CN102097418B - IGBT driving unit - Google Patents
IGBT driving unit Download PDFInfo
- Publication number
- CN102097418B CN102097418B CN 201010594698 CN201010594698A CN102097418B CN 102097418 B CN102097418 B CN 102097418B CN 201010594698 CN201010594698 CN 201010594698 CN 201010594698 A CN201010594698 A CN 201010594698A CN 102097418 B CN102097418 B CN 102097418B
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- Prior art keywords
- busbar
- igbt
- circuit board
- igbt module
- drive circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention discloses an insulated gate bipolar transistor (IGBT) driving unit, which comprises at least one IGBT module, an IGBT driving circuit board, a first bus and a second bus, wherein the IGBT module, the first bus, the second bus and the driving circuit board are arranged in parallel from bottom to top; the first bus and the second bus are fixed with the IGBT module respectively; and the first bus or the second bus is fixed with the driving circuit board. According to the technical scheme, the IGBT module and the driving circuit board of the IGBT driving unit provided by the invention are arranged vertically, so the occupation area of the IGBT driving unit is reduced, the structure in a box or a cabinet can be more compact, and optimization of electric performance is favorable; the buses connect the driving circuit board and the IGBT module into a whole, so modular assembly and disassembly can be performed on the IGBT unit; and the distance between the door extreme of the IGBT module and the driving circuit board is short, so the driving signal effect is good.
Description
Technical field
The present invention relates to a kind of IGBT driver element, specifically the package assembly of IGBT driver element.
Background technology
IGBT (Insulated Gate Bipolar Transistor; Insulated gate bipolar transistor); The compound full-control type voltage driven type power semiconductor of forming by BJT (double pole triode) and MOS (insulating gate type field effect tube); Have the advantage of low conduction voltage drop two aspects of high input impedance and the GTR of MOSFET concurrently; Little and the saturation pressure of driving power reduces, and being fit to very much be applied to direct voltage is 600V and above converter system, is widely used in fields such as alternating current machine, frequency converter, Switching Power Supply, lighting circuit, traction transmission.
The IGBT module is that common schema has 1in1 with the igbt chip of one or more IGBT single tube modularization encapsulation, 2in1, and 6in1, common encapsulation pattern has M232, M233, M245 etc.The IGBT module needs drive circuit to its gate pole end drive signal to be provided, and just can start its work, the IGBT module should with the supporting use of drive circuit board, IGBT module, drive circuit board close claims IGBT driver element.
In order to obtain bigger output current, usually with a plurality of IGBT modules and connect use, in practical application, mostly the IGBT driver element is that a drive circuit board has a plurality of parallel IGBT modules.
IGBT driver element of the prior art adopts following two kinds of package assemblies usually,
First kind of package assembly of prior art is as shown in Figure 1; With IGBT modules A edge and drive circuit board B edge parallel arrangement; Though this mode can make IGBT module gate pole shorter to the transmission line of drive circuit board, but increased the footprints of IGBT driver element.
Second kind of package assembly of prior art is as shown in Figure 2; Drive circuit board B is fixed on the mounting panel D, and the IGBT modules A is installed on the radiator C, and drive circuit board B links to each other through line plate E with the IGBT modules A; The gate pole of IGBT modules A is longer to the transmission route of drive circuit board B; Influence the laser propagation effect of signal, and, also increased production cost owing to increased installation liner plate D and terminal block E.
Show that more than there is following defective in prior art: IGBT module and drive circuit board needs are installed respectively; Can't carry out modularization installs; IGBT whole unit footprints is bigger, has influenced the compactedness of its entire system topology layout, thereby influences the electric property of system.
Summary of the invention
In view of this, the invention provides a kind of IGBT driver element, compared with prior art, the IGBT module of IGBT driver element provided by the invention and drive circuit board form an independent integral body, can carry out the modularization installation and removal; IGBT driver element footprints is less, and the gate pole input of IGBT module and the transmission line of drive circuit board distance are shorter, and the drive signal laser propagation effect is good.
