CN203553611U - Surface mount packaging of laser diode - Google Patents
Surface mount packaging of laser diode Download PDFInfo
- Publication number
- CN203553611U CN203553611U CN201320653280.7U CN201320653280U CN203553611U CN 203553611 U CN203553611 U CN 203553611U CN 201320653280 U CN201320653280 U CN 201320653280U CN 203553611 U CN203553611 U CN 203553611U
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- CN
- China
- Prior art keywords
- laser diode
- surface mount
- wiring board
- pcb wiring
- sided pcb
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a surface mount packaging of a laser diode. The surface mount packaging comprises a double-faced PCB and an insulating rubber slab; the middle of the obverse side of the double-faced PCB is provided with a surface mount diode, a surface mount capacitor and a surface mount resistor, the central section of one side of the obverse side is provided with a laser diode, and the double-faced PCB, at one side of the laser diode, is provided with a plurality of heat conduction through holes; and the obverse side of the double-faced PCB is also provided with the insulating rubber slab used for packaging the surface mount diode, the surface mount capacitor, the surface mount resistor and the laser diode, the double-faced PCB is also provided with a positive electrode and a negative electrode, and the number of the heat conduction through holes is at least three. The surface mount packaging of the laser diode is simple in structure, labor processes are decreased when used, product reliability is increased, and therefore cost is reduced and product yield rate is improved.
Description
Technical field
The utility model relates to field of laser diodes, is specifically related to a kind of paster encapsulation of laser diode.
Background technology
Existing small-power semiconductor laser diode is all TO-CAN encapsulation, while really using on product, often need to do twice processing, as manual welding, cut the operations such as pin, just do not increase cost and increased again the fraction defective of product, and due to the restriction of TO-CAN package thickness, the scope of having limited to its use.
Summary of the invention
The purpose of this utility model is to overcome the above problem that prior art exists, and a kind of paster encapsulation of laser diode is provided, and the utility model is simple in structure, overall package thickness is little, during manufacture, reduce manual process, increased the reliability of product, and then reduced costs raising product yield.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the utility model is achieved through the following technical solutions:
A kind of paster encapsulation of laser diode, comprise two-sided PCB wiring board, in the middle of described two-sided PCB wiring board front, be provided with laser diode power control module, and the middle part of a positive side is provided with the laser diode being connected with laser diode power control module, laser diode one side on described two-sided PCB wiring board is provided with heat radiation Copper Foil one, described heat radiation Copper Foil one is connected with the heat radiation Copper Foil two at the two-sided PCB wiring board back side by some heat conduction through holes, described two-sided PCB wiring board front is also provided with the insulation offset plate for encapsulating laser diode power control module and laser diode.
Further, described laser diode power control module is all connected with two-sided PCB wiring board by elargol with laser diode.
Further, described laser diode power control module is connected to form by stamp-mounting-paper diode, patch capacitor and Chip-R.
Further, on described two-sided PCB wiring board, be also provided with positive pole and negative pole.
Further, described heat conduction number of openings is at least 3.
The beneficial effects of the utility model are:
1, select PCB wiring board and copper foil material to reduce manufacturing cost;
2, twice processing of minimizing is artificial, easily manufactured;
3, components and parts are mounting method, and production requirement reduces, and improve production yield;
4, paster encapsulation effectively reduces small product size, and the scope of application is increased.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be implemented according to the content of specification, below with preferred embodiment of the present utility model and coordinate accompanying drawing to be described in detail as follows.Embodiment of the present utility model is provided in detail by following examples and accompanying drawing thereof.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide further understanding of the present utility model, forms the application's a part, and schematic description and description of the present utility model is used for explaining the utility model, does not form improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 is side cross-section schematic diagram of the present utility model;
Fig. 2 is the front schematic view of the two-sided PCB wiring board of the utility model;
Fig. 3 is the schematic rear view of the two-sided PCB wiring board of the utility model.
Number in the figure explanation: 1, two-sided PCB wiring board, 2, insulation offset plate, 3, stamp-mounting-paper diode, 4, patch capacitor, 5, Chip-R, 6, laser diode, 7, heat conduction through hole, 8, positive pole, 9, negative pole, 10, laser diode power control module, 11, heat radiation Copper Foil one, 12, heat radiation Copper Foil two.
Embodiment
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the utility model in detail.
Shown in Fig. 1 and Fig. 3, a kind of paster encapsulation of laser diode, comprise by two-sided PCB wiring board 1 and insulation offset plate 2, in the middle of two-sided PCB wiring board 1 is positive, by elargol, be fixed with laser diode power control module 10, and the edge, middle part of the positive side of two-sided PCB wiring board 1 is fixing by elargol and laser diode 6, then laser diode power control module 10 links together with laser diode 6, laser diode 6 one sides on two-sided PCB wiring board 1 are provided with heat radiation Copper Foil 1, the Copper Foil 1 that wherein dispels the heat is connected with the heat radiation Copper Foil 2 12 at two-sided PCB wiring board 1 back side by three heat conduction through holes 7, for two-side radiation, reach good radiating effect, two-sided PCB wiring board 1 front is also provided with the insulation offset plate 2 for encapsulating laser diode power control module 10 and laser diode 6, and is provided with positive pole 8 and negative pole 9 at two-sided PCB wiring board 1, for connecting power supply.
