fiber splice 3, and base 1 has square groove; Laser module 5 sides are loaded in the square groove; And affixed through securing member 8 and square groove left side wall, through cover plate 2 it is packaged in the square groove again, bonding between cover plate 2 and the base 1 through bonding agent; Rear side at base 1 has the supply module installing hole, and supply module 4 is fixed in the rear side of base through securing member; At the front openings lens installing hole of base 1, lens 6 are bonded on the lens carrier 7 through bonding agent, and integral body is adhered on the base 1 through bonding agent again; Be positioned at the outside of lens, optical fiber splice 3 is fixed on the base through securing member, and it is used for being connected with the optical fiber of output equipment.
Referring to Fig. 2, shown in Figure 4, laser module 5 is mainly heat sink 51 by ladder, power supply circuits plate 52, single tube laser 53, electrode 54, shaping lens support 55, shaping lens, insulating circuit board 56 are formed.Wherein, Ladder is heat sink 51 to have five step surfaces; On each step surface, be provided with single tube laser 53, the front side of each single tube laser (front side is meant the direction of laser radiation) passed through fixedly shaping lens support 55 of securing member, and shaping lens is installed on the shaping lens support; The top of each single tube laser 53 is placed with electrode 54, packing ring successively; The side screws in trip bolt from it then, electrode 54 is fixed in single tube laser 53 tops, and overall fixed is on the step surface of ladder heat sink 51; Ladder is heat sink 51 also to have two supporters, and the height of supporter is higher than the top height of step surface, and power supply circuits plate 52 is placed on the supporter; And fix through securing member, five single tube lasers are restricted between ladder heat sink 51 and the power supply circuits plate 52, and electrode 54 contacts with power supply circuits plate 52; Realize both electrical connections, the power supply circuits plate is the power supply of single tube laser, and ladder is heat sink when the single tube laser emits light and heat can play certain thermolysis; When actual fabrication; Electrode then is brief as required and bending, so that it contacts with the power supply circuits plate fully, further improves the reliability that connects; Bottom at power supply circuits plate 52 also is provided with insulating circuit board 56, and both are fixed on the heat sink supporter of ladder through securing member together.
Shaping lens comprises laser beam slow axis shaping lens 57, the fast axle of laser beam shaping lens 58; Corresponding offers first groove part 551 and second groove part 552 (referring to shown in Figure 5) downwards successively in shaping lens support top center; Laser beam slow axis shaping lens 57 is adhered to shaping lens support 55 upper surfaces through bonding agent; And be positioned at first groove part, 551 tops; The fast axle of laser beam shaping lens 58 is adhered to laser beam slow axis shaping lens 57 bottoms through bonding agent; And being positioned at first groove part 551 and second groove part 552, the center of shaping lens, two groove part centers and shaping lens carriage center preferably on same straight line, can reach the effect of laser beam fast axis collimation.Above-mentioned bonding agent preferably adopts ultra-violet curing glue glue.During work; Supply module connects external power source; And through the single tube laser power supply of circuit board to a plurality of mutual series connection, the place ahead of each single tube laser all is provided with shaping lens, can reach laser beam collimation effect; Scioptics have further been strengthened laser intensity again, at last the optical fiber output through joining with optical fiber splice.
More than combine specific embodiment to describe know-why of the present invention.These are described just in order to explain principle of the present invention, and can not be interpreted as the restriction to protection range of the present invention by any way.Based on the explanation here, those skilled in the art need not pay performing creative labour can associate other embodiment of the present invention, and these modes all will fall within protection scope of the present invention.
Claims (8)
1. the tandem semiconductor laser of a tool circuit board; It is characterized in that; Comprise the supply module, laser module, lens, the optical fiber splice that are disposed in order, said laser module comprises the heat sink and a plurality of single tube lasers of ladder, and described a plurality of single tube lasers are successively set on the heat sink step surface of said ladder; And described a plurality of single tube laser is connected in series through a circuit board, in the place ahead of each single tube laser shaping lens is set all.
2. the tandem semiconductor laser of tool circuit board according to claim 1; It is characterized in that, also comprise base, said base has notch by its top to extending below; Said laser module side is loaded in the said notch; And be packaged in the said base through a cover plate, said lens scioptics support is installed on the base front side, and said supply module is installed on the rear side of said base.
3. the tandem semiconductor laser of tool circuit board according to claim 2 is characterized in that, said shaping lens is installed on the shaping lens support; Said shaping lens support is fixed in the front side of said single tube laser; Said single tube laser top all is fixed with electrode, and said single tube laser is fixed on the heat sink step surface of said ladder, and said circuit board is fixed in the heat sink top of said ladder; And said electrode contacts with circuit board, so that both are electrically connected.
4. the tandem semiconductor laser of tool circuit board according to claim 2 is characterized in that, the underrun screw that said ladder is heat sink is connected with the pocket side wall of said base, so that said laser module side is loaded in the said notch.
5. the tandem semiconductor laser of tool circuit board according to claim 2; It is characterized in that; All bonding between said cover plate and said base, said lens and said lens carrier, said lens carrier and the said base through bonding agent; In the rear side of said base, said optical fiber splice passes through screw in the base front side to said supply module through screw, and is positioned at the outside of said lens.
6. the tandem semiconductor laser of tool circuit board according to claim 3; It is characterized in that; In the front side of said single tube laser, said single tube laser top is connected in series electrode, packing ring through screw to said shaping lens support successively through screw, and through said screw overall fixed on the heat sink step surface of said ladder; The bottom of said circuit board is provided with insulating circuit board; And pass through screw in the lump in the heat sink top of said ladder, said electrode contacts with circuit board, so that both are electrically connected.
7. the tandem semiconductor laser of tool circuit board according to claim 3; It is characterized in that; Said shaping lens comprises the fast axle of laser beam shaping lens, laser beam slow axis shaping lens; The top center of said shaping lens support is offered first groove part and second groove part downwards successively; Said laser beam slow axis shaping lens is adhered to said shaping lens support upper surface through bonding agent, and is positioned at said first groove part top, and the fast axle of said laser beam shaping lens is adhered to said laser beam slow axis shaping lens bottom through bonding agent.
8. according to the tandem semiconductor laser of each described tool circuit board of claim 1～7, it is characterized in that said supply module is provided with power supply terminal and signal output terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210126936XA CN102646922A (en) | 2012-04-26 | 2012-04-26 | Tandem type semiconductor laser with circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210126936XA CN102646922A (en) | 2012-04-26 | 2012-04-26 | Tandem type semiconductor laser with circuit board |
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| CN102646922A true CN102646922A (en) | 2012-08-22 |
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| CN201210126936XA Pending CN102646922A (en) | 2012-04-26 | 2012-04-26 | Tandem type semiconductor laser with circuit board |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104112980A (en) * | 2014-07-10 | 2014-10-22 | 北京凯普林光电科技有限公司 | Staggerly-laminated optical path module and multi-die semiconductor laser |
| CN104112978A (en) * | 2014-07-10 | 2014-10-22 | 北京凯普林光电科技有限公司 | Vertical laminated optical path module and multi-die semiconductor laser |
| CN104269735A (en) * | 2014-10-09 | 2015-01-07 | 西安炬光科技有限公司 | Mechanical connection conducting cooling type semiconductor laser unit stack packaging structure |
| CN104701731A (en) * | 2015-03-02 | 2015-06-10 | 无锡亮源激光技术有限公司 | High-power line laser system |
| CN106896098A (en) * | 2015-12-18 | 2017-06-27 | 无锡市金义博仪器科技有限公司 | A kind of excitation apparatus |
| CN106936055A (en) * | 2017-03-11 | 2017-07-07 | 无锡亮源激光技术有限公司 | Parallel array laser line generator |
| CN109565154A (en) * | 2016-09-05 | 2019-04-02 | 古河电气工业株式会社 | Laser aid and light supply apparatus |
| CN110024240A (en) * | 2016-11-25 | 2019-07-16 | 古河电气工业株式会社 | Laser aid and light supply apparatus |
| CN112305681A (en) * | 2019-07-25 | 2021-02-02 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112310801A (en) * | 2020-11-09 | 2021-02-02 | 中国工程物理研究院应用电子学研究所 | Phase-change cooling semiconductor laser device |
| US11011885B2 (en) | 2016-11-25 | 2021-05-18 | Furukawa Electric Co., Ltd. | Laser device and light-source device |
| CN113258448A (en) * | 2021-07-14 | 2021-08-13 | 北京凯普林光电科技股份有限公司 | Optical fiber coupling structure of multi-single-tube semiconductor laser |
| CN113314942A (en) * | 2021-05-25 | 2021-08-27 | 天津凯普林光电科技有限公司 | Power-on device of laser component |
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Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104112980A (en) * | 2014-07-10 | 2014-10-22 | 北京凯普林光电科技有限公司 | Staggerly-laminated optical path module and multi-die semiconductor laser |
| CN104112978A (en) * | 2014-07-10 | 2014-10-22 | 北京凯普林光电科技有限公司 | Vertical laminated optical path module and multi-die semiconductor laser |
| CN104269735A (en) * | 2014-10-09 | 2015-01-07 | 西安炬光科技有限公司 | Mechanical connection conducting cooling type semiconductor laser unit stack packaging structure |
| CN104269735B (en) * | 2014-10-09 | 2017-02-08 | 西安炬光科技有限公司 | Mechanical connection conducting cooling type semiconductor laser unit stack packaging structure |
| CN104701731A (en) * | 2015-03-02 | 2015-06-10 | 无锡亮源激光技术有限公司 | High-power line laser system |
| CN106896098A (en) * | 2015-12-18 | 2017-06-27 | 无锡市金义博仪器科技有限公司 | A kind of excitation apparatus |
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| US10777965B2 (en) | 2016-09-05 | 2020-09-15 | Furukawa Electric Co., Ltd. | Laser apparatus and light source apparatus |
| CN109565154A (en) * | 2016-09-05 | 2019-04-02 | 古河电气工业株式会社 | Laser aid and light supply apparatus |
| JP7247391B2 (en) | 2016-09-05 | 2023-03-28 | 古河電気工業株式会社 | Laser device and light source device |
| JP2022065182A (en) * | 2016-09-05 | 2022-04-26 | 古河電気工業株式会社 | Laser device and light source device |
| CN110024240B (en) * | 2016-11-25 | 2021-10-22 | 古河电气工业株式会社 | Laser device, light source device, and fiber laser |
| CN110024240A (en) * | 2016-11-25 | 2019-07-16 | 古河电气工业株式会社 | Laser aid and light supply apparatus |
| US10985526B2 (en) | 2016-11-25 | 2021-04-20 | Furukawa Electric Co., Ltd. | Laser device and light-source device |
| US11011885B2 (en) | 2016-11-25 | 2021-05-18 | Furukawa Electric Co., Ltd. | Laser device and light-source device |
| CN106936055A (en) * | 2017-03-11 | 2017-07-07 | 无锡亮源激光技术有限公司 | Parallel array laser line generator |
| CN112305681A (en) * | 2019-07-25 | 2021-02-02 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112305681B (en) * | 2019-07-25 | 2023-12-15 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112310801A (en) * | 2020-11-09 | 2021-02-02 | 中国工程物理研究院应用电子学研究所 | Phase-change cooling semiconductor laser device |
| CN113314942A (en) * | 2021-05-25 | 2021-08-27 | 天津凯普林光电科技有限公司 | Power-on device of laser component |
| CN113258448A (en) * | 2021-07-14 | 2021-08-13 | 北京凯普林光电科技股份有限公司 | Optical fiber coupling structure of multi-single-tube semiconductor laser |
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Application publication date: 20120822 |