To achieve these goals, the present invention adopts following technical scheme:
A kind of IGBT driver element; Comprise at least one IGBT module, IGBT drive circuit board; Wherein: said IGBT module comprises gate pole input, collector output, emitter output; The gate pole input of said IGBT module links to each other with said drive circuit board, it is characterized in that: said IGBT driver element also comprises first busbar, second busbar, wherein:
Said first busbar and said second busbar are copper bar;
Said first busbar only connects the collector output that the emitter output of said IGBT module, said second busbar only connect said IGBT module;
Or said first busbar only connects the emitter output that the collector output of IGBT module, said second busbar only connect said IGBT module;
Said IGBT module, said first busbar, said second busbar, said IGBT drive circuit board are arranged according to order from top to bottom;
Install insulation cushion between said first busbar and said second busbar, said insulation cushion can make said first busbar and the insulation of said second busbar; Or the lower surface of the upper surface of the said first busbar bottom surface and the said second busbar bottom surface is the brushing insulating barrier respectively, and said insulating barrier can make said first busbar and the insulation of said second busbar;
Said first busbar and said second busbar are fixed with said IGBT module respectively;
Said first busbar or said second busbar and said drive circuit board are fixed;
Said first busbar and said second busbar all insulate with said drive circuit board.
Preferably, said first busbar comprises the contact, and the contact of said first busbar can be assigned in the emitter output or collector output of said IGBT module, and said first busbar and said IGBT module are fixed.
Preferably, said second busbar comprises the contact, and the contact of said second busbar can be assigned in the collector output of said IGBT module or emitter output, and said second busbar and said IGBT module are fixed.
Preferably, said second busbar or/and said first busbar comprise supporter, and said supporter and said drive circuit board are fixed.
Preferably, the distance >=5mm between said drive circuit board and said second busbar.
Preferably, said first busbar and said second busbar all comprise terminals.
Can find out from above technical scheme; The superjacent air space that utilizes the IGBT module of IGBT driver element provided by the invention is laid drive circuit board; Reduce the footprints of IGBT driver element, can make the structure in casing or the cabinet compact more, helped electric property optimization; Through busbar drive circuit board, IGBT module are connected into an integral body, make the IGBT unit can the modularization installation and removal; Because IGBT module and drive circuit board vertical arranged, the gate pole end of IGBT module is shorter to the distance of drive circuit board, thereby makes drive signal effective.
Description of drawings
Fig. 1 is first kind of package assembly sketch map of prior art IGBT driver element;
Fig. 2 is second kind of package assembly sketch map of prior art IGBT driver element;
Fig. 3, Fig. 4 are the overall structure sketch mapes of the IGBT driver element that provides of the embodiment of the invention one;
Fig. 5 is the surface structure sketch map of the IGBT driver module that provides of the embodiment of the invention one;
Fig. 6 is the structural representation of first busbar of the IGBT driver element that provides of the embodiment of the invention one;
Fig. 7 is the structural representation of second busbar of the IGBT driver element that provides of the embodiment of the invention one;
Fig. 8 is the overall structure sketch map of the IGBT driver element that provides of the embodiment of the invention two;
Fig. 9 is the structural representation of first busbar of the IGBT driver element that provides of the embodiment of the invention two;
Figure 10 is the structural representation of second busbar of the IGBT driver element that provides of the embodiment of the invention two.
Specific embodiment
To combine accompanying drawing below; Technical scheme in the embodiment of the invention is carried out clear, intactly description, and obviously, described embodiment only is the present invention's part embodiment; Rather than whole embodiment; Based on the embodiment of the invention, the every other embodiment that those skilled in the art obtained belongs to protection range of the present invention.
Embodiment one
Like Fig. 3, shown in Figure 4, the IGBT driver element of present embodiment comprises three IGBT modules 1, first busbar 2, second busbar 3, drive circuit board 4; IGBT module 1, first busbar 2, second busbar 3, drive circuit board 4 are arranged according to order from top to bottom.
IGBT module 1 is for the M232 encapsulation, and is as shown in Figure 5, and the C1 end is collector output, and the E2 end is the emitter output, and G1 end and G2 end are the gate pole input.
Lower surface in the bottom surface 25 of first busbar 2 is installed three contacts 21; The position of three contacts 21 is held corresponding with the C1 of three IGBT modules 1 respectively one by one; Contact 21 can be inserted in the C1 end of IGBT module 1; Make the C1 end in contact of first busbar 2 and IGBT module 1, and first busbar 2 is fixed on the IGBT module 1.
On the bottom surface 25 of first busbar 2, offer three deep-slotted chip breakers 22, its objective is first busbar 2 only is connected with the C1 end of IGBT module 1, with other port insulation of IGBT module 1.
In order to make full use of the space of IGBT module 1 top, reduce the footprints of IGBT unit, terminals 23 are perpendicular to the bottom surface 25 of first busbar 2.
Table is installed three contacts 31 below the bottom surface 35 of second busbar 3; The position of three contacts 31 E2 end with three IGBT modules 1 respectively is corresponding one by one; Contact 31 can be inserted in the E2 end of IGBT module 1; Make the E2 end in contact of second busbar 3 and IGBT module 1, and second busbar 3 is fixed on the IGBT module 1.
On the bottom surface 35 of second busbar 3, offer six deep-slotted chip breakers 32, its objective is second busbar 3 only is connected with the E2 end of IGBT module 1, with other port insulation of IGBT module 1.
In order to make full use of the space of IGBT module 1 top, reduce the footprints of IGBT unit, terminals 33 are perpendicular to the bottom surface 35 of second busbar 3.
Two supporters 34 are vertical with bottom surface 35, and supporter comprises platform 341, and platform 341 is positioned at supporter 34 tops and contacts with the lower surface of drive circuit board 4, can drive circuit board 4 be fixed on the platform on 341 with bolt and nut.
The height of supporter 34 and supporter 24 has determined the distance between the drive circuit board 4 and second busbar 2, and the distance between the drive circuit board 4 and second busbar 3 is 6mm.
Like Fig. 3, shown in Figure 4; Insulation cushion 5 is between first busbar 2 and second busbar 3, and the effect of insulation cushion 5 is to make first busbar 2 and 3 insulation of second busbar, like Fig. 3, shown in Figure 4; On insulation cushion 5, offer 9 circular holes 51; The position of 9 circular holes 51 and respectively C1 end, E2 end, the C2E1 end of three IGBT modules 1 is corresponding corresponding one by one, the purpose of offering 9 circular holes 51 be, avoids insulation cushion 5 to influence being communicated with of first busbar 2 and second busbar 3 and IGBT module 1.
Embodiment two
Because there is something in common in the IGBT driver element that IGBT driver element that present embodiment provides and embodiment one provide, for fear of giving unnecessary details, this paper is only to describing with the difference of embodiment one:
Like Fig. 8, as shown in Figure 9, first busbar 7 comprises three installing holes 71, six deep-slotted chip breakers 72, terminals 73, bottom surface 75.
The position of on the bottom surface 75 of first busbar 7, offering 71, three installing holes 71 of three installing holes is corresponding respectively with the E2 of three IGBT modules 8 end, adopt bolt with installing hole 71 with after the E2 end of IGBT module 8 is connected, first busbar 7 and IGBT module 8 are fixed.
On the bottom surface 75 of first busbar 7, offer six deep-slotted chip breakers 72, its objective is first busbar 7 only is connected with the E2 end of IGBT module 8, with other port insulation of IGBT module 8.
In order to make full use of the space of IGBT module 1 top, reduce the footprints of IGBT unit, terminals 73 are perpendicular to the bottom surface 75 of first busbar 7.
Like Fig. 8, shown in figure 10, second busbar 6 comprises three installing holes 61, three deep-slotted chip breakers 62, terminals 63, bottom surface 65, three supporters 64.
The position of on the bottom surface 65 of second busbar 6, offering 61, three installing holes 61 of three installing holes is corresponding respectively with the C1 of three IGBT modules end, adopt bolt with installing hole 61 with after the C1 end of IGBT module 8 is connected, second busbar 6 and IGBT module 8 are fixed.
On the bottom surface 65 of second busbar 6, offer three deep-slotted chip breakers 62, its objective is second busbar 6 only is connected with the C1 end of IGBT module 8, with other port insulation of IGBT module 8.
In order to make full use of the space of IGBT module 1 top, reduce the footprints of IGBT unit, terminals 63 are perpendicular to the bottom surface 65 of second busbar 6.
Three supporters 64 are vertical with bottom surface 65, and supporter 64 comprises platform 641, and platform 641 is positioned at supporter 64 tops and contacts with the lower surface of drive circuit board 4, can drive circuit board 9 be fixed on the platform on 641 with bolt and nut.
The height of supporter 64 has determined the distance between the drive circuit board 9 and second busbar 6, and distance is 5mm between the drive circuit board 9 and second busbar 6.
As shown in Figure 8; Different with first embodiment is; The IGBT driver element that present embodiment provides does not comprise insulation cushion 5; But brush insulating barrier at the upper surface of the bottom surface 75 of first busbar 7, and brush insulating barrier in the lower surface of the bottom surface 65 of second busbar 6, first busbar 7 and second busbar 6 are insulated.