The operation principle of the present embodiment is as follows:
The utility model utilizes the Copper Foil of two-sided PCB wiring board 1 front ingehious design to be used as electrode welding point and heat sink, the Copper Foil at the back side is as heat radiation, and utilize heat conduction through hole 7 heat conduction that arrange between Copper Foil, can effectively meet the encapsulation condition of small-power semiconductor laser diode.And two-sided PCB wiring board 1 is of a size of 6*7*0.8mm, insulation offset plate 2 is of a size of 6*5*1mm, wherein in the inner side of insulation offset plate 2, is provided with the groove of a 4*5*0.7mm, is the components and parts reserved empty position in two-sided PCB wiring board 1 front.
The components and parts that use in the utility model are all SMD, are conducive to reduce small product size, and utilizing elargol to do paster welding, can avoid like this using scolding tin to do high-temperature soldering, and high temperature easily damages components and parts; The gold thread that finally utilizes insulation offset plate 2 covering protection chips and connection line, is be also used as PD optically focused and prevent parasitic reflection material, guarantees out light quality.This practical new less volume expands its scope of application, and the occasion that is applicable to requirements at the higher level, less space is used.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (5)
1. the paster of laser diode encapsulation, it is characterized in that: comprise two-sided PCB wiring board (1), in the middle of described two-sided PCB wiring board (1) is positive, be provided with laser diode power control module (10), and the middle part of a positive side is provided with the laser diode (6) being connected with laser diode power control module (10), laser diode (6) one sides on described two-sided PCB wiring board (1) are provided with heat radiation Copper Foil one (11), described heat radiation Copper Foil one (11) is connected with the heat radiation Copper Foil two (12) at two-sided PCB wiring board (1) back side by some heat conduction through holes (7), described two-sided PCB wiring board (1) front is also provided with the insulation offset plate (2) for encapsulating laser diode power control module (10) and laser diode (6).
2. the paster of a kind of laser diode according to claim 1 encapsulation, is characterized in that: described laser diode power control module (10) is all connected with two-sided PCB wiring board (1) by elargol with laser diode (6).
3. the paster of a kind of laser diode according to claim 1 encapsulation, is characterized in that: described laser diode power control module (10) is connected to form by stamp-mounting-paper diode (3), patch capacitor (4) and Chip-R (5).
4. the paster of a kind of laser diode according to claim 1 encapsulation, is characterized in that: on described two-sided PCB wiring board (1), be also provided with positive pole (8) and negative pole (9).
5. the paster of a kind of laser diode according to claim 1 encapsulation, is characterized in that: described heat conduction through hole (7) quantity is at least 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320653280.7U CN203553611U (en) | 2013-10-22 | 2013-10-22 | Surface mount packaging of laser diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320653280.7U CN203553611U (en) | 2013-10-22 | 2013-10-22 | Surface mount packaging of laser diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203553611U true CN203553611U (en) | 2014-04-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320653280.7U Expired - Lifetime CN203553611U (en) | 2013-10-22 | 2013-10-22 | Surface mount packaging of laser diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203553611U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105627167A (en) * | 2014-11-14 | 2016-06-01 | 江苏欧密格光电科技股份有限公司 | LED fluorescent tube uniform in illumination |
| TWI560399B (en) * | 2014-04-25 | 2016-12-01 | Jin Wei Electronic Co Ltd | Attaching method for self-adhesive substrate |
| WO2018134182A1 (en) * | 2017-01-18 | 2018-07-26 | Osram Opto Semiconductors Gmbh | Electrical circuit and method for producing an electrical circuit |
| CN110011178A (en) * | 2019-03-28 | 2019-07-12 | 广东工业大学 | Electric current-optical interference light supply apparatus of temperature control semiconductor laser and its measuring system of composition |
| WO2019205153A1 (en) * | 2018-04-28 | 2019-10-31 | 深圳市大疆创新科技有限公司 | Laser diode packaging module, transmitting apparatus, ranging apparatus, and electronic device |
-
2013
- 2013-10-22 CN CN201320653280.7U patent/CN203553611U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI560399B (en) * | 2014-04-25 | 2016-12-01 | Jin Wei Electronic Co Ltd | Attaching method for self-adhesive substrate |
| CN105627167A (en) * | 2014-11-14 | 2016-06-01 | 江苏欧密格光电科技股份有限公司 | LED fluorescent tube uniform in illumination |
| WO2018134182A1 (en) * | 2017-01-18 | 2018-07-26 | Osram Opto Semiconductors Gmbh | Electrical circuit and method for producing an electrical circuit |
| WO2019205153A1 (en) * | 2018-04-28 | 2019-10-31 | 深圳市大疆创新科技有限公司 | Laser diode packaging module, transmitting apparatus, ranging apparatus, and electronic device |
| CN110011178A (en) * | 2019-03-28 | 2019-07-12 | 广东工业大学 | Electric current-optical interference light supply apparatus of temperature control semiconductor laser and its measuring system of composition |
| US11108212B2 (en) | 2019-03-28 | 2021-08-31 | Guangdong University Of Technology | Optical interference light source device of current-temperature controlled semiconductor laser and measurement system including the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |