KR20170066076A - Submount for high power laser diode optical modules with a multiple wavelength - Google Patents

Submount for high power laser diode optical modules with a multiple wavelength Download PDF

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Publication number
KR20170066076A
KR20170066076A KR1020150172644A KR20150172644A KR20170066076A KR 20170066076 A KR20170066076 A KR 20170066076A KR 1020150172644 A KR1020150172644 A KR 1020150172644A KR 20150172644 A KR20150172644 A KR 20150172644A KR 20170066076 A KR20170066076 A KR 20170066076A
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South Korea
Prior art keywords
laser diode
power laser
high power
submount
optical module
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Application number
KR1020150172644A
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Korean (ko)
Inventor
임정운
장형식
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한국광기술원
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Priority to KR1020150172644A priority Critical patent/KR20170066076A/en
Publication of KR20170066076A publication Critical patent/KR20170066076A/en

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    • H01S5/02272—
    • H01S5/02288—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1092—Multi-wavelength lasing

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

A submount for a high power laser diode optical module having multiple wavelengths according to an embodiment of the present invention includes a first solder to which a first high power laser diode having a first wavelength is bonded and a second high power laser diode having a second wavelength to be bonded, (+) Electrode pad connected to the first high power laser diode, a second plug (+) electrode pad connected to the second high power laser diode, and a second plug electrode pad connected to the first high power laser diode and the second high power laser diode. And a negative (-) electrode pad to which the second high power laser diode is connected in common.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a submount for a high power laser diode optical module having multiple wavelengths,

The present invention relates to a submount for a high power laser diode optical module having multiple wavelengths capable of integrating at least two laser diodes on one submount.

Generally, a laser (Light Amplification by Stimulated Emission of Radiation (LASER)) is a light emitted from a medium by an external stimulus and amplified by a resonator.

Such a laser is composed of an amplification medium, a resonator, and a pumping source, and is classified into a gas laser, a solid laser, a semiconductor laser, and an optical fiber laser depending on the kind of the medium.

In particular, lasers are used in various industrial fields because they are easy to use, clean, and provide rapid processing results, and new industrial lasers are being developed steadily due to the increased demand for high power lasers.

The above-mentioned fiber laser has unprecedented high optical-to-optical conversion efficiency among solid-state lasers, has a good beam quality and can form a resonator in the optical fiber itself. Therefore, it does not have a resonator Therefore, maintenance is not required, and it is getting popular as an industrial light source.

Currently, the development of fiber optic lasers in the market is being developed as high power continuous operation lasers, pulse operation lasers, and ultra high speed light sources. For many years, many companies have been making KW lasers for industrial use.

On the other hand, a conventional high power laser diode optical module uses a method of bonding one laser diode chip to a submount. In this structure, only an optical module having a single wavelength, i.e., a single wavelength, can be implemented.

Therefore, in order to realize a multi-wavelength optical module, a multi-wavelength optical module is implemented using a plurality of CoS (chip on submount) having different wavelengths. As a result, in order to realize a multi-wavelength optical module, a submount as many as the number of wavelengths is required, which may be a problem in manufacturing process and cost.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a submount for a high power laser diode optical module having multiple wavelengths capable of bonding a plurality of laser diode chips having different wavelengths to one submount.

Another object of the present invention is to provide a submount for a high power laser diode optical module having multiple wavelengths in which power is not reduced even in the same size module through one submount in which laser diode chips of different wavelengths are bonded .

It is still another object of the present invention to provide a submount for a high power laser diode optical module having multiple wavelengths in which fabrication processes and manufacturing costs are reduced because laser diode chips of different wavelengths are implemented in one submount.

According to an aspect of the present invention, there is provided a submount for a high-power laser diode optical module having multiple wavelengths, including a first solder to which a first high-power laser diode having a first wavelength is bonded, (+) Electrode pad connected to the first high-power laser diode, a second plug (+) electrode pad connected to the second high-power laser diode, and a second electrode connected to the second high- And a negative (-) electrode pad to which the first high power laser diode and the second high power laser diode are connected in common.

In an embodiment, each of the first solder and the second solder may be formed on the left region and the right region with respect to the center of the submount for the high power laser diode optical module having the multiple wavelengths.

In an embodiment, the negative (-) electrode pad may be formed between the leftmost end of the left region and the first solder.

In an embodiment, the first plug (+) electrode pad and the second plug (+) electrode pad are formed in the right region, and the first plug (+ And the second plug (+) electrode pad may be formed between the rightmost end of the right region and the second solder.

The apparatus may further include an insertion unit provided adjacent to a front surface of the first high power laser diode and the second high power laser diode for outputting the laser beam and having a fast axis collimator (FAC) lens inserted therein.

