KR20170059171A - Submount for high power laser diode optical module - Google Patents

Submount for high power laser diode optical module Download PDF

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Publication number
KR20170059171A
KR20170059171A KR1020150163148A KR20150163148A KR20170059171A KR 20170059171 A KR20170059171 A KR 20170059171A KR 1020150163148 A KR1020150163148 A KR 1020150163148A KR 20150163148 A KR20150163148 A KR 20150163148A KR 20170059171 A KR20170059171 A KR 20170059171A
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KR
South Korea
Prior art keywords
laser diode
submount
high power
power laser
bonded
Prior art date
Application number
KR1020150163148A
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Korean (ko)
Inventor
임정운
한수욱
장형식
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한국광기술원
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Application filed by 한국광기술원 filed Critical 한국광기술원
Priority to KR1020150163148A priority Critical patent/KR20170059171A/en
Publication of KR20170059171A publication Critical patent/KR20170059171A/en

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    • H01S5/02252—
    • H01S5/0226—

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  • Semiconductor Lasers (AREA)

Abstract

A submount for a high power laser diode optical module to which a high power laser diode according to an embodiment of the present invention is bonded is provided adjacent to a front surface where a laser beam is output from the bonded high power laser diode and a fast axis collimator And an insertion portion to be inserted.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a submount for a high power laser diode optical module,

The present invention relates to a submount for a high power laser diode optical module that simplifies the process of bonding and bonding a FAC (fast axis collimator) lens to a submount.

Generally, a laser (Light Amplification by Stimulated Emission of Radiation (LASER)) is a light emitted from a medium by an external stimulus and amplified by a resonator.

Such a laser is composed of an amplification medium, a resonator, and a pumping source, and is classified into a gas laser, a solid laser, a semiconductor laser, and an optical fiber laser depending on the kind of the medium.

In particular, lasers are used in various industrial fields because they are easy to use, clean, and provide rapid processing results, and new industrial lasers are being developed steadily due to the increased demand for high power lasers.

The above-mentioned fiber laser has unprecedented high optical-to-optical conversion efficiency among solid-state lasers, has a good beam quality and can form a resonator in the optical fiber itself. Therefore, it does not have a resonator Therefore, maintenance is not required, and it is getting popular as an industrial light source.

Currently, the development of fiber optic lasers in the market is being developed as high power continuous operation lasers, pulse operation lasers, and ultra-fast light sources. Over the years, many companies have been making KW lasers for industrial use.

In the conventional high-power laser diode optical module, when a FAC lens is bonded to a sub-mount to which a laser diode chip is bonded, current is supplied to the laser diode to generate light, and the FAC lens is precisely aligned. To mount the FAC lens on the end face of the submount.

Specifically, after gripping the FAC lens with a gripper, aligning the gripper precisely while moving the gripper vertically, and then attaching the FAC lens using a UV curing epoxy, expensive sorting equipment is required Or the process time is increased.

The object of the present invention is to provide a method of aligning and bonding a FAC lens to a submount by aligning and bonding without turning on a laser diode instead of aligning and bonding after a conventional laser diode is turned on And a submount for a high-power laser diode optical module to be bonded to the substrate.

Another object of the present invention is to provide a submount for a high power laser diode optical module in which the process of bonding the FAC lens to the submount is simplified, the process time is shortened, There is.

According to an aspect of the present invention, there is provided a submount for a high power laser diode optical module to which a high power laser diode according to an exemplary embodiment of the present invention is bonded, And an insertion portion into which a FAC (fast axis collimator) lens is inserted.

In an embodiment, the insertion portion may be formed integrally with the submount for the high power laser diode optical module.

In an embodiment, the insertion portion may include at least one groove into which a part of the FAC lens is inserted.

In one embodiment of the present invention, the inserting portion includes a first groove formed on one end of a front surface of the bonded high power laser diode on which the laser beam is output, and a second groove formed on one end of the joined high output laser diode with reference to the bonded high power laser diode And a second groove formed at the other end of the front surface where the laser beam is output from the bonded high power laser diode.

In an embodiment, the FAC lens may be inserted into the insertion portion and then bonded to the insertion portion through UV curing using an epoxy.

In an embodiment, the inserted FAC lens can be automatically aligned in relation to the bonded high power laser diode through insertion into the insert.

The effect of the submount for a high power laser diode optical module according to the present invention is as follows.

According to at least one of the embodiments of the present invention, a method of aligning and bonding the laser diode without turning on the laser diode (passive alignment method) is used instead of the method of aligning and bonding after the conventional laser diode is turned on The FAC lens can be bonded to the submount.

