CN101453159B - Power terminal having built-in power terminal - Google Patents
Power terminal having built-in power terminal Download PDFInfo
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- CN101453159B CN101453159B CN 200810243224 CN200810243224A CN101453159B CN 101453159 B CN101453159 B CN 101453159B CN 200810243224 CN200810243224 CN 200810243224 CN 200810243224 A CN200810243224 A CN 200810243224A CN 101453159 B CN101453159 B CN 101453159B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention relates to a power module with an embedded power terminal. The module can accommodate a plurality of circuit structures, can make the output current range of the module with the same dimension maximized through the combination of lead wire terminals, has a simple structure and is convenient to replace. The power module comprises the following technical proposal to realize the aim: the power module with the embedded power terminal comprises a top cover, a base plate, a side frame, a power terminal and a signal terminal; the side frame extends upwards along the periphery of the base plate; the inner wall of the side frame is provided with the power terminal and the signal terminal; the base plate is provided with a circuit substrate and a chip; the inner side of at least one side of the side frame is provided with a slot; a power terminal main body is arranged in the slot; and the bottom of the power terminal is bonded with the base plate.
Description
Technical field
The present invention relates to a kind of power device, can be applicable to multiple circuit structure, multiple voltage, and have the power model with built-in power terminal of big electric current output area more specifically to a kind of.This invention is applicable to the power model that uses nuts/bolts constant power terminal.
Background technology
Because MOSFET and IGBT power model have the wide industrial application scenario, their design exists different voltages with different and current class.For example, the withstand voltage scope of MOSFET module can be from 20V to 1000V, and the withstand voltage scope of IGBT module can be from 300V until 6500V.On the other hand, to the power model of same voltage withstand class, according to the size of load, its output current also is very different.The IGBT module of 1200V electric pressure for example, the scope of output current can be increased to above 1000 amperes from 50 amperes.Moreover to different application scenarios, MOSFET and IGBT Module Design have the different circuits structure, and single tube is arranged, half-bridge, chopper, symmetrical, asymmetric four bridges, three phase full bridge, PIM, IPM or the like.
Existing power model comprises plastic casing 1, base plate 2, power terminal 4 and signal terminal 5 in typical case.With standard " 62mm " power model is example; Its structure is as shown in Figure 1: it is generally the power model of 3 power lead terminals, and the direct soldering of power lead terminal is on the DBC substrate, when installing hole 26 location 93mm * 48mm. are used for IGBT; Voltage range is divided into 600V, 1200V and 1700V.When voltage was 600V, its maximum output current can reach 400A.When voltage raise, output current descended.The circuit structure aspect, this module can be used as single tube, and half-bridge and chopper are used.
Modern power electronics modules is because the requirement of different voltages with different, electric current and circuit structure has caused the variation of module size and layout.A kind of design often can only be to single circuit structure and limited voltage, current range.Even different production merchant is to identical application, the module of its design also is not quite similar, and makes the versatility of module very limited, has increased user's cost.Even if same manufacturer, miscellaneous module has also increased management and manufacturing cost.Meanwhile, make power model towards high power density to the efficient and requirements of saving energy of industrial frequency transformer and other power control system, high reliability and low manufacturing cost direction develop.Therefore, need a kind ofly can be suitable for multiple circuit structure, multiple voltage on the market, and the power model that has than big electric current output area satisfies the demands.
Summary of the invention
The object of the invention overcomes the defective of prior art; A kind of power model with built-in power terminal is provided; This module can be held multiple circuit structure and the combination through lead terminal; Make the output current scope maximization of same size module, and simple in structure, power model is changed convenient.
The technical scheme that realizes the object of the invention is: the power model with built-in power terminal; Comprise top cover, base plate, frame, power terminal and signal terminal, said frame extends upward around base plate, and the inwall of frame is provided with said power terminal and signal terminal; Said base plate is provided with circuit substrate (DBC substrate) and chip; At least be provided with slot in the inboard on a limit of said frame, said power terminal main body is arranged in the slot, power terminal bottom and base plate bonding.
Said scuncheon is provided with slot, can be directly to have slot on the frame, also can be that the support that has slot is embossed in scuncheon.
As further improvement of the present invention; The notch of said slot is provided with bending, the vertical intersection in the power terminal bottom with the power terminal main body, and the both sides of power terminal bottom are provided with and above-mentioned bending corresponding grooves; Make power terminal can be installed to trench bottom, with the inboard level table crimping of housing.Like this, during bonding, the terminal bottom surface can obtain enough support forces, to satisfy the requirement of bonding technology.In addition, when a certain terminal need be scrapped owing to defective, only need to take out scrap terminal, change qualified terminal, and will module not scrap.Termination recess its width of part and the whole relatively power terminal of length are all very little, and be little to the current load power influence of terminal.
As further improvement of the present invention; The notch folding surface of said slot forms the wedge shape of certain angle; The both sides of power terminal bottom are provided with and the corresponding wedge-shaped impression of above-mentioned bending, reduce the area of power terminal bottom plate groove, have increased the area of terminal bottom bonding region.
Among the present invention, according to power model purposes needs, select slot is set on four limits of frame, and power terminal is set in slot, according to the circuit structure of module, the quantity of power terminal can change from 2 to 6 flexibly.
Among the present invention, the setting of signal terminal can be a signalization terminal support on frame, and 1 to 8 signal terminal is set on each signal terminal support.
Said power terminal and signal are the copper material of high conductivity, and support is the high-insulativity plastic material, and through molded, power terminal and signal terminal can be according to power model structure assembled in advance.
The invention has the beneficial effects as follows; Be provided with power terminal slot among the present invention; Purposes according to power model; Through the lead terminal various combination of (comprising power terminal and signal terminal), the power terminal and the signalization terminal of corresponding number promptly is set in slot, make the output current scope maximization of same size module.
Beneficial effect of the present invention is that also the setting of slot on the frame can be simplified the power terminal bonding technology, reduces the cost of power model.Because power terminal needn't be mounted to support in advance, but can be mounted separately to module, when a certain power terminal generation bonding problem; Can directly change; Again bonding is not changed and need not take out support, has overcome to adopt when having the support of jack; Accomplished under the situation of bonding when other terminal that is installed on the same support, can't change the defective of remaining problematic terminal again.
Description of drawings
Fig. 1 is a background technology structure chart of the present invention
Fig. 2 is the embodiment of the invention 1 an inserting slot construction sketch map
Fig. 3 is the embodiment of the invention 1 power terminal and signal terminal mounting structure sketch map
Fig. 4 is the embodiment of the invention 1 a power terminal structural representation
Fig. 5 is the embodiment of the invention 2 power terminals and signal terminal mounting structure sketch map
Fig. 6 is the embodiment of the invention 3 power terminals and signal terminal mounting structure sketch map
Fig. 7 is the embodiment of the invention 4 power terminals and signal terminal mounting structure figure
Fig. 8 is embodiment of the invention signal terminal support and signal terminal combination structure chart
Embodiment
Further specify below in conjunction with embodiment.
Embodiment 1
As shown in Figure 2, have the power model 100 of built-in power terminal, comprise top cover, base plate 2, frame 3, power terminal 4 and signal terminal 5, power terminal support 7 and signal terminal support 6.Four jiaos of base plate 2 are provided with installing and locating hole 26, and base plate is provided with DBC substrate and chip.Power terminal support 7 is arranged on the inboard on the forward and backward limit 31,32 of frame 3, and is embossed in frame 3 inboards, is respectively equipped with three slots 9 on two power terminal supports 7.
As shown in Figure 3, power terminal 4 inserts in three slots 9 in frame front 31, and power terminal main body 41 is arranged in the slot 9, power terminal bottom 42 and base plate 2 bondings.The notch 11 of slot is provided with bending 12, and bending side forms 45 ° wedge shape.Be positioned at frame front 31 inboard slots 9 and be respectively equipped with the first power terminal 4a, the second power terminal 4b, the 3rd power terminal 4c, they are drawn as DC+, DC-and chopper power terminal respectively.Be positioned at the inboard slots 9 in frame back 32 and be respectively equipped with the first power terminal 4a, the second power terminal 4b, the 3rd power terminal 4c, they are respectively as U, V, and W power output terminal is drawn
As shown in Figure 4; Be provided with bending otch 44 in the both sides of power terminal main body 41; Vertical intersection in power terminal bottom 42 with power terminal main body 41, the both sides of power terminal bottom 42 are provided with and the corresponding 45 ° of wedge-shaped impressions 43 of above-mentioned bending, make power terminal 9 can be installed to slot 9 bottoms; And, realize that the inside modules circuit connects through level table 21 crimping in supersonic bonding or brazing mode and the base plate 2.Like this, during bonding, terminal bottom 42 can obtain enough support forces with the contact-making surface of base plate, satisfies the requirement of bonding technology.The whole relatively power terminal of its width of termination recess 43 parts and length 9 is all very little, and is little to the current load power influence of terminal.
As shown in Figure 8, signalization terminal jacks 18 on the signal terminal support 6 is provided with signal terminal 5 in signal terminal jack 18.As shown in Figure 3, two signal terminal supports 6 embed inboard, the bottom of signal terminal 5 and the base plate bonding on the left side 33 and the right 34 of frame 3 respectively.The two ends on the left side 33 and the right 34 are provided with block 8, are used for the location of signal terminal support 6, are respectively equipped with eight signal terminals 5 on two signal terminal supports 6.
Power model adds the chopper structure as three phase full bridge in the present embodiment.
The difference of present embodiment and last example is that present embodiment is provided with three power terminals 4.
As shown in Figure 5, be respectively equipped with the first power terminal 4a, the second power terminal 4b, the 3rd power terminal 4c at three slots 9 that are positioned at 31 inboards, frame front in the present embodiment.Two signal terminal supports 6 embed the left side 33 of frame 3 and the inboard on the right 34 respectively, and the two ends on the left side 33 and the right 34 are provided with block 8, are used for the location of signal terminal support 6, are respectively equipped with two signal terminals 5 on two signal terminal supports 6.
Power model can directly be replaced standard " 34mm " power model in the present embodiment under the constant situation in installing and locating hole.
Power model is as half-bridge structure in the present embodiment.
As shown in Figure 6; Be positioned at three slots 9 that are provided with in frame 3 fronts 31; And being respectively equipped with the first power terminal 4a, the second power terminal 4b, the 3rd power terminal 4c, they are respectively as U, V; W power output terminal is drawn, and is respectively equipped with 2 signal terminals 5 on two signal terminal supports in frame 3 left sides 33.
As shown in Figure 7, in the present embodiment power model as the H-bridge construction, single tube IGBT when perhaps output current is greater than 300A and MOSFET module.Shown in figure 10, two slots 9 of difference of frame 3 the right and lefts 33,34 inboards, being provided with the first power terminal 4a and the second power terminal 4b in the slot 9 is that four power terminals are symmetrically distributed in about frame.31 inboards, front of frame 3 are provided with the first signal terminal support 6a, and the first signal terminal support 6a is provided with 3 signal terminals 5, and 32 inboards, back of frame 3 are provided with secondary signal terminal support 6b, and secondary signal terminal support 6b is provided with 2 signal terminals 5.
Circuit structure in the foregoing description can realize in power model of the present invention that all power terminal 4 is the copper material of high conductivity, and the built-in power terminal support is the high-insulativity plastic material, through molded.According to modular structure, the number of power lead terminal can from 2 to 6 variations.Lead terminal can be according to the modular structure assembled in advance.Composite type signal lead terminal.According to modular structure, the number of signal terminal 5 can from 1 to 8 variation.Its structure is similar with the power lead terminal with assembling.
The present invention is constant at contour structures, under the constant situation in installing and locating hole, can directly replace standard " 62mm " thin type power module.
Claims (8)
1. the power model that has the built-in power terminal comprises top cover, base plate, frame, power terminal and signal terminal, and said frame extends upward around base plate; The inwall of frame is provided with said power terminal and signal terminal, and said base plate is provided with circuit substrate and chip, it is characterized in that; At least be provided with slot in the inboard on a limit of said frame; Said power terminal main body embeds in the slot, each power terminal independent installation or taking-up, power terminal bottom and circuit substrate bonding; The notch of said slot is provided with bending, the vertical intersection in the power terminal bottom with the power terminal main body, and the both sides of power terminal bottom are provided with and above-mentioned bending corresponding grooves.
2. power model according to claim 1 is characterized in that, it is that the support that has slot is embossed in scuncheon that the inboard on a limit of said frame is provided with slot.
3. power model according to claim 1 is characterized in that, the notch folding surface of said slot forms the wedge shape of certain angle, and the both sides of power terminal bottom are provided with and the corresponding wedge-shaped impression of above-mentioned bending.
4. power model according to claim 1 and 2 is characterized in that, is provided with block at the interior angle of said frame, and the signal terminal support embeds the left side of frame or the space between the right and the block.
5. power model according to claim 1 and 2 is characterized in that, is respectively equipped with three slots with the inboard, back before the said frame, in each slot, is equipped with power terminal, is provided with signal terminal on two signal terminal supports in the frame left side and the right.
6. power model according to claim 1 and 2 is characterized in that, inboard, said frame front is provided with three slots, in each slot, is equipped with power terminal, is provided with signal terminal on two signal terminal supports in the frame left side and the right.
7. power model according to claim 1 and 2 is characterized in that, inboard, said frame front is provided with three slots, in each slot, is equipped with power terminal, is provided with signal terminal on two signal terminal supports in the frame left side or the right.
8. power model according to claim 1 and 2 is characterized in that, a said frame left side and inboard, the right are respectively equipped with two slots, in each slot, are equipped with power terminal, are provided with signal terminal on two signal terminal supports in frame front and back.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810243224 CN101453159B (en) | 2008-12-26 | 2008-12-26 | Power terminal having built-in power terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810243224 CN101453159B (en) | 2008-12-26 | 2008-12-26 | Power terminal having built-in power terminal |
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| CN101453159A CN101453159A (en) | 2009-06-10 |
| CN101453159B true CN101453159B (en) | 2012-02-29 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102064160A (en) * | 2010-11-11 | 2011-05-18 | 嘉兴斯达微电子有限公司 | Power module containing special power terminal |
| CN102254892A (en) * | 2011-08-10 | 2011-11-23 | 嘉兴斯达微电子有限公司 | Thin high-power semiconductor module |
| CN102800833B (en) * | 2012-08-31 | 2015-03-18 | 江苏宏微科技股份有限公司 | Electrode terminal of power module and welding method thereof |
| CN103078477B (en) * | 2013-01-28 | 2015-04-08 | 台达电子企业管理（上海）有限公司 | Connection structure of intelligent power module terminal |
| CN103779348A (en) * | 2014-01-24 | 2014-05-07 | 嘉兴斯达微电子有限公司 | Flat-plate type power semiconductor module |
| CN105006670A (en) * | 2015-07-31 | 2015-10-28 | 无锡新洁能股份有限公司 | Thin power module |
| US11183440B2 (en) | 2018-12-10 | 2021-11-23 | Gan Systems Inc. | Power modules for ultra-fast wide-bandgap power switching devices |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101197334A (en) * | 2007-09-27 | 2008-06-11 | 厦门宏发电声有限公司 | Power semiconductor module and production method thereof |
| CN101304010A (en) * | 2008-06-20 | 2008-11-12 | 南京银茂微电子制造有限公司 | Thin type power module |
| CN101320938A (en) * | 2008-07-15 | 2008-12-10 | 南京银茂微电子制造有限公司 | Multi-use power module |
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2008
- 2008-12-26 CN CN 200810243224 patent/CN101453159B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101197334A (en) * | 2007-09-27 | 2008-06-11 | 厦门宏发电声有限公司 | Power semiconductor module and production method thereof |
| CN101304010A (en) * | 2008-06-20 | 2008-11-12 | 南京银茂微电子制造有限公司 | Thin type power module |
| CN101320938A (en) * | 2008-07-15 | 2008-12-10 | 南京银茂微电子制造有限公司 | Multi-use power module |
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