In an embodiment, the insertion portion may be formed integrally with the submount for the high power laser diode optical module having the multiple wavelengths.

In an embodiment, the insertion portion may include at least one groove into which a part of the FAC lens is inserted.

In one embodiment, the inserting portion may be provided at one end of the front surface of the first high power laser diode and the second high power laser diode, from which the laser beam is output, with respect to the center of the submount for the high power laser diode optical module having multiple wavelengths And a second groove formed in the other end of the front face where the laser beam is output from the first high power laser diode and the second high power laser diode based on the center of the submount for the high power laser diode optical module having the multiple wavelengths And a second groove formed therein.

In an embodiment, the FAC lens may be inserted into the insertion portion and then bonded to the insertion portion through UV curing using an epoxy.

In an embodiment, the inserted FAC lens can be automatically aligned in relation to the first high power laser diode and the second high power laser diode through insertion into the insert.

The effect of the submount for a high power laser diode optical module having multiple wavelengths according to the present invention is as follows.

According to at least one of the embodiments of the present invention, a plurality of laser diode chips having different wavelengths can be bonded to one submount.

According to at least one of the embodiments of the present invention, power may not be reduced even in the module of the same size through one submount in which laser diode chips of different wavelengths are bonded.

According to at least one of the embodiments of the present invention, since the laser diode chips of different wavelengths are implemented in one submount, the fabrication process and manufacturing cost can be reduced.

1 is a view showing a general optical module using a high power laser diode module having one wavelength.
2 is a diagram illustrating a general multi-wavelength optical module using a high power laser diode module having two different wavelengths.
FIG. 3 is a view showing an example in which a general submount and a plurality of submounts used in FIG. 1 and FIG. 2 are connected.
4 is a view illustrating a submount for a high power laser diode optical module having multiple wavelengths according to an embodiment of the present invention.
5 is a view illustrating an example in which high power laser diodes having two different wavelengths are aligned and bonded to a submount for a high power laser diode optical module having multiple wavelengths according to an embodiment of the present invention.
6 is a view illustrating an example in which a FAC lens can be inserted into a submount for a high power laser diode optical module having multiple wavelengths according to an embodiment of the present invention.
7 is a view showing an example of a multi-wavelength optical module by connecting submounts for a high power laser diode optical module having multiple wavelengths according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals are used to designate identical or similar elements, and redundant description thereof will be omitted. The suffix "module" and " part "for the components used in the following description are given or mixed in consideration of ease of specification, and do not have their own meaning or role. In the following description of the embodiments of the present invention, a detailed description of related arts will be omitted when it is determined that the gist of the embodiments disclosed herein may be blurred. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. , ≪ / RTI > equivalents, and alternatives.

Terms including ordinals, such as first, second, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It will be apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

1 is a view showing a general optical module using a high power laser diode module having one wavelength.

Referring to FIG. 1, a general optical module includes four CoSs 110 having one wavelength (wavelength 1), four reflection mirrors 120, A condenser lens 130 and an optical fiber 140. [

The CoS 110 of FIG. 1 is configured such that one high-power laser diode is bonded to one submount, and each of the CoSs 110 can output a laser beam of the same wavelength (wavelength 1) Reflected by the condenser lens 120, and reach the optical fiber 140 via the condenser lens 130 for optical fiber coupling.

Here, the optical power finally output to the optical fiber 140 may be a sum of the power of each laser beam output from each CoS 110. [ For example, if the optical power output from one CoS 110 is 10W, the optical power finally output to the optical fiber 140 may be 40W.

2 is a diagram illustrating a general multi-wavelength optical module using a high power laser diode module having two different wavelengths.

FIG. 2 is a view for explaining optical power output from a general multi-wavelength optical module having two different wavelengths as compared with FIG. 1. Referring to FIG. 2, a general multi-wavelength optical module includes a first wavelength Two CoSs 210 having a second wavelength (wavelength 2), four reflecting mirrors 230, a condenser lens 240 for optical fiber coupling, and an optical fiber 250 .

The CoSs 210 and 220 of FIG. 2 are configured such that one high-power laser diode is bonded to one submount, and the two CoSs 210 on the left can output a laser beam of the first wavelength (wavelength 1) , And the two CoSs 220 on the right side can output the laser beam of the second wavelength (wavelength 2). Then, the output laser beam is reflected by the reflection mirror 230 positioned at the bottom, and can reach the optical fiber 250 through the condenser lens 240 for optical fiber coupling.

Here, the optical power of the first wavelength finally output from the optical fiber 250 may be a sum of powers of the respective laser beams output from the two CoS 210 located on the left side. For example, if the optical power output by the four CoSs 210 and 220 shown in FIG. 2 is 10 W, the optical power of the first wavelength finally output to the optical fiber 250 may be 20 W.

The optical power of the second wavelength finally output from the optical fiber 250 may be a sum of powers of the respective laser beams output from the two CoSs 220 located on the right side. Similarly, if the optical power output by the four CoSs 210 and 220 shown in FIG. 2 is 10 W, the optical power of the second wavelength finally output to the optical fiber 250 may be 20 W.

In general, assuming that the CoS of the same power is used, the optical power 20W of any one wavelength outputted from the optical module (FIG. 2) outputting multiple wavelengths is transmitted to the optical module (FIG. 1) Corresponds to a value obtained by dividing the optical power 40W finally output by the number (2) of wavelengths. That is, when an optical module for outputting multiple wavelengths is fabricated by using the general submount as described above, the optical power of any one of the finally outputted wavelengths decreases with an increase in the number of wavelengths. Reduction of optical power is a major factor that can cause various problems including communication errors, so that reduction of optical power should be prevented.

FIG. 3 is a view showing an example in which a general submount and a plurality of submounts used in FIG. 1 and FIG. 2 are connected.

Referring to FIG. 3 (a), a single high-power laser diode 310 may be bonded to a common submount 300. Specifically, the high-power laser diode 310 at the center of the sub-mount 300 is bonded to the plug (+) electrode pad 330 with the plug (+) pole facing the bottom, The minus (-) pole may be connected to the negative (-) electrode pad 320 by gold wire bonding 340.

Referring to FIG. 3 (b), a common submount 300 to which one high-power laser diode is bonded may be connected to another submount disposed adjacent to the submount 300. Specifically, the plug (+) electrode pad of one of the submounts 300 may be connected to the negative (-) electrode pad of another submount 300 adjacent thereto by wire bonding 350.

As a result, a multi-wavelength optical module having different wavelengths as shown in FIG. 3 can be realized by connecting a plurality of submounts to which one high-power laser diode is bonded. However, as described above, In order to maintain the optical power, the number of submounts must be increased, and the overall size of the module is increased.

4 is a view illustrating a submount for a high power laser diode optical module having multiple wavelengths according to an embodiment of the present invention.

4A and 4B, the submount 400 for a high power laser diode optical module having multiple wavelengths includes a first solder 411, a second solder 412, a negative electrode Pad 420, a first plug (+) electrode pad 431, and a second plug (+) electrode pad 432. And, all of these can be formed on the top surface of the submount, but this is only an example, and the present invention is not limited to such a configuration.

In the submount for a high power laser diode optical module having multiple wavelengths according to the present invention, at least two or more high power laser diodes having different wavelengths may be bonded. The submount for a high power laser diode optical module having multiple wavelengths shown in FIG. 4 is an example in which two high power laser diodes having two different wavelengths are bonded to each other for convenience of explanation. That is, it will be apparent to those skilled in the art that the number of high power laser diodes connected to the submount of the present invention is not limited to two.

The first solder 411 has a structure in which a first high power laser diode having a first wavelength is bonded and the second solder 412 has a structure in which a second high power laser diode having a second wavelength is bonded. The first and second high power laser diodes can be bonded to the solders 411 and 412 downwardly on the p-side because of the high heat generated due to the high optical output.

The first plug electrode pad 431 is connected to the first high power laser diode bonded to the first solder 411 and the second plug electrode pad 432 is connected to the second solder 412. And the second high-power laser diode is connected to a positive (+) voltage of the power applied from the outside, and the positive (+) voltage is applied to the first and second high-power laser diodes to be.

The minus (-) electrode pad 420 is connected to a minus (-) voltage of the power applied from the outside and commonly connected to the minus (-) poles of both the first and second high power laser diodes, ) Voltage is applied to the first and second high power laser diodes. 1 and the second high power laser diode may be connected to the negative (-) electrode pad 420 by gold wire bonding.

4 (b) shows an example of a submount for a high power laser diode optical module having multiple wavelengths according to the present invention. The first solder 411, the second solder 412, the negative electrode pad 420, the first plug (+) electrode pad 431, and the second plug (+) through FIG. 4 (b) A specific example in which the electrode pad 432 is formed on the upper surface of one submount 400 can be confirmed.

First, each of the first solder 411 and the second solder 412 is divided into a left region (left half) and a right region (left half) with reference to the center of the submount 400 for a high power laser diode optical module having multiple wavelengths The right half).