According to at least one of the embodiments of the present invention, the process of bonding the FAC lens to the submount is simplified, and the manufacturing time can be shortened and the cost of the alignment equipment is not required, thereby reducing the manufacturing cost.

1 is a view showing a high-power laser diode chip according to the present invention.
2 is a view showing a CoS (chip on submount) in which a conventional junction type FAC lens and a high output laser diode chip are bonded to a submount.
3 is a view showing a gripper used for aligning a conventional junction type FAC lens.
4 is a view showing a submount for a high power laser diode optical module according to an embodiment of the present invention.
5 is a view illustrating an example in which a high output laser diode is aligned and bonded to a submount for a high power laser diode optical module according to an embodiment of the present invention.
6 is a view illustrating a process of inserting a FAC lens into a submount for a high power laser diode optical module according to an embodiment of the present invention.
7 is a view illustrating an example in which a FAC lens is inserted into a submount for a high power laser diode optical module according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals are used to designate identical or similar elements, and redundant description thereof will be omitted. The suffix "module" and " part "for the components used in the following description are given or mixed in consideration of ease of specification, and do not have their own meaning or role. In the following description of the embodiments of the present invention, a detailed description of related arts will be omitted when it is determined that the gist of the embodiments disclosed herein may be blurred. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. , ≪ / RTI > equivalents, and alternatives.

Terms including ordinals, such as first, second, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It will be apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

1 is a view showing a high-power laser diode chip according to the present invention.

1, the high-power laser diode chip includes an n-cladding layer having an n-electrode 110, a p-cladding layer having a p-electrode 120, and a p- And the active layer 130 may be formed on the active layer 130.

When a current is applied to the high-power laser diode chip, the laser beam 140 is outputted from the active layer 130. Here, the characteristics of the laser beam 140 output from the active layer 130 of the high-power laser diode chip are as follows. The laser beam 140 output as shown in FIG. 1 is longer in the Fast Axis axis 142 (vertical direction) and output in a shorter elliptical shape in the axis axis 141 (horizontal direction). Specifically, since the laser beam 140 is diverged at an angle of about 35 degrees in the vertical direction 142 and at an angle of about 5 to 8 degrees in the horizontal direction 142, the divergence angle of the laser beam 140 is A fast axis collimation (FAC) lens and a slow axis collimation (SAC) lens may be provided at the front end of the laser diode. This is to reduce the divergence angle of the output laser beam 140, and then use the focusing lens to make the laser beam 140 into a single point and to finally insert the laser beam 140 into the core of the optical fiber.

2 is a view showing a CoS (chip on submount) in which a conventional junction type FAC lens and a high output laser diode chip are bonded to a submount. 3 is a view showing a gripper used for aligning a conventional junction type FAC lens.

Conventionally, the laser diode chip 211 is bonded to the submount 210 to form a chip on submount (CoS), and the FAC lens 220 is aligned and bonded to the formed CoS. Thereafter, the FAC lens 220 is bonded CoS is bonded to the inside of the optical fiber coupled optical module package. Then, the SAC lens and the mirror were aligned and bonded, and then a laser beam was incident on the optical fiber to form a pumping light source for the optical fiber laser.

A method of bonding the FAC lens 220 to the CoS formed by bonding the laser diode chip 211 to the submount 210 will now be described in detail. And the FAC lens 220 is held using the gripper 230 shown in FIG. 3. The grippers 230 are precisely aligned while moving the grippers 230 in the up, down, left, and right directions on the basis of the formed CoS, The end face of the submount 210 and the FAC lens 220 are bonded to each other using epoxy. This method is referred to as an active alignment method because it aligns the FAC lens 220 in the on state of the high-power laser diode 211 and performs bonding.

In such an active alignment method as described above, a sorting apparatus having a high price is indispensably required for aligning the FAC lens 220, and there is a problem that a process time for alignment may be prolonged. The present invention proposes a submount having a new structure for solving the above problems.

4 is a view showing a submount for a high power laser diode optical module according to an embodiment of the present invention. 5 is a view illustrating an example in which a high-power laser diode is aligned and bonded to a submount for a high-power laser diode optical module according to an embodiment of the present invention. FIG. 6 is a cross- FIG. 7 is a view showing a process of inserting a FAC lens into a submount for an optical module. FIG.

4, 5 and 6, the submount 410 for a high power laser diode optical module may include inserts 420 and 430.

Here, the inserting portions 420 and 430 may be provided adjacent to the front surface of the high power laser diode 440 bonded to the submount 410, from which the laser beam is output. The insertion portions 420 and 430 may include grooves into which a part of the FAC lens 450 may be inserted.