The above is merely the preferred embodiments of the present invention, is not limited to the present invention, and for a person skilled in the art, the present invention can have various changes and variation.All within change of the present invention and changing, any modification of being made, be equal to replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. IGBT driver element; Comprise at least one IGBT module, IGBT drive circuit board; Wherein: said IGBT module comprises gate pole input, collector output, emitter output; The gate pole input of said IGBT module links to each other with said drive circuit board, it is characterized in that: said IGBT driver element also comprises first busbar, second busbar, wherein:
Said first busbar and said second busbar are copper bar;
Said first busbar only connects the collector output that the emitter output of said IGBT module, said second busbar only connect said IGBT module;
Or said first busbar only connects the emitter output that the collector output of IGBT module, said second busbar only connect said IGBT module;
Said IGBT module, said first busbar, said second busbar, said IGBT drive circuit board are arranged according to order from top to bottom;
Install insulation cushion between said first busbar and said second busbar, said insulation cushion can make said first busbar and the insulation of said second busbar; Or the lower surface of the upper surface of the said first busbar bottom surface and the said second busbar bottom surface is the brushing insulating barrier respectively, and said insulating barrier can make said first busbar and the insulation of said second busbar;
Said first busbar and said second busbar are fixed with said IGBT module respectively;
Said first busbar or said second busbar and said drive circuit board are fixed;
Said first busbar and said second busbar all insulate with said drive circuit board.
2. a kind of IGBT driver element according to claim 1; It is characterized in that: said first busbar comprises the contact; The contact of said first busbar can be assigned in the emitter output or collector output of said IGBT module, and said first busbar and said IGBT module are fixed.
3. a kind of IGBT driver element according to claim 1; It is characterized in that: said second busbar comprises the contact; The contact of said second busbar can be assigned in the collector output of said IGBT module or emitter output, and said second busbar and said IGBT module are fixed.
4. a kind of IGBT driver element according to claim 1 is characterized in that: said second busbar or/and said first busbar comprise supporter, and said supporter and said drive circuit board are fixed.
5. a kind of IGBT driver element according to claim 1 is characterized in that: the distance >=5mm between said drive circuit board and said second busbar.
6. a kind of IGBT driver element according to claim 1 is characterized in that: said first busbar and said second busbar all comprise terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010594698 CN102097418B (en) | 2010-12-17 | 2010-12-17 | IGBT driving unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010594698 CN102097418B (en) | 2010-12-17 | 2010-12-17 | IGBT driving unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102097418A CN102097418A (en) | 2011-06-15 |
| CN102097418B true CN102097418B (en) | 2012-06-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010594698 Expired - Fee Related CN102097418B (en) | 2010-12-17 | 2010-12-17 | IGBT driving unit |
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| Country | Link |
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| CN (1) | CN102097418B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130011812A (en) * | 2011-07-22 | 2013-01-30 | 엘에스산전 주식회사 | Method for driving igbt |
| CN103259388B (en) * | 2013-05-02 | 2016-02-10 | 苏州汇川技术有限公司 | Modular power unit and inverter |
| CN103346680A (en) * | 2013-06-26 | 2013-10-09 | 永济新时速电机电器有限责任公司 | Novel IGBT device applicable to high-power electric locomotive |
| CN108123613B (en) * | 2016-11-28 | 2020-01-14 | 中车株洲电力机车研究所有限公司 | Power module for rail vehicle |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201408759Y (en) * | 2009-05-07 | 2010-02-17 | 深圳市禾望电气有限公司 | IGBT power module |
| CN201536318U (en) * | 2009-11-10 | 2010-07-28 | 中国北车股份有限公司大连电力牵引研发中心 | Traction converter power module |
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2010
- 2010-12-17 CN CN 201010594698 patent/CN102097418B/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN102097418A (en) | 2011-06-15 |
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Owner name: CHINA CNR CORPORATION LIMITED Free format text: FORMER OWNER: DALIAN ELECTRIC TRACTION RESEARCH + DEVELOPMENT CENTER OF CHINA NORTH LOCOMOTIVE CO., LTD. Effective date: 20140212 |
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Free format text: CORRECT: ADDRESS; FROM: 116022 DALIAN, LIAONING PROVINCE TO: 100078 FENGTAI, BEIJING |
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Effective date of registration: 20140212 Address after: 100078 Beijing Fengtai District city park is a district 15 building Patentee after: CHINA CNR Corp.,Ltd. Address before: 116022 Shahekou, Liaoning, China No. 51 The Strip Patentee before: CHINA CNR CORPORATION LIMITED DALIAN ELECTRIC TRACTION R&D CENTER |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120627 Termination date: 20211217 |
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| CF01 | Termination of patent right due to non-payment of annual fee |