The negative (-) electrode pad 420 may be formed between the leftmost end of the left region and the first solder 411.

The first plug (+) electrode pad 431 and the second plug (+) electrode pad 432 may be formed in the right region. Here, the first plug (+) electrode pad 431 may be connected to the first solder 411 over the center of the submount 400, and the second plug (+) electrode pad 432 may be connected to the And may be formed between the right end and the second solder 412.

The submount for a high power laser diode optical module having multiple wavelengths according to the present invention including the above configuration is one submount but may be bonded to a plurality of high power laser diodes having at least two different wavelengths.

Accordingly, the present invention allows one CoS formed of one submount to output two different wavelengths.

5 is a view illustrating an example in which high power laser diodes having two different wavelengths are aligned and bonded to a submount for a high power laser diode optical module having multiple wavelengths according to an embodiment of the present invention.

The submount 500 for a high power laser diode optical module having multiple wavelengths as shown in FIG. 5 is the same as that described with reference to FIG. 4, so a detailed description thereof will be omitted.

5, the first high power laser diode 511 is bonded to the first solder of the submount 500 and the second high power laser diode 512 is bonded to the second solder of the submount 500. [ As shown in FIG. The first and second high power laser diodes can be bonded to the solder in the downward direction of the p-side due to the high heat generated, as described above.

6 is a view illustrating an example in which a FAC lens can be inserted into a submount for a high power laser diode optical module having multiple wavelengths according to an embodiment of the present invention.

Referring to FIG. 6, the submount 600 for a high power laser diode optical module having multiple wavelengths may include inserts 610 and 620.

Here, the insertion portions 610 and 620 may be provided adjacent to the front surface of the first and second high power laser diodes connected to the submount 600, from which the laser beam is output. The insertion portions 610 and 620 may include grooves into which a part of the FAC lens can be inserted.

Specifically, it may include at least one groove into which a part of the FAC lens is inserted, and the number of the grooves is not particularly limited, and it is sufficient that the number of the FAC lenses can be fixed to the submount 600. [ For example, the inserters 610 and 620 may be disposed at the center of the submount 600 for the purpose of securing the path of the laser beam output from the first and second high power laser diodes, And two grooves 610 and 620 provided at both ends (one end and the other end) of the front surface of the second high power laser diode.

Meanwhile, the insertion portions 610 and 620 may be formed in a separate structure, but may be integrally formed with the submount 600 for a high power laser diode optical module having multiple wavelengths. To this end, the submount 600 for a high power laser diode optical module having multiple wavelengths may be formed by partially removing the front portion of the front surface of the first and second high power laser diodes, A groove into which the FAC lens can be inserted can be formed.

Meanwhile, the FAC lens is inserted into the inserting portions 610 and 620 provided in the submount 600 for a high power laser diode optical module having multiple wavelengths, and is connected to the first high power laser diode and the second high power laser diode The FAC lens inserted into the inserting portions 610 and 620 can be fixed to the corresponding inserting portions 610 and 620 through UV curing using epoxy.

As a result, the submount for a multi-wavelength high power laser diode optical module according to the present invention does not require a high-priced alignment equipment for alignment of the FAC lens, and since the alignment of the FAC lens can be performed by simple insertion, It is possible to shorten the process time and reduce the manufacturing cost.

7 is a view showing an example of a multi-wavelength optical module by connecting submounts for a high power laser diode optical module having multiple wavelengths according to an embodiment of the present invention.

FIG. 7 is a view for explaining optical power output from a multi-wavelength optical module having two different wavelengths as compared with FIG. 2. Referring to FIG. 7, the multi-wavelength optical module using the sub- Four CoS 710, four reflective mirrors 720, a condenser lens 730 for optical fiber coupling, and an optical fiber 740.

The CoS 710 shown in FIG. 7 has a structure in which two high-power laser diodes are bonded to one submount, and one CoS 710 has a laser beam of a first wavelength (wavelength 1) and a laser beam of a second wavelength ) Can be output. The output laser beam is reflected by the reflection mirror 720 disposed at the lower portion and can reach the optical fiber 740 through the condenser lens 730 for optical fiber coupling.

Here, the optical power of the first wavelength finally output to the optical fiber 740 may be a sum of powers of the laser beams corresponding to the first wavelengths output from the four CoSs 710. [ For example, if the optical power output from the four CoSs 710 shown in FIG. 7 is 10W, the optical power of the first wavelength finally output to the optical fiber 740 may be 40W.

Similarly, the optical power of the second wavelength finally output to the optical fiber 250 may be a sum of powers of the laser beams corresponding to the respective second wavelengths output from the four CoSs 710. That is, if the optical power output by the four CoSs 710 is 10W, the optical power of the second wavelength finally output to the optical fiber 740 may be 40W.