The number of grooves is not particularly limited and the number of grooves that the FAC lens 450 can be fixed to the submount 410 It is enough. For example, the inserting portions 420 and 430 may be formed of a high-output laser diode (hereinafter referred to as a high-power laser diode) 440 with reference to a bonded high-power laser diode 440 in order to secure the path of the laser beam output from the high- (One end and the other end) of the upper and lower surfaces of the base plate 440.

Meanwhile, the insertion portions 420 and 430 may be formed in a separate structure, but may be integrally formed with the submount 420 for a high power laser diode optical module. For this purpose, the sub-mount 420 for the high-power laser diode optical module can partially remove the front portion where the front surface of the high-power laser diode is positioned, and through which the FAC lens 450 can be inserted Grooves 420 and 430 may be formed.

The method of aligning the FAC lens 450 in this manner is called a passive alignment method because the FAC lens 450 is aligned in a state where the high power laser diode 440 is not turned on.

As a result, the passive alignment method performed in the submount for the high power laser diode optical module according to the present invention does not require high-priced alignment equipment for alignment of the FAC lens 450, Therefore, the processing time for the alignment can be shortened and the manufacturing cost can be reduced.

7 is a view illustrating an example in which a FAC lens is inserted into a submount for a high power laser diode optical module according to an embodiment of the present invention.

Referring to FIG. 7, the FAC lens 450 is inserted into an insertion portion provided in the submount 410 for a high-power laser diode optical module, and can be automatically aligned in relation to the bonded high power laser diode 440 have. As shown in FIG. 7, the FAC lens 450 inserted in the insertion portion can be fixed to the insertion portion by being UV-cured using epoxy to be firmly fixed.

That is, when the submount 410 for a high power laser diode optical module according to the present invention is used, the FAC lens 450 is bonded without turning on the high power laser diode 440 to remove the phenomenon of the laser beam spreading in the vertical direction And the process can be simplified and the manufacturing cost can be reduced as compared with the conventional method.

As a result, the submount for a high power laser diode optical module according to the present invention can be manufactured by a method of aligning and bonding without turning on a laser diode instead of a method of aligning and bonding the laser diode with an existing laser diode (active alignment method) ), The FAC lens can be bonded to the submount, and the process of bonding the FAC lens to the submount is simplified, and the manufacturing time can be shortened and the manufacturing cost can be reduced because high-cost sorting equipment is not required.

Accordingly, the foregoing detailed description should not be construed in any way as limiting and should be considered illustrative. The scope of the present invention should be determined by rational interpretation of the appended claims, and all changes within the scope of equivalents of the present invention are included in the scope of the present invention.

Claims (6)

1. A submount for a high power laser diode optical module in which a high power laser diode is bonded,
And an insertion portion provided adjacent to a front surface of the bonded high power laser diode for outputting a laser beam and into which a fast axis collimator (FAC) lens is inserted.
The method according to claim 1,
The insertion portion
And a submount for a high power laser diode optical module formed integrally with the submount for the high power laser diode optical module.
The method according to claim 1,
The insertion portion
And at least one groove into which a part of the FAC lens is inserted.
The method according to claim 1,
The insertion portion
A first groove formed at one end of a front surface of the bonded high power laser diode on which the laser beam is output, based on the bonded high power laser diode; And
And a second groove formed at the other end of the front surface of the bonded high output laser diode on which the laser beam is output, based on the bonded high output laser diode.
The method according to claim 1,
The FAC lens includes:
Wherein the optical fiber is inserted into the insertion portion and then bonded to the insertion portion through UV curing using epoxy.
The method according to claim 1,
Wherein the inserted FAC lens comprises:
Wherein the laser diode module is automatically aligned in relation to the bonded high power laser diode through insertion into the insert.
KR1020150163148A 2015-11-20 2015-11-20 Submount for high power laser diode optical module KR20170059171A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150163148A KR20170059171A (en) 2015-11-20 2015-11-20 Submount for high power laser diode optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150163148A KR20170059171A (en) 2015-11-20 2015-11-20 Submount for high power laser diode optical module

Publications (1)

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KR20170059171A true KR20170059171A (en) 2017-05-30

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KR1020150163148A KR20170059171A (en) 2015-11-20 2015-11-20 Submount for high power laser diode optical module

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200036222A (en) * 2018-09-28 2020-04-07 한국광기술원 High Power Laser Diode Module Capable of Passive Alignment
US11979002B2 (en) * 2018-02-06 2024-05-07 Nlight, Inc. Diode laser apparatus with FAC lens out-of-plane beam steering

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11979002B2 (en) * 2018-02-06 2024-05-07 Nlight, Inc. Diode laser apparatus with FAC lens out-of-plane beam steering
KR20200036222A (en) * 2018-09-28 2020-04-07 한국광기술원 High Power Laser Diode Module Capable of Passive Alignment

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