Assuming that CoS of the same power is used, the optical power 40W of any one wavelength outputted from a general optical module (FIG. 7) outputting multiple wavelengths according to the present invention is a general optical module 2, which is the same value as the optical power 40W output from the optical module outputting one wavelength shown in FIG.

That is, when a general optical module (FIG. 7) for outputting multiple wavelengths using a submount according to the present invention is fabricated, the optical power of any wavelength finally output, regardless of the increase in the number of wavelengths, The optical power of any one wavelength outputted from the optical module (FIG. 2) is increased.

Meanwhile, the high power laser diode module is applied to many parts such as industrial, medical, sensor, etc. According to the invention, the submount for a high power laser diode optical module outputs two or more wavelengths from one optical module (one submount) It is possible to increase the degree of freedom of wavelength selection and thus to impose many applications on those using it.

In addition, since the modules of the same size can output at least two different wavelengths without decreasing the optical power, the utilization thereof is expected to be increased, and it is more preferable to manufacture the module corresponding to the number of wavelengths It is also expected to be cost-effective.

As a result, the submount for a high power laser diode optical module having different wavelengths according to the present invention can bond a plurality of laser diode chips to one submount, and power is not reduced even in a module of the same size, The manufacturing cost can be reduced.

Accordingly, the foregoing detailed description should not be construed in any way as limiting and should be considered illustrative. The scope of the present invention should be determined by rational interpretation of the appended claims, and all changes within the scope of equivalents of the present invention are included in the scope of the present invention.

Claims (10)

A submount for a high power laser diode optical module having multiple wavelengths in which at least two or more high power laser diodes having different wavelengths are bonded,
A first solder to which a first high-power laser diode having a first wavelength is bonded;
A second solder to which a second high-power laser diode having a second wavelength is bonded;
A first plug (+) electrode pad connected to the first high power laser diode;
A second plug (+) electrode pad connected to the second high power laser diode; And
And a negative (-) electrode pad to which the first high-power laser diode and the second high-power laser diode are commonly connected.
The method according to claim 1,
Wherein each of the first solder and the second solder includes:
A submount for a high power laser diode optical module having multiple wavelengths formed in a left side region and a right side region with respect to a center of a submount for a high power laser diode optical module having multiple wavelengths.
3. The method of claim 2,
The negative (-
And a plurality of wavelengths formed between the leftmost end of the left region and the first solder.
3. The method of claim 2,
The first plug (+) electrode pad and the second plug (+) electrode pad,
A second electrode formed on the right region,
The first plug (+
The second solder is connected to the first solder over the center,
The second plug (+
And a plurality of wavelengths formed between the rightmost end of the right region and the second solder.
The method according to claim 1,
Output laser diode optical module having a multi-wavelength laser diode module which is provided adjacent to a front surface of the first high-power laser diode and the second high-power laser diode for outputting a laser beam and into which a fast axis collimator (FAC) Submount for.
6. The method of claim 5,
The insertion portion
And a submount for a high power laser diode optical module having multiple wavelengths formed integrally with a submount for the high power laser diode optical module having multiple wavelengths.
6. The method of claim 5,
The insertion portion
And at least one groove into which a part of the FAC lens is inserted. The submount for a high power laser diode optical module having multiple wavelengths.
6. The method of claim 5,
The insertion portion
A first groove formed at one end of a front surface of the first high power laser diode and the second high power laser diode for outputting a laser beam with respect to a center of a submount for the high power laser diode optical module having multiple wavelengths; And
And a second groove formed at the other end of the front surface of the first high power laser diode and the second high power laser diode for outputting the laser beam based on the center of the submount for the high power laser diode optical module having multiple wavelengths A submount for a high power laser diode optical module with multiple wavelengths.
6. The method of claim 5,
The FAC lens includes:
A submount for a high power laser diode optical module having multiple wavelengths bonded to the insert through UV curing using an epoxy after being inserted into the insert.
6. The method of claim 5,
Wherein the inserted FAC lens comprises:
Wherein the first and second high power laser diodes are arranged in the first and second high power laser diodes, respectively.
KR1020150172644A 2015-12-04 2015-12-04 Submount for high power laser diode optical modules with a multiple wavelength KR20170066076A (en)

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KR1020150172644A KR20170066076A (en) 2015-12-04 2015-12-04 Submount for high power laser diode optical modules with a multiple wavelength

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150172644A KR20170066076A (en) 2015-12-04 2015-12-04 Submount for high power laser diode optical modules with a multiple wavelength

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